Excelics EMP209 17.0 - 20.0 ghz power amplifier mmic Datasheet

EMP209
17.0 – 20.0 GHz Power Amplifier MMIC
UPDATED 05/08/2008
FEATURES
•
•
•
•
17.0 – 20.0 GHz Operating Frequency Range
29.0dBm Output Power at 1dB Compression
15.0 dB Typical Small Signal Gain
-40dBc OIMD3 @Each Tone Pout 19.5dBm
APPLICATIONS
•
•
Dimension: 2100um x 2650um
Thickness: 75um ± 13um
Point-to-point and point-to-multipoint radio
Military Radar Systems
Caution! ESD sensitive device.
ELECTRICAL CHARACTERISTICS (Ta = 25 °C, 50 ohm, VDD=7V, IDQ=760mA)
SYMBOL
F
P1dB
Gss
OIMD3
Input RL
Output RL
PARAMETER/TEST CONDITIONS
MIN
TYP
MAX
UNITS
20.0
GHz
Operating Frequency Range
17.0
Output Power at 1dB Gain Compression
28.0
29.0
dBm
Small Signal Gain
Output 3rd Order Intermodulation Distortion
@∆f=10MHz, Each Tone Pout 19.5dBm
12.0
15.0
dB
-40
-37
dBc
Input Return Loss
-15
-10
dB
Output Return Loss
-15
-10
dB
1072
1286
mA
7
8
Idss
Saturate Drain Current
VDD
Power Supply Voltage
VDS =3V, VGS =0V
Rth
Thermal Resistance (Au-Sn Eutectic Attach)
Tb
Operating Base Plate Temperature
858
9
-35
V
o
C/W
+85
ºC
ABSOLUTE MAXIMUM RATINGS FOR CONTINUOUS OPERATION1,2
SYMBOL
CHARACTERISTIC
VALUE
VDS
Drain to Source Voltage
8V
VGS
Gate to Source Voltage
-4 V
IDD
Drain Current
Idss
IGSF
Forward Gate Current
PIN
Input Power
TCH
Channel Temperature
150°C
TSTG
Storage Temperature
-65/150°C
PT
15mA
@ 3dB compression
Total Power Dissipation
12.6W
1. Operating the device beyond any of the above rating may result in permanent damage.
2. Bias conditions must also satisfy the following equation VDS*IDS < (TCH –THS)/RTH; where THS = ambient temperature
Specifications are subject to change without notice.
Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085
Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com
page 1 of 3
Revised May 2008
EMP209
UPDATED 05/08/2008
17.0 – 20.0 GHz Power Amplifier MMIC
Assembly Drawing
The length of RF wires should be as short as possible. Use at least two wires between RF pad and
50 ohm line and separate the wires to minimize the mutual inductance.
CHIP OUTLINE
Chip Size 2100 x 2650 microns
Chip Thickness: 75 ± 13 microns
PAD Dimensions: 100 x 100 microns
All Dimensions in Microns
Specifications are subject to change without notice.
Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085
Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com
page 2 of 3
Revised May 2008
EMP209
UPDATED 05/08/2008
17.0 – 20.0 GHz Power Amplifier MMIC
DISCLAIMER
EXCELICS SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE
TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. EXCELICS DOES NOT
ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT
DESCRIBED HEREIN.
LIFE SUPPORT POLICY
EXCELICS SEMICONDUCTOR PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS
IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF EXCELICS
SEMICONDUCTOR, INC.
AS HERE IN:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for
use provided in the labeling, can be reasonably expected to result in significant injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be
reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
Specifications are subject to change without notice.
Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085
Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com
page 3 of 3
Revised May 2008
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