Vishay MURD620CTPBF Ultrafast rectifier, 2 x 3 a fred pt Datasheet

VS-MURD620CTPbF
Vishay Semiconductors
Ultrafast Rectifier, 2 x 3 A FRED Pt®
FEATURES
Base
common
cathode
4
• Ultrafast recovery time
• Low forward voltage drop
• Low leakage current
• 175 °C operating junction temperature
2
Common
cathode
1
3
Anode
Anode
D-PAK (TO-252AA)
• Compliant to RoHS Directive 2002/95/EC
• Meets MSL level 1, per J-STD-020, LF maximum peak of
260 °C
DESCRIPTION/APPLICATIONS
VS-MURD620CTPbF is the state of the art ultrafast recovery
rectifier specifically designed with optimized performance of
forward voltage drop and ultrafast recovery time.
The planar structure and the platinum doped life time
control, guarantee the best overall performance,
ruggedness and reliability characteristics.
These devices are intended for use in the output rectification
stage of SMPS, UPS, DC/DC converters as well as
freewheeling diode in low voltage inverters and chopper
motor drives.
Their extremely optimized stored charge and low recovery
current minimize the switching losses and reduce over
dissipation in the switching element and snubbers.
PRODUCT SUMMARY
Package
D-PAK (TO-252AA)
IF(AV)
2x3A
VR
200 V
VF at IF
1.0 V
trr typ.
See Recovery table
TJ max.
175 °C
Diode variation
Common cathode
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
Peak repetitive reverse voltage
VRRM
Average rectified forward current per device
IF(AV)
Non-repetitive peak surge current
IFSM
Peak repetitive forward current per diode
IFM
Operating junction and storage temperatures
TEST CONDITIONS
Total device, rated VR, TC = 146 °C
MAX.
UNITS
200
V
6
50
Rated VR, square wave, 20 kHz, TC = 146 °C
A
6
TJ, TStg
- 65 to 175
°C
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
Breakdown voltage,
blocking voltage
Forward voltage
SYMBOL
VBR,
VR
VF
TEST CONDITIONS
MIN.
TYP.
MAX.
200
-
-
IF = 3 A
-
-
1.0
IF = 3 A, TJ = 125 °C
-
-
0.96
IF = 6 A
-
-
1.2
IR = 100 μA
IF = 6 A, TJ = 125 °C
-
-
1.13
VR = VR rated
-
-
5
TJ = 125 °C, VR = VR rated
-
-
250
UNITS
V
μA
Reverse leakage current
IR
Junction capacitance
CT
VR = 200 V
-
12
-
pF
Series inductance
LS
Measured lead to lead 5 mm from package body
-
8.0
-
nH
Document Number: 94084
Revision: 13-Jan-11
For technical questions within your region, please contact one of the following:
[email protected], [email protected], [email protected]
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VS-MURD620CTPbF
Vishay Semiconductors
Ultrafast Rectifier,
2 x 3 A FRED Pt®
DYNAMIC RECOVERY CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER
Reverse recovery time
SYMBOL
trr
TEST CONDITIONS
MIN.
TYP.
MAX.
IF = 1.0 A, dIF/dt = 50 A/μs, VR = 30 V
-
-
35
IF = 0.5 A, IR = 1.0 A, IREC = 0.25 A
-
-
25
TJ = 25 °C
-
19
-
-
26
-
TJ = 125 °C
Peak recovery current
IRRM
TJ = 25 °C
TJ = 125 °C
IF = 3 A
dIF/dt = 200 A/μs
VR = 160 V
-
3.1
-
-
4.6
-
UNITS
ns
A
TJ = 25 °C
-
30
-
TJ = 125 °C
-
60
-
MIN.
TYP.
MAX.
UNITS
TJ, TStg
- 65
-
175
°C
Thermal resistance,
junction to case per leg
RthJC
-
-
9.0
Thermal resistance,
junction to ambient per leg
RthJA
-
-
80
Thermal resistance,
case to heatsink
RthCS
-
-
-
-
0.3
-
-
0.01
-
oz.
-
12
(10)
kgf · cm
(lbf · in)
Reverse recovery charge
Qrr
nC
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
Maximum junction and
storage temperature range
SYMBOL
TEST CONDITIONS
Mounting surface, flat, smooth and
greased
Weight
6.0
(5.0)
Mounting torque
Marking device
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2
Case style D-PAK
°C/W
g
MURD620CT
For technical questions within your region, please contact one of the following:
[email protected], [email protected], [email protected]
Document Number: 94084
Revision: 13-Jan-11
VS-MURD620CTPbF
100
Vishay Semiconductors
100
10
TJ = 175 °C
TJ = 150 °C
TJ = 25 °C
1
TJ = 175 °C
IR - Reverse Current (µA)
IF - Instantaneous Forward Current (A)
Ultrafast Rectifier,
2 x 3 A FRED Pt®
10
TJ = 150 °C
TJ = 125 °C
1
TJ = 100 °C
0.1
TJ = 25 °C
0.01
0.001
0.1
0
0.4
0.2
0.6
0.8
1.2
1.0
1.4
50
0
1.6
100
200
150
VF - Forward Voltage Drop (V)
VR - Reverse Voltage (V)
Fig. 1 - Typical Forward Voltage Drop Characteristics
Fig. 2 - Typical Values of Reverse Current vs.
Reverse Voltage
CT - Junction Capacitance (pF)
100
TJ = 25 °C
10
1
10
100
1000
VR - Reverse Voltage (V)
ZthJC - Thermal Impedance (°C/W)
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
10
1
PDM
0.1
Single pulse
(thermal resistance)
0.01
0.00001
0.0001
D = 0.50
D = 0.20
D = 0.10
D = 0.05
D = 0.02
D = 0.01
0.001
t1
t2
Notes:
1. Duty factor D = t1/t2 .
2. Peak TJ = PDM x ZthJC + TC
0.01
0.1
.
1
t1 - Rectangular Pulse Duration (s)
Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics
Document Number: 94084
Revision: 13-Jan-11
For technical questions within your region, please contact one of the following:
[email protected], [email protected], [email protected]
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VS-MURD620CTPbF
Ultrafast Rectifier,
2 x 3 A FRED Pt®
Vishay Semiconductors
50
40
IF = 3 A
IF = 6 A
160
DC
150
Square wave (D = 0.50)
Rated VR applied
140
30
20
130
See note (1)
10
100
120
0
1
2
3
4
5
1000
IF(AV) - Average Forward Current (A)
dIF/dt (A/µs)
Fig. 5 - Maximum Allowable Case Temperature vs.
Average Forward Current
Fig. 7 - Typical Reverse Recovery Time vs. dIF/dt
140
4.5
4.0
120
3.5
VR = 30 V
TJ = 125 °C
TJ = 25 °C
100
3.0
RMS limit
2.5
Qrr (nC)
Average Power Loss (W)
VR = 30 V
TJ = 125 °C
TJ = 25 °C
170
trr (ns)
Allowable Case Temperature (°C)
180
D = 0.01
D = 0.02
D = 0.05
D = 0.10
D = 0.20
D = 0.50
2.0
1.5
1.0
DC
0.5
1
2
3
4
80
60
40
20
0
0
IF = 6 A
IF = 3 A
5
0
100
1000
IF(AV) - Average Forward Current (A)
dIF/dt (A/µs)
Fig. 6 - Forward Power Loss Characteristics
Fig. 8 - Typical Stored Charge vs. dIF/dt
Note
(1) Formula used: T = T - (Pd + Pd
C
J
REV) x RthJC;
Pd = Forward power loss = IF(AV) x VFM at (IF(AV)/D) (see fig. 6);
PdREV = Inverse power loss = VR1 x IR (1 - D); IR at VR1 = Rated VR
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For technical questions within your region, please contact one of the following:
[email protected], [email protected], [email protected]
Document Number: 94084
Revision: 13-Jan-11
VS-MURD620CTPbF
Ultrafast Rectifier,
2 x 3 A FRED Pt®
Vishay Semiconductors
VR = 200 V
0.01 Ω
L = 70 μH
D.U.T.
dIF/dt
adjust
D
IRFP250
G
S
Fig. 9 - Reverse Recovery Parameter Test Circuit
(3)
trr
IF
ta
tb
0
Qrr
(2)
IRRM
(4)
0.5 IRRM
dI(rec)M/dt (5)
0.75 IRRM
(1) dIF/dt
(1) dIF/dt - rate of change of current
through zero crossing
(2) IRRM - peak reverse recovery current
(3) trr - reverse recovery time measured
from zero crossing point of negative
going IF to point where a line passing
through 0.75 IRRM and 0.50 IRRM
extrapolated to zero current.
(4) Qrr - area under curve defined by trr
and IRRM
Qrr =
trr x IRRM
2
(5) dI(rec)M/dt - peak rate of change of
current during tb portion of trr
Fig. 10 - Reverse Recovery Waveform and Definitions
Document Number: 94084
Revision: 13-Jan-11
For technical questions within your region, please contact one of the following:
[email protected], [email protected], [email protected]
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VS-MURD620CTPbF
Ultrafast Rectifier,
2 x 3 A FRED Pt®
Vishay Semiconductors
ORDERING INFORMATION TABLE
Device code
VS- MUR
1
2
D
6
20
CT
3
4
5
6
1
-
Vishay Semiconductors product
2
-
Ultrafast MUR series
3
-
D = D-PAK
4
-
Current rating (6 = 6 A)
5
-
Voltage rating (20 = 200 V)
6
-
CT = Center tap (dual)
7
-
Tape and reel suffix
8
-
PbF = Lead (Pb)-free
TRL PbF
7
8
TR = Tape and reel
TRL = Tape and reel (left oriented)
TRR = Tape and reel (right oriented)
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?95016
Part marking information
www.vishay.com/doc?95059
Packaging information
www.vishay.com/doc?95033
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For technical questions within your region, please contact one of the following:
[email protected], [email protected], [email protected]
Document Number: 94084
Revision: 13-Jan-11
Outline Dimensions
Vishay High Power Products
D-PAK (TO-252AA)
DIMENSIONS in millimeters and inches
(5)
A
E
b3
Pad layout
C
A
(3)
0.010 M C A B
c2
A
L3 (3)
Ø1
4
Ø2
4
B
Seating
plane
H
D (5)
1
2
0.245
MIN.
(6.23)
D1
L4
3
3
(2) L5
2
b
1
A
c
b2
0.06
MIN.
(1.524)
0.010 M C A B
2x e
0.093 (2.38)
0.085 (2.18)
(L1)
Detail “C”
Rotated 90 °CW
Scale: 20:1
H (7)
Lead tip
C
Gauge
plane
L2
MILLIMETERS
MIN.
0.488 (12.40)
0.409 (10.40)
0.089
MIN.
(2.28)
Detail “C”
SYMBOL
0.265
MIN.
(6.74)
E1
INCHES
MAX.
MIN.
MAX.
C Seating
plane
C
Ø
L
NOTES
A1
SYMBOL
MILLIMETERS
MIN.
MAX.
MAX.
A
2.18
2.39
0.086
0.094
e
A1
-
0.13
-
0.005
H
9.40
10.41
0.370
0.410
b
0.64
0.89
0.025
0.035
L
1.40
1.78
0.055
0.070
b2
0.76
1.14
0.030
0.045
L1
3
2.29 BSC
INCHES
MIN.
2.74 BSC
L2
0.51 BSC
NOTES
0.090 BSC
0.108 REF.
b3
4.95
5.46
0.195
0.215
c
0.46
0.61
0.018
0.024
L3
0.89
1.27
0.035
0.020 BSC
0.050
c2
0.46
0.89
0.018
0.035
L4
-
1.02
-
0.040
D
5.97
6.22
0.235
0.245
5
L5
1.14
1.52
0.045
0.060
D1
5.21
-
0.205
-
3
Ø
0°
10°
0°
10°
E
6.35
6.73
0.250
0.265
5
Ø1
0°
15°
0°
15°
E1
4.32
-
0.170
-
3
Ø2
25°
35°
25°
35°
3
2
Notes
(1)
Dimensioning and tolerancing as per ASME Y14.5M-1994
(2)
Lead dimension uncontrolled in L5
(3)
Dimension D1, E1, L3 and b3 establish a minimum mounting surface for thermal pad
(4)
Section C - C dimension apply to the flat section of the lead between 0.13 and 0.25 mm (0.005 and 0.10") from the lead tip
(5)
Dimension D, and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at
the outermost extremes of the plastic body
(6)
Dimension b1 and c1 applied to base metal only
(7)
Datum A and B to be determined at datum plane H
(8)
Outline conforms to JEDEC outline TO-252AA
Document Number: 95016
Revision: 04-Nov-08
For technical questions concerning discrete products, contact: [email protected]
For technical questions concerning module products, contact: [email protected]
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Document Number: 91000
Revision: 11-Mar-11
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