ICSI IC80C58-24PQ Cmos single chip 8-bit microcontroller Datasheet

IC80C54
IC80C58
IC80C54
IC80C58
CMOS SINGLE CHIP
8-BIT MICROCONTROLLER
FEATURES
GENERAL DESCRIPTION
• 80C52 based architecture
• 16K x 8 ROM (80C54)
32K x 8 ROM (80C58)
• 256 x 8 RAM
• Three 16-bit Timer/Counters
• Full duplex serial channel
• Boolean processor
• Four 8-bit I/O ports, 32 I/O lines
• Memory addressing capability
– 64K ROM and 64K RAM
• Program memory lock
– Lock bits (2)
• Power save modes:
– Idle and power-down
• Eight interrupt sources
• Most instructions execute in 0.3 µs
• CMOS and TTL compatible
• Maximum speed: 40 MHz @ Vcc = 5V
• Packages available:
– 40-pin DIP
– 44-pin PLCC
– 44-pin PQFP
The ICSI IC80C54 and IC80C58 are high-performance
microcontroller fabricated using high-density CMOS
technology. The CMOS IC80C54/58 is functionally
compatible with the industry standard 80C52/32
microcontrollers.
The IC80C54/58 is designed with 16K x 8 ROM (IC80C54
)and 32Kx8 ROM (IC80C58); 256 x 8 RAM; 32
programmable I/O lines; a serial I/O port for either
multiprocessor communications, I/O expansion or full duplex
UART; three 16-bit timer/counters; an eight-source, twopriority-level, nested interrupt structure; and an on-chip
oscillator and clock circuit. The IC80C54/58 can be
expanded using standard TTL compatible memory.
T2/P1.0
1
40
VCC
T2EX/P1.1
2
39
P0.0/AD0
P1.2
3
38
P0.1/AD1
P1.3
4
37
P0.2/AD2
P1.4
5
36
P0.3/AD3
P1.5
6
35
P0.4/AD4
P1.6
7
34
P0.5/AD5
P1.7
8
33
P0.6/AD6
RST
9
32
P0.7/AD7
RxD/P3.0
10
31
EA
TxD/P3.1
11
30
ALE
INT0/P3.2
12
29
PSEN
INT1/P3.3
13
28
P2.7/A15
T0/P3.4
14
27
P2.6/A14
T1/P3.5
15
26
P2.5/A13
WR/P3.6
16
25
P2.4/A12
RD/P3.7
17
24
P2.3/A11
XTAL2
18
23
P2.2/A10
XTAL1
19
22
P2.1/A9
GND
20
21
P2.0/A8
Figure 1. IC80C54/58 Pin Configuration: 40-pin DIP
ICSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any errors
which may appear in this publication. © Copyright 2000, Integrated Circuit Solution Inc.
Integrated Circuit Solution Inc.
MC003-0B
1
P1.3
P1.2
P1.1/T2EX
P1.0/T2
NC
VCC
P0.0/AD0
P0.1/AD1
P0.2/AD2
P0.3/AD3
INDEX
P1.4
IC80C54
IC80C58
6
5
4
3
2
1
44
43
42
41
40
P1.5
7
39
P0.4/AD4
P1.6
8
38
P0.5/AD5
P1.7
9
37
P0.6/AD6
RST
10
36
P0.7/AD7
RxD/P3.0
11
35
EA
NC
12
34
NC
TxD/P3.1
13
33
ALE
INT0/P3.2
14
32
PSEN
INT1/P3.3
15
31
P2.7/A15
T0/P3.4
16
30
P2.6/A14
T1/P3.5
17
29
P2.5/A13
18
19
20
21
22
23
24
25
26
27
28
WR/P3.6
RD/P3.7
XTAL2
XTAL1
GND
NC
A8/P2.0
A9/P2.1
A10/P2.2
A11/P2.3
A12/P2.4
TOP VIEW
Figure 2. IC80C54/58 Pin Configuration: 44-pin PLCC
2
Integrated Circuit Solution Inc.
MC003-0B
P1.4
P1.3
P1.2
P1.1/T2EX
P1.0/T2
NC
VCC
P0.0/AD0
P0.1/AD1
P0.2/AD2
P0.3/AD3
IC80C54
IC80C58
44
43
42
41
40
39
38
37
36
35
34
P0.6/AD6
RST
4
30
P0.7/AD7
RxD/P3.0
5
29
EA
NC
6
28
NC
TxD/P3.1
7
27
ALE
INT0/P3.2
8
26
PSEN
INT1/P3.3
9
25
P2.7/A15
T0/P3.4
10
24
P2.6/A14
T1/P3.5
11
23
P2.5/A13
12
13
14
15
16
17
18
19
20
21
22
A12/P2.4
31
A11/P2.3
3
A10/P2.2
P1.7
A9/P2.1
P0.5/AD5
A8/P2.0
32
NC
2
GND
P1.6
XTAL1
P0.4/AD4
XTAL2
33
RD/P3.7
1
WR/P3.6
P1.5
Figure 3. IC80C54/58 Pin Configuration: 44-pin PQFP
Integrated Circuit Solution Inc.
MC003-0B
3
IC80C54
IC80C58
VCC
P2.0-P2.7
P0.0-P0.7
P2
DRIVERS
P0
DRIVERS
GND
ADDRESS
DECODER
& 256
BYTES RAM
RAM ADDR
REGISTER
P2
LATCH
STACK
POINT
B
REGISTER
ADDRESS
DECODER
& 16/32K
ROM
P0
LATCH
PROGRAM
ADDRESS
REGISTER
ACC
PCON SCON
T2CON TH0
TL1
TH2
RCAP2L SBUF
TMOD TCON
TL0
TH1
TL2 RCAP2H
IE
IP
2 LOCK BITS
TMP1
TMP2
INTERRUPT
SERIAL PORT
AND TIMER BLOCK
PROGRAM
COUNTER
PC
INCREMENTER
ALU
PSW
PSEN
ALE
RST
TIMING
AND
CONTROL
EA
INSTRUCTION
REGISTER
BUFFER
PD
DPTR
P3
LATCH
P1
LATCH
P3
DRIVERS
P1
DRIVERS
P3.0-P3.7
P1.0-P1.7
OSCILLATOR
XTAL1
XTAL2
Figure 4. IC80C54/58 Block Diagram
4
Integrated Circuit Solution Inc.
MC003-0B
IC80C54
IC80C58
Table 1. Detailed Pin Description
Symbol
PDIP
PLCC
PQFP
I/O
Name and Function
ALE
30
33
27
I/O
Address Latch Enable: Output pulse for latching the low byte
of the address during an access to the external memory. In
normal operation, ALE is emitted at a constant rate of 1/6 the
oscillator frequency, and can be used for external timing or
clocking. Note that one ALE pulse is skipped during each
access to external data memory.
EA
31
35
29
I
External Access enable: EA must be externally held low to
enable the device to fetch code from external program memory
locations 0000H to FFFFH. If EA is held high, the device
executes from internal program memory unless the program
counter contains an address greater than internal ROM seze.
P0.0-P0.7
39-32
43-36
37-30
I/O
Port 0: Port 0 is an 8-bit open-drain, bidirectional I/O port. Port
0 pins that have 1s written to them float and can be used as highimpedance inputs. Port 0 is also the multiplexed low-order
address and data bus during accesses to external program and
data memory. In this application, it uses strong internal pullups
when emitting 1s.
P1.0-P1.7
1-8
2-9
40-44
1-3
I/O
Port 1: Port 1 is an 8-bit bidirectional I/O port with internal
pullups. Port 1 pins that have 1s written to them are pulled high
by the internal pullups and can be used as inputs. As inputs, Port
1 pins that are externally pulled low will source current because
of the internal pullups. (See DC Characteristics: IIL). The Port 1
output buffers can sink/source four TTL inputs.
Port 1 also receives the low-order address byte during verification.
P2.0-P2.7
1
2
2
3
40
41
I
I
21-28
24-31
18-25
I/O
T2(P1.0): Timer/Counter 2 external count input.
T2EX(P1.1): Timer/Counter 2 trigger input.
Port 2: Port 2 is an 8-bit bidirectional I/O port with internal
pullups. Port 2 pins that have 1s written to them are pulled high
by the internal pullups and can be used as inputs. As inputs, Port
2 pins that are externally pulled low will source current because
of the internal pullups. (See DC Characteristics: IIL). Port 2 emits
the high order address byte during fetches from external program memory and during accesses to external data memory
that used 16-bit addresses (MOVX @ DPTR). In this application,
Port 2 uses strong internal pullups when emitting 1s. During
accesses to external data memory that use 8-bit addresses
(MOVX @ Ri [i = 0, 1]), Port 2 emits the contents of the P2
Special Function Register.
Port 2 also receives the high-order bits and some control signals
during verification.
Integrated Circuit Solution Inc.
MC003-0B
5
IC80C54
IC80C58
Table 1. Detailed Pin Description (continued)
Symbol
PDIP
PLCC
PQFP
I/O
Name and Function
P3.0-P3.7
10-17
11, 13-19
5, 7-13
I/O
Port 3: Port 3 is an 8-bit bidirectional I/O port with internal
pullups. Port 3 pins that have 1s written to them are pulled high
by the internal pullups and can be used as inputs. As inputs, Port
3 pins that are externally pulled low will source current because
of the internal pullups. (See DC Characteristics: IIL).
Port 3 also serves the special features of the IC80C54/58, as
listed below:
10
11
12
13
14
15
16
17
11
13
14
15
16
17
18
19
5
7
8
9
10
11
12
13
I
O
I
I
I
I
O
O
RxD (P3.0): Serial input port.
TxD (P3.1): Serial output port.
INT0 (P3.2): External interrupt 0.
INT1 (P3.3): External interrupt 1.
T0 (P3.4): Timer 0 external input.
T1 (P3.5): Timer 1 external input.
WR (P3.6): External data memory write strobe.
RD (P3.7): External data memory read strobe.
PSEN
29
32
26
O
Program Store Enable: The read strobe to external program
memory. When the device is executing code from the external
program memory, PSEN is activated twice each machine cycle
except that two PSEN activations are skipped during each
access to external data memory. PSEN is not activated during
fetches from internal program memory.
RST
9
10
4
I
Reset: A high on this pin for two machine cycles while the
oscillator is running, resets the device. An internal MOS resistor
to GND permits a power-on reset using only an external capacitor connected to Vcc.
XTAL 1
19
21
15
I
Crystal 1: Input to the inverting oscillator amplifier and input
to the internal clock generator circuits.
XTAL 2
18
20
14
O
Crystal 2: Output from the inverting oscillator amplifier.
GND
20
22
16
I
Ground: 0V reference.
Vcc
40
44
38
I
Power Supply: This is the power supply voltage for operation.
OPERATING DESCRIPTION
The detail description of the IC80C54/58 included in this description are:
• Memory Map and Registers
• The Timer/Counters
• The Serial Interface
• The Interrupt System
• Information
• Another information
The detail information desription of the IC80C54/58 refer to IC80C52/32 date sheet
6
Integrated Circuit Solution Inc.
MC003-0B
IC80C54
IC80C58
OTHER INFORMATION
Reset
The reset input is the RST pin, which is the input to a
Schmitt Trigger.
A reset is accomplished by holding the RST pin high for at
least two machine cycles (24 oscillator periods), while the
oscillator is running. The CPU responds by generating an
internal reset, with the timing shown in Figure 7.
The external reset signal is asynchronous to the internal
clock. The RST pin is sampled during State 5 Phase 2 of
every machine cycle. The port pins will maintain their
current activities for 19 oscillator periods after a logic 1 has
been sampled at the RST pin; that is, for 19 to 31 oscillator
periods after the external reset signal has been applied to
the RST pin.
The internal reset algorithm writes 0s to all the SFRs except
the port latches, the Stack Pointer, and SBUF. The port
latches are initialized to FFH, the Stack Pointer to 07H, and
SBUF is indeterminate. Table 9 lists the SFRs and their
reset values.
Then internal RAM is not affected by reset. On power-up
the RAM content is indeterminate.
Integrated Circuit Solution Inc.
MC003-0B
Table 2. Reset Values of the SFR's
SFR Name
PC
ACC
Reset Value
0000H
00H
B
PSW
SP
DPTR
P0-P3
IP
IE
TMOD
TCON
T2CON
TH0
TL0
TH1
TL1
TH2
TL2
RCAP2H
RCAP2L
SCON
SBUF
PCON
00H
00H
07H
0000H
FFH
XX000000B
0X000000B
00H
00H
00H
00H
00H
00H
00H
00H
00H
00H
00H
00H
Indeterminate
0XXX0000B
7
IC80C54
IC80C58
Power-on Reset
Vcc
An automatic reset can be obtained when VCC goes through
a 10 µF capacitor and GND through an 8.2K resistor,
providing the Vcc rise time does not exceed 1 msec and the
oscillator start-up time does not exceed 10 msec. This
Power-on reset circuit is shown if Figure 21. The CMOS
devices do not require the 8.2K pulldown resistor, although
its presence does no harm.
10 F
+
-
Vcc
IC80C54/58
When power is turned on, the circuit holds the RST pin high
for an amount of time that depends on the value of the
capacitor and the rate at which it charges. To ensure a good
reset, the RST pin must be high long enough to allow the
oscillator time to start-up (normally a few msec) plus two
machine cycles.
RST
8.2K Ω
GND
Note that the port pins will be in a random state until the
oscillator has start and the internal reset algorithm has
written 1s to them.
With this circuit, reducing VCC quickly to 0 causes the RST
pin voltage to momentarily fall below 0V. However, this
voltage is internally limited and will not harm the device.
Figure 6. Power-On Reset Circuit
12 OSC. PERIODS
S5 S6 S1 S2 S3 S4 S5 S6 S1 S2 S3 S4 S5 S6 S1 S2 S3 S4
RST
INTERNAL RESET SIGNAL
SAMPLE
RST
SAMPLE
RST
ALE
PSEN
P0
INST
ADDR
INST
11 OSC. PERIODS
ADDR
INST
ADDR
INST
ADDR
INST
ADDR
19 OSC. PERIODS
Figure 7. Reset Timing
8
Integrated Circuit Solution Inc.
MC003-0B
IC80C54
IC80C58
Power-Saving Modes of Operation
The IC80C54/58 has two power-reducing modes. Idle and
Power-down. The input through which backup power is
supplied during these operations is Vcc. Figure 23 shows
the internal circuitry which implements these features. In
the Idle mode (IDL = 1), the oscillator continues to run and
the Interrupt, Serial Port, and Timer blocks continue to be
clocked, but the clock signal is gated off to the CPU. In
Power-down (PD = 1), the oscillator is frozen. The Idle and
Power-down modes are activated by setting bits in Special
Function Register PCON.
XTAL 1
XTAL 2
OSC
INTERRUPT,
SERIAL PORT,
TIMER BLOCKS
CLOCK
GEN
CPU
PD
IDL
Idle Mode
An instruction that sets PCON.0 is the last instruction
executed before the Idle mode begins. In the Idle mode, the
internal clock signal is gated off to the CPU, but not to the
Interrupt, Timer, and Serial Port functions. The CPU status
is preserved in its entirety; the Stack Pointer, Program
Counter, Program Status Word, Accumulator, and all other
registers maintain their data during Idle. The port pins hold
the logical states they had at the time Idle was activated.
ALE and PSEN hold at logic high levels.
There are two ways to terminate the Idle. Activation of any
enabled interrupt will cause PCON.0 to be cleared by
hardware, terminating the Idle mode. The interrupt will be
serviced, and following RETI the next instruction to be
executed will be the one following the instruction that put
the device into Idle.
The flag bits GF0 and GF1 can be used to indicate whether
an interrupt occurred during normal operation or during an
Idle. For example, an instruction that activates Idle can also
set one or both flag bits. When Idle is terminated by an
interrupt, the interrupt service routine can examine the flag
bits.
Figure 8. Idle and Power-Down Hardware
Power-down Mode
An instruction that sets PCON.1 is the last instruction
executed before Power-down mode begins. In the Powerdown mode, the on-chip oscillator stops. With the clock
frozen, all functions are stopped, but the on-chip RAM and
Special function Registers are held. The port pins output
the values held by their respective SFRs. ALE and PSEN
output lows.
In the Power-down mode of operation, Vcc can be reduced
to as low as 2V. However, Vcc must not be reduced before
the Power-down mode is invoked, and Vcc must be restored
to its normal operating level before the Power-down mode
is terminated. The reset that terminates Power-down also
frees the oscillator. The reset should not be activated
before Vcc is restored to its normal operating level and
must be held active long enough to allow the oscillator to
restart and stabilize (normally less than 10 msec).
The only exit from Power-down is a hardware reset. Reset
redefines all the SFRs but does not change the on-chip
RAM.
The other way of terminating the Idle mode is with a
hardware reset. Since the clock oscillator is still running,
the hardware reset must be held active for only two
machine cycles (24 oscillator periods) to complete the
reset.
The signal at the RST pin clears the IDL bit directly and
asynchronously. At this time, the CPU resumes program
execution from where it left off; that is, at the instruction
following the one that invoked the Idle Mode. As shown in
Figure 22, two or three machine cycles of program execution
may take place before the internal reset algorithm takes
control. On-chip hardware inhibits access to the internal
RAM during his time, but access to the port pins is not
inhibited. To eliminate the possibility of unexpected outputs
at the port pins, the instruction following the one that
invokes Idle should not write to a port pin or to external data
RAM.
Integrated Circuit Solution Inc.
MC003-0B
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IC80C54
IC80C58
Table 3. Status of the External Pins During Idle and Power-down Modes.
Mode
Memory
ALE
PSEN
PORT 0
PORT 1
PORT 2
PORT 3
Idle
Internal
1
1
Data
Data
Data
Data
Idle
External
1
1
Float
Data
Address
Data
Power-down
Internal
0
0
Data
Data
Data
Data
Power-down
External
0
0
Float
Data
Data
Data
On-Chip Oscillators
The on-chip oscillator circuitry of the IC80C54/58 is a
single stage inverter, intended for use as a crystalcontrolled, positive reactance oscillator. In this application
the crystal is operated in its fundamental response mode
as an inductive reactance in parallel resonance with
capacitance external to the crystal (Figure 9). Examples
of how to drive the clock with external oscillator are shown
in Figure 10.
The crystal specifications and capacitance values (C1 and
C2 in Figure 9) are not critical. 20 pF to 30 pF can be used
in these positions at a 12 MHz to 24 MHz frequency with
good quality crystals. (For ranges greater than 24 MHz refer
to Figure 11.) A ceramic resonator can be used in place of
the crystal in cost-sensitive applications. When a ceramic
resonator is used, C1 and C2 are normally selected to be of
somewhat higher values. The manufacturer of the ceramic
resonator should be consulted for recommendation on the
values of these capacitors.
C2
XTAL2
C1
XTAL1
GND
Figure 9. Oscillator Connections
10
NC
EXTERNAL
OSCILLATOR
SIGNAL
XTAL2
XTAL1
GND
Figure 10. External Clock Drive Configuration
Integrated Circuit Solution Inc.
MC003-0B
IC80C54
IC80C58
XTAL2
XTAL1
R
C2
C1
Figure 11. Oscillator Connections for High Speed (> 24 MHz)
Note:
When the frequency is higher than 24 MHz, please refer to Table 4 for recommended values of C1, C2, and R.
Table 4. Recommended Value for C1, C2, R
C1
C2
R
Integrated Circuit Solution Inc.
MC003-0B
Frequency Range
3.5 MHz - 24 MHz
24 MHz - 40 MHz
20 pF-30 pF
3 pF-10 pF
20 pF-30 pF
3 pF-10 pF
Not Apply
6.2K-10K
11
IC80C54
IC80C58
ROM Verification
The address of the program menory location to be read is
applied to Port 1 and pins P2.5-P2.0 (A14 is P3.4 for
IC80C58). The other pins should be held at the “Verify”
level are indicated in Figure 12. The contents of the addressed locations exits on Port 0. External pullups are required on Rort 0 for this operation. Figure 12 shows the
setup to verify the program memory.
+ 5V
A7-A0
P1
A12-A8
P2.4-P2.0
1
RST
1
EA
1
ALE
0
PSEN
0
P2.7
0
P2.6
XTAL1
4-6 MHz
Vcc
10K x 8
P0
PGM
DATA
P2.5
A13
P3.4
P14
IC80C54 : A13 - A0
XTAL2
GND
IC80C58 : A14 - A0
Figure 12. ROM Verification
12
Integrated Circuit Solution Inc.
MC003-0B
IC80C54
IC80C58
ROM Lock System
The ICSI 80C54/58 contains two Program Memory Locking:
Security Bit 1:
When programmed, this bit two effects on masked ROM
parts:
1) External MOVC is disable, and
2) EA pin is latch on reset.
Security Bit2:
When programmed, this bit inhibits Verify User ROM.
ABSOLUTE MAXIMUM RATINGS(1)
Symbol
VTERM
TBIAS
TSTG
PT
Parameter
Terminal Voltage with Respect to GND(2)
Temperature Under Bias(3)
Storage Temperature
Power Dissipation
Value
–2.0 to +7.0
0 to +70
–65 to +125
1.5
Unit
V
°C
°C
W
Note:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause
permanent damage to the device. This is a stress rating only and functional operation
of the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
2. Minimum DC input voltage is –0.5V. During transitions, inputs may undershoot to –2.
0V for periods less than 20 ns. Maximum DC voltage on output pins is Vcc + 0.5V
which may overshoot to Vcc + 2.0V for periods less than 20 ns.
3. Operating temperature is for commercial products only defined by this specification.
OPERATING RANGE(1)
Range
Commercial
Ambient Temperature
0°C to +70°C
VCC
5V ± 10%
Oscillator Frequency
3.5 to 40 MHz
Note:
1. Operating ranges define those limits between which the functionality of the device is guaranteed.
Integrated Circuit Solution Inc.
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IC80C54
IC80C58
DC CHARACTERISTICS
(Ta=0°C to 70 °C; VCC=5V+10%; VSS=0V )
Symbol
Parameter
Test conditions
Min
Max
Unit
VIL
Input low voltage (All except EA)
–0.5
0.2Vcc – 0.1
V
VIL1
Input low voltage (EA)
–0.5
0.2Vcc – 0.3
V
VIH
Input high voltage
(All except XTAL 1, RST)
0.2Vcc + 0.9
Vcc + 0.5
V
VIH1
Input high voltage (XTAL 1)
0.7Vcc
Vcc + 0.5
V
VSCH+
RST positive schmitt-trigger
threshold voltage
0.7Vcc
Vcc + 0.5
V
VSCH–
RST negative schmitt-trigger
threshold voltage
0
0.3Vcc
V
VOL(1)
Output low voltage
Iol = 100 µA
—
0.3
V
(Ports 1, 2, 3)
IOL = 1.6 mA
—
0.45
V
IOL = 3.5 mA
—
1.0
V
Output low voltage
IOL = 200 µA
—
0.3
V
(Port 0, ALE, PSEN)
IOL = 3.2 mA
—
0.45
V
IOL = 7.0 mA
—
1.0
V
IOH = –10 µA
Vcc = 4.5V-5.5V
0.9Vcc
—
V
IOL = –25 µA
0.75Vcc
—
V
IOL = –60 µA
2.4
—
V
IOH = –80 µA
Vcc = 4.5V-5.5V
0.9Vcc
—
V
IOH = –300 µA
0.75Vcc
—
V
IOH = –800 µA
2.4
—
V
—
–50
µA
–10
+10
µA
—
–650
µA
50
300
KΩ
(1)
VOL1
VOH
VOH1
Output high voltage
(Ports 1, 2, 3, ALE, PSEN)
Output high voltage
(Port 0, ALE, PSEN)
IIL
Logical 0 input current (Ports 1, 2, 3) VIN = 0.45V
ILI
Input leakage current (Port 0)
0.45V < VIN < Vcc
ITL
Logical 1-to-0 transition current
(Ports 1, 2, 3)
VIN = 2.0V
RRST
RST pulldown resister
Note:
1. Under steady state (non-transient) conditions, IOL must be externally limited as follows:
Maximum IOL per port pin: 10 mA
Maximum IOL per 8-bit port
Port 0: 26 mA
Ports 1, 2, 3: 15 mA
Maximum total IOL for all output pins: 71 mA
If IOL exceeds the test condition, VOL may exceed the related specification.
14
Integrated Circuit Solution Inc.
MC003-0B
IC80C54
IC80C58
POWER SUPPLY CHARACTERISTICS
Symbol
Parameter
Test conditions
(1)
Icc
Min
Max
Unit
Power supply current
Vcc = 5.0V
Active mode
12 MHz
—
20
mA
16 MHz
—
26
mA
20 MHz
—
32
mA
25 MHz
—
38
mA
36 MHz
—
50
mA
40 MHz
—
62
mA
12 MHz
—
5
mA
16 MHz
—
6
mA
20 MHz
—
7.6
mA
25 MHz
—
9
mA
36 MHz
—
12
mA
40 MHz
—
15
mA
VCC = 5V
—
100
µA
Idle mode
Power-down mode
Note:
1. See Figures13,14,15, and 16 for Icc test conditiions.
Vcc
Vcc
Vcc
Icc
Icc
RST
RST
Vcc
Vcc
Vcc
Vcc
NC
XTAL2
CLOCK
SIGNAL
XTAL1
GND
P0
EA
NC
XTAL2
CLOCK
SIGNAL
XTAL1
GND
P0
EA
Figure 14. Idle Mode
Figure 13. Active Mode
Vcc
Icc
RST
Vcc
Vcc
NC
XTAL2
P0
XTAL1
GND
EA
Figure 15. Power-down Mode
Integrated Circuit Solution Inc.
MC003-0B
15
IC80C54
IC80C58
tCLCX
Vcc — 0.5V
0.45V
tCHCX
0.7Vcc
0.2Vcc — 0.1
tCHCL
tCLCH
tCLCL
Figure 16. Clock Signal Waveform for I CC Tests in Active and Idle Mode (tCLCH=t CHCL=5 ns)
EXTERNAL MEMORY CHARACTERISTICS
16
Symbol
1/tCLCL
tLHLL
tAVLL
tLLAX
tLLIV
tLLPL
tPLPH
tPLIV
tPXIX
tPXIZ
tAVIV
tPLAZ
tRLRH
tWLWH
tRLDV
tRHDX
tRHDZ
tLLDV
tAVDV
tLLWL
tAVWL
tQVWX
tWHQX
tRLAZ
Parameter
Oscillator frequency
ALE pulse width
Address valid to ALE low
Address hold after ALE low
ALE low to valid instr in
ALE low to PSEN low
PSEN pulse width
PSEN low to valid instr in
Input instr hold after PSEN
Input instr float after PSEN
Address to valid instr in
PSEN low to address float
RD pulse width
WR pulse width
RD low to valid data in
Data hold after RD
Data float after RD
ALE low to valid data in
Address to valid data in
ALE low to RD or WR low
Address to RD or WR low
Data valid to WR transition
Data hold after WR
RD low to address float
24 MHz
Clock
Min Max
—
—
68
—
26
—
31
—
—
147
31
—
110
—
—
105
0
—
—
37
—
188
—
10
230
—
230
—
—
157
0
—
—
78
—
282
—
323
105 145
146
—
26
—
31
—
—
0
tWHLH
RD or WR high to ALE high
26
57
40 MHz
Clock
Min Max
— —
35 —
10 —
15 —
— 80
15 —
60 —
— 55
0
—
— 20
— 105
— 10
130 —
130 —
— 90
0
—
— 45
— 165
— 190
55 95
80 —
10 —
15 —
—
0
Variable Oscillator
(3.5 - 40 MHz)
Min
Max
3.5
40
2tCLCL–15
—
tCLCL–15
—
tCLCL–10
—
—
4tCLCL–20
tCLCL–10
—
3tCLCL–15
—
—
3tCLCL–20
0
—
—
tCLCL–5
—
5tCLCL–20
—
10
6tCLCL–20
—
6tCLCL–20
—
—
4tCLCL–10
0
—
—
2tCLCL–5
—
7tCLCL–10
—
8tCLCL–10
3tCLCL–20
3tCLCL+20
4tCLCL–20
—
tCLCL–15
—
tCLCL–10
—
—
0
10
tCLCL–15
40
tCLCL+15
Unit
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Integrated Circuit Solution Inc.
MC003-0B
IC80C54
IC80C58
EXTERNAL MEMORY CHARACTERISTICS
Symbol
tXLXL
tQVXH
tXHQX
tXHDX
tXHDV
Parameter
Serial port clock cycle time
Output data setup to
clock rising edge
Output data hold after
clock rising edge
Input data hold after
clock rising edge
Clock rising edge to
input data valid
24 MHz
Clock
Min Max
490 510
406
—
40 MHz
Clock
Min Max
290 310
240 —
Variable Oscillator
(3.5-40 MHz)
Min
Max
12tCLCL–10
12tCLCL+10
10tCLCL–10
—
Unit
ns
ns
73
—
40
—
2tCLCL–10
—
ns
0
—
0
—
0
—
ns
—
417
—
250
—
10tCLCL
ns
Min
3.5
10
10
—
—
Max
40
—
—
10
10
Unit
MHz
ns
ns
ns
ns
Min
4
—
—
0
Max
6
40tCLCL
48tCLCL
48tCLCL
Unit
MHz
EXTERNAL CLOCK DRIVE
Symbol
1/tCLCL
tCHCX
tCLCX
tCLCH
tCHCL
Parameter
Oscillator Frequency
High time
Low time
Rise time
Fall time
ROM VERIFICATION CHARACTERISTICS
Symbol
1/tCLCL
tAVQV
tELQV
tEHQZ
Parameter
Oscillator Frequency
Address to data valid
ENABLE low to data valid
Data float after ENABLE
Integrated Circuit Solution Inc.
MC003-0B
17
IC80C54
IC80C58
TIMING WAVEFORMS
tLHLL
ALE
tLLPL
tPLPH
tPLIV
tAVLL
PSEN
tPLAZ
tLLAX
PORT 0
A7-A0
tPXIX
tPXIZ
INSTR IN
A7-A0
tLLIV
tAVIV
PORT 2
A15-A8
A15-A8
Figure 17. External Program Memory Read Cycle
ALE
tWHLH
PSEN
tLLDV
tLLWL
RD
PORT 0
tAVLL
tRLAZ
tLLAX
tRLRH
tRLDV
A7-A0 FROM RI OR DPL
tRHDZ
tRHDX
DATA IN
A7-A0 FROM PCL
INSTR IN
tAVWL
tAVDV
PORT 2
A15-A8 FROM DPH
A15-A8 FROM PCH
Figure 18. External Data Memory Read Cycle
18
Integrated Circuit Solution Inc.
MC003-0B
IC80C54
IC80C58
ALE
tWHLH
PSEN
tLLWL
WR
tWLWH
tAVLL
PORT 0
tWHQX
tQVWX
tLLAX
A7-A0 FROM RI OR DPL
DATA OUT
A7-A0 FROM PCL
INSTR IN
tAVWL
PORT 2
A15-A8 FROM DPH
A15-A8 FROM PCH
Figure 19. External Data Memory Write Cycle
INSTRUCTION
0
1
2
3
4
5
6
7
8
ALE
tXLXL
CLOCK
tXHQX
tQVXH
DATAOUT
0
1
tXHDV
DATAIN
VALID
VALID
2
tXHDX
VALID
3
4
5
6
7
SET TI
VALID
VALID
VALID
VALID
VALID
SET RI
Figure 20. Shift Register Mode Timing Waveform
Integrated Circuit Solution Inc.
MC003-0B
19
IC80C54
IC80C58
P1.0-P1.7
P2.0-P2.5[A14(P3.4)]
ADDRESS
PORT 0
DATA OUT
tAVQV
tELQV
tEHQZ
P2.7
Figure 21. ROM Verification Waveforms
tCLCX
Vcc — 0.5V
0.45V
tCHCX
0.7Vcc
0.2Vcc — 0.1
tCHCL
tCLCH
tCLCL
Figure 22. External Clock Drive Waveforms
Vcc - 0.5V
0.45V
0.2Vcc + 0.9V
0.2Vcc - 0.1V
Figure 23. AC Test Point
Note:
1. AC inputs during testing are driven at VCC – 0.5V for logic “1” and 0.45V for logic “0”.
Timing measurements are made at VIH min for logic “1” and max for logic “0”.
20
Integrated Circuit Solution Inc.
MC003-0B
IC80C54
IC80C58
ORDERING INFORMATION
Commercial Temperature: 0°C to +70°C
Speed
12 MHz
24 MHz
40 MHz
Order Part Number
IC80C54/58-12PL
IC80C54/58-12PQ
IC80C54/58-12W
IC80C54/58-24PL
IC80C54/58-24PQ
IC80C54/58-24W
IC80C54/58-40PL
IC80C54/58-40PQ
IC80C54/58-40W
Package
PLCC
PQFP
600mil DIP
PLCC
PQFP
600mil DIP
PLCC
PQFP
600mil DIP
Integrated Circuit Solution Inc.
HEADQUARTER:
NO.2, TECHNOLOGY RD. V, SCIENCE-BASED INDUSTRIAL PARK,
HSIN-CHU, TAIWAN, R.O.C.
TEL: 886-3-5780333
Fax: 886-3-5783000
BRANCH OFFICE:
7F, NO. 106, SEC. 1, HSIN-TAI 5TH ROAD,
HSICHIH TAIPEI COUNTY, TAIWAN, R.O.C.
TEL: 886-2-26962140
FAX: 886-2-26962252
http://www.icsi.com.tw
Integrated Circuit Solution Inc.
MC003-0B
21
IC80C54
IC80C58
22
Integrated Circuit Solution Inc.
MC003-0B
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