IXYS CPC5621ATR 3.3 or 5 v power supply operation Datasheet

CPC5620/CPC5621
LITELINK® III
Phone Line Interface IC (DAA)
INTEGRATED CIRCUITS DIVISION
Features
Description
• Superior voice solution with low noise, excellent
part-to-part gain accuracy
• 3 kVrms line isolation
• Transmit power of up to +10 dBm into 600 
• Data access arrangement (DAA) solution for
modems at speeds up to V.92
• 3.3 or 5 V power supply operation
• Caller ID signal reception function
• Easy interface with modem ICs and voice CODECs
• Worldwide dial-up telephone network compatibility
• CPC5620 and CPC5621 can be used in circuits that
comply with the requirements of TIA/EIA/IS-968
(FCC part 68), UL1950, UL60950, EN/IEC 60950-1
Supplementary Isolation compliant, EN55022B,
CISPR22B, EN55024, and TBR-21
• Line-side circuit powered from telephone line
• Compared to other silicon DAA solutions, LITELINK:
- Uses fewer passive components
- Takes up less printed-circuit board space
- Uses less telephone line power
- Offers simplified operation
- Is a single-IC solution
LITELINK III is a single-package silicon phone line
interface (PLI) DAA used in voice and data
communication applications to make connections
between low-voltage equipment and high-voltage
telephone networks.
LITELINK provides a high-voltage isolation barrier, AC
and DC phone line terminations, switch hook, 2-wire to
4-wire hybrid, ring detection, and on-hook signal
detection. LITELINK can be used in both differential
and single-ended signal applications.
LITELINK uses on-chip optical components and a few
inexpensive external components to form a complete
voice or high-speed data phone line interface.
LITELINK eliminates the need for large isolation
transformers or capacitors used in other interface
configurations. It includes the required high-voltage
isolation barrier in a surface-mount SOIC package.
The CPC5620 (half-wave ringing detect) and
CPC5621 (full-wave ringing detect) build upon IXYS
Integrated Circuits Division’s LITELINK product line,
with improved insertion loss control, improved noise
performance, and lower minimum current draw from
the phone line. The new mode pin enables worldwide
implementation.
Applications
•
•
•
•
•
•
•
Computer telephony and gateways, such as VoIP
PBXs
Satellite and cable set-top boxes
V.92 (and other standard) modems
Fax machines
Voicemail systems
Embedded modems for POS terminals, automated
banking, remote metering, vending machines,
security, and surveillance
Ordering Information
Part Number
Description
CPC5620A
CPC5620ATR
CPC5621A
CPC5621ATR
32-pin SOIC, half-wave ring detect, 50/Tube
32-pin SOIC, half-wave ring detect, 1000/Reel
32-pin SOIC, full-wave ring detect, 50/Tube
32-pin SOIC, full-wave ring detect, 1000/Reel
CPC5620/CPC5621 Block Diagram
TIP+
Isolation Barrier
Transmit
Isolation
Amplifier
Tx+
Tx-
Transmit
Diff.
Amplifier
Transconductance
Stage
2-4 Wire Hybrid
AC/DC Termination
Hookswitch
VI Slope Control
AC Impedance Control
Current Limit Control
MODE
OH
3kVrms
CID
Isolation
e3
Rx-
Receive
Diff.
Amplifier
CID/
RING
MUX
Snoop Amplifier
DS-CPC5620/CPC5621-R05
RING-
Vref
Gain Trim
Receive
Isolation
Amplifier
Rx+
Pb
Vref
Gain Trim
RING
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CSNOOP
RSNOOP
CSNOOP
RSNOOP
1
CPC5620/CPC5621
INTEGRATED CIRCUITS DIVISION
1 Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1 Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3
3
4
5
2 Application Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.1 Resistive Termination Application Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.1.1 Resistive Termination Application Circuit Part List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.1.2 Reactive Termination Application Circuit Part List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6
6
7
9
3 Using LITELINK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1 Switch Hook Control (On-hook and Off-hook States) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2 On-hook Operation: OH=1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2.1 Ringing Signal Reception via the Snoop Circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2.2 Polarity Reversal Detection with CPC5621 in On-hook State . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2.3 On-hook Caller ID Signal Reception . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3 Off-Hook Operation: OH=0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3.1 Receive Signal Path. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3.2 Transmit Signal Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.4 Start-up Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.5 DC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.5.1 Setting a Current Limit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.6 AC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.6.1 Resistive Termination Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.6.2 Reactive Termination Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.6.3 Mode Pin Usage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
10
10
10
10
11
11
12
12
12
13
13
13
13
13
13
14
4 Regulatory Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5 LITELINK Design Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6 LITELINK Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
7 Manufacturing Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
7.1 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2
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R05
CPC5620/CPC5621
INTEGRATED CIRCUITS DIVISION
1. Electrical Specifications
1.1 Absolute Maximum Ratings
Parameter
Minimum Maximum
Unit
VDD
-0.3
6
V
Logic Inputs
-0.3
VDD + 0.3
V
Continuous Tip to Ring
Current (RZDC = 5.2)
-
150
mA
Total Package Power
Dissipation
-
1
W
Isolation Voltage
-
3000
Vrms
Operating temperature
-40
+85
°C
Storage temperature
-40
+125
°C
R05
Absolute maximum ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
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3
CPC5620/CPC5621
INTEGRATED CIRCUITS DIVISION
1.2 Performance
Parameter
Minimum
Typical
Maximum
Unit
Conditions
DC Characteristics
Operating Voltage VDD
3.0
-
5.50
V
Low-voltage side
Operating Current IDD
-
9
13
mA
Low-voltage side
Operating Voltage VDDL
2.8
-
3.2
V
Operating Current IDDL
-
7
8
mA
Line side, drawn from tip and ring while off-hook
On-hook Characteristics
Metallic DC Resistance
10
-
-
M
Tip to ring, 100 VDC applied
Longitudinal DC Resistance
10
-
-
150 VDC applied from tip and ring to Earth ground
15 Hz ring signal applied tip to ring
-3 dB corner frequency @ 166 Hz, in IXYS Integrated
Circuits Division application circuit
120 Vrms 60 Hz common-mode signal across tip and ring
Line side, derived from tip and ring
Ringing Signal Detect Level
5
-
-
M
Vrms
Ringing Signal Detect Level
28
-
-
Vrms
Snoop Circuit Frequency Response
166
-
>4000
Hz
Snoop Circuit CMRR 1
Ringer Equivalence
60
40
0.1B
-
-
dB
REN
dB
40
-
600
26
-

dB
dB
Tip to ring, using resistive termination application circuit
Per FCC part 68
Into 600 at 1800 Hz
30
-
4000
Hz
-
36
-
dB
-0.4
0
0.4
dB
Average In-band Noise
Harmonic Distortion
-
-126
-80
-
Transmit Level
-
-
2.2
dBm/Hz
dB
VP-P
-3 dB corner frequency 30 Hz
Into 600 at 1800 Hz, with C18 in the resistive
termination application circuit
30 Hz to 4 kHz, for resistive termination application
circuit with MODE de-asserted and for reactive
termination application circuit with MODE asserted.
4 kHz flat bandwidth
60
90
2.2
0.5
120
VP-P
3000
2000
-
-
Vrms
Longitudinal Balance 1
Off-Hook Characteristics
AC Impedance
Longitudinal Balance
Return Loss
Transmit and Receive Characteristics
Frequency Response
Transhybrid Loss
Transmit and Receive Insertion Loss
Receive Level
RX+/RX- Output Drive Current
TX+/TX- Input Impedance
Isolation Characteristics
Isolation Voltage
Surge Rise Time
MODE, OH, and CID Control Logic Inputs
Input Low Voltage
mA
k
V/S
68 Hz ring signal applied tip to ring
Per FCC part 68
-3 dBm, 600 Hz, 2nd harmonic
Single-tone sine wave. Or 0 dBm into 600
Single-tone sine wave. Or 0 dBm into 600
Sink and source
Line side to low-voltage side, one minute duration
No damage via tip and ring
-
-
0.8
VIL
2.0
-
-
VIH
High Level Input Current
-
-
-120
A
VIN VDD
Low Level Input Current
RING Output Logic Levels
Output High Voltage
-
-
-120
A
VIN = GND
VDD -0.4
-
-
V
IOUT = -400 A
-
-
0.4
V
IOUT = 1 mA
Input High Voltage
Output Low Voltage
Specifications subject to change without notice. All performance characteristics based on the use of IXYS Integrated Circuits Division application circuits.
Functional operation of the device at conditions beyond those specified here is not implied. All specifications at 25°C and VDD = 5V unless otherwise noted.
1) This parameter is layout and component tolerance dependent.
4
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R05
CPC5620/CPC5621
INTEGRATED CIRCUITS DIVISION
1.3 Pin Description
Pin
Name
1
2
VDD
TXSM
3
TX-
4
TX+
5
TX
6
MODE
7
8
9
GND
OH
RING
10 CID
11 RX-
12 RX+
13
14
15
16
SNP+
SNPRXF
RX
17 VDDL
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
R05
RXS
RPB
BRZDC
DCS2
DCS1
NTF
GAT
NTS
BRTXSL
ZNT
ZTX
TXF
REFL
Figure 1. Pinout
Function
Low-voltage (CPE) side power supply
Transmit summing junction
Negative differential transmit signal to DAA
from low-voltage side
Positive differential transmit signal to DAA from
low-voltage side
Transmit differential amplifier output
When asserted low, changes gain of TX path
(-7 dB) and RX path (+7 dB) to accommodate
reactive termination networks
Low-voltage (CPE) side analog ground
Assert logic low for off-hook operation
Ringing Detect Output
Assert logic low while on hook to allow CID
information to be passed to the RX+ and RXoutput pins.
Negative differential analog signal received
from the telephone line. Must be AC coupled
with 0.1 F.
Positive differential analog signal received from
the telephone line. Must be AC coupled with
0.1 F.
Positive differential snoop input
Negative differential snoop input
Receive photodiode amplifier output
Receive photodiode summing junction
Power supply for line side, regulated from tip
and ring.
Receive isolation amp summing junction
Receive LED pre-bias current set
Bridge rectifier return
Electronic inductor DCR/current limit
DC feedback output
V to I slope control
Network amplifier feedback
External MOSFET gate control
Receive signal input
Bridge rectifier return
Transmit photodiode summing junction
Receiver impedance set
Transmit transconductance gain set
Transmit photodiode amplifier output
1.25 VDC reference
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
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VDD
TXSM
TXTX+
TX
MODE
GND
OH
RING
CID
RXRX+
SNP+
SNPRXF
RX
REFL
TXF
ZTX
ZNT
TXSL
BRNTS
GAT
NTF
DCS1
DCS2
ZDC
BRRPB
RXS
VDDL
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
5
CPC5620/CPC5621
INTEGRATED CIRCUITS DIVISION
2. Application Circuits
LITELINK can be used with telephone networks
worldwide. Some public telephone networks, notably
in North America and Japan require resistive line
termination. Other telephone networks, as in Europe
and elsewhere, require a reactive line termination.
The application circuits below address both line
termination models. The reactive termination
application circuit (see Figure 3 on page 8) describes the
TBR-21 implementation. This circuit can be adapted
easily for other reactive termination needs.
2.1 Resistive Termination Application Circuit
Figure 2. Resistive Termination Application Circuit Schematic
3.3 or 5V
R23 2
10
C1
1μ
FB1
600 Ω
200 mA
C16
10μ
TXTX+
A
U1
A
R1
(RTX)
80.6K
1 VDD
TXF
ZTX
0.1μ
3 TX-
C2
0.1μ
4 TX+
RING
RXRX+
C14
TXSL
28
6 MODE
BR-
27
7 GND
NTS 26
8 OH
GAT 25
9 RING
NTF
C4
0.1μ 11
RX-
R5
(RTXF)
60.4K
R12
(RNTF)
24
DCS2
499K
RPB
15 RXF
RXS
19
BR-
C8
(CSNP+) 4
220pF
C15
0.01μ
500V
R20
(RVDDL)
2
5%
BR-
+
DB1
TIP
R18
(RZTX)
3.32K
C18
15p 3
R10
(RZNT)
301
BR-
BR-
SP1 1
RING
BR-
R6
(RSNP-2)
R44
(RSNP-1)
1.8M
1.8M
R7
(RSNP+2)
R45
(RSNP+1)
1.8M
1.8M
NOTE: Unless otherwise noted:
Resistor values are in Ohms
All resistors are 1%.
Capacitor values are in Farads.
¹This design was tested and found to comply with FCC Part 68 with this
Sidactor. Other compliance requirements may require a different part.
²Higher-noise power supplies may require substitution of a 220 H inductor,
Toko 380HB-2215 or similar. See the Power Quality section of IXYS
Integrated Circuits Division application note AN-146, Guidelines for
Effective LITELINK Designs for more information.
6
BR-
47
5%
R76 (RHTF)
200K
R8
221K (RHTX)
R4
(RPB)
68.1
R3
(RSNPD)
1.5M
C12
(CDCS)
0.027μ
Q1
CPC5602C
BR-
VDDL 17
C7
(CSNP-) 4
220pF
R21
(RDCS1B)
6.49M
R14
(RGAT)
R16 (R
3
ZDC)
8.2
18
R2
(RRXF)
130K
C21
100p
(CGAT)
1.69M
BR- 20
14 SNP-
BR-
R22
(RDCS1A)
6.49 M
R15
(RDCS2)
22
ZDC 21
13 SNP+
C10
0.01μ
500V
R13
(RNTS)
1M
R75
(RNTX)
261K
BR-
DCS1 23
0.1μ 12
RX+
16 RX
BR-
30
ZNT
10 CID
CID
C9
0.1μ
31
29
5 TX
OH
REFL 32
2 TXSM
C13
A
LITELINK
³Optional for enhanced transhybrid loss.
4Use
voltage ratings based on the isolation requirements of your
application.
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R05
CPC5620/CPC5621
INTEGRATED CIRCUITS DIVISION
2.1.1 Resistive Termination Application Circuit Part List
Quantity
Reference Designator
Description
1
5
C1
C2, C4, C9, C13, C14
1 F, 16 V, ±10%
0.1 F, 16 V, ±10%
2
C7, C8 1
C10, C15
C12
C16
C18 (optional)
C21
R1
R2
R3
R4
R5
220 pF, ±5%
2
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
R6, R7, R44, R45 2
R8
R10
R12
R13
R14
R15
R16
R18
R20
R21, R22
R23
R75
R76
FB1
DB1
1
SP1
1
1
Q1
U1
4
1Use
2
0.01 F, 500 V, ±10%
0.027 F, 16 V, ±10%
10 F, 16 V, ±10%
15 pF, 16 V, ±10%
100 pF, 16 V, 10%
80.6 k, 1/16 W, ±1%
130 k, 1/16 W, ±1%
1.5 M, 1/16 W, ±1%
68.1 , 1/16 W, ±1%
60.4 k, 1/16 W, ±1%
Supplier(s)
AVX, Murata, Novacap, Panasonic,
SMEC, Tecate, etc.
1.8 M, 1/10 W, ±1%
221 k, 1/16 W, ±1%
301 , 1/16 W, ±1%
499 k, 1/16 W, ±1%
Panasonic, Electro Films, FMI, Vishay,
1 M, 1/16 W, ±1%
etc.
47 , 1/16 W, ±5%
1.69 M, 1/16 W, ±1%
8.2 , 1/8 W, ±1%
3.32 k 1/16 W, ±1%
2 , 1/16 W, ±5%
6.49 M, 1/16 W, ±1%
10  1/16 W, ±5%, or 220 H inductor
261 k, 1/16 W, ±1%
200 k, 1/16 W, ±1%
600 , 200 mA ferrite bead
Murata BLM11A601S or similar
S1ZB60 bridge rectifier
Shindengen, Diodes, Inc.
Bourns (TISP4350H3) or 
350 V
Teccor (P3100SC)
CPC5602 FET
IXYS Integrated Circuits Division
CPC5620/CPC5621 LITELINK
voltage ratings based on the isolation requirements of your application. Typical applications will require 2kV to safely hold off the isolation voltage.
Use components that allow enough space to account for the possibility of high-voltage arcing.
R05
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7
CPC5620/CPC5621
INTEGRATED CIRCUITS DIVISION
Figure 3. Reactive Termination Application Circuit Schematic
3.3 or 5V
R23 2
10
C1
1μ
FB1
600 Ω
200 mA
C16
10μ
TXTX+
A
U1
A
R1
(RTX)
80.6K
1 VDD
TXF
3 TX-
ZTX
C2
0.1μ
4 TX+
ZNT
29
TXSL
28
6 MODE
BR-
27
7 GND
NTS 26
8 OH
GAT 25
9 RING
NTF
RING
10 CID
CID
C14
0.1μ 11
RX-
C4
0.1μ 12
RX+
R5
(RTXF)
60.4K
R12
(RNTF)
DCS2
14 SNP-
RPB
15 RXF
RXS
BR-
R14
(RGAT)
Q1
CPC5602C
47
5%
TIP
BR-
R10
59 (RZNT1)
C20
(CZNT)
0.68μ
DB1
-
200K
R4
(RPB)
68.1
BR-
+
BRR76 (RHTF)
200K
R8 (RHTX)
VDDL 17
C15
0.01μ
500V
R20
(RVDDL)
2
5%
R16 (R
3
ZDC)
8.2
18
R2
(RRXF)
130K
C12
(CDCS)
0.027μ
1.69M
ZDC 21
19
R21
(RDCS1B)
6.49M
R15
(RDCS2)
22
BR- 20
R22
(RDCS1A)
6.49M
C21
100p
BR- (CGAT)
221K
DCS1 23
C10
0.01μ
500V
R13
(RNTS)
1M
R75
(RNTX)
110K
BR-
24
13 SNP+
16 RX
BR-
30
0.1μ
OH
C9
0.1μ
31
C13
A
RX+
REFL 32
2 TXSM
5 TX
RX-
LITELINK
R18
(RZTX)
10K
BR-
BR-
SP1 1
RING
R11
169 (RZNT2)
BR-
C7
(CSNP-) 4
220p
R3
(RSNPD)
1.5M
C8
(CSNP+) 4
220p
R6
(RSNP-2)
R44
(RSNP-1)
1.8M
1.8M
R7
(RSNP+2)
R45
(RSNP+1)
1.8M
1.8M
NOTE: Unless otherwise noted:
Resistor values are in Ohms
All resistors are 1%.
Capacitor values are in Farads.
¹This design was tested and found to comply with FCC Part 68 with this
Sidactor. Other compliance requirements may require a different part.
²Higher-noise power supplies may require substitution of a 220 H inductor,
Toko 380HB-2215 or similar. See the Power Quality section of IXYS
Integrated Circuits Division application note AN-146, Guidelines for
Effective LITELINK Designs for more information.
3
RZDC sets the loop-current limit, see “Setting a Current Limit” on
page 13. Also see IXYS Integrated Circuits Division’s application note
AN-146 for heat sinking recommendations for the CPC5602C FET.
4
Use voltage ratings based on the isolation requirements of your
application.
8
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R05
CPC5620/CPC5621
INTEGRATED CIRCUITS DIVISION
2.1.2 Reactive Termination Application Circuit Part List
Quantity
Reference Designator
Description
1
5
C1
C2, C4, C9, C13, C14
1 F, 16 V, ±10%
0.1 F, 16 V, ±10%
2
C7, C8 1
C10, C15
C12
C16
C20
C21
R1
R2
R3
R4
R5
220 pF, ±5%
2
1
1
1
1
1
1
1
1
1
0.01 F, 500 V, ±10%
0.027 F, 16 V, ±10%
10 F, 16 V, ±10%
0.68 F, 16 V, ±10%
100 pF, 16 V, 10%
80.6 k, 1/16 W, ±1%
130 k, 1/16 W, ±1%
1.5 M, 1/16 W, ±1%
68.1 , 1/16 W, ±1%
60.4 k 1/16 W, ±1%
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
R6, R7, R44, R45 2
R8
R10
R11
R12
R13
R14
R15
R16
R18
R20
R21, R22
R23
R75
R76
FB1
DB1
200 k, 1/16 W, ±1%
59 , 1/16 W, ±1%
169 , 1/16 W, ±1%
221 k, 1/16 W, ±1%
1 M, 1/16 W, ±1%
47 , 1/16 W, ±5%
1.69 M, 1/16 W, ±1%
8.2 , 1/8 W, ±1%
10 k, 1/16 W, ±1%
2 , 1/16 W, ±5%
6.49 M, 1/16 W, ±1%
10 , 1/16 W, ±5%, or 220 H inductor
110 k, 1/16 W, ±1%
200 k, 1/16 W, ±1%
600  200 mA ferrite bead
S1ZB60 bridge rectifier
1
SP1
350 V
1
1
Q1
U1
CPC5602 FET
CPC5620/CPC5621 LITELINK
4
1Use
2
Supplier
AVX, Murata, Novacap, Panasonic,
SMEC, Tecate, etc.
1.8 M, 1/10 W, ±1%
Panasonic, Electro Films, FMI, Vishay,
etc.
Murata BLM11A601S or similar
Shindengen, Diodes, Inc.
Bourns (TISP4350H3) or 
Teccor (P3100SC)
IXYS Integrated Circuits Division
voltage ratings based on the isolation requirements of your application. Typical applications will require 2kV to safely hold off the isolation voltage.
Use components that allow enough space to account for the possibility of high-voltage arcing.
R05
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9
CPC5620/CPC5621
INTEGRATED CIRCUITS DIVISION
3. Using LITELINK
As a full-featured telephone line interface, LITELINK
performs the following functions:
•
•
•
•
•
•
•
DC termination and V/I slope control
AC impedance control
2-wire to 4-wire conversion (hybrid)
Current limiting
Ringing signal reception
Caller ID signaling reception
Switch hook
Asserting OH low causes LITELINK to answer or
originate a call by entering the off-hook state. In the
off-hook state, loop current flows through LITELINK.
LITELINK can accommodate specific application
features without sacrificing basic functionality and
performance. Application features include, but are not
limited to:
•
•
•
•
•
•
•
•
High transmit power operation
Pulse dialing
Ground start
Loop start
Parallel telephone off-hook detection (line intrusion)
Battery reversal detection
Line presence detection
World-wide programmable operation
This section of the data sheet describes LITELINK
operation in standard configuration for usual
operation. IXYS Integrated Circuits Division offers
additional application information on-line (see Section 5
on page 14). These include information on the following
topics:
•
•
•
•
•
•
Circuit isolation considerations
Optimizing LITELINK performance
Data Access Arrangement architecture
LITELINK circuit descriptions
Surge protection
EMI considerations
Other specific application materials are also
referenced in this section as appropriate.
3.1 Switch Hook Control (On-hook
and Off-hook States)
LITELINK operates in one of two conditions, on-hook
and off-hook. In the on-hook condition the telephone
line is available for calls. In the off-hook condition the
telephone line is engaged. The OH control input is
used to place LITELINK in one of these two states.
10
With OH high, LITELINK is on-hook and ready to
make or receive a call. While on-hook, the CID control
is used to select between passing the caller-ID tones
from Tip and Ring to the RX+ and RX- outputs and the
ringing detect function. Setting CID to a logic low
enables the CID path while placing CID to a logic high
configures the LITELINK to detect ringing.
3.2 On-hook Operation: OH=1
The LITELINK application circuit leakage current is
less than 10 A with 100 V across ring and tip,
equivalent to greater than 10 M on-hook resistance.
3.2.1 Ringing Signal Reception via the
Snoop Circuit
In the on-hook state (OH and CID not asserted), an
internal multiplexer turns on the snoop circuit. This
circuit monitors the telephone line for two conditions;
an incoming ring signal, and caller ID data bursts.
Refer to the application schematic diagram (see Figure
2. on page 6). C7 (CSNP-) and C8 (CSNP+) provide a
high-voltage isolation barrier between the telephone
line and SNP- and SNP+ on the LITELINK while
coupling AC signals to the snoop amplifier. The snoop
circuit “snoops” the telephone line continuously while
drawing no current. In the LITELINK, ringing signals
are compared to a threshold. The comparator output
forms the RING signal output from LITELINK. This
signal must be qualified by the host system as a valid
ringing signal. A low level on RING indicates that the
LITELINK ring signal threshold has been exceeded.
For the CPC5620 (with the half-wave ring detector),
the frequency of the RING output follows the
frequency of the ringing signal from the central office
(CO), typically 20 Hz. The RING output of the
CPC5621 (with the full-wave ring detector) is twice the
ringing signal frequency.
Hysteresis is employed in the LITELINK ring detector
circuit to provide noise immunity. The set-up of the ring
detector comparator causes RING output pulses to
remain low for most of the ringing signal half-cycle.
The RING output returns high for the entire negative
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CPC5620/CPC5621
INTEGRATED CIRCUITS DIVISION
half-cycle of the ringing signal for the CPC5620. For
the CPC5621, the RING output returns high for a short
period near the zero-crossing of the ringing signal
before returning low during the positive half-cycle. For
both the CPC5620 and CPC5621, the RING output
remains high between ringing signal bursts.
The ringing detection threshold depends on the values
of R3 (RSNPD), R6 & R44 (RSNP-), R7 & R45 (RSNP+),
C7 (CSNP-), and C8 (CSNP+). The value of these
components shown in the application circuits are
recommended for typical operation. The ringing
detection threshold can be changed according to the
following formula:
750mV
V RINGPK =  -----------------
R SNPD
 R SNP
TOTAL
2
1
+ R SNPD  + -------------------------------------2 f RING C SNP 
Where:
• RSNPD = R3 in the application circuits shown in this
data sheet.
• RSNPTOTAL = the total of R6, R7, R44, and R45 in
the application circuits shown in this data sheet.
• CSNP = C7 = C8 in the application circuits shown in
this data sheet.
• And ƒRING is the frequency of the ringing signal.
IXYS Integrated Circuits Division Application Note
AN-117 Customize Caller ID Gain and Ring Detect Voltage
Threshold is a spreadsheet for trying different
component values in this circuit. Changing the ringing
detection threshold will also change the caller ID gain
and the timing of the polarity reversal detection pulse,
if used.
3.2.2 Polarity Reversal Detection with
CPC5621 in On-hook State
The full-wave ringing detector in the CPC5621 makes
it possible to detect on-hook tip and ring polarity
reversal using the RING output. When the polarity of
tip and ring reverses, a pulse on RING indicates the
event. Your system logic must be able to discriminate
this single pulse of approximately 1 msec (using the
recommended snoop circuit external components)
from a valid ringing signal.
R05
3.2.3 On-hook Caller ID Signal Reception
On-hook caller ID (CID) signals are processed by
LITELINK by coupling the CID data burst through the
snoop circuit to the LITELINK RX outputs under
control of the CID pin. In North America, CID data
signals are typically sent between the first and second
ringing signal.
In North American applications, follow these steps to
receive on-hook caller ID data via the LITELINK RX
outputs:
1.
2.
3.
4.
Detect the first ringing signal outputs on RING.
Assert CID low.
Process the CID data from the RX outputs.
De-assert CID (high or floating).
Note: Taking LITELINK off-hook (via the OH pin)
disconnects the snoop path from both the receive
outputs and the RING output, regardless of the state
of the CID pin.
CID gain from tip and ring to RX+ and RX- is
determined by:
6R SNPD
GAIN CID  dB  = 20 log ------------------------------------------------------------------------------------------------2
1
 R SNP
+ R SNPD  + -------------------------2TOTAL
 fC SNP 
Where:
• RSNPD = R3 in the application circuits in this data
sheet
• RSNPTOTAL = the total of R6, R7, R44, and R45 in
the application circuits in this data sheet
• CSNP = C7 = C8 in the application circuits in this data
sheet
• and where ƒ is the frequency of the CID signal
The recommended components in the application
circuit yield a gain 0.27 dB at 2000 Hz. IXYS
Integrated Circuits Division Application Note AN-117
Customize Caller ID Gain and Ring Detect Voltage Threshold
is a spreadsheet for trying different component values
in this circuit. Changing the CID gain will also change
the ring detection threshold and the timing of the
polarity reversal detection pulse, if used.
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11
CPC5620/CPC5621
INTEGRATED CIRCUITS DIVISION
For single-ended receive applications where only one
RX output is used, the snoop circuit gain can be
adjusted back to 0 dB by changing the value of the
snoop series resistors R6, R7, R44 and R45 from
1.8M to 715k This change results in negligible
modification to the ringing detect threshold.
On the equipment’s low voltage side of the barrier, the
receive signal is converted by a photodiode into a
photocurrent. The photocurrent, a linear
representation of the receive signal, is amplified and
converted to a differential voltage output on RX+ and
RX-.
3.3 Off-Hook Operation: OH=0
Variations in gain are controlled to within ±0.4 dB by
factory gain trim, which sets the output to unity gain.
3.3.1 Receive Signal Path
To accommodate single-supply operation, LITELINK
includes a small DC bias on the RX outputs of 1.0VDC.
Most applications should AC couple the RX outputs as
shown in Figure 4.
Signals to and from the telephone network appear on
the tip and ring connections of the application circuit.
Receive signals are extracted from transmit signals by
the LITELINK two-wire to four-wire hybrid. Next, the
receive signal is converted to infrared light by the
receive photodiode amplifier and receive path LED.
The intensity of the light is modulated by the receive
signal and coupled across the electrical isolation
barrier by a reflective dome.
LITELINK may be used for differential or single-ended
output as shown in Figure 4. Single-ended use will
produce 6 dB less signal output amplitude. Do not
exceed 0 dBm into 600  (2.2 VP-P) signal input with
the standard application circuit. See application note
AN-157, Increased LITELINK III Transmit Power for more
information.
Figure 4. Differential and Single-ended Receive Path Connections to LITELINK
Low-Voltage Side CODEC
or Voice Circuit
0.1µF
RX+
LITELINK
RX+
0.1µF
RX-
RX-
0.1µF
RX
3.3.2 Transmit Signal Path
Connect transmit signals from the low-voltage side
equipment to the TX+ and TX- pins of LITELINK. Do
not exceed a signal level of 0 dBm in 600  (or 2.2
VP-P). Differential transmit signals are converted to
single-ended signals in LITELINK. The signal is
coupled to the transmit photodiode amplifier in a
similar manner to the receive path. See application
note AN-157, Increased LITELINK III Transmit Power for
more information.
RX+
stage where the transmit signal modulates the
telephone line loop current. As in the receive path,
gain is set to unity at the factory, limiting insertion loss
variation to ±0.4 dB.
Differential and single-ended transmit signals into
LITELINK should not exceed a signal level of 0 dBm
referenced to 600  (or 2.2 VP-P). For output power
levels above 0dBm consult the application note
AN-157, Increased LITELINK III Transmit Power for more
information.
The output of the photodiode amplifier is coupled to a
voltage-to-current converter via a transconductance
12
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R05
CPC5620/CPC5621
INTEGRATED CIRCUITS DIVISION
Figure 5. Differential and Single-ended Transmit Path Connections to LITELINK
LITELINK
Low-Voltage Side CODEC or
Transmit Circuit
TXA1
TXA2
0.1µf
TX-
0.1µf
TX+
+
LITELINK
Low-Voltage Side CODEC or
Transmit Circuit
0.1µf
TX-
0.1µf
TX+
TXA1
3.4 Start-up Requirements
OH must be de-asserted (set logic high) once after
power-up for at least 50ms to transfer internal gain
trim values within LITELINK. This would be normal
operation in most applications. Failure to comply with
this requirement will result in transmission gain errors
and possibly distortion.
3.5 DC Characteristics
The CPC5620 and CPC5621 are designed for
worldwide application, including use under the
requirements of TBR-21. The ZDC, DCS1, and DCS2
pins control the VI slope characteristics of LITELINK.
Selecting appropriate resistor values for RZDC (R16)
and RDCS (R15) in the provided application circuits
assure compliance with DC requirements.
+
refer to the guidelines for FET thermal management
provided in AN-146, Guidelines for Effective
LITELINK Designs.
3.6 AC Characteristics
3.6.1 Resistive Termination Applications
North American and Japanese telephone line AC
termination requirements are met with a resistive 600
 AC termination. Receive termination is applied to
the LITELINK ZNT pin (pin 29) as a 301  resistor,
RZNT (R10).
3.6.2 Reactive Termination Applications
Many countries use a single-pole complex impedance
to model the telephone network transmission line
characteristic impedance as shown in the table below.
3.5.1 Setting a Current Limit
Line Impedance Model
LITELINK includes a telephone line current limit
feature that is selectable by choosing the desired
value for RZDC (R16) using the following formula:
RS
1V
I CL Amps = ------------- + 0.008A
R ZDC
RP
IXYS Integrated Circuits Division recommends using
8.2  for RZDC for most applications, limiting
telephone line current to 130 mA.
Whether using the recommended value above or
when setting RZDC higher for a lower loop current limit
R05
CP
Australia
China
TBR 21
RS
RP
220 
820 
200 
680 
270 
750 
CP
120 nF
100 nF
150 nF
Proper gain and termination impedance circuits for a
complex impedance requires the use of complex
network on ZNT as shown in the “Reactive Termination
Application Circuit Schematic” on page 8.
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13
CPC5620/CPC5621
INTEGRATED CIRCUITS DIVISION
3.6.3 Mode Pin Usage
Assert the MODE pin low to introduce a 7 dB pad into
the transmit path and add 7 dB of gain to the receive
path. These changes compensate for the gain
changes made to the transmit and receive paths in
reactive termination implementations.
Insertion loss with MODE de-asserted and the
resistive termination application circuit is 0 dB.
Insertion loss with the reactive termination application
circuit and MODE asserted is also 0 dB.
4. Regulatory Information
LITELINK III can be used to build products that comply
with the requirements of TIA/EIA/IS-968 (formerly
FCC part 68), FCC part 15B, TBR-21, EN60950,
UL1950, EN55022B, IEC950/IEC60950, CISPR22B,
EN55024, and many other standards. LITELINK
provides supplementary isolation. Metallic surge
requirements are met through the inclusion of a
Sidactor in the application circuit. Longitudinal surge
protection is provided by LITELINK’s optical barrier
technology and the use of high-voltage components in
the application circuit as needed.
The information provided in this document is intended
to inform the equipment designer but it is not sufficient
to assure proper system design or regulatory
compliance. Since it is the equipment manufacturer's
responsibility to have their equipment properly
designed to conform to all relevant regulations,
designers using LITELINK are advised to carefully
verify that their end-product design complies with all
applicable safety, EMC, and other relevant standards
and regulations. Semiconductor components are not
rated to withstand electrical overstress or electro-static
discharges resulting from inadequate protection
measures at the board or system level.
5. LITELINK Design Resources
The IXYS Integrated Circuits Division web site has a
wealth of information useful for designing with
LITELINK, including application notes and reference
designs that already meet all applicable regulatory
requirements. See the following links:
LITELINK datasheets and reference designs
Application note AN-117 Customize Caller ID Gain
and Ring Detect Voltage Threshold
Application note AN-146, Guidelines for Effective
LITELINK Designs
Application note AN-152 LITELINK II to LITELINK III
Design Conversion
Application note AN-155 Understanding LITELINK
Display Feature Signal Routing and Applications
14
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R05
CPC5620/CPC5621
INTEGRATED CIRCUITS DIVISION
6. LITELINK Performance
The following graphs show LITELINK performance using the North American application circuit shown in this data
sheet.
Figure 6. Receive Frequency Response at RX
Figure 9. Transmit THD on Tip and Ring
0
2
0
-20
-2
-40
-4
-60
Gain
-6
dBm
THD+N
dB
-80
-8
-100
-10
-120
-12
-14
0
500
1000
1500
2000
2500
3000
3500
4000
-140
0
500
1000
1500
Frequency
2000
2500
3000
3500
4000
Frequency
Figure 7. Transmit Frequency Response at TX
Figure 10.Transhybrid Loss
0
2
-5
0
-10
-2
-15
-4
THL
-20
dB
Gain
dBm
-6
-25
-8
-30
-10
-35
-40
-12
0
500
1000
1500
2000
2500
3000
3500
0
4000
500
1000
1500
2000
2500
3000
3500
4000
Frequency
Frequency
Figure 11.Return Loss
Figure 8. Receive THD on RX
60
0
-20
55
-40
50
-60
THD+N
dB
-80
Return
Loss 45
(dB)
-100
40
-120
35
-140
0
500
1000
1500
2000
2500
3000
3500
4000
30
Frequency
0
500
1000
1500
2000
2500
3000
3500
4000
Frequency (Hz)
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15
CPC5620/CPC5621
INTEGRATED CIRCUITS DIVISION
Figure 12.Snoop Circuit Frequency Response
5
0
-5
Gain (dBm ) -10
-15
-20
-25
0
500
1000
1500
2000
2500
3000
3500
4000
Frequency (Hz)
Figure 13.Snoop Circuit THD + N
+0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
0
500
1k
1.5k
2k
Hz
2.5k
3k
3.5k
4k
Figure 14.Snoop Circuit Common Mode
Rejection
+0
-2.5
-5
-7.5
-10
-12.5
-15
-17.5
-20
-22.5
-25
-27.5
CMRR
-30
(dBm) -32.5
-35
-37.5
-40
-42.5
-45
-47.5
-50
-52.5
-55
-57.5
-60
20
50
100
200
500
1K
2K
4K
Frequency (Hz)
16
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R05
CPC5620/CPC5621
INTEGRATED CIRCUITS DIVISION
7. Manufacturing Information
7.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee
proper operation of our devices when handled according to the limitations and information in that standard as well as
to any limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
CPC5620A / CPC5621A
MSL 3
7.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard 
JESD-625.
7.3 Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
CPC5620A / CPC5621A
260°C for 30 seconds
7.4 Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an
optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a
wash is used after solder reflow processes. Chlorine-based or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used
Pb
R05
e3
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17
CPC5620/CPC5621
INTEGRATED CIRCUITS DIVISION
7.5 Mechanical Dimensions
Figure 15. CPC5620A/CPC5621A Package Dimensions
7.239 ± 0.051
(0.285 ± 0.002)
10.287 ± .254
(0.405 ± 0.010)
PCB Land Pattern
0.203
(0.008)
7.493 ± 0.127
(0.295 ± 0.005)
9.30
(0.366)
1.90
(0.0748)
10.363 ± 0.127
(0.408 ± 0.005)
Pin 1
0.635 ± 0.076
(0.025 ± 0.003)
0.330 ± 0.051
(0.013 ± 0.002)
0.635 x 45º
1.016 Typ.
(0.025 x 45º) (0.040 Typ.)
0.635
(0.025)
0.40
(0.0157)
1.981 ± 0.051
(0.078 ± 0.002)
2.134 Max
(0.084 Max)
9.525 ± 0.076
(0.375 ± 0.003)
Dimensions
mm
(inches)
MIN 0, MAX 0.102
(MIN 0, MAX 0.004)
Figure 16. CPC5620ATR/CPC5621ATR Tape and Reel Dimensions
330.2 DIA.
(13.00 DIA.)
W=16
(0.630)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
B0=10.70
(0.421)
K0=3.20
(0.126)
A0=10.90
(0.429)
P=12.00
(0.472)
K1=2.70
(0.106)
Embossed Carrier
Embossment
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions
listed on page 5 of EIA-481-2
Dimensions
mm
(inches)
For additional information please visit www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and
reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed
or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability
whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a
particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into
the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical
harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes
to its products at any time without notice.
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