MA-COM MA4SPS402 Surmounttm pin diode rohs compliant Datasheet

MA4SPS402
SURMOUNTTM PIN Diode
RoHS Compliant
Rev V6
Features
♦
♦
♦
♦
♦
♦
♦
♦
Surface Mount
No Wire Bonding Required
Rugged Silicon-Glass Construction
Silicon Nitride Passivation
Polymer Scratch Protection
Low Parasitic Capacitance and Inductance
Higher Average and Peak Power Handling
RoHS Compliant
Description
This device is a Silicon-Glass PIN diode chip
fabricated with M/A-COM Technology Solutions patented HMICTM
process. This device features two
silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one
pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls
electrically conductive. Selective backside
metallization is applied producing a surface mount
device. This vertical conic topology provides for
exceptional heat transfer from the active area. The
topside is fully encapsulated with silicon nitride and
has an additional polymer layer for scratch and
impact protection. These protective coatings prevent
damage to the junction and the anode air-bridge
during handling and assembly.
1. Backside metal: 0.1 µM thick.
2. Yellow hatched areas indicate backside ohmic gold
INCHES
MM
DIM
Min.
Max.
Min.
Max.
A
0.046
0.051
1.170
1.290
B
0.017
0.021
0.432
0.533
C
0.004
0.006
0.102
0.203
D
0.015
0.017
0.381
0.432
E
0.014
0.016
0.356
0.406
Applications
These surmount devices are suitable for usage in
moderate incident power (5W C.W.) or higher
incident peak power (50W) series, shunt, or
series-shunt switches. Lower parasitic inductance,
0.45nH, and excellent RC constant (0.23pS), make
the devices ideal for higher frequency switch
elements compared to their plastic device
counterparts.
ADVANCED: Data Sheets contain information regarding a product MA-COM Technical
Solutions is considering for development. Performance is based on target specifications,
simulated results, and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical
Solutions has under development. Performance is based on engineering tests. Specifications
are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be
available. Commitment to produce in volume is not guaranteed.
Absolute Maximum Ratings @ TAMB = 25°C
(unless otherwise specified)
Parameter
Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Junction Temperature
Dissipated Power
( RF & DC )
Mounting Temperature
Absolute Maximum
250mA
-100V
-55°C to +125°C
-55 °C to +150°C
+175°C
1W
+280°C for 30 seconds
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
MA-COM Technical Solutions and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice.
MA4SPS402
SURMOUNTTM PIN Diode
RoHS Compliant
Rev V6
Electrical Specifications @ TAMB = +25°C
Symbol
Conditions
Units
CT1,3
-40V, 1MHz
CT1,3
Min.
Typical
Max.
pF
0.055
0.06
-40V, 1GHz
pF
0.045
RS2,3
10mA, 1GHz
Ω
5.0
5.8
VF
10mA
V
0.90
1.00
VR
-10μA
V
IR
-70V
μA
-0.1
RØJL4
IH=1A, IL=10mA
°C/W
150
TL
+10mA / -6mA
( 50% - 90% V )
nS
200
-70
-100
-10
400
1. Total Capacitance, CT, is equivalent to the sum of Junction Capacitance and Parasitic Capacitance.
CT = CJ (Junction Capacitance) + CPAR (Parasitic Capacitance)
2.
Series resistance RS is equivalent to the total diode resistance:
RS = RJ (Junction Capacitance Junction Resistance) + RO (Ohmic Resistance)
3
RS and CT are measured on an HP4291A Impedance Analyzer with die mounted in an ODS-186 package
with conductive silver epoxy.
4.
Steady-state RØJL measured with die mounted in an ODS-186 package with conductive silver epoxy.
ADVANCED: Data Sheets contain information regarding a product MA-COM Technical
Solutions is considering for development. Performance is based on target specifications,
simulated results, and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical
Solutions has under development. Performance is based on engineering tests. Specifications
are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be
available. Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
MA-COM Technical Solutions and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice.
MA4SPS402
SURMOUNTTM PIN Diode
RoHS Compliant
Rev V6
MA4SPS402 Typical RF Performance @ TAMB +25°C
Rs as a Function of Forward Current and Frequency
20
500uA
15
1m A
10
2m A
5
10m A
50m A
0
0
100
200
300
400
500
600
700
800
900
1000
F re q u e n c y (M H z )
MA4SPS402 Rs vs I at 100 MHZ and 1,000 MHz
1000.0
100 MHz
Rs_100 MHz
Rs_1,000 MHz
100.0
Rs ( Ohms )
1 GHz
10.0
1.0
0.1
0.01
0.10
1.00
10.00
100.00
I ( mA )
ADVANCED: Data Sheets contain information regarding a product MA-COM Technical
Solutions is considering for development. Performance is based on target specifications,
simulated results, and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical
Solutions has under development. Performance is based on engineering tests. Specifications
are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be
available. Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
MA-COM Technical Solutions and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice.
MA4SPS402
SURMOUNTTM PIN Diode
RoHS Compliant
Rev V6
MA4SPS402 Typical RF Performance @ TAMB +25°C
CT as a Function of Reverse Voltage and Frequency
0 .0 7 0
0V
0 .0 6 0
-5 V
0 .0 5 0
-4 0 V
0 .0 4 0
0 .0 3 0
0 .0 2 0
0 .0 1 0
0 .0 0 0
0
100
200
300
400
500
600
700
800
900
1000
F re q u e n c y (M H z )
MA4SPS402 Ct vs V at 100 MHz and 1,000 MHz
0.060
0.056
Ct ( pF )
0.052
Ct @ 100 MHz
0.048
0.044
Ct @ 1000 MHz
0.040
0.00
10.00
20.00
30.00
40.00
Reverse Voltage ( V )
ADVANCED: Data Sheets contain information regarding a product MA-COM Technical
Solutions is considering for development. Performance is based on target specifications,
simulated results, and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical
Solutions has under development. Performance is based on engineering tests. Specifications
are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be
available. Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
MA-COM Technical Solutions and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice.
MA4SPS402
SURMOUNTTM PIN Diode
RoHS Compliant
Rev V6
RP as a Function of Reverse Voltage and Frequency
MA4SPS402 Rp vs V at 100 MHz and 1,000 MHz
1.E+06
Rp ( Ohms )
Rp @ 100 MHz
Rp @ 1000 MHz
1.E+05
1.E+04
0.00
10.00
20.00
30.00
40.00
Reverse Voltage ( V )
ADVANCED: Data Sheets contain information regarding a product MA-COM Technical
Solutions is considering for development. Performance is based on target specifications,
simulated results, and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical
Solutions has under development. Performance is based on engineering tests. Specifications
are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be
available. Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
MA-COM Technical Solutions and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice.
MA4SPS402
SURMOUNTTM PIN Diode
RoHS Compliant
Rev V6
MA4SPS402 ADS SPICE Model & Schematic
MA4SPS402 SPICE Model
PinDiodeModel
NLPINM1
Is=1.0E-14 A
Vi=0.0 V
Un=900 cm^2/V-sec
Wi=6.5 um
Rr=20 K Ohm
Cmin=0.045
Tau=0.20 usec
Rs=0.1 Ohm
Cj0=0.06 pF
Vj=0.7 V
M=0.5
Fc=0.5
Imax=1.0E+6 A/m^2
Kf=0.0
Af=1.0
MA4SPS402 Schematic
wBv=100 V
wPmax=1.0 W
Ffe=1.0
ADVANCED: Data Sheets contain information regarding a product MA-COM Technical
Solutions is considering for development. Performance is based on target specifications,
simulated results, and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical
Solutions has under development. Performance is based on engineering tests. Specifications
are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be
available. Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
MA-COM Technical Solutions and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice.
MA4SPS402
SURMOUNTTM PIN Diode
RoHS Compliant
Rev V6
Handling
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin
oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components.
Bulk handling should insure that abrasion and mechanical shock are minimized.
Die Attach
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are
conveniently located on the bottom surface of these devices and are removed from the active junction locations.
These devices are well suited for solder attachment onto hard and soft substrates. The use of 80/20, Au/Sn,
60/40, Sn/Pb or RoHS compliant solders is recommended. Conductive silver epoxy solder may also be used but
could result in an increase in series and thermal resistance.
When soldering these devices to a hard substrate, hot gas die bonding is preferred. We recommend utilizing a
vacuum tip and force of 60 to 100 grams applied to the top surface of the device. When soldering to soft
substrates, it is recommended to use a lead-tin interface at the circuit board mounting pads. Position the die so
that its mounting pads are aligned with the circuit board mounting pads and reflow the solder by heating the circuit
trace near the mounting pads while applying 60 to 100 grams of force perpendicular to the top surface of the die.
The solder joint must not be made one pad at a time. Doing so could create unequal heat flow and produce
thermal and/or mechanical stresses. It is also not recommended to reflow solder by causing heat to flow through
the top surface of the die. Since the HMIC glass is transparent, the edges of the mounting pads can be visually
inspected through the die after attach is completed.
Recommended temperature and re-flow profiles for 60/40, Sn/Pb and RoHS compliant solders are provided in
Application Note M538 , “Surface Mounting Instructions“.
Ordering Information
MA4SPS402 SURMOUNTS may be ordered in either gel packs or tape and reeled by adding the appropriate suffix per the table below. Tape and reel dimensions are provided in Application Note M513 located on the M/A-COM
website at www.macomtech.com.
Part Number
Tape and Reel
Waffle Pack
Gel Pack
MA4SPS402
MADP-000402-12530G
ADVANCED: Data Sheets contain information regarding a product MA-COM Technical
Solutions is considering for development. Performance is based on target specifications,
simulated results, and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical
Solutions has under development. Performance is based on engineering tests. Specifications
are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be
available. Commitment to produce in volume is not guaranteed.
Pocket Tape
MADP-000402-12530P
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
MA-COM Technical Solutions and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice.
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