DIODES BAS116_08

BAS116
SURFACE MOUNT LOW LEAKAGE DIODE
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Features
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Mechanical Data
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Surface Mount Package Ideally Suited for Automated Insertion
Very Low Leakage Current
Lead Halogen and Antimony Free, RoHS Compliant
"Green" Device (Notes 3 and 4)
Case: SOT-23
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminal Connections: Solderable per MIL-STD-202, Method
208
Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
Polarity: See Diagram
Marking Information: See Page 2
Ordering Information: See Page 2
Weight: 0.008 grams (approximate)
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SOT-23
TOP VIEW
Internal Schematic
TOP VIEW
Maximum Ratings
@TA = 25°C unless otherwise specified
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Forward Continuous Current (Note 1)
Repetitive Peak Forward Current
Non-Repetitive Peak Forward Surge Current
Symbol
VRRM
VRWM
VR
VR(RMS)
IFM
IFRM
@ t = 1.0μs
@ t = 1.0ms
@ t = 1.0s
IFSM
Value
Unit
85
V
60
215
500
4.0
1.0
0.5
V
mA
mA
A
Thermal Characteristics
Characteristic
Power Dissipation (Note 1) @TA = 25°C
Symbol
PD
Value
250
Unit
mW
Thermal Resistance Junction to Ambient Air (Note 1) @TA = 25°C
Operating and Storage Temperature Range
RθJA
TJ, TSTG
500
-65 to +150
°C/W
°C
Electrical Characteristics
Characteristic
Reverse Breakdown Voltage (Note 2)
@TA = 25°C unless otherwise specified
Symbol
V(BR)R
Min
85
Typ
⎯
Max
⎯
Unit
V
Forward Voltage
VF
⎯
⎯
0.90
1.0
1.1
1.25
V
Leakage Current (Note 2)
IR
⎯
⎯
5.0
80
nA
nA
Total Capacitance
CT
⎯
2
⎯
pF
trr
⎯
⎯
3.0
μs
Reverse Recovery Time
Notes:
Test Condition
IR = 100μA
IF = 1.0mA
IF = 10mA
IF = 50mA
IF = 150mA
VR = 75V
VR = 75V, Tj = 150°C
VR = 0, f = 1.0MHz
IF = IR = 10mA,
Irr = 0.1 x IR, RL = 100Ω
1. Part mounted on FR-4 PC board with pad layout as shown on page 3.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead. Halogen and Antimony Free.
4. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
BAS116
Document number: DS30233 Rev. 9 - 2
1 of 3
www.diodes.com
May 2008
© Diodes Incorporated
BAS116
300
250
RθJA = 500°C/W
200
150
100
50
0
25
50
75
100
125
TA, AMBIENT TEMPERATURE (°C)
Fig. 1 Power Derating Curve
200
150
100
50
0
150
0
1,000
50
100
150
TA, AMBIENT TEMPERATURE (°C)
Fig. 2 Current Derating Curve
200
10
VR = 75V
100
IR, REVERSE CURRENT (nA)
IF, INSTANTANEOUS FORWARD CURRENT (mA)
0
Note 1
250
IF, FORWARD CURRENT (mA)
PD, POWER DISSIPATION (mW)
300
10
T A = 150°C
1
T A = 125°C
T A = 85°C
TA = 25°C
0.1
1
0.01
0.1
0.001
0
0
0.2 0.4 0.6 0.8
1
1.2 1.4 1.6
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 3 Typical Forward Characteristics
Ordering Information
200
(Note 5)
Part Number
BAS116-7-F
Notes:
50
100
150
TA, AMBIENT TEMPERATURE (°C)
Fig. 4 Typical Reverse Characteristics
Case
SOT-23
Packaging
3000/Tape & Reel
5. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
YM
Marking Information
XXX
Date Code Key
Year
Code
XXX = Product Type Marking Code; K50, K54
YM = Date Code Marking
Y = Year ex: N = 2002
M = Month ex: 9 = September
2001
M
2002
N
2003
P
2004
R
2005
S
2006
T
2007
U
2008
V
2009
W
2010
X
2011
Y
2012
Z
Month
Jan
Feb
Mar
Apr
May
Jun
Jul
Aug
Sep
Oct
Nov
Dec
Code
1
2
3
4
5
6
7
8
9
O
N
D
BAS116
Document number: DS30233 Rev. 9 - 2
2 of 3
www.diodes.com
May 2008
© Diodes Incorporated
BAS116
Package Outline Dimensions
A
SOT-23
Dim
Min
Max
A
0.37
0.51
B
1.20
1.40
C
2.30
2.50
D
0.89
1.03
F
0.45
0.60
G
1.78
2.05
H
2.80
3.00
J
0.013
0.10
K
0.903
1.10
L
0.45
0.61
M
0.085
0.180
8°
0°
α
All Dimensions in mm
B C
TOP VIEW
G
H
K
M
J
D
F
L
Suggested Pad Layout
Y
Z
C
X
Dimensions Value (in mm)
Z
2.9
X
0.8
Y
0.9
C
2.0
E
1.35
E
IMPORTANT NOTICE
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product
described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall
assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website,
harmless against all damages.
LIFE SUPPORT
Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written
approval of the President of Diodes Incorporated.
BAS116
Document number: DS30233 Rev. 9 - 2
3 of 3
www.diodes.com
May 2008
© Diodes Incorporated