ATMEL ATL25/84 Asic Datasheet

Features
•
•
•
•
•
Available in Gate Array or Embedded Array
High-speed, 100 ps Gate Delay, 2-input NAND, FO = 2 (nominal)
Up to 6.9 Million Used Gates and 976 Pins
0.25µ Geometry in up to Five-level Metal
System-level Integration Technology
– Cores: ARM7TDMI™, ARM920T™, ARM946E-S™ and MIPS64™ 5Kf™ RISC
Microprocessors; AVR ® RISC Microcontroller; OakDSPCore™, Teak™ and
PalmDSPCore™ Digital Signal Processors; 10/100 Ethernet MAC, USB, 1394, 1284,
CAN and Other Assorted Processor Peripherals
– Analog Functions: DACs, ADCs, OPAMPs, Comparators, PLLs and PORs
– Soft Macro Memory: Gate Array
SRAM — ROM — DPSRAM — FIFO
– Hard Macro Memory: Embedded Array
SRAM — ROM — DPSRAM — FIFO — Stacked E2 — Stacked Flash
– I/O Interfaces: CMOS, LVTTL, LVDS, PCI, USB; Output Currents up to 16 mA
@2.5V; 2.5V Native I/O, 3.3V Tolerant/Compliant I/O, 5.0V Tolerant I/O
ASIC
ATL25 Series
Description
The ATL25 Series ASIC family is fabricated on a 0.25µ CMOS process with up to five
levels of metal. This family features arrays with up to 6.9 million routable gates and
976 pins. The high density and high pin count capabilities of the ATL25 family, coupled
with the ability to add embedded microprocessor cores, DSP engines and memory on
the same silicon, make the ATL25 series of ASICs an ideal choice for system-level
integration.
Figure 1. ATL25 Gate Array ASIC
Standard
Gate Array
Architecture
Figure 2. ATL25 Embedded Array ASIC
Standard
Gate Array
Architecture
Analog
1414C–ASIC-08/02
1
Table 1. ATL25 Array Organization
Device
Number
4LM Routable
Gates(1)
5LM Routable
Gates(1)
Available
Routing Sites(2)
Max Pad
Count
Max I/O Count
Gate
Speed (3)
ATL25/44
9,535
10,727
15,892
44
36
100 ps
ATL25/68
30,096
33,858
50,161
68
60
100 ps
ATL25/84
50,410
56,712
84,018
84
76
100 ps
ATL25/100
75,472
84,906
125,788
100
92
100 ps
ATL25/120
106,278
120,449
188,940
120
112
100 ps
ATL25/132
131,670
149,226
234,080
132
124
100 ps
ATL25/144
159,778
181,081
284,050
144
136
100 ps
ATL25/160
200,998
227,797
357,330
160
152
100 ps
ATL25/184
270,663
306,751
481,179
184
176
100 ps
ATL25/208
329,281
376,321
627,203
208
200
100 ps
ATL25/228
401,010
458,298
763,830
228
220
100 ps
ATL25/256
512,398
585,598
975,998
256
248
100 ps
ATL25/304
733,635
838,440
1,397,400
304
296
100 ps
ATL25/352
925,815
1,068,248
1,899,108
352
344
100 ps
ATL25/388
1,133,594
1,307,994
2,325,323
388
380
100 ps
ATL25/432
1,417,125
1,635,145
2,906,925
432
424
100 ps
ATL25/484
1,651,406
1,926,640
3,669,792
484
476
100 ps
ATL25/540
2,069,052
2,413,894
4,597,895
540
532
100 ps
ATL25/600
2,567,790
2,995,755
5,706,200
600
592
100 ps
ATL25/700
3,520,954
4,107,780
7,824,344
700
692
100 ps
ATL25/800
4,231,979
5,001,430
10,259,344
800
792
100 ps
ATL25/900
5,378,257
6,356,122
13,038,200
900
892
100 ps
ATL25/976
5,765,320
6,918,384
15,374,188
976
968
100 ps
Notes:
2
1. One gate = NAND2
2. Routing site = 4 transistors
3. Nominal 2-input NAND gate FO = 2 at 2.5V
ATL25 Series ASIC
1414C–ASIC-08/02
ATL25 Series ASIC
Design
Atmel supports several major software systems for design with complete cell libraries, as well
as utilities for netlist verification, test vector verification and accurate delay simulations
Table 2. Design Systems Supported
System
Tools
Version
Cadence®
Design
Systems, Inc.
Opus™ – Schematic and Layout
NC Verilog™ – Verilog Simulator
Pearl™ – Static Path
Verilog-XL ™ – Verilog Simulator
BuildGates™ – Synthesis (Ambit)
4.46
3.3-s008
4.3-s095
3.3-s006
4.0-p003
Mentor
Graphics®
ModelSim ® – Verilog and VHDL (VITAL) Simulator
Leonardo Spectrum ™ – Logic Synthesis
5.5e
2001.1d
Synopsys®
Design Compiler™ – Synthesis
DFT Compiler – 1-Pass Test Synthesis
BSD Compiler – Boundary Scan Synthesis
TetraMax® – Automatic Test Pattern Generation
PrimeTime™ – Static Path
VCS™ – Verilog Simulator
Floorplan Manager™
01.01-SP1
01.08-SP1
01.08-SP1
01.08
01.08-SP1
5.2
01.08-SP1
Novas
Software, Inc.®
Debussy®
5.1
Silicon
Perspective™
First Encounter®
v2001.2.3
Atmel’s ASIC design flow is structured to allow the designer to consolidate the greatest number of system components onto the same silicon chip, using widely available third-party design
tools. Atmel’s cell library reflects silicon performance over extremes of temperature, voltage
and process, and includes the effects of metal loading, interlevel capacitance, and edge rise
and fall times. The design flow includes clock tree synthesis to customer-specified skew and
latency goals. RC extraction is performed on the final design database and incorporated into
the timing analysis.
The ASIC design flow, shown on page 4, provides a pictorial description of the typical interaction between Atmel’s design staff and the customer. Atmel will deliver design kits to support
the customer’s synthesis, verification, floorplanning and scan insertion activities. Leadingedge tools from vendors such as Synopsys and Cadence are fully supported in our design
flow. In the case of an embedded array design, Atmel will conduct a design review with the
customer to define the partition of the embedded array ASIC and to define the location of the
memory blocks and/or cores so an underlayer layout model can be created.
Following database acceptance, automated test pattern generation (ATPG) is performed, if
required, on scan paths using Synopsys tools; the design is routed; and post-route RC data is
extracted. After post-route verification and a final design review, the design is taped out for
fabrication.
3
1414C–ASIC-08/02
Table 3. Design Flow
Deliver
Design Kit
If Embedded Array
Kickoff
Meeting
Define
Underlayer
Synthesis/
Design Entry
Scan/JTAG
Simulation/
Static Path
If Embedded Array
(Preliminary Netlist)
Floorplan
Create
Underlayer
Database
Handoff
Tape Out
Underlayer
Database
Acceptance
Fabricate
Underlayer
Place and Route/
Clock Tree
Verification/
Resimulation
Final Design
Review
If Standard Cell
If Embedded/Gate Array
Tape Out
Full Mask Set
Tape Out
Metal Masks
Fabricate
Fabricate
Personality
Customer
Atmel
Proto Assembly
and Test
Rev. 2.2-03/02
Joint
Proto Shipment
4
ATL25 Series ASIC
1414C–ASIC-08/02
ATL25 Series ASIC
Pin Definition
Requirements
The corner pads are reserved for power and ground only. All other pads are fully programmable as input, output, bidirectional, power, or ground. When implementing a design with 3.3V
compliant buffers, an appropriate number of pad sites must be reserved for the V DD 3 pins,
which are used to distribute 3.3V power to the compliant buffers.
Design Options
Logic Synthesis
Atmel can accept RTL designs in Verilog or VHDL HDL formats. Atmel fully supports Synopsys for Verilog or VHDL simulation as well as synthesis. Of the two HDL formats, Verilog and
VHDL, Atmel’s preferred HDL format for ASIC design is Verilog.
ASIC Design
Translation
Atmel has successfully translated existing designs from most major ASIC vendors into Atmel
ASICs. These designs have been optimized for speed and gate count and modified to add
logic or memory, or replicated as a pin-for-pin compatible, drop-in replacement.
FPGA and PLD
Conversions
Atmel has successfully translated existing FPGA/PLD designs from most major vendors into
Atmel ASICs. There are four primary reasons to convert from an FPGA/PLD to an ASIC:
•
Conversion of high-volume devices for a single or combined design is cost effective.
•
Performance can often be optimized for speed or low power consumption.
•
Several FPGA/PLDs can be combined onto a single chip to minimize cost while reducing
on-board space requirements.
•
In situations where an FPGA/PLD was used for fast cycle time prototyping, an ASIC may
provide a lower cost answer for long-term volume production.
5
1414C–ASIC-08/02
Macro Cores
AVR 8-bit RISC
Microcontroller
Core
The AVR RISC microcontroller is a true 8-bit RISC architecture, ideally suited for embedded
control applications. The AVR is offered as a gate level, synthesizable macro core in the
ATL25 family.
The AVR supports a powerful set of 120 instructions. The AVR prefetches an instruction during a prior instruction execution, enabling the execution of one instruction per clock cycle.
The Fast Access RISC register file consists of 32 general purpose working registers. These 32
registers eliminate the data transfer delay in the traditional program code intensive accumulator architectures.
The AVR can incorporate up to 64 x 16K program memory (ROM) and 64 x 8K data memory
(SRAM). Among the peripheral options offered are: UART, 8-bit timer/counter, 16-bit
timer/counter, programmable watchdog timer and SPI.
Figure 3. AVR 8-bit RISC Microcontroller Core
8-bit Data Bus
16 bit
6
ATL25 Series ASIC
1414C–ASIC-08/02
ATL25 Series ASIC
ARM7TDMI™
32-bit RISC
Microprocessor
Core
The ARM7TDMI is a powerful 32-bit processor offered as a hard macro core in the ATL25
family.
The ARM7TDMI is a member of the Advanced RISC Machines (ARM) family of general purpose 32-bit microprocessors, which offer high performance with very low power consumption.
Additionally, the ARM7T offers users a “thumb” mode (for higher code density using 16-bit
instructions
The ARM architecture is based on Reduced Instruction Set Computer (RISC) principles, and
the instruction set and related decode mechanism are much simpler than those of microprogrammed Complex Instruction Set Computers (CISC). This simplicity results in a high
instruction throughput and an impressive real-time interrupt response from a small and costeffective chip.
Pipelining is employed so that all parts of the processing and memory systems can operate
continuously. Typically, while one instruction is being executed, its successor is being
decoded, and a third instruction is being fetched from memory.
The ARM memory interface has been designed to allow the performance potential to be realized without incurring high costs in the memory system. Speed-critical control signals are
pipelined to allow system control functions to be implemented in standard low-power logic,
and these control signals facilitate the exploitation of the fast local access modes offered by
industry standard SRAMs.
The ARM7TDMI core interfaces to several optional peripheral macros. Among the peripheral
options offered are real-time clock, peripheral data controller, USART, external bus interface,
interrupt controller, timer counter and watchdog timer.
Figure 4. ARM7TDMI 32-bit RISC Microprocessor Core
Address
Incrementor
Register Bank
(31 X 32-bit Registers)
(6 Status Registers)
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1414C–ASIC-08/02
ARM920T™
32-bit RISC
Microprocessor
Core
The ARM920T extends the capabilities of the popular ARM7TDMI, while maintaining code
compatibility and Thumb instruction compression. Enhancements include Harvard architecture
and a memory management unit with virtual addressing support (allowing the use of advanced
platform operating systems such as Windows CE™, Linux ®, Symbian OS ™ and VxWorks™).
16 Kbyte data and instruction caches are included.
ARM946E-S™
32-bit RISC
Microprocessor
Core
The ARM946E-S is a synthesizable version of the ARM9E-S core, with similar features to the
ARM920T. The ARM9E-S instruction set adds saturation logic to enhance DSP implementation, as well as double-word data moves. Additional DSP features include a single cycle
16 x 32 Multiply Accumulate (MAC) Unit. A memory protection unit is provided, but without full
virtual memory support. As a result, the ARM946E-S is more suited to deeply embedded tasks
that do not require extended-platform OS support. Cache sizes can be tailored to the application, resulting in a (potentially) smaller die size compared to the ARM920T.
OakDSPCore®
Digital Signal
Processing Core
Atmel’s hard macro OakDSPCore is a 16-bit, general purpose, low-power, low-voltage and
high-speed Digital Signal Processor (DSP).
Oak is designed for mid-to-high-end telecommunications and consumer electronics applications, where low-power and portability are major requirements. Among the applications
supported are digital cellular telephones, fast modems, advanced facsimile machines and hard
disk drives. Oak is available as a DSP core in Atmel’s ASIC cell library, to be utilized as an
engine for a DSP-based ASIC. It is specified with several levels of modularity in SRAM, ROM
and I/O blocks, allowing efficient DSP-based ASIC development.
Oak is aimed at achieving the best cost-performance factor for a given (small) silicon area. As
a key element of a system-on-chip, it takes into account such requirements as program size,
data memory size, glue logic and power management.
The Oak core consists of three main execution units operating in parallel: the Computation/BitManipulation Unit (CBU), the Data Addressing Arithmetic Unit (DAAU) and the Program Control Unit (PCU).
The core also contains ROM and SRAM addressing units, and Program Control Logic (PCL).
All other peripheral blocks that are application specific are defined as part of the user-specific
logic and implemented around the DSP core on the same silicon die.
Oak has an enhanced set of DSP and general microprocessor functions to meet most application requirements. The Oak programming model and instruction set are aimed at the
straightforward generation of efficient and compact code.
MIPS64™ 5Kf™
64-bit RISC
Microprocessor
Core
The MIPS64 5Kf is a synthesizable MIPS64 5K family core that provides 64-bit address and
data paths along with an onboard IEEE 754-compliant Floating Point Unit. A built-in memory
management unit with virtual addressing support allows the use of platform operating systems
such as Windows CE and others. Also provided are configurable instruction and data caches,
as well as a multiply divide unit capable of single cycle 32 x 16 Multiply Accumulate (MAC)
operations.
Teak and
PalmDSPCore®
Digital Signal
Processing Cores
The Teak and Palm are synthesizable dual-MAC DSP cores from DSP Group, Inc. The Teak
is a fixed-point 16-bit DSP, whereas the Palm can be configured for 16-bit, 20-bit or 24-bit
fixed-point math. Both cores are optimized for high MIPs per mW, with performance targeted
to handling filtering, voice compression/decompression and modem functions for portable and
wireless applications such as 3G digital cellular. Hardware support is also provided for implementing Viterbi forward error correction.
8
ATL25 Series ASIC
1414C–ASIC-08/02
ATL25 Series ASIC
The Teak and Palm cores both have a comprehensive suite of development tools that are
easy to learn and are intended to support rapid code development. A C compiler that supports
in-line assembly language and provides language extensions to enhance C code optimization
is provided. An assembler and linker are also provided. Both emulation (using test silicon) and
source-level simulation of C and assembly language enhance software verification.
9
1414C–ASIC-08/02
ATL25 Series
Cell Library
Atmel’s ATL25 Series ASICs make use of an extensive library of cell structures, including logic
cells, buffers and inverters, multiplexers, decoders and I/O options. Soft macros are also
available.
These cells are characterized by use of SPICE modeling at the transistor level, with performance verified on manufactured test silicon. Characterization is performed over the rated
temperature and voltage ranges to ensure that the simulation accurately predicts the performance of the finished product.
Absolute Maximum Ratings*
Parameter
Rating
Operating Ambient Temperature
−55°C to +125°C
Storage Temperature
−65°C to +150°C
Maximum Input Volutage:
Inputs
3.3V Compliant
3.3V/5V Tolerant
VDD + 0.5V
VDD3 + 0.5V
5.5V
Maximum Operating Voltage (V DD)
2.7V
Maximum Operating Voltage (V DD3)
3.6V
Note:
* Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any
other conditions beyond those indicated in the operational sections of this specification is not
implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Table 4. 2.5-volt DC Characteristics
Applicable over recommended operating temperature and voltage range unless otherwise noted.
Symbol
Parameter
Buffer
Test Condition
Min
TA
Operating Temperature
All
−55
VDD
Supply Voltage
All
2.3
IIH
High-level Input Current
CMOS
VIN = VDD, VDD = VDD (max)
−10
−10
Typ
2.5
IIL
Low-level Input Current
CMOS
VIN = VSS, VDD = VDD (max)
Pull-up = 620 KΩ
IOZ
High-impedance State
Output Current
All
VIN = VDD or VSS,
VDD = VDD (max),
No pull-up or pull-down
IOS
Output Short-circuit
Current
PO11
VOUT = VDD, VDD = VDD (max)
6
PO11
VOUT = VSS, VDD = VDD (max)
−4
VIH
High-level Input Voltage
VIL
Low-level Input Voltage
VHYS
Hysteresis
CMOS Schmitt
PO11
IOH = 2 mA, VDD = V DD (max)
0.7VDD
VOH
High-level Output
Voltage (Standard and
Tolerant
3.3V Tolerant
IOH = 2 mA
0.7VDD
VOL
Low-level Output Voltage
(Standard and Tolerant)
PO11
IOL = 2 mA, VDD = VDD (max)
Note:
10
CMOS
0.7VDD
CMOS Schmitt
0.7VDD
Max
Units
125
°C
2.7
V
10
µA
µA
10
mA
V
1.3
CMOS
0.3VDD
CMOS Schmitt
1.1
µA
0.3VDD
0.4
V
V
V
0.3VDD
V
All I/Os 2.5V Compliant
ATL25 Series ASIC
1414C–ASIC-08/02
ATL25 Series ASIC
Table 5. 3.3-volt DC Characteristics
Applicable over recommended operating temperature and voltage range unless otherwise noted.
Symbol
Parameter
Buffer
TA
Operating
Temperature
All
−55
VDD
Supply Voltage
All Except 3.3V
Compliant I/O
2.3
VDD3
Supply Voltage
3.3V Compliant I/O
3.0
IIH
High-level Input
Current
CMOS
VIN = VDD,
VDD = VDD (max)
IIL
Low-level Input
Current
CMOS
VIN = VSS,
VDD = VDD (max)
Pull-up = 620 KΩ
−10
IOZ
High-impedance
State Output
Current
All
VIN = VDD or VSS
VDD = VDD (max)
No pull-up
−10
2 mA Buffer
VOUT = V DD,
VDD = VDD (max)
10
2 mA Buffer
VOUT = V SS,
VDD = VDD (max)
−9
IOS
Output Short-circuit
Current
Test Condition
CMOS, LVTTL
VIH
High-level Input
Voltage
Min
Typ
Max
Units
125
°C
2.5
2.7
V
3.3
3.6
V
10
µA
µA
10
mA
2.0
PCI
0.475V DD3
CMOS/TTL-level
Schmitt
2.0
V
1.7
CMOS
VIL
Low-level Input
Voltage
1.1
0.6
TTL-level Schmitt
High-level Output
Voltage
PO11
VOH
Low-level Output
Voltage
V
0.8
V
IOH = 2 mA,
VDD3 = VDD (min)
0.8VDD3
PCI
IOH = 500 µA
0.9VDD3
PO11
IOL = 2 mA,
VDD3 = VDD (min)
0.2VDD
IOL = 1.5 mA
0.1VDD
PCI
Note:
0.325VDD3
CMOS/TTL-level
Schmitt
Hysteresis
VOL
0.8
PCI
VHYS
µA
V
V
All I/Os 3.3V Tolerant/Compliant
11
1414C–ASIC-08/02
Table 6. I/O Buffer DC Characteristics
Symbol
Parameter
Test Condition
Typical
Units
CIN
Capacitance, Input Buffer (die)
3.3V
2.4
pF
COUT
Capacitance, Output Buffer (die)
3.3V
5.6
pF
CI/O
Capacitance, Bidirectional
3.3V
6.6
pF
Testability
Techniques
For complex designs involving blocks of memory and/or cores, careful attention must be given
to design-for-test techniques. The sheer size of complex designs requires the use of more efficient testability techniques. Combinations of SCAN paths, multiplexed access to memory
and/or core blocks, and built-in self-test logic (in addition to functional test patterns) must be
employed to provide both the user and Atmel with the ability to test the finished product.
An example of a highly complex design could include a PLL for clock management or synthesis,
a microprocessor or DSP engine or both, SRAM to support the microprocessor or DSP engine,
and glue logic to support the interconnectivity of each of these blocks. The design of each of
these blocks must take into consideration the fact that the manufactured device will be tested on
a high-performance digital tester. Combinations of parametric, functional and structural tests,
defined for digital testers, should be employed to create a suite of manufacturing tests.
The type of block dictates the type of testability technique to be employed. The PLL will, by
construction, provide access to key nodes so that functional and/or parametric testing can be
performed. Since a digital tester must control all the clocks during the testing of an ASIC, provisions must be made for the VCO to be bypassed. Atmel’s PLLs include a multiplexing
capability for just this purpose. The addition of a few pins will allow other portions of the PLL to
be isolated for test without impinging upon the normal functionality.
In a similar vein, access to microprocessor, DSP and SRAM blocks must be provided so that
controllability and observability of the inputs and outputs to the blocks are achieved with the
minimum amount of preconditioning. The ARM and MIPS microprocessors, AVR microcontroller and OakDSPCore/TeakDSPCore/PalmDSPCore digital signal processors all support
SCAN testing. SRAM blocks need to provide access to both address and data ports so that
comprehensive memory tests can be performed. Multiplexing I/O pins is a method for providing this accessibility.
The glue logic can be designed using full SCAN techniques to enhance its testability.
It should be noted that in almost all of these cases, the purpose of the testability technique is
to assure all embedded circuit blocks are functional. All of the techniques described above
should be considered supplemental to a set of patterns that exercise the functionality of the
design in its anticipated operating modes.
12
ATL25 Series ASIC
1414C–ASIC-08/02
ATL25 Series ASIC
Advanced
Packaging
The ATL25 Series ASICs are offered in a wide variety of standard packages, including plastic
and ceramic quad flatpacks, thin quad flatpacks, ceramic pin grid arrays and ball grid arrays.
High-volume onshore and offshore contractors provide assembly and test for commercial
product, with prototype capability in Colorado Springs. Custom package designs are also
available as required to meet a customer’s specific needs, and are supported through Atmel’s
package design center. If a standard package cannot meet a customer’s needs, a package
can be designed to precisely fit the customer-specific application and to maintain the performance obtained in silicon. Atmel has delivered custom-designed packages in a wide variety of
configurations.
Table 7. Packaging Options–Partial List
Package Type
Pin Count
PQFP
44, 52, 64, 80, 100, 120, 128, 132, 144, 160, 184, 208, 240, 304
Power Quad
144, 160, 208, 240, 304
L/TQFP
32, 44, 48, 64, 80, 100, 120, 128, 144, 160, 176, 216
PLCC
20, 28, 32, 44, 52, 68, 84
CPGA
64, 68, 84, 100, 124, 144, 155, 180, 223, 224, 299, 391
CQFP
64, 68, 84, 100, 120, 132, 144, 160, 224, 340
PBGA
121, 169, 208, 217, 225, 240, 256, 272, 300, 304, 313, 316, 329, 352, 388, 420, 456
Super BGA
168, 204, 240, 256, 304, 352, 432, 560, 600
Low-profile Mini BGA
40, 48, 49, 56, 60, 64, 80, 81, 84, 96, 100, 108, 128, 132, 144, 160, 176, 192, 208, 224, 228
Chip-scale BGA
32, 36, 40, 48, 49, 56, 64, 81, 84, 100, 108, 121, 128, 144, 160, 169, 176, 192, 208, 224, 256, 288, 324
Flex-tape BGA
48, 49, 64, 80, 81, 84, 96, 100, 112, 132, 144, 156, 160, 180, 192, 196, 204, 208, 220, 225, 228, 256, 280
FCBGA(1)
416, 480, 564, 672, 788, 896, 960, 1032, 1152, 1157, 1292, 1357, 1413, 1500, 1517, 1557, 1677, 1728,
1932
Note:
1. Require customer design substrate.
13
1414C–ASIC-08/02
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TEL (33) 2-40-18-18-18
FAX (33) 2-40-18-19-60
ASIC/ASSP/Smart Cards
1150 East Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
TEL 1(719) 576-3300
FAX 1(719) 540-1759
Biometrics/Imaging/Hi-Rel MPU/
High Speed Converters/RF Datacom
Avenue de Rochepleine
BP 123
38521 Saint-Egreve Cedex, France
TEL (33) 4-76-58-30-00
FAX (33) 4-76-58-34-80
Zone Industrielle
13106 Rousset Cedex, France
TEL (33) 4-42-53-60-00
FAX (33) 4-42-53-60-01
1150 East Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
TEL 1(719) 576-3300
FAX 1(719) 540-1759
Scottish Enterprise Technology Park
Maxwell Building
East Kilbride G75 0QR, Scotland
TEL (44) 1355-803-000
FAX (44) 1355-242-743
e-mail
[email protected]
Web Site
http://www.atmel.com
© Atmel Corporation 2002.
Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company’s standard warranty
which is detailed in Atmel’s Terms and Conditions located on the Company’s web site. The Company assumes no responsibility for any errors
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