ONSEMI MM5Z27VT1

MM5Z2V4T1 SERIES
Zener Voltage Regulators
200 mW SOD−523 Surface Mount
This series of Zener diodes is packaged in a SOD−523 surface
mount package. They are designed to provide voltage regulation
protection and are especially attractive in situations where space is at a
premium. They are well suited for applications such as cellular
phones, hand held portables, and high density PC boards.
Specification Features:
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1
Cathode
• Standard Zener Breakdown Voltage Range − 2.4 V to 75 V
• Steady State Power Rating of 200 mW
• Small Body Outline Dimensions:
2
Anode
0.047″ x 0.032″ (1.20 mm x 0.80 mm)
2
• Low Body Height: 0.028″ (0.7 mm)
• ESD Rating of Class 3 (>16 kV) per Human Body Model
• Pb−Free Packages are Available
1
SOD−523
CASE 502
PLASTIC
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V−0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
MARKING DIAGRAM
1
xx M G
G
2
MAXIMUM RATINGS
Rating
Symbol
Max
Unit
Total Device Dissipation FR−5 Board,
@ TA = 25°C
PD
200
mW
TJ, Tstg
−65 to +150
°C
Junction and Storage
Temperature Range
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
xx
= Specific Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
Package
Shipping†
MM5ZxxxxT1
SOD−523
3000/Tape & Reel
MM5ZxxxxT1G
SOD−523
(Pb−Free)
3000/Tape & Reel
Device
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics tables starting on
page 3 of this data sheet.
© Semiconductor Components Industries, LLC, 2005
November, 2005 − Rev. 5
1
Publication Order Number:
MM5Z2V4T1/D
MM5Z2V4T1 SERIES
ELECTRICAL CHARACTERISTICS
I
(TA = 25°C unless otherwise noted,
VF = 0.9 V Max. @ IF = 10 mA for all types)
Parameter
Symbol
VZ
Reverse Zener Voltage @ IZT
IZT
Reverse Current
ZZT
Maximum Zener Impedance @ IZT
IZK
Reverse Current
ZZK
Maximum Zener Impedance @ IZK
VZ VR
IR
Reverse Leakage Current @ VR
VR
Reverse Voltage
IF
Forward Current
VF
Forward Voltage @ IF
C
IR VF
IZT
Zener Voltage Regulator
Maximum Temperature Coefficient of VZ
Max. Capacitance @VR = 0 and f = 1 MHz
100
80
POWER DISSIPATION (%)
QVZ
IF
60
40
20
0
0
25
50
75
100
125
TEMPERATURE (°C)
Figure 1. Steady State Power Derating
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2
150
V
MM5Z2V4T1 SERIES
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA for all types)
Zener Voltage (Note 1)
Zener Impedance
Leakage Current
QVZ
(mV/k) @ IZT
C
@ VR = 0
f = 1 MHz
@ IZT
ZZT
@ IZT
Max
mA
W
W
mA
mA
Volts
Min
Max
pF
2.4
2.7
3.0
3.3
3.6
2.6
2.9
3.2
3.5
3.8
5
5
5
5
5
100
100
100
95
90
1000
1000
1000
1000
1000
1.0
1.0
1.0
1.0
1.0
50
20
10
5
5
1.0
1.0
1.0
1.0
1.0
−3.5
−3.5
−3.5
−3.5
−3.5
0
0
0
0
0
450
450
450
450
450
3.7
4.0
4.4
4.8
5.2
3.9
4.3
4.7
5.1
5.6
4.1
4.6
5.0
5.4
6.0
5
5
5
5
5
90
90
80
60
40
1000
1000
800
500
200
1.0
1.0
1.0
1.0
1.0
3
3
3
2
1
1.0
1.0
2.0
2.0
2.0
−3.5
−3.5
−3.5
−2.7
−2.0
−2.5
0
0.2
1.2
2.5
450
450
260
225
200
0E
0F
0G
0H
0K
5.8
6.4
7.0
7.7
8.5
6.2
6.8
7.5
8.2
9.1
6.6
7.2
7.9
8.7
9.6
5
5
5
5
5
10
15
15
15
15
100
160
160
160
160
1.0
1.0
1.0
1.0
1.0
3
2
1
0.7
0.2
4.0
4.0
5.0
5.0
7.0
0.4
1.2
2.5
3.2
3.8
3.7
4.5
5.3
6.2
7.0
185
155
140
135
130
MM5Z10VT1
MM5Z11VT1
MM5Z12VT1
MM5Z13VT1
MM5Z15VT1
0L
0M
0N
0P
0T
9.4
10.4
11.4
12.4
14.3
10
11
12
13.25
15
10.6
11.6
12.7
14.1
15.8
5
5
5
5
5
20
20
25
30
30
160
160
80
80
80
1.0
1.0
1.0
1.0
1.0
0.1
0.1
0.1
0.1
0.05
8.0
8.0
8.0
8.0
10.5
4.5
5.4
6.0
7.0
9.2
8.0
9.0
10
11
13
130
130
130
120
110
MM5Z16VT1
MM5Z18VT1
MM5Z20VT1
MM5Z22VT1
MM5Z24VT1
0U
0W
0Z
10
11
15.3
16.8
18.8
20.8
22.8
16.2
18
20
22
24.2
17.1
19.1
21.2
23.3
25.6
5
5
5
5
5
40
45
55
55
70
80
80
100
100
120
1.0
1.0
1.0
1.0
1.0
0.05
0.05
0.05
0.05
0.05
11.2
12.6
14.0
15.4
16.8
10.4
12.4
14.4
16.4
18.4
14
16
18
20
22
105
100
85
85
80
MM5Z27VT1
MM5Z30VT1
MM5Z33VT1
MM5Z36VT1
MM5Z39VT1
12
14
18
19
20
25.1
28
31
34
37
27
30
33
36
39
28.9
32
35
38
41
2
2
2
2
2
80
80
80
90
130
300
300
300
500
500
1.0
1.0
1.0
1.0
1.0
0.05
0.05
0.05
0.05
0.05
18.9
21.0
23.2
25.2
27.3
21.4
24.4
27.4
30.4
33.4
25.3
29.4
33.4
37.4
41.2
70
70
70
70
45
MM5Z43VT1
MM5Z47VT1
MM5Z51VT1
MM5Z56VT1
MM5Z62VT1
21
1A
1C
1D
1E
40
44
48
52
58
43
47
51
56
62
46
50
54
60
66
2
2
2
2
2
150
170
180
200
215
500
500
500
500
500
1.0
1.0
1.0
1.0
1.0
0.05
0.05
0.05
0.05
0.05
30.1
32.9
35.7
39.2
43.4
37.6
42.0
46.6
52.2
58.8
46.6
51.8
57.2
63.8
71.6
40
40
40
40
35
MM5Z68VT1
MM5Z75VT1
1F
1G
64
70
68
75
72
79
2
2
240
255
500
500
1.0
1.0
0.05
0.05
47.6
52.5
65.6
73.4
79.8
88.6
35
35
VZ (Volts)
Device*
Device
Marking
Min
Nom
MM5Z2V4T1
MM5Z2V7T1
MM5Z3V0T1
MM5Z3V3T1
MM5Z3V6T1
00
01
02
05
06
2.2
2.5
2.8
3.1
3.4
MM5Z3V9T1
MM5Z4V3T1
MM5Z4V7T1
MM5Z5V1T1
MM5Z5V6T1
07
08
09
0A
0C
MM5Z6V2T1
MM5Z6V8T1
MM5Z7V5T1
MM5Z8V2T1
MM5Z9V1T1
ZZK @ IZK
IR @ VR
1. Zener voltage is measured with a pulse test current IZ at an ambient temperature of 25°C.
*The “G’’ suffix indicates Pb−Free package available.
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3
MM5Z2V4T1 SERIES
PACKAGE DIMENSIONS
SOD−523
CASE 502−01
ISSUE B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
−X−
A
−Y−
B
1
2
DIM
A
B
C
D
J
K
S
D 2 PL
0.08 (0.003)
M
T X Y
MILLIMETERS
MIN
NOM
MAX
1.10
1.20
1.30
0.70
0.80
0.90
0.50
0.60
0.70
0.25
0.30
0.35
0.07
0.14
0.20
0.15
0.20
0.25
1.50
1.60
1.70
MIN
0.043
0.028
0.020
0.010
0.0028
0.006
0.059
INCHES
NOM
0.047
0.032
0.024
0.012
0.0055
0.008
0.063
MAX
0.051
0.035
0.028
0.014
0.0079
0.010
0.067
C
−T−
K
J
SEATING
PLANE
S
SOLDERING FOOTPRINT*
1.40
0.0547
0.40
0.0157
0.40
0.0157
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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For additional information, please contact your
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MM5Z2V4T1/D