DIODES AP2280-1W

AP2280
SINGLE CHANNEL SLEW RATE CONTROLLED LOAD
SWITCH
Description
Features
•
•
•
•
•
•
•
•
•
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Wide input voltage range: 1.5V – 6V
Low RDS(ON): 80mΩ typical @ 5V
Turn-on slew rate controlled
AP2280-1: 100us turn-on rise time
AP2280-2: 1ms turn-on rise time
Very low turn-on quiescent current: << 1uA
Fast load discharge pin
Temperature range -40ºC to 85°C
Green Package: SOT25
SOT25: Available in “Green” Molding Compound
(No Br, Sb) (Note 1)
The AP2280 slew rate controlled load switch is a single P-channel
MOSFET power switch designed for high-side load-switching or
power distribution applications. The MOSFET has a typical RDS(ON)
of 80mΩ at 5V, allowing increased load current handling capability
with a low forward voltage drop. The turn-on slew rate of the
device is controlled internally to reduce turn-on inrush current.
The AP2280 load switch is designed to operate from 1.5V to 6.0V,
making it ideal for 1.8V, 2.5V, 3.3V, and 5V systems. The typical
quiescent supply current is only 0.004uA, making it ideal for
battery powered distribution systems where power consumption is
a concern.
Applications
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Smart Phones
Personal Digital Assistant (PDA)
Cell Phones
GPS Navigators
Bluetooth Headsets
PMP/MP4
Notebook and Pocket PC
Ordering Information
AP2280 - X X X X
Note:
Note:
Turn-on rise time
Package
Lead Free
1 : 100us
2 : 1ms
W : SOT25
G : Green
Packing
-7 : Taping & Reel
1. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.
Device
Package Code
AP2280-1W
AP2280-2W
W
W
Packaging
(Note 2)
SOT25
SOT25
7” Tape and Reel
Quantity
Part Number Suffix
3000/Tape & Reel
-7
3000/Tape & Reel
-7
2. Pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf.
AP2280 Rev. 2
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AP2280
SINGLE CHANNEL SLEW RATE CONTROLLED LOAD
SWITCH
Pin Assignments
( Top View )
DIS 1
5 EN
GND 2
OUT 3
4 IN
SOT25
Pin Description
Pin Name
Pin Number
Description
SOT25
DIS
1
Discharge pin. If DIS pin is tied to OUT pin externally, the output voltage
will be discharged to ground when disabled.
GND
2
Ground.
OUT
3
Voltage output pin. This is the pin to the P-channel MOSFET drain.
Bypass to ground through a 0.1uF capacitor.
IN
4
Voltage input pin. This is the pin to the P-channel MOSFET source.
Bypass to ground through a 1µF capacitor.
EN
5
Enable input, active high.
AP2280 Rev. 2
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AP2280
SINGLE CHANNEL SLEW RATE CONTROLLED LOAD
SWITCH
Block Diagram
Typical Application Circuits
V IN
V OUT
IN
V IN
V OUT
IN
O UT
OUT
D IS
1uF
Enable
D IS
0.1uF
1uF
EN
G ND
Enable
0.1uF
EN
G ND
For applications without output discharge
For applications with output discharge
Absolute Maximum Ratings
Symbol
ESD HBM
Parameter
Human Body Model ESD Protection
ESD MM
VIN
Ratings
4
Units
KV
Machine Model ESD Protection
400
V
Input Voltage
6.5
VOUT
Output Voltage
VIN + 0.3
V
V
VEN
Enable Voltage
6.5
V
Iload
Maximum Continuous Load Current
2
A
125
°C
-65 ~ 150
°C
750
mW
TJ(max)
Maximum Junction Temperature
TST
Storage Temperature Range
PD
Power Dissipation (Note 3,5)
SOT25
Note: 3. Ratings apply to ambient temperature at 25°C.
AP2280 Rev. 2
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AP2280
SINGLE CHANNEL SLEW RATE CONTROLLED LOAD
SWITCH
Recommended Operating Conditions
Symbol
VIN
IOUT
TA
Note:
Parameter
Input voltage
Output Current (Note 4)
Operating Ambient Temperature
Min
1.5
0
-40
Max
6.0
2.0
85
Units
V
A
°C
4. Maximum output current depends on application conditions. Please refer to the application note section.
Electrical Characteristics
o
(TA = 25 C, VIN = VEN = 5.0V, unless otherwise stated)
Symbol
Parameters
Input Quiescent Current
IQ
Input Shutdown Current
ISHDN
Input Leakage Current
ILEAK
RDS(ON)
Switch on-resistance
VIL
EN Input Logic Low Voltage
VIH
EN Input Logic High Voltage
ISINK
TD(ON)
TON
TD(OFF)
RDISCH
θJA
θJC
Note:
EN Input leakage
Output turn-on delay time
Output turn-on rise time
Output turn-off delay time
Discharge FET on-resistance
Thermal Resistance Junction-to-Ambient
Thermal Resistance Junction-to-Case
Test Conditions
VEN = VIN, IOUT = 0
VEN = 0V, OUT open
VEN = 0V, OUT grounded
VIN = 5.0V
VIN = 3.3V
VIN = 1.8V
VIN = 1.5V
VIN = 1.5V to 6V
VIN > 2.7V
VIN = 1.5V to 2.7V
VEN = 5V
Rload=10Ω
AP2280-1, Rload = 10Ω
AP2280-2, Rload = 10Ω
Rload = 10Ω
VEN = GND
SOT25 (Note 5)
SOT25 (Note 5)
Min
⎯
⎯
⎯
2.0
1.4
⎯
Typ. Max
0.004
1
0.004
1
0.01
1
80
92
150
200
0.4
Unit
μA
μA
μA
mΩ
mΩ
mΩ
mΩ
V
V
V
1
μA
1
μS
100 150
μS
1000 1500 μS
0.4
1
μS
20
40
Ω
o
160
C/W
o
38
C/W
5. Test condition for SOT25: Device mounted on FR-4 substrate PC board, with minimum recommended pad layout.
AP2280 Rev. 2
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AP2280
SINGLE CHANNEL SLEW RATE CONTROLLED LOAD
SWITCH
Typical Performance Characteristics
Quiescent Current vs. Input Voltage
Quiescent Current vs. Temperature
0.020
Quiescent Current (μA)
Quiescent Current (μA)
0.01
0.008
0.006
0.004
0.002
0
VIN=3.3V
0.015
VIN=5.0V
0.010
0.005
0.000
1.0
2.0
3.0
4.0
5.0
6.0
-40
-20
0
20
40
60
Input Voltage (V)
Temperature (°C)
RDS(ON) vs. Input Voltage
RDS(ON) vs. Temperature
80
I=100mA
180.00
I=500mA
250.00
160.00
RDS(ON) (mΩ)
I=1A
I=2A
200.00
150.00
140.00
120.00
100.00
80.00
60.00
VIN =1.8V
40.00
100.00
VIN =3.3V
20.00
VIN =5V
0.00
50.00
1.5
2
2.5
3
3.5
4
4.5
5
5.5
-50
6
-25
0
25
50
75
100
Temperature (°C)
Input Voltage (V)
Input Shutdown Current vs. Temperature
ENABLE Threshold vs. Input Voltage
VIN=5V
0.010
1.8
1.6
0.008
1.4
ISHDN (μA)
ON/OFF Threshold (V)
100
200.00
300.00
RDS(ON) (mΩ)
VIN=1.8V
1.2
1
0.006
0.004
0.8
VIL (V)
0.6
0.002
VIH (V)
0.000
0.4
1.5
2
2.5
3
3.5
4
4.5
5
5.5
AP2280 Rev. 2
-40
-20
0
20
40
60
80
100
Temperature (°C)
Input Voltage (V)
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AP2280
SINGLE CHANNEL SLEW RATE CONTROLLED LOAD
SWITCH
Typical Performance Characteristics
(Continued)
AP2280-1 Turn-On
AP2280-1 Turn-Off
(VIN=3.3V, RL=7Ω)
(VIN=3.3V, RL=7Ω)
VEN (2V/div)
VEN (2V/div)
VOUT (2V/div)
VOUT (2V/div)
IIN (500mA/div)
IIN (500mA/div)
Time (50μs/div)
Time (5μs/div)
AP2280-1 Turn-On
AP2280-1 Turn-Off
(VIN=5V, RL=10Ω)
(VIN=5V, RL=10Ω)
VEN (2V/div)
VEN (2V/div)
VOUT (2V/div)
VOUT (2V/div)
IIN (500mA/div)
IIN (500mA/div)
Time (5μs/div)
Time (50μs/div)
AP2280 Rev. 2
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AP2280
SINGLE CHANNEL SLEW RATE CONTROLLED LOAD
SWITCH
Typical Performance Characteristics
(Continued)
AP2280-2 Turn-On
AP2280-2 Turn-Off
(VIN=3.3V, RL=7Ω)
(VIN=3.3V, RL=7Ω)
VEN (2V/div)
VEN (2V/div)
VOUT (2V/div)
VOUT (2V/div)
IIN (500mA/div)
IIN (500mA/div)
Time (500μs/div)
Time (5μs/div)
AP2280-2 Turn-On
AP2280-2 Turn-Off
(VIN=5V, RL=10Ω)
(VIN=5V, RL=10Ω)
VEN (2V/div)
VEN (2V/div)
VOUT (2V/div)
VOUT (2V/div)
IIN (200mA/div)
IIN (500mA/div)
Time (500μs/div)
AP2280 Rev. 2
Time (5μs/div)
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AP2280
SINGLE CHANNEL SLEW RATE CONTROLLED LOAD
SWITCH
Application Note
Input Capacitor
A 1μF capacitor is recommended to connect
between IN and GND pins to decouple input power
supply glitch and noise. The input capacitor has no
specific type or ESR (Equivalent Series Resistance)
requirement. However, for higher current
application, ceramic capacitors are recommended
due to their capability to withstand input current
surges from low impedance sources, such as
batteries in portable applications. This input
capacitor must be located as close as possible to
the device to assure input stability and less noise.
For PCB layout, a wide copper trace is required for
both IN and GND.
Output Capacitor
A 0.1μF capacitor is recommended to connect
between OUT and GND pins to stabilize and
accommodate load transient condition. The output
capacitor has no specific type or ESR requirement.
The amount of the capacitance may be increased
without limit. For PCB layout, the output capacitor
must be placed as close as possible to OUT and
GND pins, and keep the traces as short as
possible.
Enable/Shutdown Operation
The AP2280 is turned on by setting the EN pin high
and is turned off by pulling it low. To ensure proper
operation, the signal source used to drive the EN
pin must be able to swing above and below the
specified turn-on/off voltage thresholds listed in the
Electrical Characteristics section under VIL and VIH.
Discharge Operation
The AP2280 offers a discharge option that helps to
discharge the output when disabled. To use this
feature, the DIS pin is connected to the OUT pin
AP2280 Rev. 2
externally. If this feature is not used, the DIS pin
should be left open.
Power Dissipation
The device power dissipation and proper sizing of
the thermal plane is critical to avoid thermal
shutdown and ensure reliable operation. Power
dissipation of the device depends on input voltage
and load conditions and can be calculated by:
PD = IOUT xR DSON
2
(1)
However, the maximum power dissipation that can
be handled by the device depends on the
maximum junction to ambient thermal resistance,
maximum ambient temperature, and maximum
device junction temperature, which can be
approximated by the equation below:
PD ([email protected] TA ) =
( +125°C − TA )
(2)
θ JA
For example at VIN = 5V, the typical RDSON = 80mΩ.
For IOUT = 2A, the maximum power dissipation
calculated using equation (1) is PD = 0.32W. Based
on θJA = 160°C/W and equation (2), the calculated
junction temperature rise from ambient is
approximately 51°C. Since the maximum junction
temperature is 125°C, the operating ambient
temperature must be kept below 74°C to safely
operate the device.
On the other hand, at TA = 85°C and VIN = 5V, the
calculated maximum power dissipation from
equation (2) is PDmax = 0.25W. Hence the safe
operating maximum continuous current is 1.77A.
For other application conditions, the users should
recalculate the device maximum power dissipation
based on the operating conditions.
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AP2280
SINGLE CHANNEL SLEW RATE CONTROLLED LOAD
SWITCH
Marking Information
( Top View )
4
7
5
XX Y M X
1
2
XX : UA : AP2280-1
UB : AP2280-2
Y : Year 0~9
M : Month A~L
X : G : Green
3
SOT25
Package Information
(All Dimensions in mm)
IMPORTANT NOTICE
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further
notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein; neither
does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will
agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages.
LIFE SUPPORT
Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written approval of the
President of Diodes Incorporated.
AP2280 Rev. 2
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