ONSEMI MC74HC164ADTR2

MC74HC164A
8-Bit Serial-Input/
Parallel-Output Shift
Register
High–Performance Silicon–Gate CMOS
http://onsemi.com
The MC74HC164A is identical in pinout to the LS164. The device
inputs are compatible with standard CMOS outputs; with pullup
resistors, they are compatible with LSTTL outputs.
The MC74HC164A is an 8–bit, serial–input to parallel–output shift
register. Two serial data inputs, A1 and A2, are provided so that one
input may be used as a data enable. Data is entered on each rising edge
of the clock. The active–low asynchronous Reset overrides the Clock
and Serial Data inputs.
•
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Output Drive Capability: 10 LSTTL Loads
Outputs Directly Interface to CMOS, NMOS, and TTL
Operating Voltage Range: 2 to 6 V
Low Input Current: 1 µA
High Noise Immunity Characteristic of CMOS Devices
In Compliance with the Requirements Defined by JEDEC Standard
No. 7A
Chip Complexity: 244 FETs or 61 Equivalent Gates
LOGIC DIAGRAM
SERIAL
DATA
INPUTS
A1
A2
3
1
4
DATA
2
5
6
10
CLOCK
RESET
QA
9
14
PDIP–14
N SUFFIX
CASE 646
QD
MC74HC164AN
AWLYYWW
1
14
SOIC–14
D SUFFIX
CASE 751A
HC164A
AWLYWW
1
14
HC
164A
ALYW
TSSOP–14
DT SUFFIX
CASE 948G
1
A
= Assembly Location
WL or L = Wafer Lot
YY or Y = Year
WW or W = Work Week
PIN ASSIGNMENT
QB
QC
QE
11
QF
12
QG
13
QH
8
MARKING
DIAGRAMS
PARALLEL
DATA
OUTPUTS
PIN 14 = VCC
PIN 7 = GND
A1
1
14
VCC
A2
2
13
QH
QA
3
12
QG
QB
4
11
QF
QC
5
10
QE
QD
6
9
RESET
GND
7
8
CLOCK
FUNCTION TABLE
Inputs
Reset Clock A1 A2 QA QB
L
H
H
H
X
ORDERING INFORMATION
Outputs
X
X
H
D
X
X
D
H
… QH
Device
L … L
No Change
D QAn … QGn
D QAn … QGn
L
March, 2000 – Rev. 1
Shipping
MC74HC164AN
PDIP–14
2000 / Box
MC74HC164AD
SOIC–14
55 / Rail
MC74HC164ADR2
D = data input
QAn – QGn = data shifted from the preceding
stage on a rising edge at the clock input.
 Semiconductor Components Industries, LLC, 2000
Package
1
SOIC–14
2500 / Reel
MC74HC164ADT
TSSOP–14
96 / Rail
MC74HC164ADTR2
TSSOP–14
2500 / Reel
Publication Order Number:
MC74HC164A/D
MC74HC164A
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MAXIMUM RATINGS*
Symbol
VCC
Parameter
DC Supply Voltage (Referenced to GND)
Value
Unit
– 0.5 to + 7.0
V
Vin
DC Input Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
Vout
DC Output Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
DC Input Current, per Pin
± 20
mA
Iout
DC Output Current, per Pin
± 25
mA
ICC
DC Supply Current, VCC and GND Pins
± 50
mA
PD
Power Dissipation in Still Air,
750
500
450
mW
Tstg
Storage Temperature
– 65 to + 150
_C
Iin
TL
Plastic DIP†
SOIC Package†
TSSOP Package†
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high–impedance circuit. For proper operation, Vin and
Vout should be constrained to the
range GND (Vin or Vout) VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
v
v
_C
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP, SOIC or TSSOP Package)
260
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C
SOIC Package: – 7 mW/_C from 65_ to 125_C
TSSOP Package: – 6.1 mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book (DL129/D).
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RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Vin, Vout
Parameter
Min
Max
Unit
2.0
6.0
V
0
VCC
V
– 55
+ 125
_C
0
0
0
1000
500
400
ns
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage (Referenced to GND)
TA
Operating Temperature, All Package Types
tr, tf
Input Rise and Fall Time
(Figure 1)
VCC = 2.0 V
VCC = 4.5 V
VCC = 6.0 V
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
Symbol
Parameter
Test Conditions
VCC
V
–55_C to
25_C
85_C
125_C
Unit
VIH
Minimum High–Level Input
Voltage
Vout = 0.1 V or VCC – 0.1 V
|Iout|
20 µA
2.0
3.0
4.5
6.0
1.5
2.1
3.15
4.2
1.5
2.1
3.15
4.2
1.5
2.1
3.15
4.2
V
VIL
Maximum Low–Level Input
Voltage
Vout = 0.1 V or VCC – 0.1 V
|Iout|
20 µA
2.0
3.0
4.5
6.0
0.5
0.9
1.35
1.8
0.5
0.9
1.35
1.8
0.5
0.9
1.35
1.8
V
Minimum High–Level Output
Voltage
Vin = VIH or VIL
|Iout|
20 µA
2.0
4.5
6.0
1.9
4.4
5.9
1.9
4.4
5.9
1.9
4.4
5.9
V
3.0
4.5
6.0
2.48
3.98
5.48
2.34
3.84
5.34
2.20
3.70
5.20
VOH
Vin = VIH or VIL |Iout|
|Iout|
|Iout|
2.4 mA
4.0 mA
5.2 mA
http://onsemi.com
2
MC74HC164A
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DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
Symbol
VOL
Parameter
Test Conditions
Maximum Low–Level Output
Voltage
Vin = VIH or VIL
|Iout|
20 µA
Vin = VIH or VIL |Iout|
|Iout|
|Iout|
Iin
ICC
2.4 mA
4.0 mA
5.2 mA
VCC
V
–55_C to
25_C
2.0
4.5
6.0
85_C
125_C
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
3.0
4.5
6.0
0.26
0.26
0.26
0.33
0.33
0.33
0.40
0.40
0.40
Unit
V
Maximum Input Leakage
Current
Vin = VCC or GND
6.0
± 0.1
± 1.0
± 1.0
µA
Maximum Quiescent Supply
Current (per Package)
Vin = VCC or GND
Iout = 0 µA
6.0
4
40
160
µA
NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book
(DL129/D).
AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns)
Guaranteed Limit
Symbol
Parameter
VCC
V
–55_C to
25_C
85_C
125_C
Unit
fmax
Maximum Clock Frequency (50% Duty Cycle)
(Figures 1 and 4)
2.0
3.0
4.5
6.0
10
20
40
50
10
20
35
45
10
20
30
40
MHz
tPLH,
tPHL
Maximum Propagation Delay, Clock to Q
(Figures 1 and 4)
2.0
3.0
4.5
6.0
160
100
32
27
200
150
40
34
250
200
48
42
ns
tPHL
Maximum Propagation Delay, Reset to Q
(Figures 2 and 4)
2.0
3.0
4.5
6.0
175
100
35
30
220
150
44
37
260
200
53
45
ns
tTLH,
tTHL
Maximum Output Transition Time, Any Output
(Figures 1 and 4)
2.0
3.0
4.5
6.0
75
27
15
13
95
32
19
16
110
36
22
19
ns
Maximum Input Capacitance
—
10
10
10
pF
Cin
NOTES:
1. For propagation delays with loads other than 50 pF, see Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book (DL129/D).
2. Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book (DL129/D).
Typical @ 25°C, VCC = 5.0 V
CPD
Power Dissipation Capacitance (Per Package)*
180
pF
* Used to determine the no–load dynamic power consumption: P D = C PD V CC 2 f + I CC V CC . For load considerations, see Chapter 2 of the
ON Semiconductor High–Speed CMOS Data Book (DL129/D).
http://onsemi.com
3
MC74HC164A
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TIMING REQUIREMENTS (Input tr = tf = 6 ns)
Guaranteed Limit
Symbol
Parameter
VCC
V
–55_C to
25_C
85_C
125_C
Unit
tsu
Minimum Setup Time, A1 or A2 to Clock
(Figure 3)
2.0
3.0
4.5
6.0
25
15
7
5
35
20
8
6
40
25
9
6
ns
th
Minimum Hold Time, Clock to A1 or A2
(Figure 3)
2.0
3.0
4.5
6.0
3
3
3
3
3
3
3
3
3
3
3
3
ns
Minimum Recovery Time, Reset Inactive to Clock
(Figure 2)
2.0
3.0
4.5
6.0
3
3
3
3
3
3
3
3
3
3
3
3
ns
tw
Minimum Pulse Width, Clock
(Figure 1)
2.0
3.0
4.5
6.0
50
26
12
10
60
35
15
12
75
45
20
15
ns
tw
Minimum Pulse Width, Reset
(Figure 2)
2.0
3.0
4.5
6.0
50
26
12
10
60
35
15
12
75
45
20
15
ns
Maximum Input Rise and Fall Times
(Figure 1)
2.0
3.0
4.5
6.0
1000
800
500
400
1000
800
500
400
1000
800
500
400
ns
trec
tr, tf
NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book
(DL129/D).
http://onsemi.com
4
MC74HC164A
PIN DESCRIPTIONS
INPUTS
register is completely static, allowing clock rates down to
DC in a continuous or intermittent mode.
A1, A2 (Pins 1, 2)
Serial Data Inputs. Data at these inputs determine the data
to be entered into the first stage of the shift register. For a
high level to be entered into the shift register, both A1 and
A2 inputs must be high, thereby allowing one input to be
used as a data–enable input. When only one serial input is
used, the other must be connected to VCC.
OUTPUTS
Clock (Pin 8)
Reset (Pin 9)
Shift Register Clock. A positive–going transition on this
pin shifts the data at each stage to the next stage. The shift
Active–Low, Asynchronous Reset Input. A low voltage
applied to this input resets all internal flip–flops and sets
Outputs QA – QH to the low level state.
QA – QH (Pins 3, 4, 5, 6, 10, 11, 12, 13)
Parallel Shift Register Outputs. The shifted data is
presented at these outputs in true, or noninverted, form.
CONTROL INPUT
SWITCHING WAVEFORMS
tr
tw
tf
VCC
90%
50%
10%
CLOCK
50%
GND
GND
tPHL
tw
1/fmax
tPLH
Q
VCC
RESET
Q
50%
tPHL
90%
50%
10%
trec
VCC
CLOCK
tTLH
50%
GND
tTHL
Figure 2.
Figure 1.
TEST POINT
OUTPUT
VALID
VCC
A1 OR A2
DEVICE
UNDER
TEST
50%
GND
tsu
CL*
th
VCC
CLOCK
50%
GND
*Includes all probe and jig capacitance
Figure 3.
Figure 4. Test Circuit
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5
MC74HC164A
EXPANDED LOGIC DIAGRAM
CLOCK
A1
8
1
2
D
D
Q
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
A2
R
R
RESET
R
R
R
R
R
R
9
3
QA
4
5
QB
6
QC
QD
TIMING DIAGRAM
CLOCK
A1
A2
RESET
QA
QB
QC
QD
QE
QF
QG
QH
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6
10
QE
11
QF
12
QG
13
QH
MC74HC164A
PACKAGE DIMENSIONS
PDIP–14
N SUFFIX
CASE 646–06
ISSUE L
14
8
1
7
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
B
A
F
DIM
A
B
C
D
F
G
H
J
K
L
M
N
L
C
J
N
H
G
D
SEATING
PLANE
K
M
INCHES
MIN
MAX
0.715
0.770
0.240
0.260
0.145
0.185
0.015
0.021
0.040
0.070
0.100 BSC
0.052
0.095
0.008
0.015
0.115
0.135
0.300 BSC
0_
10_
0.015
0.039
MILLIMETERS
MIN
MAX
18.16
19.56
6.10
6.60
3.69
4.69
0.38
0.53
1.02
1.78
2.54 BSC
1.32
2.41
0.20
0.38
2.92
3.43
7.62 BSC
0_
10_
0.39
1.01
SOIC–14
D SUFFIX
CASE 751A–03
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
–A–
14
8
–B–
1
P 7 PL
0.25 (0.010)
7
G
B
M
M
R X 45 _
C
F
–T–
SEATING
PLANE
D 14 PL
0.25 (0.010)
M
K
M
T B
S
A
S
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7
J
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
8.55
8.75
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.337
0.344
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.228
0.244
0.010
0.019
MC74HC164A
PACKAGE DIMENSIONS
TSSOP–14
DT SUFFIX
CASE 948G–01
ISSUE O
14X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
S
S
N
2X
14
L/2
0.25 (0.010)
8
M
B
–U–
L
PIN 1
IDENT.
F
7
1
0.15 (0.006) T U
N
S
DETAIL E
K
ÉÉ
ÇÇ
ÇÇ
ÉÉ
A
–V–
K1
J J1
SECTION N–N
–W–
C
0.10 (0.004)
–T– SEATING
PLANE
D
G
H
DETAIL E
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
–––
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.50
0.60
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.193
0.200
0.169
0.177
–––
0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.020
0.024
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
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MC74HC164A/D