MC100EPT23 3.3VDual Differential LVPECL/LVDS/CML to LVTTL/LVCMOS Translator The MC100EPT23 is a dual differential LVPECL/LVDS/CML to LVTTL/LVCMOS translator. Because LVPECL (Positive ECL), LVDS, and positive CML input levels and LVTTL/LVCMOS output levels are used, only +3.3 V and ground are required. The small outline 8-lead SOIC package and the dual gate design of the EPT23 makes it ideal for applications which require the translation of a clock or data signal. The EPT23 is available in only the ECL 100K standard. Since there are no LVPECL outputs or an external VBB reference, the EPT23 does not require both ECL standard versions. The LVPECL/LVDS inputs are differential. Therefore, the MC100EPT23 can accept any standard differential LVPECL/LVDS input referenced from a VCC of +3.3 V. http://onsemi.com MARKING DIAGRAMS* 8 SOIC−8 D SUFFIX CASE 751 8 1 1 8 Features TSSOP−8 DT SUFFIX CASE 948R 8 1.5 ns Typical Propagation Delay Maximum Operating Frequency > 275 MHz 1 KA23 ALYWG G 1 LVPECL/LVDS/CML Inputs, LVTTL/LVCMOS Outputs 24 mA LVTTL Outputs Operating Range: VCC = 3.0 V to 3.6 V with GND = 0 V DFN8 MN SUFFIX CASE 506AA Pb−Free Packages are Available 3T M G G • • • • • • KPT23 ALYW G 1 A L Y W M G 4 = Assembly Location = Wafer Lot = Year = Work Week = Date Code = Pb−Free Package (Note: Microdot may be in either location) *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. © Semiconductor Components Industries, LLC, 2006 December, 2006 − Rev. 15 1 Publication Order Number: MC100EPT23/D MC100EPT23 Table 1. PIN DESCRIPTION D0 D0 1 8 2 7 LVPECL D1 D1 VCC Pin Q0 LVTTL 3 6 4 5 Q1 GND Function Q0, Q1 LVTTL/LVCMOS Outputs D0**, D1** D0**, D1** Differential LVPECL/LVDS/CML Inputs VCC Positive Supply GND Ground EP Exposed pad must be connected to a sufficient thermal conduit. Electrically connect to the most negative supply or leave floating open. ** Pins will default to VCC/2 when left open. (Top View) Figure 1. Logic Diagram and 8−Lead Pinout Table 2. ATTRIBUTES Characteristics Value Internal Input Pulldown Resistor 50 kW Internal Input Pullup Resistor 50 kW ESD Protection Human Body Model Machine Model Charged Device Model > 1500 V > 100 V > 2 kV Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Flammability Rating Level 1 Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in Transistor Count 91 Devices Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see Application Note AND8003/D. Table 3. MAXIMUM RATINGS Symbol Parameter Condition 1 Condition 2 Rating Unit 3.8 V 3.8 V 50 100 mA mA VCC Power Supply GND = 0 V VI Input Voltage GND = 0 V Iout Output Current Continuous Surge TA Operating Temperature Range −40 to +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm SOIC−8 SOIC−8 190 130 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board SOIC−8 41 to 44 °C/W qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm TSSOP−8 TSSOP−8 185 140 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board TSSOP−8 41 to 44 °C/W qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm DFN8 DFN8 129 84 °C/W °C/W Tsol Wave Solder <2 to 3 sec @ 248°C <2 to 3 sec @ 260°C 265 265 °C Pb Pb−Free VI VCC Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. http://onsemi.com 2 MC100EPT23 Table 4. PECL DC CHARACTERISTICS VCC = 3.3 V, GND = 0 V (Note 2) −40°C Symbol Characteristic 25°C 85°C Min Typ Max Min Typ Max Min Typ Max Unit ICCH Power Supply Current (Outputs set to HIGH) 10 18 25 10 18 25 10 18 25 mA ICCL Power Supply Current (Outputs set to LOW) 15 26 36 15 26 36 15 26 36 mA VIH Input HIGH Voltage 2075 2420 2075 2420 2075 2420 mV VIL Input LOW Voltage 1355 1675 1355 1675 1355 1675 mV VIHCMR Input HIGH Voltage Common Mode Range (Note 3) 1.2 3.3 1.2 3.3 1.2 3.3 V IIH Input HIGH Current 150 mA IIL Input LOW Current 0.5 mA 150 D D −150 −150 150 −150 −150 −150 −150 NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 2. All values vary 1:1 with VCC. 3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. Table 5. LVTTL/LVCMOS OUTPUT DC CHARACTERISTICS VCC = 3.3 V, GND = 0.0 V, TA = −40°C to 85°C Symbol Characteristic Condition VOH Output HIGH Voltage IOH = −3.0 mA VOL Output LOW Voltage IOL = 24 mA IOS Output Short Circuit Current Min Typ Max Unit 2.4 V −180 0.5 V −50 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. Table 6. AC CHARACTERISTICS VCC = 3.0 V to 3.6 V, GND = 0.0 V (Note 4) −40°C 25°C Characteristic Min Typ fmax Maximum Frequency (Figure 2) 275 350 tPLH, tPHL Propagation Delay to Output Differential (Note 5) 1.2 1.2 1.5 1.5 1.8 1.8 tSK+ + tSK− − tSKPP Output−to−Output Skew++ Output−to−Output Skew−− Part−to−Part Skew (Note 6) 15 35 70 tJITTER Random Clock Jitter (RMS) (Figure 2) VPP Input Voltage Swing (Differential Configuration) tr tf Output Rise/Fall Times (0.8 V − 2.0 V) Symbol Q, Q Max 85°C Min Typ Max Min Typ 275 350 1.2 1.1 1.5 1.5 1.8 1.8 60 80 500 15 40 70 5 10 150 800 1200 330 600 900 Max 275 350 1.3 1.1 1.7 1.5 2.4 1.8 ns 70 80 500 30 40 140 125 80 500 ps 5 10 5 10 ps 150 800 1200 150 800 1200 mV 330 600 900 330 650 900 ps Unit MHz NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 4. Measured with a 750 mV 50% duty−cycle clock source. RL = 500 W to GND and CL = 20 pF to GND. Refer to Figure 3. 5. Reference (VCC = 3.3V ± 5%; GND = 0 V) 6. Skews are measured between outputs under identical conditions. http://onsemi.com 3 MC100EPT23 12 VOL 0.5 V VOH 8 VOH (V) 2.0 JITTER 4 1.0 0.0 0 100 200 300 0 400 FREQUENCY (MHz) Figure 2. Typical VOH / Jitter versus Frequency (255C) APPLICATION TTL RECEIVER CHARACTERISTIC TEST *CL includes fixture capacitance CL* RL AC TEST LOAD GND Figure 3. TTL Output Loading Used for Device Evaluation http://onsemi.com 4 RANDOM CLOCK JITTER (ps RMS) 3.0 MC100EPT23 ORDERING INFORMATION Package Shipping † SOIC−8 98 Units / Rail MC100EPT23DG SOIC−8 (Pb−Free) 98 Units / Rail MC100EPT23DR2 SOIC−8 2500 / Tape & Reel MC100EPT23DR2G SOIC−8 (Pb−Free) 2500 / Tape & Reel MC100EPT23DT TSSOP−8 100 Units / Rail MC100EPT23DTG TSSOP−8 (Pb−Free) 100 Units / Rail MC100EPT23DTR2 TSSOP−8 2500 / Tape & Reel MC100EPT23DTR2G TSSOP−8 (Pb−Free) 2500 / Tape & Reel MC100EPT23MNR4 DFN8 1000 / Tape & Reel DFN8 (Pb−Free) 1000 / Tape & Reel Device MC100EPT23D MC100EPT23MNR4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Resource Reference of Application Notes AN1405/D − ECL Clock Distribution Techniques AN1406/D − Designing with PECL (ECL at +5.0 V) AN1503/D − ECLinPSt I/O SPiCE Modeling Kit AN1504/D − Metastability and the ECLinPS Family AN1568/D − Interfacing Between LVDS and ECL AN1672/D − The ECL Translator Guide AND8001/D − Odd Number Counters Design AND8002/D − Marking and Date Codes AND8020/D − Termination of ECL Logic Devices AND8066/D − Interfacing with ECLinPS AND8090/D − AC Characteristics of ECL Devices http://onsemi.com 5 MC100EPT23 PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE AH NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. −X− A 8 5 0.25 (0.010) S B 1 M Y M 4 K −Y− G C N DIM A B C D G H J K M N S X 45 _ SEATING PLANE −Z− 0.10 (0.004) H D 0.25 (0.010) M Z Y S X M J S SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 6 MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8 _ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 _ 8 _ 0.010 0.020 0.228 0.244 MC100EPT23 PACKAGE DIMENSIONS TSSOP−8 DT SUFFIX PLASTIC TSSOP PACKAGE CASE 948R−02 ISSUE A 8x 0.15 (0.006) T U K REF 0.10 (0.004) S 2X L/2 8 1 PIN 1 IDENT S T U V S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 6. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. S 5 0.25 (0.010) B −U− L 0.15 (0.006) T U M M 4 A −V− F DETAIL E C 0.10 (0.004) −T− SEATING PLANE D −W− G DETAIL E http://onsemi.com 7 DIM A B C D F G K L M MILLIMETERS MIN MAX 2.90 3.10 2.90 3.10 0.80 1.10 0.05 0.15 0.40 0.70 0.65 BSC 0.25 0.40 4.90 BSC 0_ 6_ INCHES MIN MAX 0.114 0.122 0.114 0.122 0.031 0.043 0.002 0.006 0.016 0.028 0.026 BSC 0.010 0.016 0.193 BSC 0_ 6_ MC100EPT23 PACKAGE DIMENSIONS DFN8 CASE 506AA−01 ISSUE D D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994 . 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. A B PIN ONE REFERENCE 2X 0.10 C 2X ÇÇÇÇ ÇÇÇÇ ÇÇÇÇ ÇÇÇÇ 0.10 C TOP VIEW 0.08 C SEATING PLANE MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.20 0.30 2.00 BSC 1.10 1.30 2.00 BSC 0.70 0.90 0.50 BSC 0.20 −−− 0.25 0.35 A 0.10 C 8X DIM A A1 A3 b D D2 E E2 e K L E (A3) SIDE VIEW A1 C D2 e e/2 4 1 8X L E2 K 8 5 8X b 0.10 C A B 0.05 C NOTE 3 BOTTOM VIEW ECLinPS is a trademark of Semiconductor Components INdustries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 http://onsemi.com 8 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MC100EPT23/D