ON MC74HC238A 1-of-8 decoder/ demultiplexer Datasheet

MC74HC238A
1-of-8 Decoder/
Demultiplexer
High−Performance Silicon−Gate CMOS
The MC74HC238A is identical in pinout to the LS238. The device
inputs are compatible with standard CMOS outputs; with pullup
resistors, they are compatible with LSTTL outputs.
The HC238A decodes a three−bit Address to one−of−eight
active−high outputs. This device features three Chip Select inputs, two
active−low and one active−high to facilitate the demultiplexing,
cascading, and chip−selecting functions. The demultiplexing function
is accomplished by using the Address inputs to select the desired
device output; one of the Chip Selects is used as a data input while the
other Chip Selects are held in their active states.
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MARKING
DIAGRAMS
16
PDIP−16
N SUFFIX
CASE 648
16
1
1
Features
•
•
•
•
•
•
MC74HC238AN
AWLYYWWG
16
Output Drive Capability: 10 LSTTL Loads
Outputs Directly Interface to CMOS, NMOS and TTL
Operating Voltage Range: 2.0 V to 6.0 V
Low Input Current: 1.0 mA
High Noise Immunity Characteristic of CMOS Devices
In Compliance with the Requirements Defined by JEDEC
Standard No. 7A
Chip Complexity: 100 FETs or 29 Equivalent Gates
These are Pb−Free Devices*
SOIC−16
D SUFFIX
CASE 751B
16
1
HC238AG
AWLYWW
1
16
•
•
• NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
16
1
TSSOP−16
DT SUFFIX
CASE 948F
HC
238A
ALYWG
G
1
A
= Assembly Location
WL, L
= Wafer Lot
YY, Y
= Year
WW, W = Work Week
G or G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2013
June, 2013 − Rev. 4
1
Publication Order Number:
MC74HC238A/D
MC74HC238A
A0
A0
1
16
VCC
A1
2
15
Y0
A2
3
14
Y1
CS2
4
13
Y2
CS3
5
12
Y3
CS1
6
11
Y4
Y7
7
10
Y5
GND
8
9
Y6
ADDRESS
INPUTS
A1
A2
CS1
CHIPSELECT
INPUTS
CS2
CS3
Figure 1. Pin Assignment
1
15
Y0
14
Y1
13
Y2
12
Y3
11
Y4
10
Y5
9
Y6
7
Y7
2
3
ACTIVE-HIGH
OUTPUTS
6
PIN 16 = VCC
PIN 8 = GND
4
5
Figure 2. Logic Diagram
ORDERING INFORMATION
Package
Shipping†
MC74HC238ANG
PDIP−16
(Pb−Free)
500 Units / Rail
MC74HC238ADG
SOIC−16
(Pb−Free)
48 Units / Rail
MC74HC238ADR2G
SOIC−16
(Pb−Free)
2500 Tape & Reel
MC74HC238ADTG
TSSOP−16
(Pb−Free)
96 Units / Tube
MC74HC238ADTR2G
TSSOP−16
(Pb−Free)
2500 Tape & Reel
Device
NLV74HC238ADR2G*
NLV74HC238ADTR2G*
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
TRUTH TABLE
Inputs
CS3
Outputs
CS2
CS1
A0
A1
A2
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
H
X
X
X
X
X
L
L
L
L
L
L
L
L
X
H
X
X
X
X
L
L
L
L
L
L
L
L
X
X
L
X
X
X
L
L
L
L
L
L
L
L
L
L
H
L
L
L
H
L
L
L
L
L
L
L
L
L
H
H
L
L
L
H
L
L
L
L
L
L
L
L
H
L
H
L
L
L
H
L
L
L
L
L
L
L
H
H
H
L
L
L
L
H
L
L
L
L
L
L
H
L
L
H
L
L
L
L
H
L
L
L
L
L
H
H
L
H
L
L
L
L
L
H
L
L
L
L
H
L
H
H
L
L
L
L
L
L
H
L
L
L
H
H
H
H
L
L
L
L
L
L
L
H
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2
MC74HC238A
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
– 0.5 to + 7.0
V
VCC
DC Supply Voltage (Referenced to GND)
Vin
DC Input Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
Vout
DC Output Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
Iin
DC Input Current, per Pin
± 20
mA
Iout
DC Output Current, per Pin
± 25
mA
ICC
DC Supply Current, VCC and GND Pins
± 50
mA
PD
Power Dissipation in Still Air,
750
500
450
mW
Tstg
Storage Temperature
– 65 to + 150
°C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP, SOIC or TSSOP Package)
Plastic DIP†
SOIC Package†
TSSOP Package†
°C
260
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress
ratings only. Functional operation above the Recommended Operating Conditions is not implied.
Extended exposure to stresses above the Recommended Operating Conditions may affect device
reliability.
†Derating − Plastic DIP: – 10 mW/°C from 65° to 125°C
SOIC Package: – 7 mW/°C from 65° to 125°C
TSSOP Package: − 6.1 .W/°C from 65° to 125°C
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Vin, Vout
Parameter
Min
DC Supply Voltage (Referenced to GND)
Max
Unit
2.0
6.0
V
0
VCC
V
– 55
+ 125
°C
0
0
0
1000
500
400
ns
DC Input Voltage, Output Voltage (Referenced to GND)
TA
Operating Temperature, All Package Types
tr, tf
Input Rise and Fall Time
(Figure 2)
VCC = 2.0 V
VCC = 4.5 V
VCC = 6.0 V
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3
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high−impedance circuit. For proper operation, Vin and
Vout should be constrained to the
range GND v (Vin or Vout) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
MC74HC238A
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
VCC
V
Guaranteed Limit
−55°C to 25°C
v 85°C
v 125°C
Unit
VIH
Minimum High−Level Input
Voltage
Vout = 0.1 V or VCC – 0.1 V
|Iout| v 20 mA
2.0
3.0
4.5
6.0
1.5
2.1
3.15
4.2
1.5
2.1
3.15
4.2
1.5
2.1
3.15
4.2
V
VIL
Maximum Low−Level Input
Voltage
Vout = 0.1 V or VCC – 0.1 V
|Iout| v 20 mA
2.0
3.0
4.5
6.0
0.5
0.9
1.35
1.8
0.5
0.9
1.35
1.8
0.5
0.9
1.35
1.8
V
VOH
Minimum High−Level Output
Voltage
Vin = VIH or VIL
|Iout| v 20 mA
2.0
4.5
6.0
1.9
4.4
5.9
1.9
4.4
5.9
1.9
4.4
5.9
V
Vin = VIH or VIL |Iout| v 2.4 mA
|Iout| v 4.0 mA
|Iout| v 5.2 mA
3.0
4.5
6.0
2.48
3.98
5.48
2.34
3.84
5.34
2.20
3.70
5.20
Vin = VIH or VIL
|Iout| v 20 mA
2.0
4.5
6.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
Vin = VIH or VIL |Iout| v 2.4 mA
|Iout| v 4.0 mA
|Iout| v 5.2 mA
3.0
4.5
6.0
0.26
0.26
0.26
0.33
0.33
0.33
0.40
0.40
0.40
Symbol
Parameter
Test Conditions
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
VOL
Maximum Low−Level Output
Voltage
V
Iin
Maximum Input Leakage
Current
Vin = VCC or GND
6.0
± 0.1
± 1.0
± 1.0
mA
ICC
Maximum Quiescent Supply
Current (per Package)
Vin = VCC or GND
Iout = 0 mA
6.0
4
40
160
mA
AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6.0 ns)
Symbol
Parameter
Guaranteed Limit
VCC
V
−55°C to 25°C
v 85°C
v 125°C
Unit
tPLH,
tPHL
Maximum Propagation Delay, Input A to Output Y
(Figures 3 and 6)
2.0
3.0
4.5
6.0
135
90
27
23
170
125
34
29
205
165
41
35
ns
tPLH,
tPHL
Maximum Propagation Delay, CS1 to Output Y
(Figures 4 and 6)
2.0
3.0
4.5
6.0
110
85
22
19
140
100
28
24
165
125
33
28
ns
tPLH,
tPHL
Maximum Propagation Delay, CS2 or CS3 to Output Y
(Figures 5 and 6)
2.0
3.0
4.5
6.0
120
90
24
20
150
120
30
26
180
150
36
31
ns
tTLH,
tTHL
Maximum Output Transition Time, Any Output
(Figures 4 and 6)
2.0
3.0
4.5
6.0
75
30
15
13
95
40
19
16
110
55
22
19
ns
−
10
10
10
pF
Cin
Maximum Input Capacitance
Typical @ 25°C, VCC = 5.0 V
CPD
55
Power Dissipation Capacitance (Per Package)*
* Used to determine the no−load dynamic power consumption: P D = CPD VCC
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4
2f
+ ICC VCC .
pF
MC74HC238A
SWITCHING WAVEFORMS
VALID
INPUT A
VCC
50%
OUTPUT Y
VCC
90%
50%
10%
INPUT CS1
GND
GND
tPLH
tPHL
tPHL
tPLH
tf
tr
VALID
50%
90%
50%
10%
OUTPUT Y
tTHL
tTLH
Figure 4.
Figure 3.
TEST POINT
tr
tf
INPUT
CS2, CS3
VCC
90%
50%
10%
GND
tPHL
OUTPUT Y
OUTPUT
DEVICE
UNDER
TEST
tPLH
CL*
90%
50%
10%
tTHL
tTLH
*Includes all probe and jig capacitance
Figure 5.
Figure 6. Test Circuit
PIN DESCRIPTIONS
ADDRESS INPUTS
A0, A1, A2 (Pins 1, 2, 3)
Address inputs. For any other combination of CS1, CS2, and
CS3, the outputs are at a logic low.
Address inputs. These inputs, when the chip is selected,
determine which of the eight outputs is active−low.
OUTPUTS
Y0 − Y7 (Pins 15, 14, 13, 12, 11, 10, 9, 7)
CONTROL INPUTS
CS1, CS2, CS3 (Pins 6, 4, 5)
Active−high Decoded outputs. These outputs assume a
high level when addressed and the chip is selected. These
outputs remain low when not addressed or the chip is not
selected.
Chip select inputs. For CS1 at a high level and CS2, CS3
at a low level, the chip is selected and the outputs follow the
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5
MC74HC238A
EXPANDED LOGIC DIAGRAM
15
14
A0
A1
13
1
12
2
11
A2
3
10
CS3
CS2
Y1
Y2
Y3
Y4
Y5
5
4
9
7
CS1
Y0
6
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6
Y6
Y7
MC74HC238A
PACKAGE DIMENSIONS
SOIC−16
CASE 751B−05
ISSUE K
−A−
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
9
−B−
1
P
8 PL
0.25 (0.010)
8
M
B
S
G
R
K
F
X 45 _
C
−T−
SEATING
PLANE
J
M
D
16 PL
0.25 (0.010)
M
T B
S
A
S
SOLDERING FOOTPRINT
8X
6.40
16X
1
1.12
16
16X
0.58
1.27
PITCH
8
9
DIMENSIONS: MILLIMETERS
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7
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
MC74HC238A
PACKAGE DIMENSIONS
TSSOP−16
CASE 948F−01
ISSUE B
16X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
S
V
S
K
S
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
ÇÇÇ
K1
2X
L/2
16
9
J1
B
−U−
L
SECTION N−N
J
PIN 1
IDENT.
N
8
1
0.25 (0.010)
M
0.15 (0.006) T U
S
A
−V−
N
F
DETAIL E
C
0.10 (0.004)
−T− SEATING
PLANE
D
H
G
DETAIL E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
MILLIMETERS
INCHES
DIM MIN
MAX
MIN
MAX
A
4.90
5.10 0.193 0.200
B
4.30
4.50 0.169 0.177
C
−−−
1.20
−−− 0.047
D
0.05
0.15 0.002 0.006
F
0.50
0.75 0.020 0.030
G
0.65 BSC
0.026 BSC
H
0.18
0.28 0.007
0.011
−W−
J
0.09
0.20 0.004 0.008
J1
0.09
0.16 0.004 0.006
K
0.19
0.30 0.007 0.012
K1
0.19
0.25 0.007 0.010
L
6.40 BSC
0.252 BSC
M
0_
8_
0_
8_
SOLDERING FOOTPRINT
7.06
1
0.65
PITCH
16X
0.36
16X
1.26
DIMENSIONS: MILLIMETERS
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8
MC74HC238A
PACKAGE DIMENSIONS
PDIP−16
N SUFFIX
CASE 648−08
ISSUE T
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE
MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
−A−
16
9
1
8
B
F
C
L
S
−T−
H
SEATING
PLANE
K
G
D
M
J
16 PL
0.25 (0.010)
M
T A
M
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740 0.770
0.250 0.270
0.145 0.175
0.015 0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008 0.015
0.110 0.130
0.295 0.305
0_
10 _
0.020 0.040
MILLIMETERS
MIN
MAX
18.80 19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
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MC74HC238A/D
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