MC10H161 Binary to 1−8 Decoder (Low) Description The MC10H161 provides parallel decoding of a three bit binary word to one of eight lines. The MC10H161 is useful in high−speed multiplexer/demultiplexer applications. The MC10H161 is designed to decode a three bit input word to one of eight output lines. The MC10H161 output will be low when selected while all other output are high. The enable inputs, when either or both are high, force all outputs high. The MC10H161 is a true parallel decoder. This eliminates unequal parallel path delay times found in other decoder designs. These devices are ideally suited for multiplexer/demultiplexer applications. http://onsemi.com MARKING DIAGRAMS* 16 MC10H161L AWLYYWW Features • Propagation Delay, 1.0 ns Typical • Power Dissipation, 315 mW Typical (same as MECL 10K™) • Improved Noise Margin 150 mV (Over Operating Voltage and • • • 16 Temperature Range) Voltage Compensated MECL 10K Compatible Pb−Free Packages are Available* 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 1 PDIP−16 P SUFFIX CASE 648 Q6 Q7 B SOEIAJ−16 CASE 966 the ON Semiconductor MECL Data Book (DL122/D). 1 20 VCC1 = Pin 1 VCC2 = Pin 16 VEE = Pin 8 A7 B9 10H161G AWLYYWW 20 1 LOGIC DIAGRAM E02 E115 6Q0 ENABLE INPUTS 5Q1 E1 E0 L L L L 4Q2 L L L L 3Q3 L L L L 13Q4 L L L L 12Q5 H X X H 1 10H161 ALYWG VCC2 E1 Pin assignment is for Dual−in−Line C Package. For PLCC pin assignment, see Q4 the Pin Conversion Tables on page 18 of Q5 MC10H161P AWLYYWWG 16 DIP PIN ASSIGNMENT VCC1 E0 Q3 Q2 Q1 Q0 A VEE 1 CDIP−16 L SUFFIX CASE 620A TRUTH TABLE INPUTS OUTPUTS C B A Q0 Q1 Q2 Q3 Q4 Q5 L L L L H H H H H L L H H L H H H H L H L H H L H H H L H H H H H L H H H L L H H H H L H H L H H H H H H L H H L H H H H H H H H H H H H H H H X X X H H H H H H X X X H H H H H H Q6 H H H H H H L H H H Q7 H H H H H H H L H H PLLC−20 FN SUFFIX CASE 775 A WL, L YY, Y WW, W G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package 11Q6 C14 10Q7 *For additional marking information, refer to Application Note AND8002/D. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2006 February, 2006 − Rev. 7 1 ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. Publication Order Number: MC10H161/D MC10H161 Table 1. MAXIMUM RATINGS Symbol Rating Unit VEE Power Supply (VCC = 0) Characteristic −8.0 to 0 Vdc VI Input Voltage (VCC = 0) 0 to VEE Vdc Iout Output Current 50 100 mA TA Operating Temperature Range 0 to +75 °C Tstg Storage Temperature Range − Plastic − Ceramic −55 to +150 −55 to +165 °C °C − Continuous − Surge Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. Table 2. ELECTRICAL CHARACTERISTICS (VEE = −5.2 V ±5%) (Note 1) 0° Symbol 75° Min Max Min Max Min Max Unit Power Supply Current − 84 − 76 − 84 mA IinH Input Current High − 465 − 275 − 275 mA IinL Input Current Low 0.5 − 0.5 − 0.3 − mA VOH High Output Voltage −1.02 −0.84 −0.98 −0.81 −0.92 −0.735 Vdc VOL Low Output Voltage −1.95 −1.63 −1.95 −1.63 −1.95 −1.60 Vdc VIH High Input Voltage −1.17 −0.84 −1.13 −0.81 −1.07 −0.735 Vdc VIL Low Input Voltage −1.95 −1.48 −1.95 −1.48 −1.95 −1.45 Vdc IE Characteristic 25° 1. Each MECL 10H™ series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained. Outputs are terminated through a 50 W resistor to −2.0 V. Table 3. AC PARAMETERS 0° Symbol 75° Min Max Min Max Min Max Propagation Delay Data Enable 0.6 0.8 2.0 2.3 0.65 0.8 2.1 2.4 0.7 0.9 2.2 2.5 tr Rise Time 0.55 1.7 0.65 1.8 0.7 1.9 ns tf Fall Time 0.55 1.7 0.65 1.8 0.7 1.9 ns tpd Characteristic 25° Unit ns NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. http://onsemi.com 2 MC10H161 TYPICAL APPLICATIONS HIGH SPEED 16−BIT MULTIPLEXER/DEMULTIPLEXER Control Selection S0 S1 CR A 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 MC10H136 B C D E1 C B A MC10H164 E1 C B A MC10H161 D0 E1 C B A MC10H164 E1 C B A MC10H161 D0 S0 S0 S1 S1 CR A CR MC10H136 B C D Start/Stop E0 15 14 1312 11 10 9 8 1−OF−64 LINE MULTIPLEXER E A B C MC10H164 E A B C MC10H164 E MSB MC10H161 9 7 LSB Q7 Q6 Q5 Q4 Q3 Q2 Q1 Q0 E The Bit chosen is dependent on six−bit code present on inputs 7, 9, 14 of the MC10H161 and the A, B, C inputs of the MC10H164. Dout A B C MC10H164 E Dout A B C MC10H164 E Dout A B C MC10H164 E Dout A B C MC10H164 E Dout A B C MC10H164 14 Dout Dout A B C MC10H164 Dout http://onsemi.com 3 E0 7 6 5 4 3 2 1 0 MC10H161 ORDERING INFORMATION Package Shipping † MC10H161FN PLLC−20 46 Units / Rail MC10H161FNG PLLC−20 (Pb−Free) 46 Units / Rail MC10H161FNR2 PLLC−20 500 / Tape & Reel MC10H161FNR2G PLLC−20 (Pb−Free) 500 / Tape & Reel MC10H161L CDIP−16 25 Unit / Rail MC10H161M SOEIAJ−16 50 Unit / Rail MC10H161MG SOEIAJ−16 (Pb−Free) 50 Unit / Rail MC10H161MEL SOEIAJ−16 2000 / Tape & Reel MC10H161MELG SOEIAJ−16 (Pb−Free) 2000 / Tape & Reel MC10H161P PDIP−16 25 Unit / Rail MC10H161PG PDIP−16 (Pb−Free) 25 Unit / Rail Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 4 MC10H161 PACKAGE DIMENSIONS 20 LEAD PLLC CASE 775−02 ISSUE E 0.007 (0.180) M T L−M B Y BRK −N− U N S 0.007 (0.180) M T L−M S S N S D −L− −M− Z W 20 D 1 V 0.007 (0.180) M T L−M S N S R 0.007 (0.180) M T L−M S N S Z T L−M S N H J 0.007 (0.180) M T L−M S −T− VIEW S SEATING PLANE F 0.007 (0.180) M T L−M S VIEW S N S N S K 0.004 (0.100) G S S K1 E G1 0.010 (0.250) S T L−M S VIEW D−D A C 0.010 (0.250) G1 X NOTES: 1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M, 1982. 2. DIMENSIONS IN INCHES. 3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM −T−, SEATING PLANE. 5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). http://onsemi.com 5 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 −−− 0.025 −−− 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 −−− 0.020 2_ 10 _ 0.310 0.330 0.040 −−− MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 −−− 0.64 −−− 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 −−− 0.50 2_ 10 _ 7.88 8.38 1.02 −−− N S MC10H161 PACKAGE DIMENSIONS SOEIAJ−16 CASE 966−01 ISSUE A 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). LE 9 Q1 E HE 1 M_ L 8 Z DETAIL P D e VIEW P A DIM A A1 b c D E e HE L LE M Q1 Z A1 b 0.13 (0.005) c 0.10 (0.004) M CDIP−16 L SUFFIX CERAMIC DIP PACKAGE CASE 620A−01 ISSUE O B A A 16 9 1 8 B M L 16X 0.25 (0.010) E F C K T N SEATING PLANE G 16X 0.25 (0.010) M D T A http://onsemi.com 6 M J T B MILLIMETERS MIN MAX −−− 2.05 0.05 0.20 0.35 0.50 0.10 0.20 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 −−− 0.78 INCHES MIN MAX −−− 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 −−− 0.031 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. 5 THIS DRAWING REPLACES OBSOLETE CASE OUTLINE 620−10. DIM A B C D E F G H K L M N INCHES MIN MAX 0.750 0.785 0.240 0.295 −−− 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 −−− 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15 _ 0.51 1.01 MC10H161 PACKAGE DIMENSIONS PDIP−16 P SUFFIX PLASTIC DIP PACKAGE CASE 648−08 ISSUE R −A− 16 9 1 8 B F C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. L S −T− H SEATING PLANE K G D M J 16 PL 0.25 (0.010) M T A M DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 MECL 10H and MECL 10K are trademarks of Motorola, Inc. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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