Cypress CY62256VLL-70ZI 32k x 8 static ram Datasheet

CY62256V
256K (32K x 8) Static RAM
Functional Description[1]
Features
• Temperature Ranges
— Commercial: 0°C to 70°C
The CY62256V family is composed of two high-performance
CMOS static RAM’s organized as 32K words by 8 bits. Easy
memory expansion is provided by an active LOW chip enable
(CE) and active LOW output enable (OE) and three-state
drivers. These devices have an automatic power-down
feature, reducing the power consumption by over 99% when
deselected.
— Industrial: –40°C to 85°C
— Automotive: –40°C to 125°C
• Speed: 70 ns and 100 ns
• Low voltage range:
— CY62256V (2.7V–3.6V)
•
•
•
•
•
•
— CY62256V25 (2.3V–2.7V)
Low active power and standby power
Easy memory expansion with CE and OE features
TTL-compatible inputs and outputs
Automatic power-down when deselected
CMOS for optimum speed/power
Package available in a standard 450-mil-wide (300-mil
body width) 28-lead narrow SOIC, 28-lead TSOP-1, and
reverse 28-lead TSOP-1 package
An active LOW write enable signal (WE) controls the
writing/reading operation of the memory. When CE and WE
inputs are both LOW, data on the eight data input/output pins
(I/O0 through I/O7) is written into the memory location
addressed by the address present on the address pins (A0
through A14). Reading the device is accomplished by selecting
the device and enabling the outputs, CE and OE active LOW,
while WE remains inactive or HIGH. Under these conditions,
the contents of the location addressed by the information on
address pins are present on the eight data input/output pins.
The input/output pins remain in a high-impedance state unless
the chip is selected, outputs are enabled, and write enable
(WE) is HIGH.
Logic Block Diagram
I/O0
INPUTBUFFER
I/O1
512 × 512
ARRAY
I/O2
SENSE AMPS
ROW DECODER
A10
A9
A8
A7
A6
A5
A4
A3
A2
I/O3
I/O4
I/O5
CE
WE
COLUMN
DECODER
I/O6
POWER
DOWN
I/O7
A12
A11
A1
A0
A13
A14
OE
Note:
1. For best practice recommendations, please refer to the Cypress application note “System Design Guidelines” on http://www.cypress.com.
Cypress Semiconductor Corporation
Document #: 38-05057 Rev. *D
•
3901 North First Street
•
San Jose
•
CA 95134 • 408-943-2600
Revised June 28, 2004
CY62256V
Product Portfolio
Power Dissipation
Operating, ICC (mA)
Standby, ISB2 (µA)
Range
Min.
VCC Range (V)
Typ.[2]
Max.
(ns)
Typ.[2]
Max.
Typ.[2]
CY62256VLL
Com’l / Ind’l
2.7
3.0
3.6
70
11
30
0.1
5
CY62256VLL
Automotive
2.7
3.0
3.6
70
11
30
0.1
130
CY62256V25LL
Com’l
2.3
2.5
2.7
100
9
15
0.1
4
Product
Speed
Max.
Pin Configurations
Narrow SOIC
Top View
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
I/O0
I/O1
I/O2
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
VCC
WE
A4
A3
A2
A1
OE
A0
CE
I/O7
I/O6
I/O5
I/O4
I/O3
A11
A10
A9
A8
A7
A6
A5
VCC
WE
A4
A3
A2
A1
OE
7
6
8
9
5
4
3
2
10
11
12
13
14
15
16
17
18
1
28
27
26
25
24
23
22
TSOP I
Reverse Pinout
Top View
(not to scale)
19
20
21
A12
A13
A14
I/O0
I/O1
I/O2
GND
I/O3
I/O4
I/O5
I/O6
I/O7
CE
A0
OE
A1
A2
A3
A4
WE
VCC
A5
A6
A7
A8
A9
A10
A11
21
22
23
24
25
26
27
28
1
2
3
4
5
6
7
TSOP I
Top View
(not to scale)
20
19
18
17
16
15
14
13
12
11
10
9
8
A0
CE
I/O7
I/O6
I/O5
I/O4
I/O3
GND
I/O2
I/O1
I/O0
A14
A13
A12
Pin Definitions
Pin Number
Type
Description
1-10, 21, 23-26
Input
A0-A14. Address Inputs
11-13, 15-19
Input/Output
I/O0-I/O7. Data lines. Used as input or output lines depending on operation
27
Input/Control
WE. When selected LOW, a WRITE is conducted. When selected HIGH, a READ
is conducted
20
Input/Control
CE. When LOW, selects the chip. When HIGH, deselects the chip
22
Input/Control
OE. Output Enable. Controls the direction of the I/O pins. When LOW, the I/O pins
behave as outputs. When deasserted HIGH, I/O pins are three-stated, and act as
input data pins
14
Ground
GND. Ground for the device
28
Power Supply
Vcc. Power supply for the device
Notes:
2. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at VCC = VCC Typ., TA = 25°C, and tAA = 70 ns.
Document #: 38-05057 Rev. *D
Page 2 of 13
CY62256V
Maximum Ratings
Static Discharge Voltage.......................................... > 2001V
(per MIL-STD-883, Method 3015)
(Above which the useful life may be impaired. For user guidelines, not tested.)
Latch-up Current.................................................... > 200 mA
Operating Range
Storage Temperature ................................. –65°C to +150°C
Ambient Temperature with
Power Applied............................................. –55°C to +125°C
Range
Ambient
Temperature
(TA) [4]
Commercial
0°C to +70°C
Device
Supply Voltage to Ground Potential
(Pin 28 to Pin 14) ........................................... –0.5V to +4.6V
CY62256V
DC Voltage Applied to Outputs
in High-Z State[3] ....................................–0.5V to VCC + 0.5V
DC Input Voltage[3] .................................–0.5V to VCC + 0.5V
Output Current into Outputs (LOW) .............................20 mA
CY62256V25
Industrial
−40°C to
+85°C
Automotive
−40°C to
+125°C
Commercial
0°C to +70°C
VCC
2.7V to
3.6V
2.3V to
2.7V
Electrical Characteristics Over the Operating Range
CY62256V-70
Parameter
Description
Test Conditions
Min.
Typ.[2]
Max.
Unit
VOH
Output HIGH Voltage
IOH = −1.0 mA
VCC = 2.7V
VOL
Output LOW Voltage
IOL = 2.1 mA
VCC = 2.7V
0.4
V
VIH
Input HIGH Voltage
2.2
VCC
+0.3V
V
VIL
Input Leakage Voltage
–0.5
0.8
V
IIX
Input Leakage Current
IOZ
Output Leakage Current
GND < VIN < VCC
2.4
V
Com’l, Ind’l
–1
+1
µA
Automotive
-10
+10
µA
GND < VIN < VCC, Output Disabled Com’l, Ind’l
–1
+1
µA
Automotive
-10
+10
µA
ICC
VCC Operating Supply
Current
VCC = 3.6V, IOUT = 0 mA,
f = fMAX = 1/tRC
All ranges
11
30
mA
ISB1
Automatic CE Power-down
Current— TTL Inputs
VCC = 3.6V, CE > VIH,
VIN > VIH or VIN < VIL, f = fMAX
All ranges
100
300
µA
ISB2
Automatic CE Power-down
Current— CMOS Inputs
VCC = 3.6V, CE > VCC – 0.3V
Com’l
VIN > VCC – 0.3V or VIN < 0.3V, f = 0 Ind’l
0.1
5
10
Automotive
130
Electrical Characteristics Over the Operating Range
CY62256V25-100
Parameter
Description
Test Conditions
Min.
VOH
Output HIGH Voltage
IOH = −0.1 mA
Vcc=2.3V
IOL = 0.1 mA
Vcc= 2.3V
Typ.[2]
Max.
2
Unit
V
VOL
Output LOW Voltage
0.4
V
VIH
Input HIGH Voltage
1.7
Vcc +
0.3V
V
VIL
Input LOW Voltage
–0.3
0.7
V
IIX
Input Leakage Current
GND < VIN < VCC
–1
+1
µA
IOZ
Output Leakage Current
GND < VIN < VCC, Output Disabled
–1
+1
µA
Notes:
3. VIL (min.) = –2.0V for pulse durations of less than 20 ns.
4. TA is the “Instant-On” case temperature
Document #: 38-05057 Rev. *D
Page 3 of 13
CY62256V
Electrical Characteristics Over the Operating Range (continued)
CY62256V25-100
Parameter
Description
Test Conditions
Min.
Typ.[2]
Max.
Unit
ICC
VCC Operating Supply Current VCC = 2.7V, IOUT = 0 mA, f = fMAX
= 1/tRC
Com’l, Ind’l
9
15
mA
ISB1
Automatic CE Power-down
Current— TTL Inputs
VCC = 2.7V, CE > VIH,
VIN > VIH or VIN < VIL, f = fMAX
Com’l, Ind’l
75
225
µA
ISB2
Automatic CE Power-down
Current — CMOS Inputs
Com’l
VCC = 2.7V, CE > VCC − 0.3V
VIN > VCC – 0.3V or VIN < 0.3V, f = 0 Ind’l
0.1
4
8
Capacitance[5]
Parameter
Description
CIN
Input Capacitance
COUT
Output Capacitance
Test Conditions
Max.
Unit
6
pF
8
pF
TA = 25°C, f = 1 MHz,
VCC = 3.0V
AC Test Loads and Waveforms
R1
VCC
ALL INPUT PULSES
OUTPUT
VCC
50 pF
INCLUDING
JIG AND
SCOPE
R2
90%
10%
GND
< 5 ns
< 5 ns
Equivalent to:
90%
10%
THÉVENIN EQUIVALENT
OUTPUT
Rth
Vth
Parameter
3.3V
2.5V
Units
R1
1100
16600
Ohms
R2
1500
15400
Ohms
RTH
645
8000
Ohms
VTH
1.750
1.20
Volts
Notes:
5. Tested initially and after any design or process changes that may affect these parameters.
Document #: 38-05057 Rev. *D
Page 4 of 13
CY62256V
Data Retention Characteristics (Over the Operating Range)
Parameter
Conditions[6]
Description
VDR
VCC for Data Retention
ICCDR
Data Retention Current
Typ.[2]
Min.
Max.
1.4
VCC = 1.6V, CE > VCC – 0.3V,
VIN > VCC – 0.3V or VIN < 0.3V
V
Com’l
0.1
Ind’l
Chip Deselect to Data
Retention Time
tR[6]
Operation Recovery Time
µA
3
6
Auto
tCDR[6]
Unit
50
0
ns
tRC
ns
Data Retention Waveform
DATA RETENTION MODE
1.8V
VCC
VDR > 1.4V
1.8V
tR
tCDR
CE
Thermal Resistance
Parameter
Description
Test Conditions
SOIC
TSOPI
RTSOPI
Unit
ΘJA
Thermal Resistance
Still Air, soldered on a 3 × 4.5 inch,
(Junction to Ambient)[6] four-layer printed circuit board
68.45
87.62
87.62
°C/W
ΘJC
Thermal Resistance
(Junction to Case)[5]
26.94
23.73
23.73
°C/W
Notes:
6. No input may exceed VCC + 0.3V.
Document #: 38-05057 Rev. *D
Page 5 of 13
CY62256V
Switching Characteristics Over the Operating Range[7]
CY62256V-70
Parameter
Description
Min.
Max.
CY62256V25-100
Min.
Max.
Unit
Read Cycle
tRC
Read Cycle Time
tAA
Address to Data Valid
tOHA
Data Hold from Address Change
tACE
CE LOW to Data Valid
70
100
ns
tDOE
OE LOW to Data Valid
35
75
ns
50
ns
70
[8]
tLZOE
OE LOW to Low-Z
tHZOE
OE HIGH to High-Z[8, 9]
tLZCE
CE LOW to Low-Z[8]
tHZCE
CE HIGH to High-Z[8, 9]
tPU
CE LOW to Power-up
tPD
CE HIGH to Power-down
100
70
10
ns
100
10
5
ns
5
25
10
ns
10
25
0
ns
50
ns
100
ns
0
70
ns
ns
Write Cycle[10, 11]
tWC
Write Cycle Time
70
100
ns
tSCE
CE LOW to Write End
60
90
ns
tAW
Address Set-up to Write End
60
90
ns
tHA
Address Hold from Write End
0
0
ns
tSA
Address Set-up to Write Start
0
0
ns
tPWE
WE Pulse Width
50
80
ns
tSD
Data Set-up to Write End
30
60
ns
tHD
Data Hold from Write End
0
tHZWE
WE LOW to High-Z[8, 9]
tLZWE
WE HIGH to Low-Z[8]
0
25
10
ns
50
10
ns
ns
Notes:
7. Test conditions assume signal transition time of 5 ns or less timing reference levels of VCC/2, input pulse levels of 0 to VCC, and output loading of the specified
IOL/IOH and 100-pF load capacitance.
8. At any given temperature and voltage condition, tHZCE is less than tLZCE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any given device.
9. tHZOE, tHZCE, and tHZWE are specified with CL = 5 pF as in (b) of AC Test Loads. Transition is measured ± 200 mV from steady-state voltage.
10. The internal write time of the memory is defined by the overlap of CE LOW and WE LOW. Both signals must be LOW to initiate a write and either signal can terminate
a write by going HIGH. The data input set-up and hold timing should be referenced to the rising edge of the signal that terminates the write.
11. The minimum write cycle time for write cycle #3 (WE controlled, OE LOW) is the sum of tHZWE and tSD.
Document #: 38-05057 Rev. *D
Page 6 of 13
CY62256V
Switching Waveforms
Read Cycle No. 1[12, 13]
tRC
ADDRESS
tOHA
DATA OUT
tAA
PREVIOUS DATA VALID
DATA VALID
Read Cycle No. 2 [13, 14]
t RC
CE
tACE
OE
DATA OUT
t HZOE
tHZCE
tDOE
t LZOE
HIGH IMPEDANCE
DATA VALID
tLZCE
VCC
SUPPLY
CURRENT
HIGH
IMPEDANCE
t PD
t PU
ICC
50%
50%
Write Cycle No. 1 (WE Controlled)
ISB
[10, 15, 16]
tWC
ADDRESS
CE
tAW
tSA
WE
tHA
t PWE
OE
tSD
DATA I/O
NOTE 17
tHD
DATAINVALID
t HZOE
Notes:
12. Device is continuously selected. OE, CE = VIL.
13. WE is HIGH for read cycle.
Document #: 38-05057 Rev. *D
Page 7 of 13
CY62256V
Switching Waveforms (continued)
Write Cycle No. 2 (CE Controlled) [10, 15, 16]
tWC
ADDRESS
tSCE
CE
tSA
tAW
tHA
WE
tSD
DATA I/O
t HD
DATAINVALID
Write Cycle No. 3 (WE Controlled, OE LOW)[11, 16]
tWC
ADDRESS
CE
tAW
t HA
tSA
WE
tSD
DATA I/O
NOTE 17
t HZWE
t HD
DATA INVALID
tLZWE
Notes:
14. Address valid prior to or coincident with CE transition LOW.
15. Data I/O is high impedance if OE = VIH.
16. If CE goes HIGH simultaneously with WE HIGH, the output remains in a high-impedance state.
17. During this period, the I/Os are in output state and input signals should not be applied.
Document #: 38-05057 Rev. *D
Page 8 of 13
CY62256V
Typical DC and AC Characteristics
0.4
0.5
0.2
0.0
25
1.6
AA
2.0
NORMALIZED t
NORMALIZED t AA
NORMALIZED ACCESS TIME
vs. AMBIENT TEMPERATURE
1.5
TA = 25°C
1.0
VCC = 2.5V
1.2
1.0
0.8
0.5
0.0
1.65
VCC = 3.0V
1.4
2.1
2.6
3.1
3.6
0.6
−55
25
125
OUTPUT SOURCE CURRENT (mA)
105
OUTPUT SINK CURRENT
14 vs. OUTPUT VOLTAGE
12
10
8
6
VCC = 2.5 V
4
TA = 25°C
2
0
0.0
1.0
2.0
3.0
OUTPUT VOLTAGE (V)
AMBIENT TEMPERATURE (°C)
SUPPLY VOLTAGE (V)
25
AMBIENT TEMPERATURE (°C)
AMBIENT TEMPERATURE (°C)
NORMALIZED ACCESS TIME
vs. SUPPLY VOLTAGE
ISB
-0.5
−55
125
=
0.4
SUPPLY VOLTAGE (V)
2.5
1.0
cc
0.6
1.5
3.
3V
VCC = 2.5V
=
0.8
0.0
−55
3.6
3.2
2.8
2.4
2.0
1.8
1.6
0.2
2.0
cc
TA= 25°C
0.6
1.0
V
0.8
2.5
V
1.0
1.2
ISB2 µA
NORMALIZED I CC
NORMALIZED ICC
1.2
3.0
VCC = 3.0V
2.
5V
1.4
1.6
1.4
OUTPUT SINK CURRENT (mA)
1.8
STANDBY CURRENT
vs. AMBIENT TEMPERATURE
NORMALIZED SUPPLY CURRENT
vs. AMBIENT TEMPERATURE
NORMALIZED SUPPLY CURRENT
vs. SUPPLY VOLTAGE
OUTPUT SOURCE CURRENT
vs. OUTPUT VOLTAGE
-14
-12
-10
-8
-6
VCC = 2.5V
TA = 25°C
-4
0
0.0
0.5
1.0
1.5
2
2.5
OUTPUT VOLTAGE (V)
Document #: 38-05057 Rev. *D
Page 9 of 13
CY62256V
Typical DC and AC Characteristics (continued)
TYPICAL ACCESS TIME CHANGE
vs. OUTPUT LOADING
NORMALIZED I CC vs.CYCLE TIME
1.25
25.0 T = 25°C
A
VCC = 3V
20.0
NORMALIZED ICC
DELTA tAA (ns)
30.0
15.0
10.0
VCC = 3.0V
1.00
TA = 25°C
VIN = 0.5V
0.75
5.0
0.0
0
200
400
600
0.50
1
800 1000
10
20
30
CYCLE FREQUENCY (MHz)
CAPACITANCE (pF)
Truth Table
Inputs/Outputs
CE
WE
OE
H
X
X
High-Z
Mode
Deselect/Power-down
Power
Standby (ISB)
L
H
L
Data Out
Read
Active (ICC)
L
L
X
Data In
Write
Active (ICC)
L
H
H
High-Z
Deselect, Output Disabled
Active (ICC)
Ordering Information
Speed
(ns)
70
Ordering Code
CY62256VLL-70SNC
CY62256VLL-70ZC
Package
Name
SN28
Z28
Package Type
28-lead (300-mil Narrow Body) Narrow SOIC
Industrial
CY62256VLL -70SNI
SN28
28-lead (300-mil Narrow Body) Narrow SOIC
CY62256VLL-70ZRI
ZR28
28-lead Reverse Thin Small Outline Package
CY62256VLL-70SNE
SN28
CY62256VLL-70ZRE
100
CY62256V25LL-100ZC
Document #: 38-05057 Rev. *D
Commercial
28-lead Thin Small Outline Package
CY62256VLL-70ZI
CY62256VLL-70ZE
Operating
Range
Z28
ZR28
Z28
28-lead (300-mil Narrow Body) Narrow SOIC
Automotive
28-lead Thin Small Outline Package
28-lead Reverse Thin Small Outline Package
28-lead Thin Small Outline Package
Commercial
Page 10 of 13
CY62256V
Package Diagrams
28-lead (300-mil) SNC (Narrow Body) SN28
51-85092-*B
28-lead Thin Small Outline Package Type 1 (8 × 13.4 mm) Z28
51-85071-*G
Document #: 38-05057 Rev. *D
Page 11 of 13
CY62256V
Package Diagrams (continued)
28-lead Reverse Type 1 Thin Small Outline Package (8 × 13.4 mm) ZR28
51-85074-*F
All product and company names mentioned in this document are the trademarks of their respective holders.
Document #: 38-05057 Rev. *D
Page 12 of 13
© Cypress Semiconductor Corporation, 2004. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
CY62256V
Document Title: CY62256V 256K (32K x 8) Static RAM
Document Number: 38-05057
REV.
ECN NO. Issue Date
Orig. of
Change
Description of Change
**
107248
09/10/01
SZV
Changed from spec number: 38-00519 to 38-05057
*A
111445
11/01/01
MGN
Removed obsolete parts. Change to standard format
*B
115229
05/23/02
GBI
Changed SN package diagram
*C
116507
09/04/02
GBI
Added footnote 1
Clarified ICC spec for VCC(typ) = 2.5V
*D
239134
See ECN
AJU
Added Automotive product information
Document #: 38-05057 Rev. *D
Page 13 of 13
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