Hynix HY628100B-E 128k x8 bit 5.0v low power cmos slow sram Datasheet

HY628100B Series
128Kx8bit CMOS SRAM
Document Title
128K x8 bit 5.0V Low Power CMOS slow SRAM
Revision History
Revision No
History
Draft Date
Remark
10
Initial Revision History Insert
Jul.14.2000
Final
11
Marking Information Add
Revised
- E.T (-25~85°C), I.T (-40~85°C) Part Insert
- AC Test Condition Add : 5pF Test Load
Dec.04.2000
Final
12
Changed Logo
- HYUNDAI -> hynix
- Marking Information Change
Apr.30.2001
Final
This document is a general product description and is subject to change without notice. Hynix Electronics does not assume any responsibility
for use of circuits described. No patent licenses are implied.
Rev 12 / Apr.2001
Hynix Semiconductor
HY628100B Series
DESCRIPTION
FEATURES
The HY628100B is a high speed, low power and
1M bit CMOS Static Random Access Memory
organized as 131,072 words by 8bit. The
HY628100B uses high performance CMOS
process technology and designed for high speed
low power circuit technology. It is particulary well
suited for used in high density low power system
application. This device has a data retention
mode that guarantees data to remain valid at a
minimum power supply voltage of 2.0V.
• Fully static operation and Tri-state output
• TTL compatible inputs and outputs
• Battery backup(L/LL-part)
-. 2.0V(min) data retention
• Standard pin configuration
-. 32pin SOP - 525mil
-. 32pin TSOPI - 8X20(Standard)
Product
Voltage
Speed
Operation
No
(V)
(ns)
Current/Icc(mA)
HY628100B
4.5~5.5 50*/55/70/85
10
HY628100B-E 4.5~5.5 50*/55/70/85
10
HY628100B-I
4.5~5.5 50*/55/70/85
10
Comment : 50ns is available with 30pF test load.
Standby Current(uA)
L
LL
100
20
100
30
100
30
Temperature
(°C)
0~70
-25~85
-40~85
PIN CONNECTION
NC
A16
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O1
I/O2
I/O3
Vss
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Vcc
A15
CS2
/WE
A13
A8
A9
A11
/OE
A10
/CS1
I/O8
I/O7
I/O6
I/O5
I/O4
SOP
A11
A9
A8
A13
/WE
CS2
A15
Vcc
NC
A16
A14
A12
A7
A6
A5
A4
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
/OE
A10
/CS1
DQ8
DQ7
DQ6
DQ5
DQ4
Vss
DQ3
DQ2
DQ1
A0
A1
A2
A3
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
TSOP-I(Standard)
PIN DESCRIPTION
BLOCK DIAGRAM
A0
ROW
DECODER
WRITE DRIVER
MEMORY ARRAY
128K x 8
I/O1
DATA I/O
BUFFER
SENSE AMP
A16
COLUMN
DECODER
Pin Function
Chip Select 1
Chip Select 2
Write Enable
Output Enable
Address Inputs
Data Inputs / Outputs
Power(4.5V~5.5V)
Ground
ADD INPUT
BUFFER
Pin Name
/CS1
CS2
/WE
/OE
A0 ~ A16
I/O1 ~ I/O8
Vcc
Vss
I/O8
/CS1
/OE
CONTROL
LOGIC
CS2
/WE
Rev 12 / Apr.2001
2
HY628100B Series
ORDERING INFORMATION
Part No.
Speed
Power
HY628100BLG
55/70/85
L-part
HY628100BLLG
55/70/85
LL-part
HY628100BLG-E
55/70/85
L-part
HY628100BLLG-E
55/70/85
LL-part
HY628100BLG-I
55/70/85
L-part
HY628100BLLG-I
55/70/85
LL-part
HY628100BLT1
55/70/85
L-part
HY628100BLLT1
55/70/85
LL-part
HY628100BLT1-E
55/70/85
L-part
HY628100BLLT1-E
55/70/85
LL-part
HY628100BLT1-I
55/70/85
L-part
HY628100BLLT1-I
55/70/85
LL-part
Comment : 50ns is available with 30pF test load.
Temp
0~70°C
0~70°C
-25~85°C
-25~85°C
-40~85°C
-40~85°C
0~70°C
0~70°C
-25~70°C
-25~70°C
-40~70°C
-40~70°C
Package
SOP
SOP
SOP
SOP
SOP
SOP
TSOP-I(Standard)
TSOP-I(Standard)
TSOP-I(Standard)
TSOP-I(Standard)
TSOP-I(Standard)
TSOP-I(Standard)
ABSOLUTE MAXIMUM RATING (1)
Symbol
Vcc, VIN, VOUT
TA
Parameter
Power Supply, Input/Output Voltage
Operating Temperature
TSTG
PD
IOUT
TSOLDER
Storage Temperature
Power Dissipation
Data Output Current
Lead Soldering Temperature & Time
Rating
-0.5 to 7.0
0 to 70
-25 to 85
-40 to 85
-65 to 125
1.0
50
260 • 10
Unit
V
°C
°C
°C
°C
W
mA
°C•sec
Remark
HY628100B
HY628100B-E
HY628100B-I
Note
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent
damage to the device. This is stress rating only and the functional operation of the device under these
or any other conditions above those indicated in the operation of this specification is not implied.
Exposure to the absolute maximum rating conditions for extended period may affect reliablity.
TRUTH TABLE
/CS1
H
X
L
L
L
CS2
X
L
H
H
H
/WE
X
X
H
H
L
/OE
X
X
H
L
X
Mode
Deselected
Deselected
Output Disabled
Read
Write
I/O
High-Z
High-Z
High-Z
Data Out
Data In
Power
Standby
Standby
Active
Active
Active
Note :
1. H=VIH, L=VIL, X=don't care( VIH or VIL )
Rev 12 / Apr.2001
2
HY628100B Series
RECOMMENDED DC OPERATING CONDITION
TA = 0°C to 70°C / -25°C to 85°C (E) / -40¡ Éto 85¡ É
(I), unless otherwise specified
Symbol
Parameter
Min.
Typ.
Max.
Unit
Vcc
Supply Voltage
4.5
5.0
5.5
V
Vss
Ground
0
0
0
V
VIH
Input High Voltage
2.2
Vcc+0.5
V
VIL
Input Low Voltage
-0.5(1)
0.8
V
Note :
1. VIL = -1.5V for pulse width less than 30ns and not 100% tested
DC ELECTRICAL CHARACTERISTICS
Vcc = 4.5V~5.5V, TA = 0°C to 70°C / -25°C to 85°C (E) / -40¡ Éto 85¡ É
(I), unless otherwise specified
Symbol
Parameter
Test Condition
Min.
Typ.
Max.
ILI
Input Leakage Current
Vss < VIN < Vcc
-1
1
ILO
Output Leakage Current
Vss < VOUT < Vcc,
-1
1
/CS1 = VIH or CS2 = VIL
or /OE = VIH or /WE = VIL
Icc
Operating Power Supply
/CS1 = VIL, CS2 = VIH,
10
Current
VIN = VIH or VIL, II/O = 0mA
ICC1
Average Operating
/CS1 = VIL, CS2 = VIH,
50
Current
VIN = VIH or VIL
Cycle Time = Min, 100% duty,
IIO = 0mA
ISB
TTL Standby Current
/CS1 = VIH or CS2 = VIL
2
(TTL Input)
VIN = VIH or VIL
ISB1
Standby
HY628100B
/CS1 > Vcc - 0.2V or
L
2
100
Current
CS2 < 0.2V ,
LL
1
20
(CMOS Input)
HY628100B-E/I
VIN > Vcc - 0.2V or
L
2
100
VIN < Vss + 0.2V
LL
1
30
VOL
Output Low Voltage
IOL = 2.1mA
0.4
VOH
Output High Voltage
IOH = -1mA
2.4
-
Unit
uA
uA
mA
mA
mA
uA
uA
uA
uA
V
V
Note : Typical values are at Vcc = 5.0V, TA = 25°C
CAPACITANCE
Temp = 25°C, f= 1.0MHz
Symbol
Parameter
CIN
Input Capacitance
COUT
Output Capacitance
Condition
VIN = 0V
VI/O = 0V
Max.
6
8
Unit
pF
pF
Note : These parameters are sampled and not 100% tested
Rev 12 / Apr.2001
3
HY628100B Series
AC CHARACTERISTICS
Vcc = 4.5V~5.5V, TA = 0°C to 70°C / -25°C to 85°C (E) / -40¡ Éto 85¡ É
(I), unless otherwise specified
-55
-70
-85
# Symbol
Parameter
Min.
Max. Min.
Max. Min
Max.
READ CYCLE
1
tRC
Read Cycle Time
55
70
85
2
tAA*
Address Access Time
55
70
85
3
tACS* Chip Select Access Time
55
70
85
4
tOE
Output Enable to Output Valid
25
35
45
5
tCLZ
Chip Select to Output in Low Z
10
10
10
6
tOLZ
Output Enable to Output in Low Z
5
5
5
7
tCHZ
Chip Deselection to Output in High Z
0
20
0
25
0
30
8
tOHZ
Out Disable to Output in High Z
0
20
0
25
0
30
9
tOH
Output Hold from Address Change
10
10
10
WRITE CYCLE
10 tWC
Write Cycle Time
55
70
85
11 tCW
Chip Selection to End of Write
45
60
70
12 tAW
Address Valid to End of Write
45
60
70
13 tAS
Address Set-up Time
0
0
0
14 tWP
Write Pulse Width
40
50
55
15 tWR
Write Recovery Time
0
0
0
16 tWHZ
Write to Output in High Z
0
20
0
25
0
30
17 tDW
Data to Write Time Overlap
25
30
40
18 tDH
Data Hold from Write Time
0
0
0
19 tOW
Output Active from End of Write
5
5
5
Comment : tAA* and tACS* can meet 50ns with 30pF test load.
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
AC TEST CONDITIONS
TA = 0°C to 70°C / -25°C to 85°C (E) / -40¡ Éto 85¡ É
(I), unless otherwise specified
Parameter
Value
Input Pulse Level
0.4V to 2.2V
Input Rise and Fall Time
5ns
Input and Output Timing Reference Level
1.5V
Output Load
tCLZ,tOLZ,tCHZ,tOHZ,tWHZ,tOW
CL = 5pF + 1TTL Load
Others
CL = 100pF + 1TTL Load
CL* = 30pF + 1TTL Load
Comment
* : Test load is 30pF for 50ns
AC TEST LOADS
TTL
CL(1)
Note : Including jig and scope capacitance
Rev 12 / Apr.2001
4
HY628100B Series
TIMING DIAGRAM
READ CYCLE 1(Note 1,4)
tRC
ADDR
tAA
tOH
tACS
/CS1
CS2
tCHZ(3)
tOE
/OE
tOLZ(3)
Data
Out
tOHZ(3)
tCLZ(3)
High-Z
Data Valid
READ CYCLE 2(Note 1,2,4)
tRC
ADDR
tAA
tOH
tOH
Data
Out
Previous Data
Data Valid
READ CYCLE 3(Note 1,2,4)
/CS1
CS2
tACS
tCLZ(3)
Data
Out
tCHZ(3)
Data Valid
Notes:
1. A read occurs during the overlap of a low /OE, a high /WE, a low /CS1 and a high CS2.
2. /OE = VIL
3. Transition is measured + 200mV from steady state voltage.
This parameter is sampled and not 100% tested.
4. /CS1 in high for the standby, low for active
CS2 in low for the standby, high for active
Rev 12 / Apr.2001
5
HY628100B Series
WRITE CYCLE 1(1,4,5,8) (/WE Controlled)
tW C
ADDR
tW R (2)
tCW
/CS1
CS2
tAW
tW P
/W E
tAS
Data In
tDW
High-Z
tDH
Data Valid
tW H Z (3,7)
tOW
(5 )
(6 )
Data
Out
WRITE CYCLE 2 (Note 1,4,5,8) (/CS1, CS2 Controlled)
tW C
ADDR
tCW
tAS
tW R (2)
/CS1
tAW
CS2
tW P
/W E
tDW
Data In
Data
Out
High-Z
tDH
Data Valid
High-Z
Notes:
1. A write occurs during the overlap of a low /WE, a low /CS1 and a high CS2.
2. tWR is measured from the earlier of /CS1 or /WE going high or CS2 going low to the end of
write cycle.
3. During this period, I/O pins are in the output state so that the input signals of opposite phase to the
output must not be applied.
4. If the the /CS1 low transition and CS2 high transition occur simultaneously with the /WE low transition
or after the /WE transition, outputs remain in a high impedance state.
6. Q(data out) is the same phase with the write data of this write cycle.
7. Q(data out) is the read data of the next address.
8. Transition is measured +200mV from steady state.
This parameter is sampled and not 100% tested.
9. /CS1 in high for the standby, low for active
CS2 in low for the standby, high for active
Rev 12 / Apr.2001
6
HY628100B Series
DATA RETENTION ELECTRIC CHARACTERISTIC
TA = 0°C to 70°C / -25°C to 85°C (E) / -40¡ Éto 85¡ É
(I), unless otherwise specified
Sym
Parameter
Test Condition
Min
VDR
Vcc for Data Retention
/CS1 > Vcc - 0.2V or CS2 < 0.2V,
2.0
VIN > Vcc - 0.2V or VIN < Vss + 0.2V
ICCDR Data
HY628100B
Vcc = 3.0V,
L
Retention
/CS1>Vcc-0.2V or CS2< 0.2V, LL
Current
HY628100B-E/I
VIN > Vcc - 0.2V or
L
VIN < Vss + 0.2V
LL
tCDR
Chip Deselect to Data Retention Time
0
tR
Operating Recovery Time
tRC
Typ
-
Max
-
Unit
V
2
1
2
1
-
50
10
50
15
-
uA
uA
uA
uA
ns
ns
(2)
Notes:
1. Typical values are under the condition of TA = 25°C.
2. tRC is read cycle time.
DATA RETENTION TIMING DIAGRAM 1
DATA RETENTION MODE
VCC
4.5V
tCDR
tR
2.2V
VDR
CS1>VCC-0.2V
CS1
VSS
DATA RETENTION TIMING DIAGRAM 2
DATA RETENTION MODE
VCC
4.5V
tR
tCDR
CS2
VDR
0.4V
VSS
Rev 12 / Apr.2001
CS2<0.2V
7
HY628100B Series
PACKAGE INFORMATION
32pin 525mil Small Outline Package(G)
UNIT : INCH(mm)
0.810(20.574)
0.804(20.422)
0.444(11.278)
0.438(11.125)
0.564(14.326)
0.546(13.868)
0.109(2.769)
0.099(2.515)
0.011(0.279)
0.004(0.102)
0.050(1.27)BSC
0.0125(0.318)
0.0061(0.155)
0.020(0.508)
0 deg
0.0425(1.080)
0.014(0.356)
8 deg
0.0235(0.597)
32pin 8x20mm Thin Small Outline Package Standard(T1)
#1
#32
UNIT : INCH(mm)
0.319(8.103)
0.311(7.900)
#17
#16
0.728(18.491)
0.720(18.288)
0.792(20.117)
0.784(19.914)
0.041(1.05)
0.037(0.95)
0.006(0.15)
0.002(0.05)
0.025(0.64)
0.021(0.54)
Rev 12 / Apr.2001
0.008(0.21)
0.004(0.10)
0.020(0.50)
BSC
0.011(0.27)
0.007(0.17)
8
HY628100B Series
MARKING INFORMATION
Package
SOP
TSOP-I
Marking Example
h
y
n
i
x
H
Y
6
2
8
y
y
w
w
p
h
y
n
i
x
H
Y
6
2
8
y
y
w
w
p
1
0
0
0
O
R
E
A
G
-
s
s
t
K
O
R
E
A
1
-
s
s
t
B
c
1
K
0
B
c
c
c
T
Index
• hynix
• KOREA
• HY628100B
• yy
• ww
•p
• cc
• G / T1
• ss
•t
Note
- Capital Letter
- Small Letter
Rev 12 / Apr.2001
: hynix Logo
: Origin Country
: Part Name
: Year ( ex : 00 = year 2000, 01 = year 2001 )
: Work Week ( ex : 12 = ww12 )
: Process Code
: Power Consumption
-L
: Low Power
- LL
: Low Low Power
: Package Type
-G
: SOP
- T1
: TSOP-I
: Speed
- 55
: 55ns
- 70
: 70ns
: Temperature
- Blank
: Commercial ( 0 ~ 70 °C )
-E
: Extended ( -25 ~ 85 °C )
-I
: Industrial ( -40 ~ 85 °C )
: Fixed Item
: Non-fixed Item (Except hynix)
9
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