ON MBRS3201T3 200v, 3a schottky fast soft−recovery power rectifier smc power surface mount package Datasheet

MBRS3201T3
200V, 3A Schottky
Fast Soft−Recovery
Power Rectifier
SMC Power Surface Mount Package
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Features
• Lower Forward Voltage than any Ultrafast Rectifier:
•
•
•
•
SCHOTTKY RECTIFIER
3 AMPS, 200 VOLTS
VF < 0.59 V at 150°C
Fast Switching Speed: Reverse Recovery Time (tRR) < 35 ns
Soft Recovery Characteristics: Softness Factor (tb/ta) w 1
Highly Stable Over Temperature
Pb−Free Package is Available
Benefits
•
•
•
•
Significantly Reduced EMI
Eliminates the Need of Snubber Circuits
Low Switching and Heat Losses
Improved Thermal Management
Applications
SMC
CASE 403
PLASTIC
• Engine and Convenience Control Systems
• Motor Controls
• Battery Chargers and Switching Power Supplies
MARKING DIAGRAM
Mechanical Characteristics
•
•
•
•
•
•
Small Compact Surface Mount Package with J–Bend Leads
Rectangular Package for Automated Handling
Weight: 217 mg (Approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Maximum for 10 Seconds
Polarity: Notch in Plastic Body Indicates Cathode Lead
MAXIMUM RATINGS
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Characteristic
VRRM
VRWM
VR
200
V
Average Rectified Forward Current
(Rated VR, TC = 70°C)
IF(AV)
3
A
Nonrepetitive Peak Surge Current
IFSM
100
A
TJ
−55 to +150
°C
Operating Junction Temperature
August, 2005 − Rev. 2
B321
= Specific Device Code
A
= Assembly Location
Y
= Year
WW
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
MBRS3201T3
SMC
2500 / Tape & Reel
MBRS3201T3G
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
© Semiconductor Components Industries, LLC, 2005
AYWW
B321G
G
1
SMC
(Pb−Free)
2500 / Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Publication Order Number:
MBRS3201T3/D
MBRS3201T3
THERMAL CHARACTERISTICS
Symbol
Value
Unit
Thermal Resistance, Junction−to−Lead
Characteristic
RqJL
12
°C/W
Thermal Resistance, Junction−to−Ambient
RqJA
60
°C/W
Symbol
Value
Unit
ELECTRICAL CHARACTERISTICS
Characteristic
Maximum Instantaneous Forward Voltage
VF
V
(IF = 3 A, TJ = 25°C)
(IF = 3 A, TJ = 150°C)
0.84
0.59
Maximum Instantaneous Reverse Current (Rated VR)
IR
(Rated DC Voltage, TJ = 25°C)
(Rated DC Voltage, TJ = 150°C)
Maximum Reverse Recovery Time
trr
1.0
5.0
mA
mA
35
ns
(IF = 1 A, di/dt = 100 A/us, VR = 30 V)
IF, FORWARD CURRENT (A)
100
10
25°C
150°C
1.0
100°C
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0 1.1
25°C
150°C
1.0
100°C
0.1
0.2
1.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
VF, INSTANTANEOUS VOLTAGE (V)
VF, INSTANTANEOUS VOLTAGE (V)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
1.1
1.2
1.0E−01
1E−1
IR, REVERSE CURRENT (A)
1E−2
1.0E−02
1E−3
150°C
1E−4
TC = 150°C
1.0E−03
1E−5
100°C
TC = 25°C
1.0E−04
1E−6
1E−7
1.0E−05
25°C
1E−8
1E−9
0
10
IR, MAXIMUM REVERSE CURRENT (A)
IF, FORWARD CURRENT (A)
100
20
40
60
80
1.0E−06
0
100 120 140 160 180 200
20
40
60
80
100
120 140 160 180 200
VR, REVERSE VOLTAGE (V)
VR, REVERSE VOLTAGE (V)
Figure 3. Typical Reverse Current
Figure 4. Maximum Reverse Current
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2
MBRS3201T3
C, CAPACITANCE (pF)
1000
100
10
1.0
0
20
40
60
80
100 120 140 160 180 200
VR, REVERSE VOLTAGE (V)
4.0
IF, AVERAGE FORWARD CURRENT (A)
PFO, AVERAGE POWER DISSIPATION (W)
Figure 5. Typical Capacitance
3.5
3.0
2.5
SQUARE
2.0
DC
1.5
1.0
0.5
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
7
6
DC
5
4
SQUAREWAVE
3
2
1
0
80
90
100
110
120
130
140
IO, AVERAGE FORWARD CURRENT
TL, LEAD TEMPERATURE (°C)
Figure 6. Power Dissipation
Figure 7. Derating Curve
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3
150
160
MBRS3201T3
PACKAGE DIMENSIONS
SMC
CASE 403−03
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.
4. 403−01 THRU −02 OBSOLETE, NEW STANDARD 403−03.
HE
E
b
DIM
A
A1
b
c
D
E
HE
L
L1
D
MIN
1.90
0.05
2.92
0.15
5.59
6.60
7.75
0.76
MILLIMETERS
NOM
MAX
2.13
2.41
0.10
0.15
3.00
3.07
0.23
0.30
5.84
6.10
6.86
7.11
7.94
8.13
1.02
1.27
0.51 REF
MIN
0.075
0.002
0.115
0.006
0.220
0.260
0.305
0.030
INCHES
NOM
0.084
0.004
0.118
0.009
0.230
0.270
0.313
0.040
0.020 REF
MAX
0.095
0.006
0.121
0.012
0.240
0.280
0.320
0.050
A
L
L1
c
A1
SOLDERING FOOTPRINT*
4.343
0.171
3.810
0.150
2.794
0.110
SCALE 4:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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MBRS3201T3/D
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