TI1 BQ20Z70 Sbs 1.1-compliant gas gauge enabled with impedance trackâ ¢ Datasheet

Not Recommended For New Designs
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SLUS686B – NOVEMBER 2005 – REVISED JULY 2007
SBS 1.1-COMPLIANT GAS GAUGE ENABLED WITH IMPEDANCE TRACK™
TECHNOLOGY FOR USE WITH THE bq29330
FEATURES
APPLICATIONS
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Next Generation Patented Impedance Track™
Technology accurately Measures Available
Charge in Li-Ion and Li-Polymer Batteries
Better than 1% Error Over Lifetime of the
Battery
Instant Accuracy – No Learning Cycle
Required
Supports the Smart Battery Specification SBS
V1.1
Powerful 8-Bit RISC CPU With Ultra-Low
Power Modes
Works With the TI bq29330 Analog Front-End
(AFE) Protection IC to Provide Complete Pack
Electronics Solution
Full Array of Programmable Protection
Features
– Voltage, Current and Temperature
Fully Integrated High Accurate Clock
Flexible Configuration for 2 to 4 Series Li-Ion
and Li-Polymer Cells
Integrated Field Programmable FLASH
Memory Eliminates the Need for External
Configuration Memory
Smart Battery Charger Control Feature
Two 16-Bit Delta-Sigma Converter
– Accurate Voltage and Temperature
Measurements
– Integrating Coloumb Counter for Charge
Flow
– Better Than 0.65 nVh of Resolution
– Self-Calibrating
Supports SHA-1 Authentication
20-Pin TSSOP (PW)
Notebook PCs
Medical and Test Equipment
Portable Instrumentation
DESCRIPTION
The bq20z70 SBS-compliant gas gauge IC,
incorporating
patented
Impedance
Track™
technology, is designed for battery-pack or in-system
installation. The bq20z70 measures and maintains
an accurate record of available charge in Li-ion or
Li-polymer
batteries
using
its
integrated
high-performance analog peripherals. The bq20z70
monitors capacity change, battery impedance,
open-circuit voltage, and other critical parameters of
the battery pack, and reports the information to the
system host controller over a serial-communication
bus. It is designed to work with the bq29330 analog
front-end (AFE) protection IC to maximize
functionality and safety, and minimize component
count and cost in smart battery circuits.
The Impedance Track technology continuously
analyzes the battery impedance, resulting in superior
gas-gauging accuracy. This enables remaining
capacity to be calculated with discharge rate,
temperature, and cell aging all accounted for during
each stage of every cycle.
AVAILABLE OPTIONS
PACKAGE (1)
TA
20-PIN TSSOP (PW)
Tube
20-PIN TSSOP (PW)
Tape and Reel
–40°C to
85°C
bq20z70PW (2)
bq20z70PWR (3)
(1)
(2)
(3)
For the most current package and ordering information, see
the Package Option Addendum at the end of this document,
or see the TI website at www.ti.com.
A single tube quantity is 50 units.
A single reel quantity is 2000 units
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
IMPEDANCE TRACK is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2007, Texas Instruments Incorporated
Not Recommended For New Designs
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SLUS686B – NOVEMBER 2005 – REVISED JULY 2007
SYSTEM PARTITIONING DIAGRAM
Pack +
Fuse
Supply Voltage
32kHz Clock
Generator
Reset
32KHz
bq29330
Validation &
Control
SBS v1.1
Data
N-CH FET
Drive
Watchdog &
Protection
Timing
Charge Pumps
Registers
Alert
System
Interface
System
Interface
I2C
SHA-1
Authentication
Overvoltage &
Undervoltage
Protection
Cell & Pack
Voltage
Measurement
Voltage Level
Translator
Cell Balancing
Algorithm &
Control
Overrcurrent
Protection
Impedance
Track™ Gas
Gauging
Overcurrent &
Short Circuit
Protection
bq20z70
bq29330
Pack RSNS
5mΩ – 20mΩ typ.
TSSOP (PW)
(TOP VIEW)
XALERT
TS2
TS1
CLKOUT
PRES
PFIN
SAFE
SMBD
NC
SMBC
2
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
VCELLVCELL+
VCC
VSS
MRST
SRN
SRP
VSS
SCLK
SDATA
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2nd Level Voltage Protection
SMBus
LDO
& Therm. Drive
& Reset
Cell Selection Multiplexer
Charging
Algorithm
Therm
Temperature
Measurement
& Protection
Cell Balancing Drive
Fail Safe
Protection
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SLUS686B – NOVEMBER 2005 – REVISED JULY 2007
TERMINAL FUNCTIONS
TERMINAL
I/O (1)
DESCRIPTION
NO.
NAME
1
XALERT
I
Alert interrupt input from bq29330. Connect directly to bq29330 XALERT pin
2
TS2
I
2nd thermistor voltage input connection to monitor temperature
3
TS1
I
1st thermistor voltage input connection to monitor temperature
4
CLKOUT
O
32.768kHz output for bq29330 watchdog. Connect directly to bq29330 WDI pin
5
PRES
I
Active low input to sense system insertion
6
PFIN
I
Active low input to sense secondary protector output status
(1)
7
SAFE
O
8
SMBD
I/OD
Active high output to enforce additional level of safety, e.g. fuse blow
9
NC
–
10
SMBC
I/OD
SMBus clock open drain bidirectional pin used for communication with bq20z70
11
SDATA
I/OD
Data transfer line from and to bq29330. Connect directly to SDATA pin of bq29330
12
SCLK
I/OD
Data clock line to bq29330. Connect directly to SCLK pin of bq29330
13
VSS
I/OD
VSS
14
SRP
IA
Connection for a small-value resistor to monitor the battery charge and discharge current flow
15
SRN
IA
Connection for a small-value resistor to monitor the battery charge and discharge current flow
16
MRST
I
Master reset input that forces the device into reset when held low. Connect directly to XRST pin of
bq29330
17
VSS
P
Negative supply. Both VSS needs to be connected together
18
VCC
P
Positive supply
19
VCELL+
I
Positive differential cell input. Connect directly to CELL+ pin of bq29330
20
VCELL-
I
Negative differential cell input. Connect directly to CELL- pin of bq29330
SMBus data open drain bidirectional pin used for communication with bq20z70
Not used - leave floating
I = Input, IA = Analog input, I/O = Input/output, I/OD = Input/Open-drain output, O = Output, OA = Analog output, P = Power
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1)
RANGE
VCC relative to VSS (2)
Supply voltage range on VCC pin
V(IOD) relative to VSS (2)
XALERT, PFIN, SAFE, SMBD, SMBC, SDATA, SCLK,
VI relative to VSS
(2)
TS2, TS1, CLKOUT, PRES, SRP, SRN, MRST, VCELL+,VCELL-
–0.3 V to 2.75 V
–0.3 V to 6.0 V
–0.3 V to VCC + 0.3 V
TA
Operating free-air temperature range
–40°C to 85°C
Tstg
Storage temperature range
–65°C to 150°C
(1)
(2)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
VSS refers to Voltage at VSS pin.
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ELECTRICAL CHARACTERISTICS
VCC = 2.4 V to 2.6 V, TA = -40°C - 85°C (unless otherwise noted)
PARAMETER
VDD
TEST CONDITIONS
Supply voltage
IDD
VDDA and VDDD
MIN
TYP
MAX
2.4
2.5
2.6
400 (1)
No flash programming
Operating mode current
I(SLP) Low-power storage mode current
bq20z70 + bq29330
475
Sleep mode
8 (1)
bq20z70 + bq29330
VOL
Output voltage low CLKOUT, SAFE, SMBD, SMBC, SDATA,
SCLK
IOL = 7 mA
VOH
Output high voltage CLKOUT, SAFE, SMBD,SMBC, SDATA,
SCLK
IOH = –0.5 mA
VIL
Input voltage low PRES, PFIN, SMBD, SMBC, SDATA, MRST
VIH
Input voltage high PRES, PFIN, SMBD, SMBC, SDATA, MRST
CIN
Input capacitance
μA
0.1 (1)
bq20z70 + bq29330
V
μA
48
Shutdown Mode
I(SLP) Shutdown Current
UNIT
μA
0.2
0.4
VCC – 0.5
V
V
0.8
2.0
V
V
5
pF
V(AI1) Input voltage range TS1, TS2, VCELL+, VCELL-
– 0.2
0.8 x VCC
V(AI2) Input voltage range SRP, SRN
– 0.2
0.2
V
Z(AI1) Input impedance TS1, TS2, VCELL+, VCELL -
0V–1V
8
MΩ
Z(AI2) Input impedance SRP, SRN
0V–1V
2.5
MΩ
(1)
This value does not include the bq29330
POWER-ON RESET
VCC = 2.4 V to 2.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TYP
MAX
UNIT
VIT–
Negative-going voltage input
1.7
1.8
1.9
V
VHYS
Power-on reset hysteresis
50
125
200
mV
Power-On Reset Negative-Going Voltage - V
1.81
1.8
1.79
1.78
1.77
1.76
-40
-20
0
20
40
60
TA - Free-Air Temperature - °C
4
MIN
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INTEGRATING ADC (Coulomb Counter) CHARACTERISTICS
VCC = 2.4 V to 2.6 V, TA = –40°C to 85°C (unless otherwise noted)
TEST CONDITIONS
MIN
V(SR)
Input voltage range, V(SRN) and V(SRP)
PARAMETER
V(SR) = V(SRP) – V(SRN)
–0.20
V(SROS)
Input offset
TA =25°C to 85°C
INL
Integral nonlinearity error
TYP
MAX
0.20
V
μV
10
±0.007%
UNIT
±0.037%
OSCILLATOR
VCC = 2.4 V to 2.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
HIGH FREQUENCY OSCILLATOR
f (OSC)
Operating frequency
f (EIO)
Frequency error
f (sxo)
Start-up time
4.194
(1) (2)
T A = 20°C to 70°C
MHz
-3%
0.25%
3%
-2%
0.25%
2%
2.5
5
(3)
ms
LOW FREQUENCY OSCILLATOR
f (LOSC)
Operating frequency
f (LEIO)
Frequency error
f (Lsxo)
(5)
(1)
(2)
(3)
(4)
(5)
The
The
The
The
The
Start-up time
32.768
(2) (4)
T A = 20°C to 70°C
kHz
-2.5%
0.25%
2.5%
-1.5%
0.25%
1.5%
500
μs
frequency error is measured from 4.194 MHz.
frequency drift is included and measured f rom the trimmed frequency at V CC = 2.5 V, T A = 25°C.
start-up time is defined as the time it takes for the oscillator output frequency to be within 1% of the specified frequency.
frequency error is measured from 32.768 kHz.
start-up time is defined as the time it takes for the oscillator output frequency to be ±3%.
DATA FLASH MEMORY CHARACTERISTICS
VCC = 2.4 V to 2.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Data retention
See
(1)
10
Years
Flash programming write-cycles
See
(1)
20,000
Cycles
t(WORDPROG) Word programming time
See
(1)
I(DDPROG)
See
(1)
tDR
(1)
Flash-write and erase supply current
5
2
ms
10
mA
Specified by design. Not production tested
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SLUS686B – NOVEMBER 2005 – REVISED JULY 2007
SMBus TIMING SPECIFICATIONS
VCC = 2.4 V to 2.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
fSMB
SMBus operating frequency
Slave mode, SMBC 50% duty cycle
fMAS
SMBus master clock frequency
Master mode, no clock low slave extend
tBUF
Bus free time between start and stop
tHD:STA
Hold time after (repeated) start
tSU:STA
Repeated start setup time
tSU:STO
Stop setup time
TYP
10
MAX
100
51.2
UNIT
kHz
4.7
4
μs
4.7
4
Receive mode
0
Transmit mode
300
tHD:DAT
Data hold time
tSU:DAT
Data setup time
tTIMEOUT
Error signal/detect
tLOW
Clock low period
tHIGH
Clock high period
See
(2)
tLOW:SEXT
Cumulative clock low slave extend time
See
(3)
25
tLOW:MEXT
Cumulative clock low master extend time
See
(4)
10
tF
Clock/data fall time
(VILMAX – 0.15 V) to (VIHMIN + 0.15 V)
tR
Clock/data rise time
0.9 VCC to (VILMAX – 0.15 V)
(1)
(2)
(3)
(4)
ns
250
See
(1)
25
35
4.7
4
50
300
1000
ms
μs
ms
ns
The bq20z70 times out when any clock low exceeds tTIMEOUT.
tHIGH:MAX. is minimum bus idle time. SMBC = 1 for t > 50 μs causes reset of any transaction involving the bq20z70 that is in progress.
tLOW:SEXT is the cumulative time a slave device is allowed to extend the clock cycles in one message from initial start to the stop.
tLOW:MEXT is the cumulative time a master device is allowed to extend the clock cycles in one message from initial start to the stop.
SMBus TIMING DIAGRAM
6
MIN
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FEATURE SET
Primary (1st Level) Safety Features
The bq20z70 supports a wide range of battery and system protection features that can easily be configured. The
primary safety features include:
•
•
•
•
•
Cell over/under voltage protection
Charge and Discharge overcurrent
Short Circut
Charge and Discharge Overtemperature
AFE Watchdog
Secondary (2nd Level) Safety Features
The secondary safety features of the bq20z70 can be used to indicate more serious faults via the SAFE (pin 7).
This pin can be used to blow an in-line fuse to permanently disable the battery pack from charging or
discharging. The secondary safety protection features include:
•
•
•
•
•
•
Safety overvoltage
Safety overcurrent in Charge and Discharge
Safety overtemperature in Charge and Discharge
Charge FET and 0 Volt Charge FET fault
Discharge FET fault
AFE communication fault
Charge Control Features
The bq20z70 charge control features include:
•
•
•
•
•
•
Reports the appropriate charging current needed for constant current charging and the appropriate charging
voltage needed for constant voltage charging to a smart charger using SMBus broadcasts.
Determines the chemical state of charge of each battery cell using Impedance Track™ and can reduce the
charge difference of the battery cells in fully charged state of the battery pack gradually using cell balancing
algorithm during charging. This prevents fully charged cells from overcharging and causing excessive
degradation and also increases the usable pack energy by preventing premature charge termination
Supports pre-charging/zero-volt charging
Support fast charging
Supports charge inhibit and charge suspend if battery pack temperature is out of temperature range
Reports charging fault and also indicate charge status via charge and discharge alarms.
Gas Gauging
The bq20z70 uses the Impedance Track™ Technology to measure and calculate the available charge in battery
cells. The achievable accuracy is better than 1% error over the lifetime of the battery and there is no full charge
discharge learning cycle required.
See Theory and Implementation of Impedance Track Battery Fuel-Gauging Algorithm application note
(SLUA364) for further details.
Authentication
The bq20z70 supports authentication by the host using SHA-1.
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FEATURE SET (continued)
Power Modes
The bq20z70 supports 3 different power modes to reduce power consumption:
•
•
•
In Normal Mode, the bq20z70 performs measurements, calculations, protection decisions and data updates
in 1 second intervals. Between these intervals, the bq20z70 is in a reduced power stage.
In Sleep Mode, the bq20z70 performs measurements, calculations, protection decisions and data update in
adjustable time intervals. Between these intervals, the bq20z70 is in a reduced power stage. The bq20z70
has a wake function that enables exit from Sleep mode, when current flow or failure is detected.
In Shutdown Mode the bq20z70 is completely disabled.
CONFIGURATION
Oscillator Function
The bq20z70 fully integrates the system oscillators. Therefore, the bq20z70 requires no external components for
this feature.
System Present Operation
The bq20z70 pulls the PU pin high periodically (1 s). Connect this pin to the PRES pin of the bq20z70 via a
resistor of approximately 5 kΩ. The bq20z70 measures the PRES input during the PU-active period to determine
its state. If PRES input is pulled to ground by external system, the bq20z70 detects this as system present.
BATTERY PARAMETER MEASUREMENTS
The bq20z70 uses an integrating delta-sigma analog-to-digital converter (ADC) for current measurement, and a
second delta-sigma ADC for individual cell and battery voltage, and temperature measurement.
Charge and Discharge Counting
The integrating delta-sigma ADC measures the charge/discharge flow of the battery by measuring the voltage
drop across a small-value sense resistor between the SR1 and SR2 pins. The integrating ADC measures bipolar
signals from -0.25 V to 0.25 V. The bq20z70 detects charge activity when VSR = V(SR1)-V(SR2)is positive and
discharge activity when VSR = V(SR1)-V(SR2) is negative. The bq20z70 continuously integrates the signal over
time, using an internal counter. The fundamental rate of the counter is 0.65 nVh.
Voltage
The bq20z70 updates the individual series cell voltages through the bq29330 at one second intervals. The
bq20z70 configures the bq29330 to connect the selected cell, cell offset, or bq29330 VREF to the CELL pin of
the bq29330, which is required to be connected to VIN of the bq20z70. The internal ADC of the bq20z70
measures the voltage, scales and calibrates it appropriately. This data is also used to calculate the impedance
of the cell for the Impedance Track™ gas-gauging.
Current
The bq20z70 uses the SRP and SRN inputs to measure and calculate the battery charge and discharge current
using a 5 mΩ to 20 mΩ typ. sense resistor.
Auto Calibration
The bq20z70 provides an auto-calibration feature to cancel the voltage offset error across SRN and SRP for
maximum charge measurement accuracy. The bq20z70 performs auto-calibration when the SMBus lines stay
low continuously for a minimum of 5 s.
Temperature
The bq20z70 has an internal temperature sensor and 2 external temperature sensor inputs TS1 and TS2 used
in conjunction with two identical NTC thermistors (default are Semitec 103AT) to sense the battery enviromental
temperature. The bq20z70 can be configured to use internal or external temperature sensors.
8
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FEATURE SET (continued)
COMMUNICATIONS
The bq20z70 uses SMBus v1.1 with Master Mode and package error checking (PEC) options per the SBS
specification.
SMBus On and Off State
The bq20z70 detects an SMBus off state when SMBC and SMBD are logic-low for ≥ 2 seconds. Clearing this
state requires either SMBC or SMBD to transition high. Within 1 ms, the communication bus is available.
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FEATURE SET (continued)
SBS Commands
Table 1. SBS COMMANDS
SBS
Cmd
Mode
Name
Format
Size in
Bytes
Min
Value
Max
Value
0x00
R/W
ManufacturerAccess
hex
0x01
R/W
RemainingCapacityAlarm
unsigned int
0x02
R/W
RemainingTimeAlarm
unsigned int
2
0x03
R/W
BatteryMode
hex
2
0x04
R/W
AtRate
signed int
2
0x05
R
AtRateTimeToFull
unsigned int
0x06
R
AtRateTimeToEmpty
unsigned int
0x07
R
AtRateOK
unsigned int
0x08
R
Temperature
0x09
R
0x0a
R
0x0b
Default
Value
Unit
2
0x0000
0xffff
—
2
0
65535
—
mAh or
10mWh
0
65535
—
min
0x0000
0xffff
—
-32768
32767
—
mA or 10mW
2
0
65535
—
min
2
0
65535
—
min
2
0
65535
—
unsigned int
2
0
65535
—
0.1°K
Voltage
unsigned int
2
0
20000
—
mV
Current
signed int
2
-32768
32767
—
mA
R
AverageCurrent
signed int
2
-32768
32767
—
mA
0x0c
R
MaxError
unsigned int
1
0
100
—
%
0x0d
R
RelativeStateOfCharge
unsigned int
1
0
100
—
%
0x0e
R
AbsoluteStateOfCharge
unsigned int
1
0
100
—
%
0x0f
R/W
RemainingCapacity
unsigned int
2
0
65535
—
mAh or
10mWh
0x10
R
FullChargeCapacity
unsigned int
2
0
65535
—
mAh or
10mWh
0x11
R
RunTimeToEmpty
unsigned int
2
0
65535
—
min
0x12
R
AverageTimeToEmpty
unsigned int
2
0
65535
—
min
0x13
R
AverageTimeToFull
unsigned int
2
0
65535
—
min
0x14
R
ChargingCurrent
unsigned int
2
0
65535
—
mA
0x15
R
ChargingVoltage
unsigned int
2
0
65535
—
mV
0x16
R
BatteryStatus
unsigned int
2
0x0000
0xffff
—
0x17
R/W
CycleCount
unsigned int
2
0
65535
—
0x18
R/W
DesignCapacity
unsigned int
2
0
65535
—
mAh or
10mWh
0x19
R/W
DesignVoltage
unsigned int
2
7000
16000
14400
mV
0x1a
R/W
SpecificationInfo
unsigned int
2
0x0000
0xffff
0x0031
0x1b
R/W
ManufactureDate
unsigned int
2
0
65535
0
0x1c
R/W
SerialNumber
hex
2
0x0000
0xffff
0x0001
0x20
R/W
ManufacturerName
String
11+1
—
—
Texas
Instruments
ASCII
0x21
R/W
DeviceName
String
7+1
—
—
bq20z70
ASCII
0x22
R/W
DeviceChemistry
String
4+1
—
—
LION
ASCII
0x23
R
ManufacturerData
String
14+1
—
—
—
ASCII
0x2f
R/W
Authenticate
String
20+1
—
—
—
ASCII
0x3c
R
CellVoltage4
unsigned int
2
0
65535
—
mV
0x3d
R
CellVoltage3
unsigned int
2
0
65535
—
mV
0x3e
R
CellVoltage2
unsigned int
2
0
65535
—
mV
0x3f
R
CellVoltage1
unsigned int
2
0
65535
—
mV
10
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Table 2. EXTENDED SBS COMMANDS
SBS
Cmd
Mode
Name
Format
Size in
Bytes
Min Value
Max Value
Default
Value
Unit
0x45
R
AFEData
String
11+1
—
0x46
R/W
FETControl
hex
1
0x00
—
—
ASCII
0xff
—
0x4f
R
StateOfHealth
unsigned int
1
0
100
—
0x51
R
SafetyStatus
hex
0x53
R
PFStatus
hex
2
0x0000
0xffff
—
2
0x0000
0xffff
0x54
R
OperationStatus
—
hex
2
0x0000
0xffff
—
0x55
R
0x57
R
ChargingStatus
hex
2
0x0000
0xffff
—
ResetData
hex
2
0x0000
0xffff
0x5a
—
R
PackVoltage
unsigned int
2
0
65535
—
mV
0x5d
R
AverageVoltage
unsigned int
2
0
65535
—
mV
0x60
R/W
UnSealKey
hex
4
0x00000000
0xffffffff
—
0x61
R/W
FullAccessKey
hex
4
0x00000000
0xffffffff
—
0x62
R/W
PFKey
hex
4
0x00000000
0xffffffff
—
0x63
R/W
AuthenKey3
hex
4
0x00000000
0xffffffff
—
0x64
R/W
AuthenKey2
hex
4
0x00000000
0xffffffff
—
0x65
R/W
AuthenKey1
hex
4
0x00000000
0xffffffff
—
0x66
R/W
AuthenKey0
hex
4
0x00000000
0xffffffff
—
0x70
R/W
ManufacturerInfo
String
8+1
—
—
—
0x71
R/W
SenseResistor
unsigned int
2
0
65535
—
0x77
R/W
DataFlashSubClassID
hex
2
0x0000
0xffff
—
0x78
R/W
DataFlashSubClassPage1
hex
32
—
—
—
0x79
R/W
DataFlashSubClassPage2
hex
32
—
—
—
0x7a
R/W
DataFlashSubClassPage3
hex
32
—
—
—
0x7b
R/W
DataFlashSubClassPage4
hex
32
—
—
—
0x7c
R/W
DataFlashSubClassPage5
hex
32
—
—
—
0x7d
R/W
DataFlashSubClassPage6
hex
32
—
—
—
0x7e
R/W
DataFlashSubClassPage7
hex
32
—
—
—
0x7f
R/W
DataFlashSubClassPage8
hex
32
—
—
—
%
μΩ
Application Schematic
The application schematic is on the following page.
Submit Documentation Feedback
11
Not Recommended For New Designs
PACKAGE OPTION ADDENDUM
www.ti.com
2-Oct-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
BQ20Z70PW-V150
NRND
TSSOP
PW
20
70
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
20Z70
BQ20Z70PW-V160
NRND
TSSOP
PW
20
70
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
20Z70
BQ20Z70PWR-V150
NRND
TSSOP
PW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
20Z70
BQ20Z70PWR-V160
NRND
TSSOP
PW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
20Z70
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
2-Oct-2014
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
IMPORTANT NOTICE
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changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
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