STMicroelectronics BZW06-102 Peak pulse power 600 w (10/1000ms) Datasheet

BZW06-5V8/376
BZW06-5V8B/376B
®
TRANSILTM
FEATURES
■
■
■
■
■
■
PEAK PULSE POWER : 600 W (10/1000µs)
STAND-OFF VOLTAGE RANGE :
From 5.8V to 376 V
UNI AND BIDIRECTIONAL TYPES
LOW CLAMPING FACTOR
FAST RESPONSE TIME
UL RECOGNIZED
DESCRIPTION
Transil diodes provide high overvoltage protection
by clamping action. Their instantaneous response
to transient overvoltages makes them particularly suited to protect voltage sensitive devices
such as MOS Technology and low voltage supplied IC’s.
DO-15
ABSOLUTE MAXIMUM RATINGS (Tamb = 25°C)
Symbol
Parameter
Value
Unit
Peak pulse power dissipation (see note 1)
Tj initial = Tamb
600
W
Power dissipation on infinite heatsink
Tamb = 75°C
1.7
W
IFSM
Non repetitive surge peak forward current
for unidirectional types
tp = 10ms
Tj initial = Tamb
100
A
Tstg
Tj
Storage temperature range
Maximum junction temperature
- 65 to + 175
175
°C
°C
TL
Maximum lead temperature for soldering during 10s a 5mm
from case.
230
°C
PPP
P
Note 1 : For a surge greater than the maximum values, the diode will fail in short-circuit.
THERMAL RESISTANCES
Symbol
Parameter
Rth (j-l)
Junction to leads
Rth (j-a)
Junction to ambient on printed circuit.
February 2003 - Ed : 3A
Llead = 10 mm
Value
Unit
60
°C/W
100
°C/W
1/6
BZW06-xx
I
ELECTRICAL CHARACTERISTICS (Tamb = 25°C)
Symbol
IF
Parameter
VRM
Stand-off voltage
VBR
Breakdown voltage
VCL
Clamping voltage
IRM
Leakage current @ VRM
IPP
Peak pulse current
αT
Voltage temperature coefficient
VF
Forward voltage drop
Types
VCL
V RM
V
I PP
IRM @ VRM
VBR
@
IR
min
µA
VCL @ IPP
max
note2
Bidirectional
VF
I RM
max
Unidirectional
VBR
VCL @ IPP
max
10/1000µs
8/20µs
αT
C
max
typ
note3
note4
-4
V
V
mA
V
A
V
A
10 /°C
pF
BZW06-5V8
BZW06-5V8B
1000
5.8
6.45
10
10.5
57.0
13.4
298
5.7
4000
BZW06-6V4
BZW06-6V4B
500
6.4
7.13
10
11.3
53.0
14.5
276
6.1
3700
BZW06-8V5
BZW06-8V5B
10
8.5
9.5
1
14.5
41
18.6
215
7.3
2800
BZW06-10
BZW06-10B
5
10.2
11.4
1
16.7
36.0
21.7
184
7.8
2300
BZW06-13
BZW06-13B
5
12.8
14.3
1
21.2
28.0
27.2
147
8.4
1900
BZW06-15
BZW06-15B
1
15.3
17.1
1
25.2
24.0
32.5
123
8.8
1600
BZW06-19
BZW06-19B
1
18.8
20.9
1
30.6
19.6
39.3
102
9.2
1350
BZW06-20
BZW06-20B
1
20.5
22.8
1
33.2
18.0
42.8
93
9.4
1250
BZW06-23
BZW06-23B
1
23.1
25.7
1
37.5
16.0
48.3
83
9.6
1150
BZW06-26
BZW06-26B
1
25.6
28.5
1
41.5
14.5
53.5
75
9.7
1075
BZW06-28
BZW06-28B
1
28.2
31.4
1
45.7
13.1
59.0
68
9.8
1000
BZW06-31
BZW06-31B
1
30.8
34.2
1
49.9
12.0
64.3
62
9.6
950
BZW06-33
BZW06-33B
1
33.3
37.1
1
53.9
11.1
69.7
57
10.0
900
BZW06-40
BZW06-40B
1
40.2
44.7
1
64.8
9.3
84
48
10.1
800
BZW06-48
BZW06-48B
1
47.8
53.2
1
77.0
7.8
100
40
10.3
700
BZW06-58
BZW06-58B
1
58.1
64.6
1
92.0
6.5
121
33
10.4
625
BZW06-70
BZW06-70B
1
70.1
77.9
1
113
5.3
146
27.0
10.5
550
BZW06-85
BZW06-85B
1
85.5
95.0
1
137
4.4
178
22.5
10.6
500
BZW06-102
BZW06-102B
1
102
114
1
165
3.6
212
19.0
10.7
450
BZW06-128
BZW06-128B
1
128
143
1
207
2.9
265
15.0
10.8
400
BZW06-154
BZW06-154B
1
154
171
1
246
2.4
317
12.6
10.8
360
BZW06-171
BZW06-171B
1
171
190
1
274
2.2
353
11.3
10.8
350
2/6
BZW06-xx
Types
IRM @ VRM
VBR @
IR
min
max
note2
Unidirectional
Bidirectional
µA
VCL @ IPP
VCL @ IPP
max
10/1000µs
8/20µs
αT
C
max
typ
note3
note4
-4
V
V
mA
V
A
V
A
10 /°C
pF
188
209
1
328
2.0
388
10.3
10.8
330
BZW06-188
BZW06-188B
1
BZW06-213
BZW06-213B
1
231
237
1
344
2.0
442
9.0
11.0
310
BZW06-256
BZW06-256B
1
256
285
1
414
1.6
529
7.6
11.0
290
BZW06-273
BZW06-273B
1
273
304
1
438
1.6
564
7.1
11.0
280
BZW06-299
BZW06-299B
1
299
332
1
482
1.6
618
6.5
11.0
270
BZW06-342
BZW06-342B
1
342
380
1
548
1.3
706
5.7
11.0
360
BZW06-376
BZW06-376B
1
376
418
1
603
1.3
776
5.7
11.0
350
Fig. 1: Peak pulse power dissipation versus initial
junction temperature (printed circuit board).
% I PP
100
10 s
PULSE WAVEFORM 10/1000 s
50
0
t
1000 s
Note 2 :
Note 3 :
Note 4 :
Pulse test: tp < 50 ms.
∆VBR = αT * (Tamb - 25) * VBR(25°C)
VR = 0 V, F = 1 MHz. For bidirectional types,
capacitance value is divided by 2
3/6
BZW06-xx
Fig. 2 : Peak pulse power versus exponential pulse duration.
Ppp (W)
1E5
Tj initial = 25ø
°C
1E4
1E3
1E2
tp (m S ) EXPO.
1E1
0.001
0.01
0.1
1
10
100
Fig. 3 : Clamping voltage versus peak pulse current.
Exponential waveform tp = 20 µs________
tp = 1 ms——————tp = 10 m...............
Note : The curves of the figure 3 are specified for a junction temperature of 25°C before surge.
The given results may be extrapolated for other junction temperatures by using the following formula :
∆VBR = αT * (Tamb -25) * VBR (25°C).
For intermediate voltages, extrapolate the given results.
4/6
BZW06-xx
Fig. 4a : Capacitance versus reverse applied
voltage for unidirectional types (typical values).
Fig. 4b : Capacitance versus reverse applied
voltage for bidirectional types (typical values).
Fig. 5 : Peak forward voltage drop versus peak forward current (typical values for unidirectional
types).
Fig. 6 : Transient thermal impedance junction ambient versus pulse duration (For FR4 PC Board
with L lead = 10mm).
Fig. 7 : Relative variation of leakage current versus junction temperature.
5/6
BZW06-xx
ORDER
BZW
06
-
10
B
RL
PACKAGING:
‘ ‘ = Ammopack tape
‘RL’ = Tape & reel
600W
BIDIRECTIONAL
No suffix: Unidirectional
STAND-OFF VOLTAGE
MARKING : Logo, Date Code, Type Code, Cathode Band (for unidirectional types only).
PACKAGE MECHANICAL DATA
DO-15 (Plastic)
REF.
C
A
D
C
B
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
A
6.05
6.75
0.238
0.266
B
2.95
3.53
0.116
0.139
C
26
31
1.024
1.220
D
0.71
0.88
0.028
0.035
Packaging : standard packaging is in tape and reel.
Weight = 0.4 g.
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written
approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 2003 STMicroelectronics - Printed in Italy - All rights reserved.
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6/6
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