Panasonic ERJ12 Thick film chip resistors 0201, 0402, 0603, 0805, 1206, 1210, 1812, 2010, 2512 Datasheet

Thick Film Chip Resistors
Thick Film Chip Resistors
0201, 0402, 0603, 0805, 1206,
1210, 1812, 2010, 2512
Type:
ERJ 1G, 2G, 3G, 6G, 8G, 14,
12, 12Z, 1T
■ Features
● Small size and lightweight
For PCB size reduction and lightweight products
● High reliability
Metal glaze thick film resistive element and three layers of electrodes result in high reliability
● Matching with placement machine
Taping and bulk case packagings for automatic placement machine
● Solderability
Suitable for both reflow soldering and flow soldering
● Reference Standards
IEC 60115-8, JIS C 5201-8, EIAJ RC-2134A
■ Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
12
E
R
J
3
G
E
Y
J
1
0
2
V
Product Code
Thick Film
Chip Resistors
Size, Power Rating
Type : inches Power R.
0.05 W
1GE : 0201
0.063 W
2GE : 0402
0.1 W
3GE : 0603
0.125 W
6GE : 0805
0.25 W
8GE : 1206
0.25 W
14 : 1210
0.5 W
12 : 1812
0.5 W
12Z : 2010
1W
1T : 2512
Code
Y
]Nil
Marking
Marking
Value Marking on
black side
No marking
Resistance Tolerance
Code
J
0
Tolerance
±5%
Jumper
Resistance Value
The first two digits are significant figures of resistance and
the third one denotes number of zeros following. Decimal
Point is expressed by R as 4.7 = 4R7.
Jumper is expressed by R00.
Packaging Methods
Packaging
Punched (Paper) Taping
V
(Only 3G, 6G, 8G type)
Code
U
Embossed Taping
(Only 14, 12, 12Z, 1T type)
B
Bulk case
(Only 2G, 3G, 6G type)
X
Punched (Paper) Taping
2 mm pitch, 10000 pcs.
Y
Punched (Paper) Taping
2 mm pitch, 20000 pcs.
C
Punched (Paper) Taping
2 mm pitch, 15000 pcs.
✽ When omitted, all the rest P/N factors shall be moved up respectively.
Design, Specifications are subject to change without notice.
Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.
(Only 2G, 3G type)
(Only 2G type)
(Only 1G type)
Thick Film Chip Resistors
■ Dimensions in mm (not to scale)
■ Construction
L
a
W
Protective coating
High purity alumina
Termination (Inner)
t
substrate
b
Dimensions (mm)
Type
(inches)
Termination
ERJ1G
(0201)
ERJ2G
(0402)
ERJ3G
(0603)
ERJ6G
(0805)
ERJ8G
(1206)
ERJ14
(1210)
ERJ12
(1812)
ERJ12Z
(2010)
ERJ1T
(2512)
(Between)
Resistive element
Termination (Outer)
L
W
a
b
Weight
(1000 pcs.)
t
0.60±0.03 0.30±0.03 0.12±0.05 0.15±0.05 0.25±0.05
0.15 g
1.00±0.05 0.50±0.05 0.20±0.10 0.25±0.05 0.35±0.05
0.8 g
1.60±0.15 0.80+0.15
0.30±0.20 0.30±0.15 0.45±0.10
Ð0.05
2g
2.00±0.20 1.25±0.10 0.40±0.20 0.40±0.20 0.60±0.10
4g
3.20
+0.05
Ð0.20
3.20
±0.20
1.60
+0.05
Ð0.15
2.50
±0.20
0.50
±0.20
0.50
±0.20
0.50
±0.20
0.60
±0.10
0.50
±0.20
10 g
0.60
±0.10
16 g
4.50±0.20 3.20±0.20 0.50±0.20 0.50±0.20 0.60±0.10
27 g
5.00±0.20 2.50±0.20 0.60±0.20 0.60±0.20 0.60±0.10
27 g
6.40±0.20 3.20±0.20 0.65±0.20 0.60±0.20 0.60±0.10
45 g
■ Ratings
Type
(inches)
ERJ1G
(0201)
ERJ2G
(0402)
ERJ3G
(0603)
ERJ6G
(0805)
ERJ8G
(1206)
ERJ14
(1210)
ERJ12, 12Z
(1812, 2010)
ERJ1T
(2512)
Jumper
Power Rating Limiting Element Maximum Overload
Resistance
Voltage (Maximum Voltage(2)
at 70 ¡C
Tolerance(%)
RCWV)(1) (V)
(W)
(V)
Resistance Range (W)
min.
max.
0.05
15
30
±5
10
1 M
0.063
50
100
±5
1
2.2 M
0.1
50
100
±5
1
10 M
0.125
150
200
±5
1
10 M
0.25
200
400
±5
1
10 M
0.25
200
400
±5
1
10 M
0.5
200
400
±5
1
10 M
1
200
400
±5
1
1 M
1G
2G á 3G
6Gá8Gá14á12á12Zá1T
Rated Current
Maximum Overload Current
0.5 A
1 A
2 A
1A
2A
4A
T.C.R.
Standard
´10-6/¡C
Resistance Values
(ppm/¡C)
<10 W:
Ð100 to
+600
E24
E24
E24
10 W to
1 MW:
±200
E24
E24
E24
1 MW<:
Ð400 to
+150
E24
E24
(1) Rated Continuous Working Voltage (RCWV) shall be determined from RCWV= ÖPower Rating ´ Resistance Values, or Limiting Element Voltage
(max. RCWV) listed above, whichever less.
(2) Overload (Short-time Overload) Test Voltage (SOTV) shall be determined from SOTV=2.5 ´ Power Rating or max. Overload Voltage listed above
whichever less.
70 ¡C
100Ð55 ¡C
80
60
3G, 6G, 8G
40
1G,2G,14,12,12Z,1T
155 ¡C
20
0Ð60 Ð40 Ð20 0 20 40 60 80125100¡C120 140 160 180
Ambient Temperature (¡C)
Rated Load (%)
Power Derating Curve
For resistors operated in ambient temperatures above
70 ¡C, power rating shall be derated in accordance
with the right figure.
Design, Specifications are subject to change without notice.
Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.
Thick Film Chip Resistors
■ Packaging Methods
● Standard Quantity
Type
(inches)
Thickness
(mm)
Punched (Paper) Taping
ERJ1G
(0201)
ERJ2G
(0402)
ERJ3G
(0603)
ERJ6G
(0805)
ERJ8G
(1206)
ERJ14
(1210)
ERJ12,12Z
(1812, 2010)
ERJ1T
(2512)
0.25
15000 pcs./reel (2 mm pitch)
10000
20000
10000
5000
0.35
0.45
pcs./reel
pcs./reel
pcs./reel
pcs./reel
Embossed Taping
(4 mm pitch)
Bulk Case
(2 mm pitch)
(2 mm pitch)
(2 mm pitch)
(4 mm pitch)✽
0.6
5000 pcs./reel (4 mm pitch)✽
0.6
5000 pcs./reel (4 mm pitch)✽
50000 pcs./case
25000 pcs./case
10000 pcs./case
0.6
5000 pcs./reel
0.6
5000 pcs./reel
0.6
4000 pcs./reel
✽ Please ask us when resistors except standard specification shown above talde are needed.
● Taping Reel
● Bulk Case
(mm)
T
Slider
12
Shutter
38
fB
fC
fA
fA
Type
110
W
fB
fC
W
T
Dimensions 1G,2G,3G
9.0±1.0 11.4±2.0
0
(mm)
6G,8G,14 180.0Ð3.0
60 min. 13.0±1.0
12,12Z,1T
13.0±1.0 15.4±2.0
● Punched (Paper) Taping
Compartment
Chip component
Type
1G
2G
Dimensions
3G
(mm)
6G
8G
P1 P2
A
B
0.38±0.05
0.70±0.05
1.10±0.10
1.65±0.15
2.00±0.15
0.68±0.05
1.20±0.05
1.90±0.10
2.50±0.20
3.60±0.20
8.00±0.20
3.50±0.05
1.75±0.10
P2
P0
fD0
2.00±0.05
4.00±0.10
1.50+0.10
0
T
0.47±0.05
0.52±0.05
0.70±0.05
Type
P1
1G
2.00±0.10
Dimensions 2G
(mm)
3G
6G 4.00±0.10
8G
W
F
E
F
W
A
Tape running direction
P0
Compartment
B
B
A
T
Sprocket hole
fD0
F E
W
Sprocket hole
fD0
● Embossed Taping
E
0.84±0.05
t
Chip component
Type
14
Dimensions 12
(mm)
12Z
1T
A
2.80±0.20
3.50±0.20
2.80±0.20
3.60±0.20
Type
P2
14
Dimensions 12
2.00±0.05
(mm)
12Z
1T
P1
P2
B
fD1
Tape running direction
P0
W
F
E
P1
3.50±0.20 8.00±0.30 3.50±0.05
4.80±0.20
1.75±0.10 4.00±0.10
5.30±0.20 12.00±0.30 5.50±0.05
6.90±0.20
P0
fD0
t
4.00±0.10
1.50+0.10
0
1.00±0.10
Design, Specifications are subject to change without notice.
Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.
fD1
1 min.
1.5 min.
Thick Film Chip Resistors
■ Recommended Land Pattern
In the case of flow soldering, the land width must be smaller than the Chip Resistor width to control the solder amount
properly. Generally, the land width should be 0.7 to 0.8 times (W) of the width of chip resistor. In the case of reflow soldering,
solder amount can be adjusted, therefor the land width should be set to 1.0 to 1.3 times chip resistor width (W).
Type
(inches)
ERJ1G(0201)
ERJ2G(0402)
ERJ3G(0603)
ERJ6G(0805)
ERJ8G(1206)
ERJ14(1210)
ERJ12(1812)
ERJ12Z(2010)
ERJ1T(2512)
c
Chip Resistor
a
b
Dimensions (mm)
a
b
c
0.3 to 0.4
0.8 to 0.9 0.25 to 0.35
0.5 to 0.6
1.4 to 1.6
0.4 to 0.6
0.7 to 0.9
2 to 2.2
0.8 to 1
1 to 1.4
3.2 to 3.8
0.9 to 1.4
2 to 2.4
4.4 to 5
1.2 to 1.8
2 to 2.4
4.4 to 5
1.8 to 2.8
3.3 to 3.7
5.7 to 6.5
2.3 to 3.5
3.6 to 4
6.2 to 7
1.8 to 2.8
5 to 5.4
7.6 to 8.6
2.3 to 3.5
■ Recommended Soldering Conditions
Recommendations and precautions are described below.
● Recommended soldering conditions for reflow
áReflow soldering shall be two times maximum.
áPlease contact us for additional information when you
use in conditions other than those specified.
áPlease measure a temperature of terminations and study
solderability every kind of solder and board, before actual
use.
For solder (Example : Sn/Pb)
Preheating
Main heating
Peak
Peak
Time
140 ¡C to 160 ¡C
60 s to 120 s
Above 200 ¡C
30 s to 40 s
235 ± 5 ¡C
max. 10 s
For lead-free solder (Example : Sn/Ag/Cu)
Temperature
Time
Preheating
Temperature
Temperature
Preheating
Heating
Main heating
Peak
150 ¡C to 180 ¡C
60 s to 120 s
Above 230 ¡C
30 s to 40 s
max. 260 ¡C
max. 10 s
Time
● Recommended soldering conditions for flow
For solder
For lead-free solder
Temperature
Time
Temperature
Time
Preheating
140 ¡C to 160 ¡C
60 s to 120 s
150 ¡C to 180 ¡C
60 s to 120 s
Soldering
245±5 ¡C
20 s to 30 s
max. 260 ¡C
max. 10 s
Cautions for Safety
1. If transient load (heavy load in a short time) like pulse is expected to be applied, carry out evaluation and
confirmation test with the resistors actually mounted on your own board.
When the load of more than rated power is applied under the load condition at steady state, it may
impair performance and/or reliability of resistor.
Never exceed the rated power.
2. Chlorine type or other high-activity flux is not recommended as the residue may affect performance or reliability of
resistors.
3. When soldering with soldering iron, never touch the body of the chip resistor with a tip of the soldering iron. When
using a soldering iron with a tip at high temperature, solder for a time as short as possible (three seconds or less
up to 350 ¡C).
4. Avoid physical shock to the resistor and nipping of the resistor with hard tool (a pair of pliers or tweezers) as it may
damage protective film or the body of resistor and may affect resistorÕs performance.
Design, Specifications are subject to change without notice.
Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.
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