ONSEMI CS8126

CS8126
5.0 V, 750 mA Low
Dropout Linear Regulator
with Delayed RESET
The CS8126 is a low dropout, high current 5.0 V linear regulator. It
is an improved replacement for the CS8156. Improvements include
higher accuracy, tighter saturation control, better supply rejection, and
enhanced RESET circuitry. Familiar PNP regulator features such as
reverse battery protection, overvoltage shutdown, thermal shutdown,
and current limit make the CS8126 suitable for use in automotive and
battery operated equipment. Additional on−chip filtering has been
included to enhance rejection of high frequency transients on all
external leads.
An active microprocessor RESET function is included on−chip with
externally programmable delay time. During power−up, or after
detection of any error in the regulated output, the RESET lead will
remain in the low state for the duration of the delay. Types of errors
include short circuit, low input voltage, overvoltage shutdown,
thermal shutdown, or others that cause the output to become
unregulated. This function is independent of the input voltage and will
function correctly with an output voltage as low as 1.0 V. Hysteresis is
included in both the reset and Delay comparators for enhanced noise
immunity. A latching discharge circuit is used to discharge the Delay
capacitor, even when triggered by a relatively short fault condition.
This circuit improves upon the commonly used SCR structure by
providing full capacitor discharge (0.2 V type).
Note: The CS8126 is lead compatible with the LM2927 and
LM2926.
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TO−220−5
T SUFFIX
CASE 314D
1
5
TO−220−5
TVA SUFFIX
CASE 314K
1
TO−220−5
THA SUFFIX
CASE 314A
1
Pin 1. VIN
2. VOUT
3. GND
4. Delay
5. RESET
5
TO−220−5
THE SUFFIX
CASE 314J
1
5
Features
•
•
•
•
•
•
D2PAK−7
DPS SUFFIX
CASE 936AB
Low Dropout Voltage (0.6 V at 0.5 A)
3.0% Output Accuracy
Active RESET
External RESET Delay for Reset
Protection Circuitry
− Reverse Battery Protection
− +60 V, −50 V Peak Transient Voltage
− Short Circuit Protection
− Internal Thermal Overload Protection
Pb−Free Packages are Available
1
7
Pin 1. VIN
2. VOUT
3. VOUT(SENSE)
4. GND
5. Delay
6. RESET
7. NC
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 9 of this data sheet.
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 9 of this data sheet.
*For additional information on our Pb−Free strategy
and soldering details, please download the
ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
February, 2006 − Rev. 16
1
Publication Order Number:
CS8126/D
CS8126
VIN
Over Voltage
Shutdown
VOUT
Regulated Supply
for Circuit Bias
Pre−Regulator
Bandgap
Reference
Error
Amp
Anti−Saturation
and
Current Limit
−
+
Internally
connected
on
TO−220−5
VOUT(SENSE)
Charge
Current
Generator
Thermal
Shutdown
Delay
Latching
Discharge
−
Q
S
R
−
+
Reset
Comparator
+
Delay
Comparator
VDischarge
+
−
GND
Figure 1. Block Diagram
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2
RESET
CS8126
MAXIMUM RATINGS*
Rating
Value
Unit
Internally Limited
−
−50, 60
V
Internally Limited
−
ESD Susceptibility (Human Body Model)
4.0
kV
Package Thermal Resistance, TO−220−5:
Junction−to−Case, RqJC
Junction−to−Ambient, RqJA
2.1
50
°C/W
°C/W
Package Thermal Resistance, D2PAK−7:
Junction−to−Case, RqJC
Junction−to−Ambient, RqJA
2.1
10−50**
°C/W
°C/W
Junction Temperature Range
−40 to +150
°C
Storage Temperature Range
−55 to +150
°C
260 peak
230 peak
°C
°C
Power Dissipation
Peak Transient Voltage (46 V Load Dump)
Output Current
Lead Temperature Soldering:
Wave Solder (through hole styles only) (Note 1)
Reflow (SMD styles only) (Note 2)
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. 10 second maximum.
2. 60 second maximum above 183°C.
*The maximum package power dissipation must be observed.
**Depending on thermal properties of substrate. RqJA = RqJC + RqCA.
ELECTRICAL CHARACTERISTICS (TA = −40°C to +125°C, TJ = −40°C to +150°C, VIN = 6.0 to 26 V,
IO = 5.0 to 500 mA, RRESET = 4.7 kW to VCC, unless otherwise noted.)
Characteristic
Test Conditions
Min
Typ
Max
Unit
−
4.85
5.00
5.15
V
Output Stage (VOUT)
Output Voltage
Dropout Voltage
IOUT1 = 500 mA
−
0.35
0.60
V
Supply Current
IOUT ≤ 10 mA
IOUT ≤ 100 mA
IOUT ≤ 500 mA
−
−
−
2.0
6.0
55
7.0
12
100
mA
mA
mA
Line Regulation
VIN = 6.0 to 26 V, IOUT = 50 mA
−
5.0
50
mV
Load Regulation
IOUT = 50 to 500 mA, VIN = 14 V
−
10
50
mV
Ripple Rejection
f = 120 Hz, VIN = 7.0 to 17 V, IOUT = 250 mA
54
75
−
dB
Current Limit
−
0.75
1.20
−
A
Overvoltage Shutdown
−
32
−
40
V
−
95
−
V
−15
−30
−
V
−
−80
−
V
150
180
210
°C
Maximum Line Transient
VOUT ≤ 5.5 V
Reverse Polarity Input Voltage DC
VOUT ≥ −0.6 V, 10 W Load
Reverse Polarity Input Voltage Transient
1.0% Duty Cycle, T < 100 ms, 10 W Load
Thermal Shutdown
Note 3
3. Guaranteed By Design
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3
CS8126
ELECTRICAL CHARACTERISTICS (continued) (TA = −40°C to +125°C, TJ = −40°C to +150°C, VIN = 6.0 to 26 V,
IO = 5.0 to 500 mA, RRESET = 4.7 kW to VCC, unless otherwise noted.)
Characteristic
Test Conditions
Min
Typ
Max
Unit
RESET and Delay Functions
Delay Charge Current
VDelay = 2.0 V
5.0
10
15
mA
RESET Threshold
VOUT Increasing, VRT(ON)
VOUT Decreasing, VRT(OFF)
4.65
4.50
4.90
4.70
VOUT − 0.01
VOUT − 0.15
V
V
RESET Hysteresis
VRH = VRT(ON) − VRT(OFF)
150
200
250
mV
Delay Threshold
Charge, VDC(HI)
Discharge, VDC(LO)
3.25
2.85
3.50
3.10
3.75
3.35
V
V
200
400
800
mV
Delay Hysteresis
−
RESET Output Voltage Low
1.0 V < VOUT < VRTL, 3.0 kW to VOUT
−
0.1
0.4
V
RESET Output Leakage Current
VOUT > VRT(ON)
−
0
10
mA
Delay Capacitor Discharge Voltage
Discharge Latched “ON”, VOUT > VRT
−
0.2
0.5
V
Delay Time
CDelay = 0.1 mF*. Note 4
16
32
48
ms
* Delay Time +
CDelay
VDelayThreshold Charge
ICharge
+ CDelay
3.2
4. Assumes Ideal Capacitor
PACKAGE LEAD DESCRIPTION
PACKAGE LEAD #
TO−220−5
D2PAK−7
LEAD SYMBOL
1
1
VIN
2
2
VOUT
Regulated 5.0 V output.
3
4
GND
Ground connection.
4
5
Delay
Timing capacitor for RESET function.
5
6
RESET
−
3
VOUT(SENSE)
−
7
NC
FUNCTION
Unregulated supply voltage to IC.
CMOS/TTL compatible output lead. RESET goes low after detection of any error in
the regulated output or during power up.
Remote sensing of output voltage.
No Connection.
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4
CS8126
TYPICAL PERFORMANCE CHARACTERISTICS
RLOAD = 25 W
Room Temp.
55
120
110
50
45
35
ICQ (mA)
ICQ (mA)
40
30
25°C
25
70
60
10
50
40
30
20
5.0
0
10
0
20
15
−40°C
0
1.0
2.0
3.0
4.0
RLOAD = 6.67
100
90
80
125°C
5.0
6.0
7.0
8.0
9.0
10
RLOAD = 10
RLOAD = 25
RLOAD = NO LOAD
0
1.0
2.0
3.0
4.0
4.5
4.0
4.0
3.5
3.5
VOUT (V)
VOUT (V)
5.0
4.5
3.0
125°C
2.5
2.0
−40°C
10
3.0
2.5
2.0
RLOAD = 10
0.5
0
25°C
2.0
9.0
RLOAD = 6.67
1.0
1.0
10
RLOAD = NO LOAD
1.5
1.0
0.5
0
9.0
Room Temp.
5.0
1.5
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10
0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
VIN (V)
VIN (V)
Figure 4. VOUT vs. VIN Over Temperature
Figure 5. VOUT vs. VIN Over RLOAD
6.0
VIN 6.0−26 V
TEMP = −40°C
4.0
40
Load Regulation (mV)
60
Line Regulation (mV)
8.0
Figure 3. ICQ vs. VIN Over RLOAD
5.5
80
7.0
Figure 2. ICQ vs. VIN Over Temperature
RLOAD = 25 W
100
6.0
VIN (V)
5.5
0
5.0
VIN (V)
TEMP = 25°C
20
TEMP = 40°C
0
−20
−40
TEMP = 125°C
2.0
0
−2.0
VIN = 14 V
−6.0
TEMP = 125°C
−8.0
−60
−10
−80
−12
−100
TEMP = 25°C
−4.0
−14
0
100
200
300
400
500
600
700
800
0
100
200
300
400
500
600
700
Output Current (mA)
Output Current (mA)
Figure 6. Line Regulation vs. Output
Current Over Temperature
Figure 7. Load Regulation vs. Output
Current Over Temperature
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5
800
CS8126
900
100
800
90
25°C
700
600
Quiescent Current (mA)
Dropout Voltage (mV)
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
125°C
500
400
300
−40°C
200
100
25°C
VIN = 14 V
70
−40°C
60
50
40
30
20
0
0
100
200
300
400
500
600
700
800
0
200
300
400
500
600
700
Output Current (mA)
Figure 8. Dropout Voltage vs. Output
Current Over Temperature
Figure 9. Quiescent Current vs. Output
Current Over Temperature
800
103
80
COUT
C
10mF,
mF,ESR = 1
OUT ==10
&
ESR
0.1=mF,
1 &ESR
0.1 =mF,
0 ESR = 0
70
102
101
ESR (W)
60
50
40
COUT = 10 mF, ESR = 1.0 W
30
COUT = 47/68 mF
100
Stable Region
10−1
COUT = 47 mF
10−2
20
COUT = 10 mF, ESR = 10 W
101
102
103
104
105
106
COUT = 68 mF
10−3
10
100
100
Output Current (mA)
90
Rejection (dB)
80
10
0
0
125°C
107
10−4
108
100
101
102
Freq. (Hz)
Output Current (mA)
Figure 10. Ripple Rejection
Figure 11. Output Capacitor ESR
103
RESET CIRCUIT WAVEFORM
VOUT
VRT(ON)
VRT(OFF)
(1) = No Delay Capacitor
(2) = With Delay Capacitor
(3) = Max:RESET Voltage (1.0 V)
VRH
(1)
RESET
(2)
(3)
VRL
tDelay
Delay
VDC(HI)
VDC(LO)
VDH
VDIS
(2)
Figure 12. RESET Circuit Waveform
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6
CS8126
CIRCUIT DESCRIPTION
voltage is above VRT(ON). Otherwise, the Delay lead sinks
current to ground (used to discharge the delay capacitor).
The discharge current is latched ON when the output voltage
falls below VRT(OFF). The Delay capacitor is fully
discharged anytime the output voltage falls out of
regulation, even for a short period of time. This feature
ensures a controlled RESET pulse is generated following
detection of an error condition. The circuit allows the
RESET output transistor to go to the OFF (open) state only
when the voltage on the Delay lead is higher than VDC(H1).
The Delay time for the RESET function is calculated from
the formula:
The CS8126 RESET function, has hysteresis on both the
Reset and Delay comparators, a latching Delay capacitor
discharge circuit, and operates down to 1.0 V.
The RESET circuit output is an open collector type with
ON and OFF parameters as specified. The RESET output
NPN transistor is controlled by the two circuits described
(see Block Diagram).
Low Voltage Inhibit Circuit
This circuit monitors output voltage, and when the output
voltage falls below VRT(OFF), causes the RESET output
transistor to be in the ON (saturation) state. When the output
voltage rises above VRT(ON), this circuit permits the RESET
output transistor to go into the OFF state if allowed by the
RESET Delay circuit.
Delay time +
CDelay
VDelayThreshold
ICharge
Delay time + CDelay
RESET Delay Circuit
VOUT
VIN
RRST
4.7 kW
CS8126
C2**
10 mF to 100 mF
RESET
Delay
Delay
0.1 mF
105
If CDelay = 0.1 mF, Delay time (ms) = 32 ms ± 50%: i.e.
16 ms to 48 ms. The tolerance of the capacitor must be taken
into account to calculate the total variation in the delay time.
This circuit provides a programmable (by external
capacitor) delay on the RESET output lead. The Delay lead
provides source current to the external delay capacitor only
when the “Low Voltage Inhibit” circuit indicates that output
C1*
100 nF
3.2
GND
* C1 is required if the regulator is far from the power source filter.
** C2 is required for stability.
Figure 13. Application Diagram
APPLICATION NOTES
Stability Considerations
temperatures (−25°C to −40°C), both the value and ESR of
the capacitor will vary considerably. The capacitor
manufacturers data sheet usually provides this information.
The value for the output capacitor C2 shown in the test and
applications circuit should work for most applications,
however it is not necessarily the optimized solution.
To determine an acceptable value for C2 for a particular
application, start with a tantalum capacitor of the
recommended value and work towards a less expensive
alternative part.
The output or compensation capacitor helps determine
three main characteristics of a linear regulator: start−up
delay, load transient response and loop stability.
The capacitor value and type should be based on cost,
availability, size and temperature constraints. A tantalum or
aluminum electrolytic capacitor is best, since a film or
ceramic capacitor with almost zero ESR, can cause
instability. The aluminum electrolytic capacitor is the least
expensive solution, but, if the circuit operates at low
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7
CS8126
Step 1: Place the completed circuit with a tantalum
capacitor of the recommended value in an environmental
chamber at the lowest specified operating temperature and
monitor the outputs with an oscilloscope. A decade box
connected in series with the capacitor will simulate the
higher ESR of an aluminum capacitor. Leave the decade box
outside the chamber, the small resistance added by the
longer leads is negligible.
Step 2: With the input voltage at its maximum value,
increase the load current slowly from zero to full load while
observing the output for any oscillations. If no oscillations
are observed, the capacitor is large enough to ensure a stable
design under steady state conditions.
Step 3: Increase the ESR of the capacitor from zero using the
decade box and vary the load current until oscillations
appear. Record the values of load current and ESR that cause
the greatest oscillation. This represents the worst case load
conditions for the regulator at low temperature.
Step 4: Maintain the worst case load conditions set in step
3 and vary the input voltage until the oscillations increase.
This point represents the worst case input voltage
conditions.
Step 5: If the capacitor is adequate, repeat steps 3 and 4 with
the next smaller valued capacitor. A smaller capacitor will
usually cost less and occupy less board space. If the output
oscillates within the range of expected operating conditions,
repeat steps 3 and 4 with the next larger standard capacitor
value.
Step 6: Test the load transient response by switching in
various loads at several frequencies to simulate its real
working environment. Vary the ESR to reduce ringing.
Step 7: Raise the temperature to the highest specified
operating temperature. Vary the load current as instructed in
step 5 to test for any oscillations.
where:
VIN(max) is the maximum input voltage,
VOUT(min) is the minimum output voltage,
IOUT(max) is the maximum output current, for the
application, and
IQ is the quiescent current the regulator consumes at
IOUT(max).
Once the value of PD(max) is known, the maximum
permissible value of RqJA can be calculated:
RQJA +
(2)
The value of RqJA can then be compared with those in the
package section of the data sheet. Those packages with
RqJA’s less than the calculated value in equation 2 will keep
the die temperature below 150°C.
In some cases, none of the packages will be sufficient to
dissipate the heat generated by the IC, and an external
heatsink will be required.
IIN
VIN
IOUT
SMART
REGULATOR®
VOUT
Control
Features
IQ
Figure 14. Single Output Regulator With Key
Performance Parameters Labeled
Heat Sinks
A heat sink effectively increases the surface area of the
package to improve the flow of heat away from the IC and
into the surrounding air.
Each material in the heat flow path between the IC and the
outside environment will have a thermal resistance. Like
series electrical resistances, these resistances are summed to
determine the value of RqJA.
Once the minimum capacitor value with the maximum
ESR is found, a safety factor should be added to allow for the
tolerance of the capacitor and any variations in regulator
performance. Most good quality aluminum electrolytic
capacitors have a tolerance of ± 20% so the minimum value
found should be increased by at least 50% to allow for this
tolerance plus the variation which will occur at low
temperatures. The ESR of the capacitor should be less than
50% of the maximum allowable ESR found in step 3 above.
RQJA + RQJC ) RQCS ) RQSA
(3)
where:
RqJC = the junction−to−case thermal resistance,
RqCS = the case−to−heatsink thermal resistance, and
RqSA = the heatsink−to−ambient thermal resistance.
RqJC appears in the package section of the data sheet. Like
RqJA, it is a function of package type. RqCS and RqSA are
functions of the package type, heatsink and the interface
between them. These values appear in heat sink data sheets
of heat sink manufacturers.
Calculating Power Dissipation in a Single Output
Linear Regulator
The maximum power dissipation for a single output
regulator (Figure 14) is:
PD(max) + NJVIN(max) * VOUT(min)NjIOUT(max) ) VIN(max)IQ
150°C * TA
PD
(1)
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8
CS8126
ORDERING INFORMATION
Package
Shipping †
CS8126−1YT5
TO−220−5 STRAIGHT
50 Units/Rail
CS8126−1YT5G
TO−220−5 STRAIGHT
(Pb−Free)
50 Units/Rail
CS8126−1YTVA5
TO−220−5 VERTICAL
50 Units/Rail
CS8126−1YTVA5G
TO−220−5 VERTICAL
(Pb−Free)
50 Units/Rail
CS8126−1YTHA5
TO−220−5 HORIZONTAL
50 Units/Rail
CS8126−1YTHA5G
TO−220−5 HORIZONTAL
(Pb−Free)
50 Units/Rail
CS8126−1YTHE5
TO−220−5 SURFACE MOUNT
50 Units/Rail
CS8126−1YTHE5G
TO−220−5 SURFACE MOUNT
(Pb−Free)
50 Units/Rail
CS8126−1YTHER5
TO−220−5 SURFACE MOUNT
750 / Tape & Reel
CS8126−1YTHER5G
TO−220−5 SURFACE MOUNT
(Pb−Free)
750 / Tape & Reel
CS8126−1YDPS7
D2PAK−7
50 Units/Rail
CS8126−1YDPS7G
D2PAK−7
50 Units/Rail
Device
(Pb−Free)
CS8126−1YDPSR7
D2PAK−7
750 / Tape & Reel
CS8126−1YDPSR7G
D2PAK−7
750 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
MARKING DIAGRAMS
TO−220−5
T SUFFIX
CASE 314D
CS
8126
AWLYWWG
TO−220−5
TVA SUFFIX
CASE 314K
TO−220−5
THA SUFFIX
CASE 314A
CS
8126
AWLYWWG
CS
8126
AWLYWWG
TO−220−5
THE SUFFIX
CASE 314J
CS
8126
AWLYWWG
D2PAK−7
DPS SUFFIX
CASE 936AB
CS
8126
AWLYWWG
1
1
1
1
A
WL, L
YY, Y
WW, W
G
1
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Device
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9
CS8126
PACKAGE DIMENSIONS
TO−220−5
T SUFFIX
CASE 314D−04
ISSUE E
−T−
−Q−
SEATING
PLANE
C
B
E
A
U
L
J
H
G
D
DIM
A
B
C
D
E
G
H
J
K
L
Q
U
1234 5
K
5 PL
0.356 (0.014)
M
T Q
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 10.92 (0.043) MAXIMUM.
M
INCHES
MIN
MAX
0.572
0.613
0.390
0.415
0.170
0.180
0.025
0.038
0.048
0.055
0.067 BSC
0.087
0.112
0.015
0.025
0.990
1.045
0.320
0.365
0.140
0.153
0.105
0.117
MILLIMETERS
MIN
MAX
14.529 15.570
9.906 10.541
4.318
4.572
0.635
0.965
1.219
1.397
1.702 BSC
2.210
2.845
0.381
0.635
25.146 26.543
8.128
9.271
3.556
3.886
2.667
2.972
TO−220−5
TVA SUFFIX
CASE 314K−01
ISSUE O
−T−
B
SEATING
PLANE
C
−Q−
E
W
A
U
DIM
A
B
C
D
E
F
G
J
K
L
M
Q
R
S
U
W
F
L
12345
K
M
G
D
5 PL
0.356 (0.014)
M
T Q
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D, INCLUDING PROTRUSION, SHALL
NOT EXCEED 10.92 (0.043) MAXIMUM.
J
S
R
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10
INCHES
MIN
MAX
0.560
0.590
0.385
0.415
0.160
0.190
0.027
0.037
0.045
0.055
0.530
0.545
0.067 BSC
0.014
0.022
0.785
0.800
0.321
0.337
0.063
0.078
0.146
0.156
0.271
0.321
0.146
0.196
0.460
0.475
5_
MILLIMETERS
MIN
MAX
14.22
14.99
9.78
10.54
4.06
4.83
0.69
0.94
1.14
1.40
13.46
13.84
1.70 BSC
0.36
0.56
19.94
20.32
8.15
8.56
1.60
1.98
3.71
3.96
6.88
8.15
3.71
4.98
11.68
12.07
5_
CS8126
PACKAGE DIMENSIONS
TO−220−5
THA SUFFIX
CASE 314A−03
ISSUE E
−T−
B
−P−
Q
C
E
OPTIONAL
CHAMFER
A
U
F
L
DIM
A
B
C
D
E
F
G
J
K
L
Q
S
U
K
G
5X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 0.043 (1.092) MAXIMUM.
SEATING
PLANE
5X
J
S
D
0.014 (0.356)
M
T P
M
INCHES
MIN
MAX
0.572
0.613
0.390
0.415
0.170
0.180
0.025
0.038
0.048
0.055
0.570
0.585
0.067 BSC
0.015
0.025
0.730
0.745
0.320
0.365
0.140
0.153
0.210
0.260
0.468
0.505
MILLIMETERS
MIN
MAX
14.529 15.570
9.906 10.541
4.318
4.572
0.635
0.965
1.219
1.397
14.478 14.859
1.702 BSC
0.381
0.635
18.542 18.923
8.128
9.271
3.556
3.886
5.334
6.604
11.888 12.827
TO−220−5
THE SUFFIX
CASE 314J−01
ISSUE O
−T−
SEATING
PLANE
C
B
−Q−
E
W
A
U
F
L
1
D
0.356 (0.014)
M
2
3
4
5
5 PL
T Q
K
J
M
G
−M−
S
0.102 (0.004)
−N−
http://onsemi.com
11
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 10.92 (0.043) MAXIMUM.
4. DIMENSIONS EXCLUSIVE OF MOLD FLASH
AND METAL BURRS.
5. FOOTPAD LENGTH MEASURED FROM LEAD
TIP WITH REFERENCE TO DATUM −M−.
6. COPLANARITY 0.004" MAX. REFERENCE TO
DATUM −N− STANDOFF HEIGHT 0.00 − 0.010".
DIM
A
B
C
D
E
F
G
J
K
L
Q
S
U
W
INCHES
MIN
MAX
0.568
0.583
0.395
0.405
0.170
0.180
0.028
0.036
0.045
0.055
0.543
0.558
0.067 BSC
0.014
0.022
0.073
0.088
0.324
0.339
0.146
0.156
0.000
0.010
0.460
0.475
5°
MILLIMETERS
MIN
MAX
14.43
14.81
10.03
10.29
4.32
4.57
0.71
0.91
1.14
1.40
13.79
14.17
1.70 BSC
0.36
0.56
1.85
2.24
8.23
8.61
3.71
3.96
0.00
0.25
11.68
12.07
5°
CS8126
PACKAGE DIMENSIONS
D2PAK−7 (SHORT LEAD)
DPS SUFFIX
CASE 936AB−01
ISSUE A
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
TERMINAL 8
A
K
U
E
S
B
DIM
A
B
C
D
E
G
H
K
L
M
N
P
R
S
U
V
V
M
H
L
P
D
G
N
R
INCHES
MIN
MAX
0.396
0.406
0.326
0.336
0.170
0.180
0.026
0.036
0.045
0.055
0.050 REF
0.539
0.579
0.055
0.066
0.000
0.010
0.100
0.110
0.017
0.023
0.058
0.078
0°
8°
0.095
0.105
0.256 REF
0.305 REF
MILLIMETERS
MIN
MAX
10.05
10.31
8.28
8.53
4.31
4.57
0.66
0.91
1.14
1.40
1.27 REF
13.69
14.71
1.40
1.68
0.00
0.25
2.54
2.79
0.43
0.58
1.47
1.98
0°
8°
2.41
2.67
6.50 REF
7.75 REF
C
SOLDERING FOOTPRINT*
9.5
0.374
2.16
0.085
1.27
0.050
3.25
0.128
CL
10.54
0.415
CL
3.8
0.150
1
0.96
0.038
8.26
0.325
SCALE 3:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SMART REGULATOR is a registered trademark of Semiconductor Components Industries, LLC (SCILLC).
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CS8126/D