NUF6406MN Low Capacitance 6 Line EMI Filter with ESD Protection This device is a 6 line EMI filter array for wireless applications. Greater than −30 dB attenuation is obtained at frequencies from 800 MHz to 2.4 GHz. It also offers ESD protection−clamping transients from static discharges. ESD protection is provided across all capacitors. http://onsemi.com 1 12 Cd Cd Cd Cd Features • EMI Filtering and ESD Protection • Integration of 30 Discrete Components • Compliance with IEC61000−4−2 (Level 4) • • • • 2 > 8.0 kV (Contact) DFN Package, 1.35 x 3.0 mm Moisture Sensitivity Level 1 ESD Ratings: Machine Model = C Human Body Model = 3B This is a Pb−Free Device* 3 10 Cd Cd Cd Cd Cd Cd Cd Cd 4 Benefits 9 5 • Reduces EMI/RFI Emissions on a Data Line • Integrated Solution Offers Cost and Space Savings in a DFN Package • Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass • • 11 8 6 7 Filter Response Integrated Solution Improves System Reliability Compatible Footprint to BGA or Flip−Chip Package (Top View) Applications • • • • • MARKING DIAGRAM EMI Filtering and ESD Protection for Data Lines Wireless Phones PDAs and Handheld Products Notebook Computers LCD Displays 1 2 3 4 5 12 1 64 06 MG G 1 DFN12 CASE 506AD 6 6406 = Specific Device Code M = Month G = Pb−Free Package (Note: Microdot may be in either location) GND ORDERING INFORMATION 12 11 10 9 8 (Bottom View) 7 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2005 June, 2005 − Rev. 2 1 Device Package Shipping† NUF6406MNT1G DFN12 (Pb−Free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Publication Order Number: NUF6406MN/D NUF6406MN MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Symbol Value Unit VPP 8.0 kV Operating Temperature Range TOP −40 to 85 °C Storage Temperature Range TSTG −55 to 150 °C TL 260 °C Parameter ESD Discharge IEC61000−4−2 Contact Discharge Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 seconds) Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted) Test Conditions Min Typ VBR IR = 1.0 mA 6.0 7.0 Leakage Current IR VRWM = 3.0 V Resistance RA IR = 20 mA Capacitance (Notes 1 and 2) Cd Cut−Off Frequency (Note 3) f3dB Parameter Maximum Reverse Working Voltage Breakdown Voltage Symbol VRWM Max Unit 5.0 V V 1.0 A 100 115 VR = 2.5 V, f = 1.0 MHz 13 16 pF Above this frequency, appreciable attenuation occurs 138 1. Measured at 25°C, VR = 2.5 V, f = 1.0 MHz. 2. Total line capacitance is 2 times the Diode Capacitance (Cd). 3. 50 source and 50 load termination. http://onsemi.com 2 85 MHz NUF6406MN 0 0 −5 10 −10 −20 S41 (dB) S21 (dB) −15 −20 −25 −30 −40 −50 −35 −60 −40 −70 −45 1.E+06 1.E+07 1.E+08 1.E+09 −80 1.E+06 1.E+10 1.E+07 1.E+08 1.E+09 FREQUENCY (Hz) FREQUENCY (Hz) Figure 1. Insertion Loss Characteristic Figure 2. Analog Crosstalk 1.E+10 110 2 108 106 1.5 RESISTANCE () NORMALIZED CAPACITANCE −30 1 0.5 104 102 100 98 96 94 92 0 0 1 2 3 4 90 −40 5 REVERSE VOLTAGE (V) −20 0 20 40 60 TEMPERATURE (°C) Figure 4. Typical Resistance over Temperature Figure 3. Typical Capacitance vs. Reverse Biased Voltage (Normalized Capacitance, Cd @ 2.5 V) http://onsemi.com 3 80 NUF6406MN PACKAGE DIMENSIONS DFN12 3.0*1.35*0.85 CASE 506AD−01 ISSUE F 2X 0.15 C A (A3) D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. 5. EXPOSED PADS CONNECTED TO DIE FLAG. USED AS TEST CONTACTS. B E EXPOSED Cu 2X 0.15 C TOP VIEW PIN ONE REFERENCE (A3) 0.10 C A 12 X 0.08 C A1 C MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.18 0.30 3.00 BSC 2.10 2.30 1.35 BSC 0.20 0.40 0.50 BSC 0.20 −−− 0.20 0.40 D2 L e 1 12 X K SEATING PLANE SIDE VIEW 2X 0.2 X 0.25 MM NOTE 5 12 X DIM A A1 A3 b D D2 E E2 e K L 12 EXPOSED PAD 6 E2 7 12 X b SOLDERING FOOTPRINT* 2.352 0.093 BOTTOM VIEW 0.10 C A B 0.05 C NOTE 3 0.351 0.014 0.479 0.019 0.265 0.01 SCALE 16:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 4 For additional information, please contact your local Sales Representative. NUF6406MN/D