MIC MIC4422BN 9a-peak low-side mosfet driver bipolar/cmos/dmos process Datasheet

MIC4421/4422
Micrel, Inc.
MIC4421/4422
9A-Peak Low-Side MOSFET Driver
Bipolar/CMOS/DMOS Process
General Description
Features
MIC4421 and MIC4422 MOSFET drivers are rugged, efficient, and easy to use. The MIC4421 is an inverting driver,
while the MIC4422 is a non-inverting driver.
• BiCMOS/DMOS Construction
• Latch-Up Proof: Fully Isolated Process is Inherently
Immune to Any Latch-up.
• Input Will Withstand Negative Swing of Up to 5V
• Matched Rise and Fall Times ............................... 25ns
• High Peak Output Current ...............................9A Peak
• Wide Operating Range .............................. 4.5V to 18V
• High Capacitive Load Drive ........................... 47,000pF
• Low Delay Time .............................................30ns Typ.
• Logic High Input for Any Voltage from 2.4V to VS
• Low Equivalent Input Capacitance (typ) ................. 7pF
• Low Supply Current .............. 450µA With Logic 1 Input
• Low Output Impedance .........................................1.5Ω
• Output Voltage Swing to Within 25mV of GND or VS
Both versions are capable of 9A (peak) output and can drive
the largest MOSFETs with an improved safe operating margin. The MIC4421/4422 accepts any logic input from 2.4V to
VS without external speed-up capacitors or resistor networks.
Proprietary circuits allow the input to swing negative by as
much as 5V without damaging the part. Additional circuits
protect against damage from electrostatic discharge.
MIC4421/4422 drivers can replace three or more discrete
components, reducing PCB area requirements, simplifying
product design, and reducing assembly cost.
Applications
Modern Bipolar/CMOS/DMOS construction guarantees
freedom from latch-up. The rail-to-rail swing capability of
CMOS/DMOS insures adequate gate voltage to the MOSFET during power up/down sequencing. Since these devices
are fabricated on a self-aligned process, they have very low
crossover current, run cool, use little power, and are easy
to drive.
•
•
•
•
•
•
•
•
Switch Mode Power Supplies
Motor Controls
Pulse Transformer Driver
Class-D Switching Amplifiers
Line Drivers
Driving MOSFET or IGBT Parallel Chip Modules
Local Power ON/OFF Switch
Pulse Generators
Functional Diagram
VS
0.1mA
MIC4421
IN V E R T I N G
0.3mA
OUT
IN
2kΩ
MIC4422
NONINVERTING
GND
Micrel, Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel + 1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com
August 2005
1
M9999-081005
MIC4421/4422
Micrel, Inc.
Ordering Information
Part Number
Standard
PbFree
MIC4421BM
MIC4421YM
MIC4421BN
MIC4421YN
MIC4421CM
MIC4421ZM
MIC4421CN
MIC4421ZN
MIC4421CT
MIC4421ZT
MIC4422BM
MIC4422YM
MIC4422BN
MIC4422YN
MIC4422CM
MIC4422ZM
MIC4422CN
MIC4422ZN
MIC4422CT
MIC4422ZT
Configuration
Inverting
Inverting
Inverting
Inverting
Inverting
Non-inverting
Non-inverting
Non-inverting
Non-inverting
Non-inverting
Temp. Range
–40ºC to +85ºC
–40ºC to +85ºC
–0ºC to +70ºC
–0ºC to +70ºC
–0ºC to +70ºC
–40ºC to +85ºC
–40ºC to +85ºC
–0ºC to +70ºC
–0ºC to +70ºC
–0ºC to +70ºC
Package
8-pin SOIC
8-pin DIP
8-pin SOIC
8-pin DIP
5-pin TO-220
8-pin SOIC
8-pin DIP
8-pin SOIC
8-pin DIP
5-pin TO-220
Pin Configurations
8 VS
VS 1
IN 2
7 OUT
NC 3
6 OUT
GND 4
5 GND
Plastic DIP (N)
SOIC (M)
5
4
3
2
1
OUT
GND
VS
GND
IN
TO-220-5 (T)
Pin Description
Pin Number
TO-220-5
Pin Number
DIP, SOIC
Pin Name
1
2
IN
2, 4
4, 5
GND
3, TAB
1, 8
VS
5
6, 7
OUT
3
NC
M9999-081005
Pin Function
Control Input
Ground: Duplicate pins must be externally connected together.
Supply Input: Duplicate pins must be externally connected together.
Output: Duplicate pins must be externally connected together.
Not connected.
2
August 2005
MIC4421/4422
Micrel, Inc.
Absolute Maximum Ratings
Operating Ratings
(Notes 1, 2 and 3)
Supply Voltage .............................................................. 20V
Input Voltage ...................................VS + 0.3V to GND – 5V
Input Current (VIN > VS) .............................................. 50 mA
Power Dissipation, TA ≤ 25°C
PDIP .................................................................... 960mW
SOIC .................................................................. 1040mW
5-Pin TO-220 .............................................................. 2W
Power Dissipation, TCASE ≤ 25°C
5-Pin TO-220 ......................................................... 12.5W
Derating Factors (to Ambient)
PDIP ................................................................ 7.7mW/°C
SOIC ................................................................ 8.3mW/°C
5-Pin TO-220 .................................................... 17mW/°C
Storage Temperature ................................ –65°C to +150°C
Lead Temperature (10 sec) ....................................... 300°C
Electrical Characteristics:
Symbol
Junction Temperature ................................................ 150°C
Ambient Temperature
C Version .................................................... 0°C to +70°C
B Version ................................................ –40°C to +85°C
Thermal Resistance
5-Pin TO-220 (θJC) ............................................... 10°C/W
(TA = 25°C with 4.5 V ≤ VS ≤ 18 V unless otherwise specified.)
Parameter
Conditions
Min
Typ
2.4
1.3
Max
Units
INPUT
VIH
Logic 1 Input Voltage
VIL
Logic 0 Input Voltage
VIN
Input Voltage Range
IIN
Input Current
1.1
V
0.8
V
–5
VS+0.3
V
0 V ≤ VIN ≤ VS
–10
10
µA
VS–.025
OUTPUT
VOH
High Output Voltage
See Figure 1
VOL
Low Output Voltage
See Figure 1
RO
Output Resistance,
Output High
IOUT = 10 mA, VS = 18 V
0.6
RO
Output Resistance,
Output Low
IOUT = 10 mA, VS = 18 V
0.8
IPK
Peak Output Current
VS = 18 V (See Figure 6)
9
IDC
Continuous Output Current
IR
Latch-Up Protection
Withstand Reverse Current
Duty Cycle ≤ 2%
t ≤ 300 µs
V
0.025
V
Ω
1.7
Ω
A
2
A
>1500
mA
SWITCHING TIME (Note 3)
tR
Rise Time
Test Figure 1, CL = 10,000 pF
20
75
ns
tF
Fall Time
Test Figure 1, CL = 10,000 pF
24
75
ns
tD1
Delay Time
Test Figure 1
15
60
ns
tD2
Delay Time
Test Figure 1
35
60
ns
VIN = 3 V
VIN = 0 V
0.4
80
1.5
150
mA
µA
18
V
POWER SUPPLY
IS
Power Supply Current
VS
Operating Input Voltage
August 2005
4.5
3
M9999-081005
MIC4421/4422
Micrel, Inc.
Electrical Characteristics:
Symbol
(Over operating temperature range with 4.5V ≤ VS ≤ 18V unless otherwise specified.)
Parameter
Conditions
Min
Typ
2.4
1.4
Max
Units
INPUT
VIH
Logic 1 Input Voltage
VIL
Logic 0 Input Voltage
V
1.0
0.8
V
VIN
Input Voltage Range
IIN
Input Current
0V ≤ VIN ≤ VS
–5
VS+0.3
V
–10
10
µA
VOH
High Output Voltage
Figure 1
VOL
Low Output Voltage
Figure 1
0.025
V
RO
Output Resistance,
Output High
IOUT = 10mA, VS = 18V
0.8
3.6
Ω
RO
Output Resistance,
Output Low
IOUT = 10mA, VS = 18V
1.3
2.7
Ω
OUTPUT
VS–.025
V
SWITCHING TIME (Note 3)
tR
Rise Time
Figure 1, CL = 10,000pF
23
120
ns
tF
Fall Time
Figure 1, CL = 10,000pF
30
120
ns
tD1
Delay Time
Figure 1
20
80
ns
tD2
Delay Time
Figure 1
40
80
ns
VIN = 3V
VIN = 0V
0.6
0.1
3
0.2
mA
18
V
POWER SUPPLY
IS
Power Supply Current
VS
Operating Input Voltage
Note 1:
Note 2:
4.5
Functional operation above the absolute maximum stress ratings is not implied.
Static-sensitive device. Store only in conductive containers. Handling personnel and equipment should be grounded to
prevent damage from static discharge.
Switching times guaranteed by design.
Note 3:
Test Circuits
VS = 18V
VS = 18V
0.1µF
0.1µF
IN
OUT
15000pF
MIC4421
INPUT
5V
90%
tD1
tP W
tF
tD2
0.1µF
0.1µF
IN
OUT
15000pF
MIC4422
2.5V
tP W ≥ 0.5µs
10%
0V
VS
90%
4.7µF
INPUT
tR
5V
90%
2.5V
tP W ≥ 0.5µs
10%
0V
VS
90%
4.7µF
tD1
tP W
tR
tD2
tF
O U TPU T
O U TPU T
10%
0V
10%
0V
Figure 2. Noninverting Driver Switching Time
Figure 1. Inverting Driver Switching Time
M9999-081005
4
August 2005
MIC4421/4422
Micrel, Inc.
0
10k
August 2005
100k
1M
FREQUENCY (Hz)
10M
TIME (ns)
100
60
pF
80
40
20
0
10k
100k
1M
FREQUENCY (Hz)
5
10M
16
18
Supply Current
vs. Capacitive Load
VS = 5V
100
kH
z
50
0k
H
Hz
1M
15
20
30
z
45
60
VS = 12V
8 10 12 14
VOLTAGE (V)
1000
10k
CAPACITIVE LOAD (pF)
100k
Supply Current
vs. Frequency
VS = 5V
50
40
30
1000
pF
Supply Current
vs. Frequency
6
60
0
100k
4
µF
z
1000
10k
CAPACITIVE LOAD (pF)
Crossover Energy
vs. Supply Voltage
0.01
100
0k
H
30
SUPPLY CURRENT (mA)
20
Hz
1M
0
40
80
120
TEMPERATURE (°C)
10-8
75
VS = 12V
20
50
F
60
40
Supply Current
vs. Capacitive Load
60
-40
PER TRANSITION
10-9
100k
µF
kH
z
z
H
1000
p
80
0.01
0.1µ
F
120
µF
140
1000
10k
CAPACITIVE LOAD (pF)
90
120
VS = 18V
100
120
0
100k
Supply Current
vs. Frequency
100
18V
1000
160
Hz
1M
1000
10k
CAPACITIVE LOAD (pF)
10V
0.01
180
150
VS = 18V
100
150
0
100k
tRISE
10-7
5V
50
Supply Current
vs. Capacitive Load
20
0k
220
200
180
160
140
120
100
80
60
40
20
0
Fall Time
vs. Capacitive Load
100
20
0
18
kH
z
18V
1000
10k
CAPACITIVE LOAD (pF)
6
8 10 12 14 16
SUPPLY VOLTAGE (V)
200
30
10
50
10V
100
4
F
RISE TIME (ns)
5V
150
0
10,000pF
250
200
100
300
22,000pF
tFALL
40
F
Rise Time
vs. Capacitive Load
50
SUPPLY CURRENT (mA)
18
47,000pF
0.1µ
6
8 10 12 14 16
SUPPLY VOLTAGE (V)
CL = 10,000pF
VS = 18V
50
0.1µ
4
Rise and Fall Times
vs. Temperature
60
CROSSOVER ENERGY (A•s)
10,000pF
220
200
180
160
140
120
100
80
60
40
20
0
Fall Time
vs. Supply Voltage
SUPPLY CURRENT (mA)
22,000pF
250
SUPPLY CURRENT (mA)
FALL TIME (ns)
47,000pF
FALL TIME (ns)
300
Rise Time
vs. Supply Voltage
SUPPLY CURRENT (mA)
220
200
180
160
140
120
100
80
60
40
20
0
SUPPLY CURRENT (mA)
RISE TIME (ns)
Typical Characteristics
20
10
0
10k
100k
1M
FREQUENCY (Hz)
10M
M9999-081005
MIC4421/4422
Micrel, Inc.
Typical Characteristics
20
tD1
10
QUIESCENT SUPPLY CURRENT (µA)
0
4
6
8 10 12 14 16
SUPPLY VOLTAGE (V)
18
Quiescent Supply Current
vs. Temperature
1000
VS = 18V
INPUT = 1
100
INPUT = 0
10
-40
0
40
80
TEMPERATURE (°C)
M9999-081005
120
Propagation Delay
vs. Input Amplitude
50
40
30
tD2
20
tD2
tD1
10
0
2
4
6
INPUT (V)
tD1
8
TJ = 150°C
TJ = 25°C
4
6
8 10 12 14 16
SUPPLY VOLTAGE (V)
6
0
10
High-State Output Resist.
vs. Supply Voltage
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
Propagation Delay
vs. Temperature
VS = 10V
TIME (ns)
30
TIME (ns)
tD2
HIGH-STATE OUTPUT RESISTANCE (Ω)
TIME (ns)
40
120
110
100
90
80
70
60
50
40
30
20
10
0
18
LOW-STATE OUTPUT RESISTANCE (Ω)
Propagation Delay
vs. Supply Voltage
50
-40
0
40
80
120
TEMPERATURE (°C)
Low-State Output Resist.
vs. Supply Voltage
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
TJ = 150°C
TJ = 25°C
4
6
8 10 12 14 16
SUPPLY VOLTAGE (V)
18
August 2005
MIC4421/4422
Micrel, Inc.
Applications Information
To guarantee low supply impedance over a wide frequency
range, a parallel capacitor combination is recommended for
supply bypassing. Low inductance ceramic disk capacitors
with short lead lengths (< 0.5 inch) should be used. A 1µF low
ESR film capacitor in parallel with two 0.1µF low ESR ceramic
capacitors, (such as AVX RAM Guard®), provides adequate
bypassing. Connect one ceramic capacitor directly between
pins 1 and 4. Connect the second ceramic capacitor directly
between pins 8 and 5.
Supply Bypassing
Charging and discharging large capacitive loads quickly
requires large currents. For example, charging a 10,000pF
load to 18V in 50ns requires 3.6A.
The MIC4421/4422 has double bonding on the supply pins,
the ground pins and output pins. This reduces parasitic
lead inductance. Low inductance enables large currents to
be switched rapidly. It also reduces internal ringing that can
cause voltage breakdown when the driver is operated at or
near the maximum rated voltage.
Grounding
The high current capability of the MIC4421/4422 demands
careful PC board layout for best performance. Since the
MIC4421 is an inverting driver, any ground lead impedance
will appear as negative feedback which can degrade switching
speed. Feedback is especially noticeable with slow-rise time
inputs. The MIC4421 input structure includes about 200mV
of hysteresis to ensure clean transitions and freedom from
oscillation, but attention to layout is still recommended.
Internal ringing can also cause output oscillation due to
feedback. This feedback is added to the input signal since it
is referenced to the same ground.
VS
Figure 5 shows the feedback effect in detail. As the MIC4421
input begins to go positive, the output goes negative and
several amperes of current flow in the ground lead. As little
as 0.05Ω of PC trace resistance can produce hundreds of
millivolts at the MIC4421 ground pins. If the driving logic is
referenced to power ground, the effective logic input level is
reduced and oscillation may result.
1µF
VS
MIC4451
Ø2
Ø1 DRIV E S IGNA L
DRIVE
L OGIC
CONDUCTION ANGLE
CONT ROL 0° TO 180°
Ø1
CONDUCTION ANGLE
CONTROL 180° TO 360°
M
Ø3
To insure optimum performance, separate ground traces
should be provided for the logic and power connections. Connecting the logic ground directly to the MIC4421 GND pins
will ensure full logic drive to the input and ensure fast output
switching. Both of the MIC4421 GND pins should, however,
still be connected to power ground.
VS
VS
1µF
MIC4452
PHASE 1 of 3 PHASE MOTOR
DRIVER USING MIC4420/4429
Figure 3. Direct Motor Drive
+15
(x2) 1N4448
5.6 kΩ
OUTPUT VOLTAGE vs LOAD CURRENT
30
560 Ω
0.1µF
50V
+
1
2
0.1µF
WIMA
MKS2
8
MIC4421
4
5
1µF
50V
MKS2
6, 7
VOLTS
29
BYV 10 (x 2)
28
12 Ω LINE
27
26
+
25
+
560µF 50V
100µF 50V
UNIT E D CHE MCON S X E
0
50
100 150 200 250 300 350
mA
Figure 4. Self Contained Voltage Doubler
August 2005
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M9999-081005
MIC4421/4422
Micrel, Inc.
Input Stage
dissipation limit can easily be exceeded. Therefore, some
attention should be given to power dissipation when driving
low impedance loads and/or operating at high frequency.
The input voltage level of the MIC4421 changes the quiescent supply current. The N channel MOSFET input stage
transistor drives a 320µA current source load. With a logic
“1” input, the maximum quiescent supply current is 400µA.
Logic “0” input level signals reduce quiescent current to
80µA typical.
The supply current vs. frequency and supply current vs
capacitive load characteristic curves aid in determining
power dissipation calculations. Table 1 lists the maximum
safe operating frequency for several power supply voltages when driving a 10,000pF load. More accurate power
dissipation figures can be obtained by summing the three
dissipation sources.
The MIC4421/4422 input is designed to provide 300mV of
hysteresis. This provides clean transitions, reduces noise
sensitivity, and minimizes output stage current spiking
when changing states. Input voltage threshold level is approximately 1.5V, making the device TTL compatible over
the full temperature and operating supply voltage ranges.
Input current is less than ±10µA.
Given the power dissipation in the device, and the thermal
resistance of the package, junction operating temperature
for any ambient is easy to calculate. For example, the
thermal resistance of the 8-pin plastic DIP package, from
the data sheet, is 130°C/W. In a 25°C ambient, then, using
a maximum junction temperature of 150°C, this package
will dissipate 960mW.
The MIC4421 can be directly driven by the TL494,
SG1526/1527, SG1524, TSC170, MIC38C42, and similar
switch mode power supply integrated circuits. By offloading
the power-driving duties to the MIC4421/4422, the power
supply controller can operate at lower dissipation. This can
improve performance and reliability.
Accurate power dissipation numbers can be obtained by
summing the three sources of power dissipation in the
device:
The input can be greater than the VS supply, however, current will flow into the input lead. The input currents can be
as high as 30mA p-p (6.4mARMS) with the input. No damage
will occur to MIC4421/4422 however, and it will not latch.
• Load Power Dissipation (PL)
• Quiescent power dissipation (PQ)
• Transition power dissipation (PT)
Calculation of load power dissipation differs depending on
whether the load is capacitive, resistive or inductive.
The input appears as a 7pF capacitance and does not
change even if the input is driven from an AC source.
While the device will operate and no damage will occur up
to 25V below the negative rail, input current will increase
up to 1mA/V due to the clamping action of the input, ESD
diode, and 1kΩ resistor.
Resistive Load Power Dissipation
Dissipation caused by a resistive load can be calculated
as:
PL = I2 RO D
Power Dissipation
where:
CMOS circuits usually permit the user to ignore power
dissipation. Logic families such as 4000 and 74C have outputs which can only supply a few milliamperes of current,
and even shorting outputs to ground will not force enough
current to destroy the device. The MIC4421/4422 on the
other hand, can source or sink several amperes and drive
large capacitive loads at high frequency. The package power
I=
RO =
D=
the current drawn by the load
the output resistance of the driver when the output
is high, at the power supply voltage used. (See data
sheet)
fraction of time the load is conducting (duty cycle)
+18
WIMA
MKS-2
1 µF
5.0V
1
8
MIC4421
0V
5
0.1µF
0.1µF
4
LOGIC
GROUND
Table 1: MIC4421 Maximum
Operating Frequency
VS
Max Frequency
18V
220kHz
15V
300kHz
10V
640kHz
5V
2MHz
0V
2,500 pF
POLYCARBONATE
6 AMPS
300 mV
POWE R
GROUND
6, 7
18 V
TEK CURRENT
PROBE 6302
PC TRACE RESISTANCE = 0.05Ω
Conditions:
Figure 5. Switching Time Degradation Due to
Negative Feedback
M9999-081005
8
1. θJA = 150°C/W
2. TA = 25°C
3. CL = 10,000pF
August 2005
MIC4421/4422
Micrel, Inc.
Capacitive Load Power Dissipation
Transition Power Dissipation
Dissipation caused by a capacitive load is simply the energy
placed in, or removed from, the load capacitance by the
driver. The energy stored in a capacitor is described by the
equation:
Transition power is dissipated in the driver each time its
output changes state, because during the transition, for a
very brief interval, both the N- and P-channel MOSFETs in
the output totem-pole are ON simultaneously, and a current
is conducted through them from VS to ground. The transition
power dissipation is approximately:
E = 1/2 C V2
As this energy is lost in the driver each time the load is charged
or discharged, for power dissipation calculations the 1/2 is
removed. This equation also shows that it is good practice
not to place more voltage in the capacitor than is necessary,
as dissipation increases as the square of the voltage applied
to the capacitor. For a driver with a capacitive load:
PT = 2 f VS (A•s)
where (A•s) is a time-current factor derived from the typical
characteristic curve “Crossover Energy vs. Supply Voltage.”
Total power (PD) then, as previously described is just
PL = f C (VS)2
PD = PL + PQ + PT
where:
Definitions
f = Operating Frequency
C = Load Capacitance
VS =Driver Supply Voltage
CL = Load Capacitance in Farads.
D = Duty Cycle expressed as the fraction of time the
input to the driver is high.
Inductive Load Power Dissipation
f = Operating Frequency of the driver in Hertz
For inductive loads the situation is more complicated. For
the part of the cycle in which the driver is actively forcing
current into the inductor, the situation is the same as it is in
the resistive case:
IH = Power supply current drawn by a driver when both
inputs are high and neither output is loaded.
IL = Power supply current drawn by a driver when both
inputs are low and neither output is loaded.
PL1 = I2 RO D
However, in this instance the RO required may be either
the on resistance of the driver when its output is in the high
state, or its on resistance when the driver is in the low state,
depending on how the inductor is connected, and this is still
only half the story. For the part of the cycle when the inductor is forcing current through the driver, dissipation is best
described as
ID = Output current from a driver in Amps.
PD = Total power dissipated in a driver in Watts.
PL = Power dissipated in the driver due to the driver’s
load in Watts.
PQ = Power dissipated in a quiescent driver in Watts.
PL2 = I VD (1 – D)
PT = Power dissipated in a driver when the output
changes states (“shoot-through current”) in Watts.
NOTE: The “shoot-through” current from a dual
transition (once up, once down) for both drivers is
stated in Figure 7 in ampere-nanoseconds. This
figure must be multiplied by the number of repetitions per second (frequency) to find Watts.
where VD is the forward drop of the clamp diode in the driver
(generally around 0.7V). The two parts of the load dissipation
must be summed in to produce PL
PL = PL1 + PL2
Quiescent Power Dissipation
RO = Output resistance of a driver in Ohms.
Quiescent power dissipation (PQ, as described in the input
section) depends on whether the input is high or low. A low
input will result in a maximum current drain (per driver) of
≤ 0.2mA; a logic high will result in a current drain of ≤ 3.0mA.
Quiescent power can therefore be found from:
VS = Power supply voltage to the IC in Volts.
PQ = VS [D IH + (1 – D) IL]
where:
IH =
IL =
D=
VS =
quiescent current with input high
quiescent current with input low
fraction of time input is high (duty cycle)
power supply voltage
August 2005
9
M9999-081005
MIC4421/4422
Micrel, Inc.
+18 V
WIMA
MK22
1 µF
5.0V
1
2
0V
0.1µF
8
MIC4421
4
6, 7
5
TEK CURRENT
PROBE 6302
0.1µF
18 V
0V
10,000 pF
POLYCARBONATE
Figure 6. Peak Output Current Test Circuit
M9999-081005
10
August 2005
MIC4421/4422
Micrel, Inc.
Package Information
PIN 1
INCH (MM)
0.370 (9.40)
0.245 (6.22)
0.125 (3.18)
0.300 (7.62)
0.013 (0.330)
0.010 (0.254)
0.018 (0.57)
0.130 (3.30)
0.100 (2.54)
0.0375 (0.952)
8-Pin Plastic DIP (N)
MAX )
PIN 1
INCHES (MM)
0.150 (3.81)
0.013 (0.33)
45°
TYP
0.0040 (0.102)
0.010 (0.25)
0.007 (0.18)
0°–8°
0.189 (4.8)
0.045 (1.14)
0.016 (0.40)
PLANE
0.228 (5.79)
8-Pin SOIC (M)
August 2005
11
M9999-081005
MIC4421/4422
Micrel, Inc.
0.187 (4.74)
0.112 (2.84)
INCH (MM)
0.116 (2.95)
0.038 (0.97)
0.032 (0.81)
0.007 (0.18)
0.005 (0.13)
0.012 (0.30) R
0.012 (0.03)
5°
0° MIN
0.004 (0.10)
0.0256 (0.65) TYP
0.012 (0.03) R
0.035 (0.89)
0.021 (0.53)
8-Pin MSOP (MM)
0.150 D ±0.005
(3.81 D ±0.13)
0.177 ±0.008
(4.50 ±0.20)
0.400 ±0.015
(10.16 ±0.38)
0.050 ±0.005
(1.27 ±0.13)
0.108 ±0.005
(2.74 ±0.13)
0.241 ±0.017
(6.12 ±0.43)
0.578 ±0.018
(14.68 ±0.46)
SEATING
PLANE
7°
Typ.
0.550 ±0.010
(13.97 ±0.25)
0.067 ±0.005
(1.70 ±0.127)
0.032 ±0.005
(0.81 ±0.13)
0.268 REF
(6.81 REF)
0.018 ±0.008
(0.46 ±0.20)
Dimensions:
0.103 ±0.013
(2.62 ±0.33)
inch
(mm)
5-Lead TO-220 (T)
MICREL INC.
TEL
2180 FORTUNE DRIVE
+ 1 (408) 944-0800
FAX
SAN JOSE, CA 95131
+ 1 (408) 474-1000
WEB
USA
http://www.micrel.com
This information furnished by Micrel in this data sheet is believed to be accurate and reliable. However no responsibility is assumed by Micrel for its use.
Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can
reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into
the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser's
use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser's own risk and Purchaser agrees to fully indemnify
Micrel for any damages resulting from such use or sale.
© 2004 Micrel, Inc.
M9999-081005
12
August 2005
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