Toshiba HN2E04F Toshiba multi chip discrete device Datasheet

HN2E04F
TOSHIBA MULTI CHIP DISCRETE DEVICE
HN2E04F
Super High Speed Switching Application
Audio Frequency Amplifier Application
Audio Low Noise Amplifier Application
Q1
High Voltage
Q2
Unit: mm
: VCEO = 120V
High DC Current Gain : hFE = 200 to 700
Good hFE Linearity
: hFE(IC = 0.1mA)/ hFE(IC = 2mA) = 0.95
Low Forward Voltage Drop
: VF(3) = 0.98V (typ.)
Fast Reverse Recovery Time
: trr = 1.6ns (typ.)
Low Total Capacitance
: CT = 0.5pF (typ.)
Q1 (Transistor)
: 2SA1587 equivalent
Q2 (Diode)
: 1SS352 equivalent
1.NC
2.Emitter
3.Cathode
4.Anode
5.Collector
6.Base
Q1 (Transistor) Absolute Maximum Ratings (Ta = 25°C)
Characteristic
Symbol
Rating
Unit
Collector-base voltage
VCBO
−120
V
Collector-emitter voltage
VCEO
−120
V
Emitter-base voltage
VEBO
−5
V
Collector current
IC
−100
mA
Base current
IB
−20
mA
Symbol
Rating
Unit
VRM
85
V
Reverse voltage
VR
80
V
Maximum (peak) forward current
IFM
300
mA
Average forward current
IO
100
mA
IFSM
1
A
Maximum (peak) reverse voltage
Surge current (10ms)
―
JEITA
―
TOSHIBA
2-3N1E
Weight: 0.015g (typ.)
Q2 (Diode) Absolute Maximum Ratings (Ta = 25°C)
Characteristic
JEDEC
Absolute Maximum Ratings (Ta = 25°C) (Q1, Q2 Common)
Characteristic
Collector power dissipation
Junction temperature
Storage temperature range
Symbol
Rating
Unit
PC*
300
mW
Tj
125
°C
Tstg
−55 to 125
°C
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if
the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report
and estimated failure rate, etc).
*Total rating: Power dissipation per element should not exceed 200mW per element.
Start of commercial production
2000-02
1
2014-03-01
HN2E04F
Q1 (Transistor) Electrical Characteristics (Ta = 25°C)
Symbol
Test
Circuit
Collector cut-off current
ICBO
―
Emitter cut-off current
IEBO
DC current gain
hFE*
Characteristic
Test Condition
Min
Typ.
Max
Unit
VCB = −120V, IE = 0
―
―
−100
nA
―
VEB = −5V, IC = 0
―
―
−100
nA
―
VCE =− 6V, IC = −2mA
200
―
700
VCE(sat)
―
IC =−10mA, IB =−1mA
―
―
−0.3
V
fT
―
VCE = −6V, IC =−1mA
―
100
―
MHz
Collector Output Capacitance
Cob
―
VCB =−10V, IE = 0, f=1MHz
―
4
―
pF
Noise figure
NF
―
―
1.0
―
dB
Min
Typ.
Max
Unit
Collector-emitter saturation voltage
Transition Frequency
VCE = −6 V, IC = −0.1 mA
f = 1 kHz, Rg = 10 kΩ
*: hFE Classifications GR(G): 200 to 400 , BL(L): 350 to 700
( )Marking Symbol
Q2 (Diode) Electrical Characteristics (Ta = 25°C)
Characteristic
Forward voltage
Symbol
Test
Circuit
VF (1)
―
IF = 1mA
―
0.62
―
VF (2)
―
IF = 10mA
―
0.75
―
VF (3)
―
IF = 100mA
―
0.98
1.20
Test Condition
V
IR (1)
―
VR = 30V
―
―
0.1
IR (2)
―
VR = 80V
―
―
0.5
Total capacitance
CT
―
VR = 0, f = 1MHz
―
0.5
―
pF
Reverse recovery time
trr
―
IF = 10mA (fig.1)
―
1.6
―
ns
Reverse current
Marking
μA
Equivalent Circuit (Top View)
Type Name
6
5
4
hFE RANK
32G
Q1
1
2
Q2
2
3
2014-03-01
HN2E04F
Fig. 1: Reverse Recovery Time (trr) Test Circuit
3
2014-03-01
HN2E04F
Q1
IC – VCE
IC – VBE
−5
−30
−10
COLLECTOR CURRENT IC
COMMON EMITTER
(mA)
Ta = 25°C
−9
−4
−8
COLLECTOR CURRENT IC
(mA)
COMMON EMITTER
−7
−3
−6
−5
−2
−4
−3
−1
−2
IB = −1 μA
0
0
0
−2
−4
−6
−8
COLLECTOR EMITTER VOLTAGE
−25
−20
−15
(V)
−0.2
(pF)
10
COLLECTOR OUTPUT
CAPACITANCE
Cob
hFE
DC CURRENT GAIN
VCE = −6 V
1000
Ta = 100°C
100
−0.1
25
−25
−0.3
−1
−0.4
−0.6
−0.8
VBE
−1.0
(V)
Cob – VCB
COMMON EMITTER
300
−25
BASE-EMITTER VOLTAGE
hFE – IC
500
25
−5
0
0
5
5000
3000
Ta = 100°C
−10
−10
VCE
VCE = −6 V
−3
−10
COLLECTOR CURRENT IC
−30
IE = 0
f = 1 MHz
Ta = 25°C
3
1
−1
−3
−10
COLLECTOR-BASE VOLTAGE
−30
VCB
−100
(V)
(mA)
COLLECTOR-EMITTER SATURATION
VCE (sat) (V)
VCE (sat) – IC
−1
COMMON EMITTER
−0.5
IC/IB = 10
−0.3
Ta = 100°C
−0.1
25
−25
−0.05
−0.03
−0.01
−0.1
−0.3
−1
−3
−10
COLLECTOR CURRENT IC
−30
(mA)
4
2014-03-01
HN2E04F
5
2014-03-01
HN2E04F
Q2
6
2014-03-01
HN2E04F
Q1, Q2 Common
PC* – Ta
COLLECTOR POWER DISSPATION
PC (mW)
500
400
300
200
100
0
0
25
50
75
100
125
150
175
AMBIENT TEMPERATURE Ta (°C)
*Total Rating.
7
2014-03-01
HN2E04F
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product,
or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all
relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for
Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for
the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product
design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or
applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams,
programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for
such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without
limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for
automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,
safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE
PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your
TOSHIBA sales representative.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology
products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export
laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export
Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in
compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES
OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
8
2014-03-01
Similar pages