STMicroelectronics M58BF008B100ZA6T 8 mbit 256kb x32, burst flash memory Datasheet

M58BF008
8 Mbit (256Kb x32, Burst) Flash Memory
PRELIMINARY DATA
■
SUPPLY VOLTAGE
– VDD = 5V Supply Voltage
– VDDQ = 3.3V Input/Output Supply Voltage
– Optional VPP = 12V for fast Program and Erase
■
CONFIGURABLE OPTIONS
BGA
– Synchronous or Asynchronous write mode
– Burst Wrap/No-wrap default
– Critical Word X (3 or 4) and Burst Word
Y (1 or 2) latency times
■
ACCESS TIME
LBGA80 (ZA)
10 x 8 solder balls
PQFP80 (D)
– Synchronous X-Y-Y-Y Burst Read
up to 40MHz
– Asynchronous Read: 100ns
■
PROGRAMMING TIME: 10µs typical
■
MEMORY BLOCKS
Figure 1. Logic Diagram
– 32 equal Main blocks of 256 Kbit
VDD VDDQ VPP
– One Overlay block of 256 Kbit
■
18
ELECTRONIC SIGNATURE
– Manufacturer Code: 20h
– Device Code: F0h
32
A17-A0
DQ31-DQ0
CLK
– Version Code: 0-7h
RP
DESCRIPTION
The M58BF008 is a family of 8 Mbit non-volatile
Flash memories that can be erased electrically at
the block level and programmed in-system. Family
members are configured during product testing for
a specific Synchronous or Asynchronous Write
mode, a Burst default of Wrap or No-wrap and for
Critical Word X = 3 or 4 and Burst Word Y = 1 or 2
latency times. The Main memory array matrix allows each of the 32 equal blocks of 256 Kbit to be
erased separately and re-programmed without affecting other blocks. The memory features a
256 Kbit Overlay block having the same address
space as the first Main memory block. The Overlay
block provides a secure storage area that is controlled by special Instructions and an external input. A separate supply VDDQ allows the Input/
Output signals to be at 3.3V levels, while the main
supply VDD is 5V.
E
G
M58BF008
GD
W
LBA
WR
BAA
VSS
VSSQ
AI02656B
February 2000
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
1/36
M58BF008
Figure 2. LBGA Connections (Top view through package)
1
2
3
4
5
6
7
8
A
A16
A15
A13
A11
A9
A8
A4
A3
B
A17
A14
A12
A10
A7
A6
A1
A2
C
DQ1
DQ2
DQ0
VDD
VSS
A0
A5
DQ31
D
DQ4
DQ3
VDDQ
DU
VPP
VDDQ
DQ30
DQ28
E
DQ7
DQ5
VSSQ
DU
DU
VSSQ
DQ29
DQ27
F
DQ8
DQ6
VDDQ
DU
DU
VSSQ
DQ26
DQ25
G
DQ10
DQ9
VSSQ
VDDQ
DU
VDDQ
DQ23
DQ24
H
DQ11
DQ12
BAA
VSS
VDD
DQ22
DQ201
DQ19
J
DQ14
DQ13
CLK
G
W
DQ18
DQ21
DQ17
K
DQ15
RP
LBA
E
WR
GD
DU
DQ16
AI02668
2/36
M58BF008
NC
NC
GD
WR
W
G
E
VDD
BAA
VSS
LBA
NC
NC
CLK
RP
VDDQ
Figure 3. PQFP Connections
73
1
12
M58BF008
53
DQ15
DQ14
DQ13
DQ12
VSSQ
VDDQ
DQ11
DQ10
DQ9
DQ8
DQ7
DQ6
DQ5
DQ4
VSSQ
VDDQ
DQ3
DQ2
DQ1
DQ0
NC
NC
A17
A16
VSS
VPP
VDD
A9
A10
A11
A12
A13
A14
A15
32
A3
A4
A5
A6
A7
A8
DQ16
DQ17
DQ18
DQ19
VDDQ
VSSQ
DQ20
DQ21
DQ22
DQ23
DQ24
DQ25
DQ26
DQ27
VDDQ
VSSQ
DQ28
DQ29
DQ30
DQ31
NC
A0
A1
A2
AI02661
3/36
M58BF008
Table 1. Signal Names
A0-A17
Address Inputs
DQ0-DQ31
Data Input/Output
CLK
System Clock
RP
Reset/Power-down
E
Chip Enable
G
Output Enable
GD
Output Disable
W
Write Enable
LBA
Load Burst Address
WR
Write/Read
BAA
Burst Address Advance
VDD
Supply Voltage
VDDQ
Supply Voltage for Input/Output
Buffers
VPP
Program Supply Voltage
VSS
Ground
VSSQ
Input/Output Ground
NC
Not Connected Internally
DU
Don’t Use as Internally Connected
A Command Interface decodes the Instructions
written to the memory to access or modify the
memory content, to toggle the enable/disable of
read access to the Overlay block, to toggle the
burst Wrap/No-wrap or to toggle the Synchronous
or Asynchronous Read mode. A Program/Erase
Controller (P/E.C.) executes the algorithms taking
care of the timings necessary for program and
erase operations. The P/E.C. also takes care of
verification to unburden the system microprocessor, while a Status Register tracks the status of
each operation.
The following Instructions are executed by the
memory in either Asynchronous or Synchronous
mode.
Access or modify memory content:
- Read Array
- Read or Clear Status Register
- Read Electronic Signature
- Erase Main memory block or Overlay block
- Program Main memory or Overlay memory
- Program Erase Suspend or Resume
Toggle:
– Asynchronous/Synchronous Read
– Overlay Block Read Enable/Disable
– Burst Wrap/No-wrap
The M58BF008 devices are offered in PQFP80
and LBGA80 1.0mm ball pitch packages.
When the VPP supply is at VSS this prevents programming and erasure of the memory blocks and,
in addition, it prevents reading of the Overlay
block. When the VPP supply is at 5V it enables
both in-system program/erase and read access to
the Overlay block. For a limited time and number
of program/erase cycles the VPP supply may be
raised to 12V to provide fast program and erase
times.
Table 2. Absolute Maximum Ratings (1)
Symbol
Value
Unit
Ambient Operating Temperature
–40 to 125
°C
TBIAS
Temperature Under Bias
–40 to 125
°C
TSTG
Storage Temperature
–55 to 150
°C
V IO
Input Output Voltage
–0.6 to VDDQ +0.6
V
–0.6 to 7
V
–0.6 to 13.5
V
TA
VDD, VDDQ
V PP
Parameter
Supply Voltage
Program Voltage
Note: 1. Stresses above those listed in the Table ”Absolute Maximum Ratings” may cause permanent damage to the device.
4/36
M58BF008
ORGANISATION
The M58BF008 has a data path width of 32 bit
(Double-Word) and is organised as a Main memory array of 32 blocks of 256 Kbit plus an Overlay
block of 256 Kbit having the same address space
as the first Main memory block. The memory map
is shown in Table 3.
The memory is addressed by A0-A17 which are
static for Asynchronous or latched for Synchronous operation. Data Input/Output is static or
latched on DQ0-DQ31, these signals output data,
Table 3. Block Addresses
#
Size
(Kbit)
31
256
3E000-3FFFF
30
256
3C000-3DFFF
29
256
3A000-3BFFF
28
256
38000-39FFF
27
256
36000-37FFF
26
256
34000-35FFF
25
256
32000-33FFF
24
256
30000-31FFF
23
256
2E000-2FFFF
22
256
2C000-2DFFF
21
256
2A000-2BFFF
20
256
28000-29FFF
19
256
26000-27FFF
18
256
24000-25FFF
17
256
22000-23FFF
16
256
20000-21FFF
15
256
1E000-1FFFF
14
256
1C000-1DFFF
13
256
1A000-1BFFF
12
256
18000-19FFF
11
256
16000-17FFF
Address Range
10
256
14000-15FFF
9
256
12000-13FFF
8
256
10000-11FFF
7
256
0E000-0FFFF
6
256
0C000-0DFFF
5
256
0A000-0BFFF
4
256
08000-09FFF
3
256
06000-07FFF
2
256
04000-05FFF
1
256
02000-03FFF
0
256
00000-01FFF
Overlay Block
256
00000-01FFF
status or signatures read from the memory, or they
input data to be programmed or Instruction commands to the Command Interface.
Asynchronous mode
Memory control is provided by Chip Enable E, Output Enable G and Write Enable W for read and
write operations.
Synchronous mode
Memory control is provided by Load Burst Address
LBA which loads a read or write address. A Synchronous Single Read or a Synchronous Burst
Read is performed under control of Output Enable
G. Synchronous Write is controlled by Write/Read
Enable WR, Load Burst Address LBA and Write
Enable W. Internal advance of the burst address is
controlled by Burst Address Advance BAA.
SIGNAL DESCRIPTIONS
See Figure 1 and Table 1.
Address Inputs (A0-A17). The address signal
A17 is the MSB and A0 the LSB.
In the Asynchronous mode the addresses must be
stable before Chip Enable E and Write Enable W
go to VIL. They must remain stable during the read
or write cycle.
In the Synchronous modes, the addresses are
latched by the rising edge of the System Clock
CLK when both Latch Burst Address LBA and
Chip Enable E are at VIL. The addresses are
latched for a read operation if Write/Read WR is at
VIH or for a write operation when it is at VIL.
Data Input/Output (DQ0-DQ31). The data signal
DQ31 is the MSB and DQ0 the LSB. Commands
are input on DQ0-DQ7.
Data input is a Double-Word to be programmed in
the memory or an Instruction command to the
Command Interface. Data is read from the Main or
Overlay memory blocks, the Status Register or the
Electronic Signature.
In the Asynchronous mode data is read when the
addresses are stable and Chip Enable E and Output Enable G are at VIL. Commands or address/
data are written when Chip Enable E and Write W
are at VIL.
In the Synchronous mode, after addresses are
latched, data is read on a rising edge of the System Clock CLK when Chip Enable E is at VIL and
if Output Enable was at VIL on the previous rising
clock edge. Data is written on a rising edge of the
System Clock CLK when Chip Enable E and Write
Enable W are at VIL.
The outputs are high impedance when Chip Enable E or Output Enable G are at VIH, or when Output Disable GD is at VIL. Outputs are also high
impedance when System Reset RP is at VIL.
5/36
M58BF008
System Clock (CLK). All synchronous signals
are input and output relative to the System Clock.
Synchronous input signals must respect the setup and hold times relative to the System Clock rising edge.
Reset/Power-down (RP). The
Reset/Powerdown RP input provides a hardware reset for the
memory. When Reset/Power-down RP is at VIL
the memory is reset and in the Power-down mode.
In this mode the outputs are high impedance and
the current consumption is minimised. When Reset/Power-down RP is at VIH the memory is in the
normal operating mode. When leaving the Powerdown mode the memory enters the Asynchronous
Read Array mode.
Reset/Power-down has a weak pull-up resistor to
VDDQ and will assume a high level if not connected.
Chip Enable (E). When the Chip Enable E input
is at VIL it activates the memory control logic, input
buffers, decoders and sense amplifiers. When
Chip Enable E is at VIH the memory is deselected
and the power consumption is reduced to the
standby level.
Output Enable (G). Output Enable G controls the
data output buffers. In the Asynchronous mode
data is output when Output Enable G is at VIL. In
the Synchronous mode, Output Enable G is sampled on the rising edge of the System Clock CLK.
If Output Enable E is at VIL then valid output data
on DQ0-DQ31 can be read at the next rising edge
of the System Clock CLK.
Output Disable (GD). In
the
Asynchronous
mode the data outputs DQ0-DQ31 are high impedance when Output Disable GD is at VIL, irrespective of the state of Output Enable G. In
Synchronous mode Output Disable GD is sampled, together with Output Enable G, on the rising
edge of the System Clock CLK. If Output Disable
is at VIL then the data outputs DQ0-DQ31 are high
impedance at the next rising edge of the System
Clock CLK, irrespective of the state of Output Enable G.
Output Disable has a weak pull-up resistor to
VDDQ and will assume a high level if not externally
connected.
Write Enable (W). The Write Enable W input
controls the writing of commands or input data. In
the Asynchronous mode commands or data are
written when Chip Enable E and Write Enable W
are at VIL. In the Synchronous mode with Chip Enable E at VIL, input data is sampled if Write Enable
W is at VIL on the rising edge of the System Clock
CLK.
6/36
Load Burst Address (LBA). In the Asynchronous mode Load Burst Address LBA is Don’t Care
(but if it falls during an asynchronous read then a
new read cycle is started). In the Synchronous
mode Load Burst Address LBA enables latching of
the burst starting address for Synchronous read or
write. The address is latched on the rising edge of
the System Clock CLK if Load Burst Address LBA
is at VIL.
Write/Read (WR). Write/Read WR is used in
Synchronous mode to control write or read operations. If Load Burst Address LBA is at VIL and
Write/Read is at VIL then the rising edge of the
System Clock CLK latches a write address. If
Write/Read is at VIH then a read address is
latched.
Write/Read has a weak pull-up resistor to VDDQ
and will assume a high level if not externally connected.
Burst Address Advance (BAA). When
Burst
Address Advance BAA is at VIL, the rising edge of
the System Clock CLK advances the burst address. When Burst Address Advance BAA is at VIH
the advance is suspended.
VDD Supply Voltage. The supply VDD provides
the power to the internal circuits of the memory.
The V DD supply voltage is 4.5 to 5.5V.
VDDQ Input/Output Supply Voltage. The Input/
Output supply VDDQ provides the power for the input/outputs of the memory, independent from the
supply VDD. The Input/Output supply VDDQ may
be connected to the VDD supply or it can use a
separate supply of 3.0 to 3.6V.
VPP Program/Erase Supply Voltage. The Program/Erase supply VPP is used for programming
and erase operations. The memory normally executes program and erase operations at the supply
VPP1 voltage levels.
In a manufacturing environment, programming
may be speeded up by applying a higher VPPH level to the VPP Program/Erase Supply. This is not intended for extended use. The VPPH supply may be
applied for a total of 80 hours maximum and during
program and erase for a maximum of 1000 cycles.
Stressing the device beyond these limits could
damage the device.
When VPP Program/Erase supply is at VSS all
blocks are protected from programming or erase.
Leaving VPP floating is equivalent to connecting it
to VSS due to an internal pull-down circuit.
Ground (V SS and VSSQ ). The Ground VSS is the
reference for the internal supply voltage VDD . The
Ground VSSQ is the reference for the Input/Output
supply VDDQ.
M58BF008
DEVICE OPERATIONS
See Table 4 for Asynchronous or Synchronous
Bus Operations.
In the Asynchronous mode the memory is selected
with Chip Enable E Low. The data outputs are enabled by Output Enable G Low or disabled by Output Disable GD Low. Data is input by Write Enable
W Low.
In the Synchronous mode the memory latches addresses and data (input or output) on the rising
edge of the System Clock CLK. Burst address
latching is enabled by Load Burst Address LBA
Low with Write/Read WR Low for a write cycle or
High for a read cycle.
Data outputs are enabled for reading on the rising
edge of the System Clock CLK when Output Enable G is low. Data is input on the rising edge of
the System Clock CLK when Write Enable W is
Low.
The memory is deselected and in standby mode
when Chip Enable E is High, and it is reset or in
power-down mode when Reset/Power-Down RP
is Low.
Read. Read operations are used to output the
contents of the memory, the Electronic Signature
or the Status Register. The data read depends on
the previous Instruction given to the memory.
Read operations can be Asynchronous or Synchronous, with a single or burst read. On power-up
the device is in Asynchronous read mode, the Instruction Asynchronous/Synchronous Read Toggle ART can be used to enter the Synchronous
read mode.
– Asynchronous Read. To read a data DoubleWord in Asynchronous mode the address inputs
must be stable and Chip Enable E must be Low
during the read cycle. Output Enable G must be
Low and Output Disable GD High. The Load
Burst Address LBA is Don’t Care, but its falling
edge will start a new read cycle.
Table 4. Bus Operations (1,2)
Operation
RP
CLK
E
LBA
WR
W
GD
G
DQ0-DQ31
Asynchronous Read
V IH
X
V IL
X
X
VIH
VIH
VIL
Data Output
Asynchronous Write
V IH
X
V IL
X
X
VIL
VIH
VIH
Data Input
Synchronous Read
V IH
V IL
VIH
V IH
X
VIH
VIL
Data Output
Synchronous Write Address for
Read
V IH
V IL
VIL
V IH
X
VIH
VIH
X
Synchronous Write Address for
Command
V IH
V IL
VIL
VIL
X
VIH
VIH
X
Synchronous Data Write
V IH
V IL
VIH
V IH
VIL
VIH
VIH
Data Input
Output Disabled by G
V IH
X
V IL
X
X
X
VIH
VIH
Hi-Z
Output Disabled by GD
V IH
X
V IL
X
X
X
V IL
X
Hi-Z
Standby
V IH
X
VIH
X
X
X
X
X
Hi-Z
Reset / Power-down
VIL
X
X
X
X
X
X
X
Hi-Z
Note: 1. See Device Operations, Instructions and Commands, sections for more details.
2. X=VIL or VIH.
Table 5. Read Electronic Signature
Code
RP
E
G
W
A0
A1
A2-A17
DQ0-DQ31
Manufacturer
VIH
VIL
VIL
VIH
VIL
V IL
Don’t Care
00000020h
Device
VIH
VIL
VIL
VIH
V IH
V IL
Don’t Care
000000F0h
Version
VIH
VIL
VIL
VIH
VIL
VIH
Don’t Care
0000000xh
Note: ”x” = version level. The first version is ”0” and it can have a value up to ”7”.
7/36
M58BF008
– Synchronous Single Read. To read a single
data Double-Word in Synchronous mode Chip
Enable E must be Low. Load Burst Address
LBA must be Low for one System Clock CLK rising edge with Write/Read WR High. This latches
the read address, after which the address bus
inputs are Don’t Care. The Output Enable G is
Low for a single System Clock CLK cycle. The
Double-Word of valid data is output on the next
System Clock CLK rising edge.
– Synchronous Burst Read. To read a burst of
four Double-Words in Synchronous mode Chip
Enable /E must be Low. Load Burst Address
LBA must be Low for one System Clock CLK rising edge with Write/Read WR High. This latches
the first address of the burst sequence, after
which the address bus inputs are Don’t Care.
The Output Enable G is driven Low before the
burst output sequence. Four Double-Words of
data are output on the subsequent System
Clock CLK rising edges if Burst Address Advance BAA is maintained Low. The address advance for synchronous burst read is suspended
if Burst Address Advance BAA goes High and
the output data remains constant. The data bus
will go high impedance on the rising edge of the
System Clock CLK after Output Enable G goes
High.
The burst timing depends on the device configuration for the Critical Word X and Burst Word Y
latency times and the choice of wrap or no-wrap
for burst addresses. The operation burst wrap is
shown in Table 13. The wrap sequence uses
only the address bits A0 and A1 and does not
repeat after the last Double-Word has been output.
Read Overlay Block. The Overlay block can be
read, as for a Main block, after it has been enabled. To enable the Overlay block the Overlay
Block Enable bit OBEB and the Overlay Block Status bit OBS in the Status Register must be set to
’1’ - see Table 9.
The Overlay Block Enable bit OBEB can be set to
’1’ in three ways - see Table 10:
– By Toggling the Reset/Power-Down signal RP
with the VPP Program/Erase supply in the range
VPP1 or VPPH. VPP out of range will reset the
OBEB bit to ’0’.
– By a leaving power-on reset with VPP Program/
Erase supply in the range VPP1 or VPPH. VPP out
of range will reset the OBEB bit to ’0’.
– By giving the Overlay Block Enable/Disable for
Read Instruction OBT.
The Overlay Block Status bit OBS monitors the
VPP Program/Erase supply and will be set to ’1’
when in the range VPP1 or VPPH. The Overlay
block is enabled with OBEB at ’1’ but will not be
read unless OBS status bit is also at ’1’. If it is not
8/36
then a read operation will read the contents of the
Main block at the same address.
When the Overlay block is enabled for reading,
only this one block of 256 Kbit is accesible and
none of the other Main blocks may be accessed,
the address signals A13-A17 are Don’t Care.
Read Electronic Signature. The memory contains three Electronic Signature codes identifying
the manufacturer, device and version, which can
be read after giving the Instruction RSIG. The
manufacturer code 00000020h is read when the
address inputs A0 and A1 are at VIL. The device
code 000000F0h is read when A0 is at V IH and A1
is at VIL. The version code 0000000xh is read
when A0 is at VIL and A1 is at VIH. The codes are
read on DQ0-DQ31, all other address signal inputs
are Don’t Care. See Table 5.
Write. Write operations are used to give commands to the memory that latch input data and addresses to program or block addresses to erase.
– Asynchronous Write. To write data in the
Asynchronous mode the address inputs must
be stable and Chip Enable E must be Low during the write cycle. Write W must be Low and input data valid on the rising edge is Write W.
– Synchronous Write. To write input data in
Synchronous mode Chip Enable E must be
Low. Load Burst Address LBA must be Low for
one System Clock CLK rising edge with Write/
Read WR Low. This latches the write address,
after which the address bus inputs are Don’t
Care. When Write Enable W is Low input data is
latched on the next System Clock CLK rising
edge.
Output Disable. The data outputs are high impedance when the Output Enable G is High or
when the Output Disable GD is Low, independent
of the level on Output Enable G.
Standby. The memory is in standby when the P/
E.C. is not running, the memory is in read mode
and Chip Enable E is High. The power consumption is reduced to the standby level and the outputs
are high impedance, independent of the Output
Enable G or Write Enable W inputs.
If Chip Enable goes High during a program or
erase operation the device enters the standby
mode when the internal algorithm has finished.
Reset/Power-down. During power-down all internal circuits are switched off, the memory is deselected and the outputs are high impedance. The
memory is in Power-down mode when Reset/Power-down RP is Low. The power consumption is reduced to the power-down level, independent of the
Chip Enable E, Load Burst Address LBA, Output
Enable G or Write Enable W inputs.
If Reset/Power-down RP is pulled Low during a
program or erase operation this is aborted and the
memory content is no longer valid.
M58BF008
INSTRUCTIONS AND COMMANDS
The Instructions are listed in Tables 6 and 7. They
may be broadly divided into two types, those that
access or modify the memory content and those
that toggle a mode or function.
The Instructions that access or modify the memory
content include:
– Read Memory Array (RD)
– Read Status Register (RSR) and Clear Status
Register (CLRS)
– Read Electronic Signature (RSIG)
– Erase (EE) and Overlay Block Erase (OBEE)
– Program (PG) and Overlay Block Program (OBPG)
– Program or Erase Suspend (PES) and Program
or Erase Resume (PER)
The Instructions that toggle a mode or function include:
– Asynchronous/Synchronous Read mode Toggle (ART)
– Wrap/No-wrap Burst mode Toggle (WBT)
– Overlay Block Enable/Disable function Toggle
(OBT)
Instructions are written, in one or more write cycles, to the memory Command Interface (C.I.) for
decoding. The Command Interface is reset to
Read Memory Array at power-up, when exiting
from power-down. Any invalid sequence of commands will also reset the Command Interface to
Read Memory Array.
A Program/Erase Controller (P/E.C.) handles all
the timing and verifies the correct execution of the
Program or Erase instructions. The P/E.C. has a
Status Register which monitors the operations and
which may be read at any time during program or
erase. The Status Register bits indicate the operation and exit status of the internal algorithms.
The V PP Program and Erase Supply Voltage must
be within the range VPP1 or VPPH for programming
or erasure. If VPP out of range, the program or
erase algorithms do not start and Status Register
bit VPP Status VPPS will be set to ’1’.
Table 6. Commands
Code
Command
02h
Overlay Block Erase Set-up
04h
Overlay Block Program Set-up
06h
Overlay Block Read Enable/
Disable
0Dh
Overlay Block Erase Confirm
20h
Erase Set-up
30h
Wrap/No-wrap Burst Toggle
40h
Program Set-up
50h
Clear Status Register
60h
Asynchronous/Synchronous
Read Toggle
70h
Read Status Register
90h
Read Electronic Signature
B0h
Program/Erase Suspend
D0h
Program/Erase Resume or
Erase Confirm
FFh
Read Memory Array
9/36
M58BF008
Table 7. Instructions
1st Cycle
Mnemonic
Instruction
RD
Read Memory
Array
RSR
2nd Cycle
Cycles
Operation
Address
Data
Operation
Address.
Data
1+
Write
00000h
FFh
Read
Read Address
Data Output
Read Status
Register
1+
Write
00000h
70h
Read
X
Status
Register
CLRS
Clear Status
Register
1
Write
00000h
50h
RSIG
Read Electronic
Signature
1+++
Write
00000h
90h
Read
Signature
Address
Electronic
Signature
EE
Erase
2
Write
00000h
20h
Write
Block Address
D0h
OBEE
Overlay Block
Erase
2
Write
00000h
02h
Write
Overlay Block
Address
0Dh
PG
Program
2
Write
00000h
40h
Write
Program
Address
Data Input
OBPG
Overlay Block
Program
2
Write
00000h
04h
Write
Overlay Block
Program
Address
Data Input
PES
Program/Erase
Suspend
1
Write
00000h
B0h
PER
Program/Erase
Resume
1
Write
00000h
D0h
ART
Asynch/Synch
Read Toggle
1
Write
00000h
60h
WBT
Wrap//No-wrap
Burst Toggle
1
Write
00000h
30h
OBT
Overlay Block
Read En/Dis
Toggle
1+
Write
00000h
06h
Read
Read Address
Data Output
Read Memory Array (RD). The Read Memory
Array instruction consists of one write cycle giving
the command FFh at the address 00000h. Subsequent read operations will read the addressed location and output the memory data. The data can
be read from the Main memory Array or the Overlay memory block if it is enabled.
Read Status Register (RSR). The Read Status
Register instruction consists of one write cycle giving the command 70h at the address 00000h. Subsequent read operations will output the Status
Register contents. See Table 8 for an explanation
of the Status Register bits. The Status Register indicates when a program or Erase operation is
complete and its success or failure. The Status
Register also indicates if the Overlay block is accessible for reading. The Read Status Register instruction may be given at any time, including while
a program or erase operation in progress.
10/36
Clear Status Register (CLRS). The Clear Status
Register instruction consists of one write cycle giving the command 50h at the address 00000h. The
Clear Status Register command clears the bits 3,
4 and 5 of the Status Register if they have been set
to ’1’ by the P/E.C. operation. The Clear Status
Register command should be given after an error
has been detected and before any new operation
is attempted. A Read Memory Array command
should also be given before data can be read from
the memory array.
Read Electronic Signature (RSIG). The Read
Electronic Signature instruction consists of a first
write cycle giving the command 90h at the address
00000h. This is followed by three read operations
at addresses xxxx0h, xxxx1h and xxxx2h which
output the manufacturer, device and version
codes respectively.
M58BF008
Table 8. Status Register Bits
Mnemonic
Bit
P/ECS
7
PESS
ES
PS
VPPS
6
5
4
3
Reserved
2
OBEB
1
OBS
0
Name
Logic
Level
Definiti on
’1’
Ready
’0’
Busy
‘1’
Suspend
‘0’
In Progress or
Completed
Indicates the P/E.C. status, check during
Program or Erase
P/E.C. Status
Program/Erase
Suspend Status
Note
On Program/Erase Suspend instruction both
P/ECS and PESS bits are set to ‘1’.
Either ES bit or PS bit is set to ‘1’.
PESS and either ES or PS bits remain at ‘1’
until Erase Resume instruction is given.
’1’
Erase Error or
Erase Suspend
’0’
Erase Success
’1’
’0’
Program Error or PS bit is set to ‘1’ if either PESS instruction is
Program Suspend given or Program operation fails. If PS bit is ‘1’,
Program Success check PESS bit.
’1’
VPP Invalid
’0’
VPP OK
Overlay Block
Enable Bit
’1’
Enabled
’0’
Disabled
Overlay Block
Status
’1’
Activated
’0’
Not Activated
Erase Status
Program Status
VPP Status
Erase (EE). The Erase instruction consists of two
write cycles, the first is the erase set-up command
20h at the address 00000h. This is followed by the
Erase Confirm command D0h written to an address within the block to be erased. If the second
is not the Erase Confirm command the Status
Register bits 4 and 5 are set to ’1’ and the instruction aborts. While erasing is in progress only the
Read Status Register and Erase Suspend instructions are valid.
Blocks are erased one at a time. An erase operation sets all bits in a block to ’1’. The erase algorithm automatically programs all bits to ’0’ before
erasing the block to all ’1’s.
Read operations output the Status Register after
the erase operation has started. The Status Register bit 7 is ’0’ while the erase is in progress and is
set to ’1’ when it is completed. After completion the
Status Register bit 5 is set to ’1’ if there has been
an erase failure.
Erasure should not be attempted when the VPP
Program/Erase Supply Voltage is out of the range
VPP1 or VPPH as the results will be uncertain. The
ES bit is set to ‘1’ if either PESS instruction is
given or Erase operation fails. If ES bit is ‘1’,
check PESS bit.
VPPS bit is set to ‘1’ if initially VPP is not VPPH
nor VPP1, when Program or Erase Instruction
are executed.
OBEB bit is set to ‘1’ when Overlay Block is
Enabled.
OBS bit is set to ‘1’ when OBEB is ‘1’ and VPP
is in the range VPP1 or V PPH.
Status Register bit 3 is set to ’1’ if VPP is not within
the allowed ranges when erasing is attempted or if
it falls out of the ranges during erase execution.
The erase operation aborts if VPP drops out of the
allowed range or if Reset/Power-down RP falls to
VIL. As data integrity cannot be guaranteed when
the erase operation is aborted, the erase must be
repeated.
A Clear Status Register instruction must be given
to clear the Status Register bits.
Overlay Block Erase (OBEE). The
Overlay
Block Erase instruction consists of two write cycles, the first is the Overlay block erase set-up
command 02h at the address 00000h. This is followed by the Overlay Block Erase Confirm command 0Dh written to an address within the Overlay
block. If the second is not the Overlay Block Erase
Confirm command the Status Register bit 5 is set
to ’1’ and the instruction aborts. While erasing is in
progress only the Read Status Register instruction
is valid.
The operation is executed as described for the
Erase (EE) instruction of the Main memory array.
A Clear Status Register instruction must be given
to clear the Status Register bits.
11/36
M58BF008
Program (PG). The Program instruction consists
of two write cycles, the first is the program set-up
command 40h at the address 00000h. This is followed by a second write cycle to latch the address
and data to be programmed. This second command starts the P/E.C. A program operation can
be aborted by writing FFFFFFFFh to any address
after the program set-up command has been given. While programming is in progress only the
Read Status Register and Program Suspend instructions are valid.
Read operations output the Status Register after
the program operation has started. The Status
Register bit 7 is ’0’ while programming is in
progress and is set to ’1’ when it is completed. After completion the Status Register bit 4 is set to ’1’
if there has been a programming failure.
Programming should not be attempted when the
VPP Program/Erase Supply Voltage is out of the
range VPP1 or VPPH as the results will be uncertain. The Status Register bit 3 is set to ’1’ if VPP is
not within the allowed ranges when programming
is attempted or if it falls out of the ranges during
program execution.
The program operation aborts if VPP drops out of
the allowed ranges or if Reset/Power-Down RP
falls to VIL. As data integrity cannot be guaranteed
when the program operation is aborted, the memory block must be erased and programming repeated.
A Clear Status Register instruction must be given
to clear the Status Register bits.
Overlay Block Program (OBPG). The Overlay
Block Program instruction consists of two write cycles, the first is the program set-up command 04h
at the address 00000h. This is followed by a second write cycle to latch the address and data to be
programmed. This second command starts the P/
E.C.
The operation is executed as described for the
Program (PG) instruction of the Main memory array.
While programming of the Overlay block in
progress only the Read Status Register instruction
is valid.
Program/Erase Suspend (PES). As
memory
erasure takes of the order of seconds to complete
and programming a few microseconds, a Program/Erase Suspend instruction is implemented.
Program/Erase Suspend interrupts the operations
to allow reading or programming in a block other
than one in which program or erase is suspended.
A Program/Erase Suspend instruction is accepted
only during a Program or Erase instruction. When
the Program/Erase Suspend command is written
to the Command Interface, the P/E.C. freezes the
12/36
program or erase operation. The suspended program or erase operation may be restarted by using
the Program/Erase Resume instruction. Program/
Erase Suspend is not allowed during the Overlay
block program/erase operation and the command
is ignored.
The Program/Erase Suspend instruction consists
of one write cycle giving the command B0h at the
address 00000h.
If a program operation is in progress when the instruction is given, the Status Register bits 4 and 6
are set to ’1’ after it has been suspended. If an
erase operation is in progress when the instruction
is given, the Status Register bits 5 and 6 are set to
’1’ after it has been suspended.
The valid instructions that may be given to the
memory while programing is suspended are
– Read Memory Array (RD)
– Read Status Register (RSR)
– Read Electronic Signature (RSIG)
– Program/Erase Resume (PER)
In addition, while erasure is suspended, the Program (PG) instruction may be given.
In Program/Erase Suspend mode the memory can
be placed in a pseudo-standby mode by taking
Chip Enable /E to VIH to reduce power consumption.
Program/Erase Resume (PER). If a Program/
Erase Suspend instruction has previously been
executed, then the operation may be resumed by
giving the command D0h at the address 00000h.
The Status Register bits 4, 5 and 6 are cleared
when program or erase resumes. A Read Memory
Array instruction will output the Status Register after program or erase is resumed.
Suggested flow charts for software that uses programming, erasure and program/erase suspend/
resume operations are shown in Figures 11, 12,
13 and 14.
Asynchronous/Synchronous Read Toggle (ART).
Asynchronous Read Memory Array is the memory
default at power-up or when returning from PowerDown. To read data in Synchronous mode, either
single or burst, the Asynchronous/Synchronous
Read Toggle instruction must be used.
The Asynchronous/Synchronous Read Toggle instruction consists of one write cycle giving the
command 60h at the address 00000h. Two consecutive instructions are not recognised and another Instruction, for example the Read Memory
Array, must be given before another Asynchronous/Synchronous Read Toggle will be recognised.
M58BF008
Wrap/No-wrap Burst Toggle (WBT). The
default for burst read is set by the device configuration. The Wrap/No-wrap Burst Toggle can be used
to toggle the burst wrap operation.
The Wrap/No-wrap Burst Toggle instruction consists of one write cycle giving the command 30h at
the address 00000h. Two consecutive instructions
are not recognised and another Instruction, for example the Read Memory Array, must be given before another Wrap/No-wrap Burst Toggle will be
recognised.
Overlay Block Read Enable/Disable Toggle
(OBT). Read operations in the Overlay block can
be enabled or disabled using the Overlay Block
Read Enable/Disable Toggle instruction. This toggle instruction consists of one write cycle giving
the command 06h at the address 00000h. Two
consecutive instructions are not recognised.
The Status Register bit 1 is set to ’1’ when the
Overlay block is enabled.
Table 9. Read Access to Overlay Block or Main Block
OBEB Status Bit
VPP
OBS Status Bit
Read Access
1
In the range VPP1 or VPPH
1
Overlay Block
1
Out of the range
VPP1 or VPPH
0
Main Block
0
X
0
Main Block
1
Unknown
Not guaranteed
Unknown
Table 10. Overlay Block Enable/Disable Bit (OBEB)
OBEB Status Bit
Method
Toggle RP
(1)
VPP
Prior state of
OBEB
Next state of
OBEB
In the range
VPP1 or VPPH
X
1
Out of the range
VPP1 or VPPH
X
0
In the range
VPP1 or VPPH
X
1
Out of the range
VPP1 or VPPH
X
0
–
0
1
–
1
0
Power-on-reset
Overlay Block Read Enable/Disable instruction OBT
Note: 1. Toggle H-L-H for tPLPH minimum.
13/36
M58BF008
CONFIGURATION
The M58BF008 is configured during testing which
sets the default for the write and burst interface.
The settings are:
Write Interface. The write interface can be set
permanently to either Asynchronous or Synchronous. Note that the read interface is not affected
by this configuration and defaults to Asynchronous
read at power-up, it can be toggled to Synchronous read and back using the Asynchronous/Synchronous Read Toggle Instruction.
Wrap/No-Wrap. The burst function can be set to
default to wrap or no-wrap. The behaviour is
shown in Table 13. Wrap/No-wrap can be toggled
using the Wrap/No-wrap Burst Toggle Instruction.
Critical Word and Burst Word Latency Times.
The Critical Word and Burst Word latency times
can be set permanently to
– Critical Word Latency Time X = 3 or 4
– Burst Word Latency Time Y = 1 or 2
A burst sequence is described as X-Y-Y-Y.
Table 11. Configuration
Name
Option 1
Optio n 2
Synchronous
Asynchronous
Wrap
No-wrap
Critical Word Latency Time (X)
4
3
Burst Word Latency Time (Y)
1
2
Write Interface
Wrap/No-wrap Burst
Table 12. Wrap/No-wrap Burst Sequence
First Burst Address A1-A0
Data Wrap
00
Double-Word 0 ⇒ 1 ⇒ 2 ⇒ 3
Double-Word 0 ⇒ 1 ⇒ 2 ⇒ 3
01
Double-Word 1 ⇒ 2 ⇒ 3 ⇒ 0
Double-Word 1 ⇒ 2 ⇒ 3
10
Double-Word 2 ⇒ 3 ⇒ 0 ⇒ 1
Double-Word 2 ⇒ 3
11
Double-Word 3 ⇒ 0 ⇒ 1 ⇒ 2
Double-Word 3
POWER SUPPLY
The M58BF008 places itself in one of three different modes depending on the status of the control
signals which define decreasing levels of current
consumption. This minimises the memory power
consumption, allowing an overall decrease in the
system power consumption without affecting performance. A different recovery time is, however,
linked to the different modes - see the AC timing
tables.
Active Power mode. When Chip Enable E is at
VIL and Reset/Power-Down RP is at VIH the memory is in Active Power mode. The DC characteristics tables show the current consumption figures.
Standby mode. Refer to the Device Operating
section
Power-Down mode. Refer to the Device Operating section.
14/36
Data No-wrap
Power Up. The VDD Supply Voltage, VDDQ Input/
Output Supply Voltage and the VPP Program/
Erase Supply Voltage can be applied in any order.
The memory Command Interface is reset on power-up to Read Memory Array, but a negative transition on Chip Enable E or a change of the
addresses is required to ensure valid data is output.
Care must be taken to avoid writes to the memory
when the VDD Supply Voltage is above VLKO and
VPP Program/Erase Supply Voltage powers-up
first. Writes can be inhibited by driving either Write
Enable W or Write/Read WR to VIH.
The memory is disabled until Reset/Power-Down
RP is up to VIH.
SUPPLY RAILS
Normal precautions must be taken for supply rail
decoupling. Each device in a system should have
the VDD, VDDQ and VPP rails decoupled with a
0.1µF capacitor close to the package pins. PCB
track widths should be sufficient to carry the required program and erase currents on the VPP
supply.
M58BF008
Table 13. AC Measurement Conditions
Input Rise and Fall Times
Figure 5. AC Testing Load Circuit
≤ 10ns
VDDQ/2
0 to VDDQ
Input Pulse Voltages
Input and Output Timing Ref. Voltages
VDDQ/2
1N914
3.3kΩ
Figure 4. AC Testing Input Output Waveform
DEVICE
UNDER
TEST
VDDQ
OUT
CL = 80pF
VDDQ/2
0V
AI00610
CL includes JIG capacitance
AI02657
Table 14. Capacitance (1) (TA = 25 °C, f = 1MHz)
Symbol
CIN
COUT
Parameter
Input Capacitance
Output Capacitance
Test Condition
Min
Max
Unit
VIN = 0V
6
pF
VOUT = 0V
12
pF
Note: 1. Sampled only, not 100% tested.
15/36
M58BF008
Table 15. DC Characteristics
(TA = –40 to 125°C; VDD = 5V ± 10% and VDDQ = 3.3V ± 0.3V)
Symbol
Parameter
Test Conditi on
Min
Max
Unit
ILI
Input Leakage Current
0V≤ VIN ≤ VDDQ
±1
µA
ILO
Output Leakage Current
0V ≤ VOUT ≤VDDQ
±10
µA
ILT1
Input Leakage Current pull-up
0V≤ VIN ≤ VDDQ
–600
µA
0≤ V PP ≤ 12.6
200
µA
ILIVPP
Input Leakage Current pull-down
–20
ICC
Supply Current (Async. Read)
E = VIL, G = VIL, f = 5MHz
25
mA
ICCB
Supply Current (Burst Read)
E = VIL , G = V IL, f = 40MHz
25
mA
ICC1
Supply Current (Standby)
E = VIH, RP = VIH
10
µA
ICC2
Supply Current (Power-down)
RP = VIL
10
µA
Supply Current (Program)
Program in Progress
V PP = VPP1
25
mA
ICC3
VPP = VPPH
25
mA
Supply Current (Erase)
Erase in Progress
V PP = VPP1
25
mA
ICC4
VPP = VPPH
25
mA
IPP
Program Current (Read or Standby)
VPP ≥ VPP1
200
µA
IPP1
Program Current (Read or Standby)
VPP ≤ VPP1
±15
µA
IPP2
Program Current (Power-down)
RP = VIL
5
µA
Program Current (Program)
Program in Progress
V PP = VPP1
15
mA
IPP3
VPP = VPPH
25
mA
V PP = VPP1
15
mA
VPP = VPPH
25
mA
IPP4
Program Current (Erase)
Erase in Progress
VIL
Input Low Voltage
–0.3
0.1V DDQ
V
VIH
Input High Voltage
0.9V DDQ
V DDQ
+0.3
V
VOL
Output Low Voltage
IOL = 100µA,
VDD = VDD min,
V DDQ = VDDQ min
0.2
V
VOH
Output High Voltage
I OL = –100µA,
VDD = VDD min,
V DDQ = VDDQ min
VPP1
Program Voltage
(Program or Erase operations)
4.5
5.5
V
V PPH
Program Voltage
(Program or Erase operations)
11.4
12.6
V
VLKO
VDD Supply Voltage Lock-out
1.5
V
VPPLK
Program Voltage Lock-out
1.5
V
16/36
VDDQ –0.2
V
M58BF008
Table 16. Asynchronous Read AC Characteristics (1)
(TA = –40 to 125°C; VDD = 5V ± 10% and VDDQ = 3.3V ± 0.3V)
Symbol
Alt
tAVAV
tRC
Address Valid to Next Address Valid
tAVQV
tACC
Address Valid to Output Valid
tAXQX (2)
tOH
Address Transition to Output Transition
0
ns
tEHQX (2)
tOH
Chip Enable High to Output Transition
0
ns
tELQV (2, 3)
tCE
Chip Enable Low to Output Valid
tELQX (2)
tLZ
Chip Enable Low to Output Transition
(2)
tHZ
Chip Enable High to Output Hi-Z
tGHQX (2)
tOH
Output Enable High to Output Transition
tGHQZ (2)
tDF
Output Enable High to Output Hi-Z
25
ns
tGLQV (2)
tOE
Output Enable Low to Output Valid
30
ns
tGLQX
tOLZ
Output Enable Low to Output Transition
tEXQZ
Parameter
Min
Max
Unit
100
ns
100
ns
100
ns
0
ns
25
ns
0
ns
0
ns
Note: 1. See AC Testing Measurements Conditions for timing measurements.
2. Sampled only, not 100% tested.
3. G may be delayed up to tELQV-tGLQV after falling edge of E without increasing tELQV.
Figure 6. Asynchronous Read AC Waveforms
tAVAV
VALID
A12-A29
tAVQV
E, LBA
tELQV
tELQX
tEHQX
tEHQZ
G
tGLQX
tGLQV
tGHQX
tGHQZ
VALID
DQ0-DQ31
tPHQV
RP
AI03571
17/36
M58BF008
Table 17. Synchronous Read AC Characteristics (1)
(TA = –40 to 125°C; VDD = 5V ± 10% and VDDQ = 3.3V ± 0.3V)
Symbol
Min
Max
Unit
System Clock Duty Cycle
45
55
%
Address Valid to System Clock High
10
ns
Burst Address Advance Low to System Clock High
10
ns
tBLCH (2)
Load Burst Address Low to System Clock High
10
ns
tCHAX (2)
System Clock High to Address Transition
5
ns
tCHBH (2)
System Clock High to Load Burst Address High
5
ns
DCCLK
tAVCH (2)
tBALCH
tCHCL
Parameter
System Clock Fall Time
3
ns
tCHGDH (2)
System Clock High to Output Disable High
5
ns
tCHGH (2)
System Clock High to Output Enable High
5
ns
tCHQV (2)
System Clock High to Data Valid
t CHQX1 (2)
System Clock High to Data Transition
0
ns
t CHQX2 (2)
System Clock High to Data Transition
5
ns
tCHQZ (2)
System Clock High to Data Hi-Z
20
ns
tCLCH
System Clock Rise Time
3
ns
tCLCL
System Clock Period
25
ns
tELCH
Chip Enable Low to System Clock High
20
ns
tGDLCH (2)
Output Disable Low to System Clock High
10
ns
tGLCH (2)
Output Enable Low to System Clock High
10
ns
Reset/Power-down High to Load Burst Address Low
20
ns
Write/Read High to System Clock High
10
ns
tPHBL
tWRHCH
Note: 1. See AC Testing Measurement Conditions for timing measurements.
2. Sampled only, not 100% tested.
18/36
20
ns
M58BF008
Figure 7. Synchronous Single Read AC Waveforms
CLK
tAVCH
A0-A17
tCHAX
VALID
LBA
tBLCH
tCHBH
G
tGLCH
tCHGH
E
tELCH
DQ0-DQ31
tCHQV
tCHQZ
tCHQX1
tCHQX2
VALID
tPHBL
RP
tWRHCH
WR
AI02658
19/36
M58BF008
Figure 8. Synchronous Burst Read AC Waveforms
CLK
tAVCH
A0-A17
tCHAX
VALID
LBA
tBLCH
tCHBH
G
tGLCH
E
tELCH
tCHQV
tCHQV
tCHQX1
tCHQX2
DQ0-DQ31
VALID
tCHQX2
VALID
tPHBL
RP
tWRHCH
WR
tBALCH
BAA
AI03583
20/36
M58BF008
Table 18. Asynchronous Write AC Characteristics (1)
(TA = –40 to 125°C; VDD = 5V ± 10% and VDDQ = 3.3V ± 0.3V)
Symbol
Alt
tAVAV
tWC
Write Cycle Time
70
ns
tAVWH
tAS
Address Valid to Write Enable High
70
ns
tDVWH
tDS
Data Valid to Write Enable High
70
ns
tELWL
tCS
Chip Enable Low to Write Enable Low
0
ns
tPHWL
tPS
Reset/Power-down High to Write Enable Low
70
ns
Output Valid to VPP out of the range VPP1 or V PPH
0
ns
200
ns
tQVVPL (2)
Parameter
Min
Max
Unit
tVPHWH (2)
tVPS
VPP High to Write Enable High
tWHAX
tAH
Write Enable High to Address Transition
0
ns
tWHDX
tDH
Write Enable High to Data Transition
0
ns
tWHEH
tCH
Write Enable High to Chip Enable High
0
ns
tWHQV1 (3)
Write Enable High to Output Valid, Program
10
µs
tWHQV2 (3)
Write Enable High to Output Valid, Erase
2.1
sec
tWHWL
tWPH
Write Enable High to Write Enable Low
30
ns
tWLWH
tWP
Write Enable Low to Write Enable High
70
ns
Note: 1. See AC Testing Measurement conditions for timing measurements.
2. Sampled only, not 100% tested.
3. Time is measured to Status Register Read giving bit b7 = ’1’.
21/36
M58BF008
Figure 9. Asynchronous Write AC Waveforms
tAVAV
A0-A17
00000h
VALID
tWHAX
tAVWH
G
E
tELWL
tWHEH
tWLWH
tWHWL
W
tDVWH
DQ0-DQ31
tWHQV1,2
tWHDX
COMMAND
or DATA
COMMAND
STATUS
REGISTER
tQVVPL
tVPHWH
VPP
tPHWL
RP
WR
WRITE
WRITE
READ
AI02660
22/36
M58BF008
Table 19. Synchronous Write AC Characteristics (1)
(TA = –40 to 125°C; VDD = 5V ± 10% and VDDQ = 3.3V ± 0.3V)
Symbol
Min
Max
Unit
System Clock Duty Cycle
45
55
%
tAVCH (2)
Address Valid to System Clock High
10
ns
tBLCH (2)
Load Burst Address Low to System Clock High
10
ns
tCHAX (2)
System Clock High to Address Transition
5
ns
tCHBH (2)
System Clock High to Load Burst Address High
5
ns
DCCLK
tCHCL
Parameter
System Clock Fall Time
3
ns
t CHQV1 (3)
System Clock High to Output Valid, Program
10
µs
t CHQV2 (3)
System Clock High to Output Valid, Erase
2.1
sec
tCHQX (2)
System Clock High to Data Transition
5
ns
tCHWH (2)
System Clock High to Write/Read High
5
ns
tCHWRH (2)
System Clock High to Write Enable High
5
ns
tCLCH
System Clock Rise Time
3
ns
tCLCL
System Clock Period
25
ns
tELCH
Chip Enable Low to System Clock High
tPHCH
Reset/Power-down High to System Clock High
(2)
20
ns
200
ns
Data Valid to System Clock High
10
ns
tQVVPL (2)
Output Valid to VPP out of range VPP1 or VPPH
0
ns
tVPHCH (2)
V PP High to System Clock High
200
ns
tWLCH (2)
Write Enable Low to System Clock High
10
ns
Write/Read Low to System Clock High
10
ns
tQVCH
tWRLCH (2)
Note: 1. See AC Testing Measurement conditions for timing measurements.
2. Sampled only, not 100% tested.
3. Time is measured to Status Register Read giving bit b7 = ’1’.
23/36
M58BF008
Figure 10. Synchronous Write AC Waveforms
CLK
tAVCH
A17-A0
tCHAX
00000h
VALID
LBA
tBLCH
tCHBH
WR
tWRLCH
tCHWRH
W
tWLCH
tCHWH
tQVCH
tCHQX
DQ31-DQ0
COMMAND
tWHQV1,2
COMMAND
or DATA
STATUS
REGISTER
tPHCB
RP
tVPHCH
VPP
tELCH
E
WRITE
WRITE
READ
AI02659
24/36
M58BF008
Table 20. Reset/Power-down AC Characteristics
(TA = –40 to 125°C; VDD = 5V ± 10% and VDDQ = 3.3V ± 0.3V)
Mode
Async
Symbol
Parameter
Max
Unit
tPHEL
Reset/Power-down High to Chip Enable Low
tPHQV
Reset/Power-down High to Output Valid
tPHWL
Reset/Power-down High to Write Enable Low
70
ns
Reset/Power-down Pulse Width
100
ns
tPLPH (1)
Sync
Min
70
ns
100
tPLRH
Reset/Power-down Low to Program Erase Abort
tPHBL1
Reset/Power-down High to Load Burst Address Low
tPHBL2
Reset/Power-down High to Load Burst Address Low
22
20
ns
µs
ns
22
µs
Note: 1. The device Reset is possible but not guaranteed if tPLPH < 100ns.
A Reset will complete within 100ns if RP is Low while not in Program or Erase.
Figure 11. Reset/Power-down AC Waveforms
Reset during Read Mode
tPLPH
RP
tPHQV
tPHBL1
Reset during Program with tPLPH ≤ tPLRH
Abort
Complete
tPLRH
tPHWL
tPHEL
tPHBL1
tPLPH
RP
Reset during Program/Erase with tPLPH > tPLRH
Abort
Power
Complete Down
tPLRH
tPHWL
tPHEL
tPHBL2
tPLPH
RP
AI00624
25/36
M58BF008
Table 21. Program, Erase Times and Program/Erase Endurance Cycles
(TA = –40 to 125°C; VDD = 5V ± 10% and VDDQ = 3.3V ± 0.3V)
Parameter
Test Condition s
Min
Typ
Max
Unit
VPP = VPPH
0.14
1.4
sec
VPP = VPP1
0.18
1.8
sec
VPP = VPPH
0.21
2.1
sec
VPP = VPP1
0.33
3.3
sec
Main/Overlay Block Program Time
Main/Overlay Block Erase Time
VPP = VPPH
1,000
cycles
VPP = VPP1
10,000
cycles
Program/Erase Cycles (per Block)
Figure 12. Program Flowchart and Pseudo Code
Start
Write 40h/04h
Command
PG/OBPG instructions:
– write 40h/04h command
– write Address & Data
(memory enters read status
state after the PG instruction)
Write Address
& Data
Read Status
Register
b7 = 1
do:
– read status register
(E or G must be toggled)
NO
while b7 = 1
YES
b3 = 0
NO
VPP Invalid
Error (1)
NO
Program
Error (1)
If b3 = 1, VPP invalid error:
– error handler
YES
b4 = 0
If b4 = 1, Program error:
– error handler
YES
End
AI02663
Note: 1. If an error is found, the Status Register must be cleared (CLRS instruction) before further P/E.C. operations.
26/36
M58BF008
Figure 13. Program Suspend & Resume Flowchart and Pseudo Code
Start
Write B0h
Command
Write 70h
Command
PES instruction (note 1):
– write B0h command
(memory enters read register
state after the PES instruction)
do:
– read status register
(E or G must be toggled)
Read Status
Register
b7 = 1
NO
while b7 = 1
YES
b6 = 1
NO
YES
b4 = 1
NO
Program Complete
If b4 = 0, Program completed
(at this point the memory will
accept only the RD or PER instruction)
YES
Write FFh
Command
RD instruction:
– write FFh command
– one or more data reads
from another block
Read data from
another block
Write D0h
Command
Write FFh
Command
Program Continues
Read Data
PER instruction:
– write D0h command
to resume erasure
– if the program operation completed
then this is not necessary. The device
returns to Read Array as normal
(as if the Program/Erase suspend
was not issued).
AI02664
Note: 1. PES instruction is not allowed during OBPG operation.
27/36
M58BF008
Figure 14. Erase Flowchart and Pseudo Code
Start
Write 20h/02h
Command
EE/OBEE instructions:
– write 20h/02h command
– write Block Address
(A12-A17) & command D0h/0Dh
(memory enters read status
state after the EE instruction)
Write Block Address
& D0h Command
do:
– read status register
(E or G must be toggled)
Read Status
Register
b7 = 1
NO
while b7 = 1
YES
b3 = 0
NO
VPP Invalid
Error (1)
NO
Command
Sequence Error
NO
Erase
Error (1)
If b3 = 1, VPP invalid error:
– error handler
YES
b4, b5 = 0
If b4, b5 = 1, Command Sequence error:
– error handler
YES
b5 = 0
If b5 = 1, Erase error:
– error handler
YES
End
AI02680
Note: 1. If an error is found, the Status Register must be cleared (CLRS instruction) before further P/E.C. operations.
28/36
M58BF008
Figure 15. Erase Suspend & Resume Flowchart and Pseudo Code
Start
Write B0h
Command
Write 70h
Command
PES instruction (note 1):
– write B0h command
(memory enters read register
state after the PES instruction)
do:
– read status register
(E or G must be toggled)
Read Status
Register
b7 = 1
NO
while b7 = 1
YES
b6 = 1
NO
YES
b5 = 1
NO
Erase Complete
If b6 = 0, Erase completed
(at this point the memory wich
accept only the RD or PER instruction)
YES
Write FFh
Command
RD instruction:
– write FFh command
– one o more data reads
from another block
Read data from
another block
or Program
PG instruction:
– write 40h command
– write Address & Data
Write D0h
Command
Write FFh
Command
Program Continues
Read Data
PER instruction:
– write D0h command
to resume erasure
– if the program operation completed
then this is not necessary. The device
returns to Read Array as normal
(as if the Program/Erase suspend
was not issued).
AI02681
Note: 1. PES instruction is not allowed during OBEE operation.
29/36
M58BF008
Figure 16. Command Interface and Program Erase Controller Flowchart (a)
WAIT FOR
COMMAND
WRITE (1)
NO
90h
READ
ARRAY
YES
READ
SIGNATURE
06h
NO
YES
OBEB
TOGGLE
70h
NO
YES
READ
STATUS
30h
NO
YES
WRAPPING
TOGGLE
NO
50h
YES
CLEAR
STATUS
04h
NO
YES
PROGRAM
OB SET-UP
02h
NO
YES
YES
A
ERASE
OB SET-UP
NO
PROGRAM
OB
READY
0Dh
READ
STATUS
NO
YES
READY
ERASE
OB
NO
ERASE
COMMAND
ERROR
D
B
AI02682
Note: 1. If no command is written, the Command Interface remains in its previous valid state. Upon power-up, on exit from power-down or
if VDD falls below V LKO, the Command Interface defaults to Read Array mode.
2. P/E.C. status (Ready or Busy) is read on Status Register bit 7.
30/36
M58BF008
Figure 17. Command Interface and Program Erase Controller Flowchart (b)
A
B
C
40h
NO
YES
PROGRAM
SET UP
PROGRAM
YES
(READ STATUS)
READY
(2)
NO
B0h
NO
YES
READ
STATUS
PROGRAM
SUSPEND
YES
READY
(2)
NO
NO
PROGRAM
SUSPENDED
READ
STATUS
YES
READ
STATUS
YES
70h
NO
READ
SIGNATURE
YES
90h
NO
READ
ARRAY
NO
D0h
YES
READ
STATUS
(PROGRAM RESUME)
AI02684
Note: 2. P/E. C. status (Ready or Busy) is read on Status Register bit 7.
31/36
M58BF008
Figure 18. Command Interface and Program Erase Controller Flowchart (c)
C
B
D
20h
D0h
YES
NO
ERASE
COMMAND
ERROR
YES
ERASE
YES
NO
FFh
ERASE
SET-UP
(READ STATUS)
READY
(2)
NO
B0h
NO
YES
READ
STATUS
ERASE
SUSPEND
NO
ERASE
SUSPENDED
YES
YES
READ
STATUS
YES
READY
(2)
NO
READ
STATUS
70h
NO
READ
SIGNATURE
YES
90h
NO
PROGRAM
SET-UP
YES
c
READ
ARRAY
40h or
10h
NO
NO
D0h
YES
READ
STATUS
(ERASE RESUME)
AI02683
Note: 2. P/E. C. status (Ready or Busy) is read on Status Register bit 7.
32/36
M58BF008
Table 22. Ordering Information Scheme
Example:
M58BF008B
100 ZA
6
T
Device Type
M58
Architecture
B = Burst Mode
Operating Voltage
F = VDD = 5V ± 10%; VDDQ = 3.0V or 3.6V
Device Function
008 = 8 Mbit (256Kb x 32), Burst
Configuration
B = Synchronous Write, Burst Wrap,
Critical Word Latency = 4
Burst Word Latency = 1
Speed
100 = 100ns
Package
D = PQFP80
ZA = LBGA80: 1.0 mm pitch
Temperature Range
3 = –40 to 125 °C
Optio n
T = Tape & Reel Packing
Devices are shipped from the factory with the memory content bits erased to ’1’.
For a list of available options (Configuration, Package, etc...) or for further information on any aspect of
this device, please contact the STMicroelectronics Sales Office nearest to you.
33/36
M58BF008
Table 23. PQFP80 - 80 lead Plastic Quad Flat Pack, Package Mechanical Data
mm
inches
Symbol
Typ
Min
A
Max
Typ
Min
Max
3.40
A1
0.1339
0.25
A2
2.80
0.0098
2.55
3.05
b
0.30
c
0.1102
0.1004
0.1201
0.45
0.0118
0.0177
0.11
0.23
0.0043
0.0091
D
23.90
–
–
0.9409
–
–
D1
20.00
–
–
0.7874
–
–
e
0.80
–
–
0.0315
–
–
E
17.90
–
–
0.7047
–
–
E1
14.00
–
–
0.5512
–
–
L
0.88
0.73
1.03
0.0346
0.0287
0.0406
α
3.5 °
0°
7°
3.5 °
0°
7°
N
80
80
Nd
24
24
Ne
16
16
CP
0.250
0.0098
Figure 19. PQFP80 - 80 lead Plastic Quad Flat Pack, Package Outline
D
D1
D2
A2
e
Ne
E2 E1 E
b
N
1
Nd
A
CP
c
TQFP
Drawing is not to scale.
34/36
A1
α
L
M58BF008
Table 24. LBGA80 - 10 x 8 balls, 1mm pitch, Package Mechanical Data
mm
inch
Symbol
Typ
Min
Max
A
Typ
Min
Max
1.700
A1
0.400
0.350
A2
1.100
b
0.500
–
–
D
12.000
–
D1
9.000
–
0.0669
0.450
0.0157
0.0138
0.0177
0.0197
–
–
–
0.4724
–
–
–
0.3543
–
–
0.0433
ddd
0.150
0.0059
e
1.000
–
–
0.0394
–
–
E
10.000
–
–
0.3937
–
–
E1
7.000
–
–
0.2756
–
–
FD
1.500
–
–
0.0591
–
–
FE
1.500
–
–
0.0591
–
–
SD
0.500
–
–
0.0197
–
–
SE
0.500
–
–
0.0197
–
–
Figure 20. LBGA80 - 10 x 8 balls, 1mm pitch, Bottom View Package Outline
E
E1
FE
FD
SE
SD
D D1
ddd
e
e
b
A
A2
A1
BGA-Z05
Drawing is not to scale.
35/36
M58BF008
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in lif e support devices or systems without express written approval of STMicroelectronics.
The ST logo is registered trademark of STMicroelectronics
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36/36
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