TI CY74FCT543TSOIC 8-bit latched registered transceiver Datasheet

Data sheet acquired from Cypress Semiconductor Corporation.
Data sheet modified to remove devices not offered.
CY54/74FCT543T
8-Bit Latched Registered Transceiver
SCCS030 - May 1994 - Revised March 2000
Features
Functional Description
• Function, pinout, and drive compatible with FCT and
F logic
• FCT-C speed at 5.3 ns max. (Com’l)
FCT-A speed at 6.5 ns max. (Com’l)
• Reduced VOH (typically = 3.3V) versions of equivalent
FCT functions
• Edge-rate control circuitry for significantly improved
noise characteristics
• Power-off disable feature
• Matched rise and fall times
• Fully compatible with TTL input and output logic levels
• ESD > 2000V
• Sink current
64 mA (Com’l), 48 mA (Mil)
Source current
32 mA (Com’l), 12 mA (Mil)
• Separation controls for data flow in each direction
• Back to back latches for storage
• Extended commercial range of −40˚C to +85˚C
Functional Block Diagram
The FCT543T octal latched transceiver contains two sets of
eight D-type latches with separate latch enable (LEAB, LEBA)
and output enable (OEAB, OEBA) controls for each set to
permit independent control of inputting and outputting in either
direction of data flow. For data flow from A to B, for example,
the A-to-B enable (CEAB) input must be LOW in order to enter
data from A or to take data from B, as indicated in the truth
table. With CEAB LOW, a LOW signal on the A-to-B latch
enable (LEAB) input makes the A-to-B latches transparent; a
subsequent LOW-to-HIGH transition of the LEAB signal puts
the A latches in the storage mode and their output no longer
change with the A inputs. With CEAB and OEAB both LOW,
the three-stage B output buffers are active and reflect the data
present at the output of the A latches. Control of data from B
to A is similar, but uses CEAB, LEAB, and OEAB inputs.
The outputs are designed with a power-off disable feature to
allow for live insertion of boards.
Logic Block Diagram
Detail A
B0
D Q
A0
LE
A0
A1
A2
A3
A4
A5
A6
CEAB
Q D
OEAB
CEBA
LE
LEAB
OEBA
LEBA
A1
B1
A2
B2
A3
B3
A4
Detail A x 7
A7
B0
B1
B2
B3
B4
B5
B6
B7
B4
A5
B5
A6
B6
A7
B7
Pin Configurations
SOIC/QSOP
Top View
OEBA
OEAB
LEBA
1
24
CEAB
OEBA
2
23
A0
3
22
B0
LEAB
A1
4
21
B1
A2
5
20
B2
A3
6
19
B3
A4
7
18
B4
A5
8
17
B5
A6
9
16
B6
A7
10
15
B7
CEAB
11
14
LEAB
GND
12
13
OEAB
CEBA
LEBA
Copyright
VCC
CEBA
© 2000, Texas Instruments Incorporated
CY54/74FCT543T
Maximum Ratings[4, 5]
Pin Description
Name
(Above which the useful life may be impaired. For user guidelines, not tested.)
Description
OEAB
A-to-B Output Enable Input (Active LOW)
OEBA
B-to-A Output Enable Input (Active LOW)
CEAB
A-to-B Enable Input (Active LOW)
Ambient Temperature with
Power Applied............................................. –65°C to +135°C
CEBA
B-to-A Enable Input (Active LOW)
Supply Voltage to Ground Potential ............... –0.5V to +7.0V
LEAB
A-to-B Latch Enable Input (Active LOW)
DC Input Voltage ........................................... –0.5V to +7.0V
LEBA
B-to-A Latch Enable Input (Active LOW)
DC Output Voltage......................................... –0.5V to +7.0V
A
A-to-B Data Inputs or B-to-A Three-State Outputs
DC Output Current (Maximum Sink Current/Pin) ...... 120 mA
B
B-to-A Data Inputs or A-to-B Three-State Outputs
Power Dissipation .......................................................... 0.5W
Storage Temperature ................................. –65°C to +150°C
Static Discharge Voltage............................................>2001V
(per MIL-STD-883, Method 3015)
Function Table[1, 2]
Inputs
Latch
Outputs
CEAB
LEAB
OEAB
A-to-B[3]
B
H
X
X
Storing
High Z
X
H
X
Storing
X
X
X
H
X
High Z
L
L
L
Transparent
Current A Inputs
L
H
L
Storing
Previous A Inputs
Operating Range
Range
Range
VCC
Commercial
DT
0°C to +70°C
5V ± 5%
Commercial
T, AT, CT
–40°C to +85°C
5V ± 5%
Military[6]
All
–55°C to +125°C
5V ± 10%
Notes:
1. H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care.
2. A-to-B data flow shown: B-to-A flow control is the same, except using CEBA, LEBA, and OEBA.
3. Before LEAB LOW-to-HIGH Transition.
4. Unless otherwise noted, these limits are over the operating free-air temperature range.
5. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground.
6. TA is the “instant on” case temperature.
2
Ambient
Temperature
CY54/74FCT543T
Electrical Characteristics Over the Operating Range
Parameter
VOH
Description
Output HIGH Voltage
VOL
Output LOW Voltage
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
[8]
Test Conditions
Min.
Typ.[7]
Max.
Unit
VCC=Min., IOH=–32 mA
Com’l
2.0
V
VCC=Min., IOH=–15 mA
Com’l
2.4
3.3
V
VCC=Min., IOH=–12 mA
Mil
2.4
3.3
V
VCC=Min., IOL=64 mA
Com’l
0.3
0.55
V
VCC=Min., IOL=48mA
Mil
0.3
0.55
V
2.0
V
0.8
VH
Hysteresis
All inputs
0.2
VIK
Input Clamp Diode Voltage
VCC=Min., IIN=–18 mA
–0.7
IIH
Input HIGH Current
IIH
Input HIGH Current[8]
IIL
Input LOW
Current[8]
IOZH
Off State HIGH-Level Output
Current
IOZL
V
V
–1.2
V
VCC=Max., VIN=VCC
5
µA
VCC=Max., VIN=2.7V
±1
µA
VCC=Max., VIN=0.5V
±1
µA
VCC=Max., VOUT = 2.7V
10
µA
Off State LOW-Level
Output Current
VCC= Max., VOUT = 0.5V
–10
µA
IOS
Output Short Circuit Current[9]
VCC=Max., VOUT=0.0V
–225
mA
IOFF
Power-Off Disable
VCC=0V, VOUT=4.5V
±1
µA
–60
–120
Capacitance[8]
Parameter
Description
Typ.[7]
Max.
Unit
CIN
Input Capacitance
5
10
pF
COUT
Output Capacitance
9
12
pF
Notes:
7. Typical values are at VCC=5.0V, TA=+25˚C ambient.
8. This parameter is specified but not tested.
9. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample
and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of
a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter
tests, IOS tests should be performed last.
3
CY54/74FCT543T
Power Supply Characteristics
Parameter
ICC
Description
Test Conditions
Quiescent Power Supply Current VCC=Max., VIN≤0.2V, VIN≥VCC–0.2V
Typ.[7]
Max.
Unit
0.1
0.2
mA
∆ICC
Quiescent Power Supply Current VCC=Max., VIN=3.4V,
(TTL inputs)
f1=0, Outputs Open
0.5
2.0
mA
ICCD
Dynamic Power Supply Current[11] VCC=Max., One Input Toggling,
50% Duty Cycle, Outputs Open,
CEAB and OEAB=LOW, CEBA=HIGH,
VIN≤0.2V or VIN≥VCC–0.2V
0.06
0.12
mA/MHz
IC
Total Power Supply Current[12]
VCC=Max., f0=10 MHz,
50% Duty Cycle, Outputs Open,
One Bit Toggling at f1=5 MHz,
CEAB and OEAB=LOW,CEBA=HIGH,
f0=LEAB = 10 MHz,
VIN≤0.2V or VIN≥VCC–0.2V
0.7
1.4
mA
VCC=Max., f0=10 MHz,
50% Duty Cycle, Outputs Open,
One Bit Toggling at f1=5 MHz,
CEAB and OEAB=LOW, CEBA=HIGH,
f0=LEAB = 10 MHz, VIN=3.4V or VIN=GND
1.2
3.4
mA
VCC=Max., f0=10 MHz,
50% Duty Cycle, Outputs Open,
Eight Bits Toggling at f1=5 MHz,
CEAB and OEAB=LOW, CEBA=HIGH,
f0=LEAB = 10 MHz,
VIN≤0.2V or VIN≥VCC–0.2V
2.8
5.6[13]
mA
VCC=Max., f0=10 MHz,
50% Duty Cycle, Outputs Open,
Eight Bits Toggling at f1=5 MHz,
CEAB and OEAB=LOW, CEBA=HIGH,
f0=LEAB = 10 MHz, VIN=3.4V or VIN=GND
5.1
14.6[13]
mA
[10]
Notes:
10. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND.
11. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.
= IQUIESCENT + IINPUTS + IDYNAMIC
12. IC
IC
= ICC+∆ICCDHNT+ICCD(f0/2 + f1N1)
ICC = Quiescent Current with CMOS input levels
∆ICC = Power Supply Current for a TTL HIGH input (VIN=3.4V)
DH = Duty Cycle for TTL inputs HIGH
NT = Number of TTL inputs at DH
ICCD = Dynamic Current caused by an input transition pair (HLH or LHL)
= Clock frequency for registered devices, otherwise zero
f0
= Input signal frequency
f1
N1 = Number of inputs changing at f1
All currents are in milliamps and all frequencies are in megahertz.
13. Values for these conditions are examples of the ICC formula. These limits are specified but not tested.
4
CY54/74FCT543T
Switching Characteristics Over the Operating Range[14]
FCT543T
Military
Parameter
Description
FCT543AT
Commercial
Commercial
Min.[14]
Max.
Min.[14]
Max.
Min.[14]
Max.
Unit
Fig. No.[15]
tPLH
tPHL
Propagation Delay
Transparent Mode A to B or B to A
2.0
10.0
2.5
8.5
2.5
6.5
ns
1, 3
tPLH
tPHL
Propagation Delay
LEBA to A, LEAB to B
2.5
14.0
2.5
12.5
2.5
8.0
ns
1, 5
tPZH
tPZL
Output Enable Time
OEBA or OEAB to A or B
CEBA or CEAB to A or B
2.0
14.0
2.0
12.0
2.0
9.0
ns
1, 7, 8
tPZH
tPZL
Output Disable Time
OEBA or OEAB to A or B
CEBA or CEAB to A or B
2.0
13.0
2.0
9.0
2.0
7.5
ns
1, 7, 8
tS
Set-Up Time HIGH or LOW,
A or B to LEBA or LEAB
3.0
2.0
2.0
ns
9
tH
Hold Time HIGH or LOW,
A or B to LEBA or LEAB
2.0
2.0
2.0
ns
9
tW
Pulse Width LOW[8]
LEBA or LEAB
5.0
5.0
5.0
ns
5
FCT543CT
Commercial
Parameter
Description
Min.[14]
Max.
Unit
Fig. No.[15]
tPLH
tPHL
Propagation Delay
Transparent Mode A to B or B to A
2.5
5.3
ns
1, 3
tPLH
tPHL
Propagation Delay
LEBA to A, LEAB to B
2.5
7.0
ns
1, 5
tPZH
tPZL
Output Enable Time
OEBA or OEAB to A or B
CEBA or CEAB to A or B
2.0
8.0
ns
1, 7, 8
tPZH
tPZL
Output Disable Time
OEBA or OEAB to A or B
CEBA or CEAB to A or B
2.0
6.5
ns
1, 7, 8
tS
Set-Up Time, HIGH or LOW,
A or B to LEBA or LEAB
2.0
ns
9
tH
Hold Time, HIGH or LOW,
A or B to LEBA or LEAB
2.0
ns
9
tW
Pulse Width LOW LEBA or LEAB[8]
5.0
ns
5
Notes:
14. Minimum limits are specified but not tested on Propagation Delays.
15. See “Parameter Measurement Information” in the General Information Section.
5
CY54/74FCT543T
Ordering Information
Speed
(ns)
5.3
6.5
8.5
10.0
Ordering Code
Package
Name
Package Type
CY74FCT543CTQCT
Q13
24-Lead (150-Mil) QSOP
CY74FCT543CTSOC/SOCT
S13
24-Lead (300-Mil) Molded SOIC
CY74FCT543ATQCT
Q13
24-Lead (150-Mil) QSOP
CY74FCT543ATSOC/SOCT
S13
24-Lead (300-Mil) Molded SOIC
CY74FCT543TQCT
Q13
24-Lead (150-Mil) QSOP
CY74FCT543TSOC/SOCT
S13
24-Lead (300-Mil) Molded SOIC
CY54FCT543TDMB
D14
24-Lead (300-Mil) CerDIP
Document #: 38-00264-B
6
Operating
Range
Commercial
Commercial
Commercial
Military
CY54/74FCT543T
Package Diagrams
24-Lead (300-Mil) CerDIP D14
MIL-STD-1835
D-9 Config.A
24-Lead Quarter Size Outline Q13
7
CY54/74FCT543T
Package Diagrams (continued)
24-Lead (300-Mil) Molded SOIC S13
8
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