VISHAY SI3456CDV

New Product
Si3456CDV
Vishay Siliconix
N-Channel 30-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
rDS(on) (Ω)
ID (A)d
0.034 at VGS = 10 V
7.8
0.052 at VGS = 4.5 V
6.3
VDS (V)
30
• TrenchFET® Power MOSFET
Qg (Typ)
APPLICATIONS
4 nC
RoHS
COMPLIANT
• Load Switch
• HDD
TSOP-6
Top View
D
1
6
D
D
(1, 2, 5, 6)
3 mm D
2
5
D
Marking Code
G
3
4
AP
S
XXX
Lot Traceability
and Date Code
G
(3)
Part # Code
2.85 mm
(4)
S
Ordering Information: Si3456CDV-T1-E3 (Lead (Pb)-free)
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (TJ = 150 °C)
Symbol
VDS
VGS
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
Pulsed Drain Current
Limit
30
± 20
7.7
6.2
6.1a, b
4.9a, b
20
2.9
1.7a, b
3.3
2.1
2a, b
1.3a, b
- 55 to 150
260
ID
IDM
TC = 25 °C
TA = 25 °C
TC = 25 °C
TC = 70 °C
Maximum Power Dissipation
TA = 25 °C
TA = 70 °C
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
Continuous Source-Drain Diode Current
IS
PD
TJ, Tstg
Unit
V
A
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambienta, c
Maximum Junction-to-Foot (Drain)
t≤5s
Steady State
Symbol
RthJA
RthJF
Typical
53
32
Maximum
62.5
38
Unit
°C/W
Notes:
a. Surface Mounted on 1" x 1" FR4 board.
b. t = 5 s.
c. Maximum under steady state conditions is 110 °C/W.
d. Based on TC = 25 °C.
Document Number: 69933
S-80188-Rev. A, 04-Feb-08
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New Product
Si3456CDV
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min.
VDS
VGS = 0 V, ID = 250 µA
30
Typ.
Max.
Unit
Static
Drain-Source Breakdown Voltage
VDS Temperature Coefficient
ΔVDS/TJ
V
30
ID = 250 µA
mV/°C
VGS(th) Temperature Coefficient
ΔVGS(th)/TJ
Gate-Source Threshold Voltage
VGS(th)
VDS = VGS , ID = 250 µA
3
V
IGSS
VDS = 0 V, VGS = ± 20 V
± 100
nA
VDS = 30 V, VGS = 0 V
1
VDS = 30 V, VGS = 0 V, TJ = 70 °C
10
Gate-Source Leakage
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
Forward Transconductancea
rDS(on)
gfs
VDS ≥ 5 V, VGS = 10 V
-6
1.2
15
µA
A
VGS = 10 V, ID = 6.1 A
0.028
0.034
VGS = 4.5 V, ID = 1.9 A
0.043
0.052
VDS = 15 V, ID = 6.1 A
12
Ω
S
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Rg
460
VDS = 15 V, VGS = 0 V, f = 1 MHz
VDS = 15 V, VGS = 10 V, ID = 6.1 A
td(off)
pF
8
12
4
6
1.8
VDS = 15 V, VGS = 4.5 V, ID = 6.1 A
f = 1 MHz
VDD = 15 V, RL = 3.1 Ω
ID ≅ 4.9 A, VGEN = 4.5 V, Rg = 1 Ω
2.4
4.8
7.2
20
30
12
20
15
25
tf
10
15
td(on)
10
15
12
20
12
20
10
15
tr
td(off)
nC
1.2
td(on)
tr
85
45
VDD = 15 V, RL = 3.1 Ω
ID ≅ 4.9 A, VGEN = 10 V, Rg = 1 Ω
tf
Ω
ns
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
IS
Pulse Diode Forward Current
ISM
Body Diode Voltage
VSD
Body Diode Reverse Recovery Time
trr
Body Diode Reverse Recovery Charge
Qrr
Reverse Recovery Fall Time
ta
Reverse Recovery Rise Time
tb
TC = 25 °C
2.9
20
IS = 2.5 A, VGS = 0 V
IF = 4.9 A, di/dt = 100 A/µs, TJ = 25 °C
A
0.8
1.2
V
20
30
ns
12
20
nC
13
8
ns
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 69933
S-80188-Rev. A, 04-Feb-08
New Product
Si3456CDV
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
20
5
VGS = 10 thru 5 V
4
I D - Drain Current (A)
I D - Drain Current (A)
15
VGS = 4 V
10
3
2
TC = 25 °C
5
1
VGS = 3 V
0
0.0
0.5
1.0
1.5
TC = 125 °C
2.0
2.5
0
0.0
3.0
0.5
1.0
1.5
2.0
2.5
3.0
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
3.5
4.0
600
0.10
Ciss
500
0.08
0.06
C - Capacitance (pF)
r DS(on) - On-Resistance (Ω)
TC = - 55 °C
VGS = 4.5 V
0.04
VGS = 10 V
400
300
200
Coss
0.02
100
Crss
0
0.00
0
5
10
15
0
20
5
15
20
VDS -- Drain-to-Source Voltage (V)
ID - Drain Current (A)
On-Resistance vs. Drain Current and Gate Voltage
Capacitance
1.6
10
ID = 6.1 A
VGS = 10 V, 4.5 V, ID = 6.1 A
1.4
VDS = 15 V
6
VDS = 24 V
4
(Normalized)
8
r DS(on) - On-Resistance
VGS - Gate-to-Source Voltage (V)
10
1.2
1.0
0.8
2
0
0
2
4
6
Qg - Total Gate Charge (nC)
Gate Charge
Document Number: 69933
S-80188-Rev. A, 04-Feb-08
8
10
0.6
- 50
- 25
0
25
50
75
100
125
150
TJ - Junction Temperature (°C)
On-Resistance vs. Junction Temperature
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New Product
Si3456CDV
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
100
0.10
r DS(on) - On-Resistance (Ω)
I S - Source Current (A)
ID = 6.1 A
TJ = 150 °C
10
TJ = 25 °C
1
0.0
0.08
0.06
TA = 125 °C
0.04
TA = 25 °C
0.02
0.00
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0
2
VSD - Source-to-Drain Voltage (V)
4
6
8
10
VGS - Gate-to-Source Voltage (V)
On-Resistance vs. Gate-to-Source Voltage
Source-Drain Diode Forward Voltage
2.4
30
2.2
25
20
ID = 250 µA
Power (W)
V GS(th) (V)
2.0
1.8
1.6
15
10
1.4
Single Pulse Power
5
1.2
1.0
- 50
- 25
0
25
50
75
100
125
0
0.001
150
0.01
TJ - Temperature (°C)
0.1
1
10
100
1000
Time (s)
Threshold Voltage
Single Pulse Power
100
Limited by rDS(on)*
I D - Drain Current (A)
10
100 µs
1
1 ms
10 ms
100 ms
0.1
1 s, 10 s
BVDSS
TA = 25 °C
Single Pulse
0.01
0.1
1
DC
10
100
VDS - Drain-to-Source Voltage (V)
* VGS > minimum VGS at which rDS(on) is specified
Safe Operating Area, Junction-to-Ambient
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Document Number: 69933
S-80188-Rev. A, 04-Feb-08
New Product
Si3456CDV
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
4
10
Power Dissipation (W)
I D - Drain Current (A)
8
Package Limited
6
4
3
2
1
2
0
0
0
25
50
75
100
Foot (Drain) Temperature (°C)
Current Derating*
125
150
25
50
75
100
125
150
Foot (Drain) Temperature (°C)
Power Derating
* The power dissipation PD is based on TJ(max) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
limit.
Document Number: 69933
S-80188-Rev. A, 04-Feb-08
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New Product
Si3456CDV
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
Notes:
0.1
PDM
t1
0.05
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 90 °C/W
0.02
3. TJM - TA = PDMZthJA(t)
Single Pulse
0.01
10 -4
4. Surface Mounted
10 -3
10 -2
10 -1
1
Square Wave Pulse Duration (s)
100
10
1000
Normalized Thermal Transient Impedance, Junction-to-Ambient
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
Square Wave Pulse Duration (s)
1
10
Normalized Thermal Transient Impedance, Junction-to-Foot
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see http://www.vishay.com/ppg?69933.
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Document Number: 69933
S-80188-Rev. A, 04-Feb-08
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
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Document Number: 91000
Revision: 18-Jul-08
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