ONSEMI NLSV8T244DWR2G

NLSV8T244
8-Bit Dual-Supply NonInverting Level Translator
The NLSV8T244 is a 8−bit configurable dual−supply voltage level
translator. The input An and output Bn ports are designed to track two
different power supply rails, VCCA and VCCB respectively. Both
supply rails are configurable from 0.9 V to 4.5 V allowing universal
low−voltage translation from the input An to the output Bn port.
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MARKING
DIAGRAMS
Features
•
•
•
•
•
•
•
•
•
Wide VCCA and VCCB Operating Range: 0.9 V to 4.5 V
High−Speed w/ Balanced Propagation Delay
Inputs and Outputs have OVT Protection to 4.5 V
Non−preferential VCCA and VCCB Sequencing
Outputs at 3−State until Active VCC is Reached
Power−Off Protection
Outputs Switch to 3−State with VCCB at GND
Ultra−Small Packaging: 4.0 mm x 2.0 mm UDFN20
This is a Pb−Free Device
UQFN20
MU SUFFIX
CASE 517AK
LCM
G
LC = Specific Device Code
M = Date Code
G
= Pb−Free Package
20
SOIC−20
DW SUFFIX
CASE 751D
Typical Applications
NLSV8T244
AWLYYWWG
1
• Mobile Phones, PDAs, Other Portable Devices
A
WL
YY
WW
G
Important Information
• ESD Protection for All Pins:
HBM (Human Body Model) > 6000 V
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
TSSOP−20
DT SUFFIX
CASE 948E
A
L
Y
W
G
SV8T
244
ALYWG
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
© Semiconductor Components Industries, LLC, 2009
June, 2009 − Rev. 1
1
Publication Order Number:
NLSV8T244/D
NLSV8T244
VCCA
VCCB
OE
A1
B1
A2
B2
A3
B3
A4
B4
A5
B5
A6
B6
A7
B7
A8
B8
VCCA
1
20
VCCB
A1
2
19
B1
A2
3
18
B2
A3
4
17
B3
A4
5
16
B4
A5
6
15
B5
A6
7
14
B6
A7
8
13
B7
A8
9
12
B8
GND
10
11
OE
(Top View)
Figure 1. Logic Diagram
Figure 2. Pin Assignment
TRUTH TABLE
PIN ASSIGNMENT
Inputs
Outputs
PIN
FUNCTION
OE
An
Bn
VCCA
Input Port DC Power Supply
L
L
L
VCCB
Output Port DC Power Supply
L
H
H
GND
Ground
H
X
3−State
An
Input Port
Bn
Output Port
OE
Output Enable
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2
NLSV8T244
MAXIMUM RATINGS
Symbol
VCCA, VCCB
VI
VC
VO
Rating
Value
DC Supply Voltage
Condition
Unit
−0.5 to +5.5
V
An
−0.5 to +5.5
V
OE
−0.5 to +5.5
V
(Power Down)
Bn
−0.5 to +5.5
(Active Mode)
Bn
−0.5 to +5.5
V
(Tri−State Mode)
Bn
−0.5 to +5.5
V
DC Input Voltage
Control Input
DC Output Voltage
VCCA = VCCB = 0
V
IIK
DC Input Diode Current
−20
VI < GND
mA
IOK
DC Output Diode Current
−50
VO < GND
mA
IO
DC Output Source/Sink Current
±50
mA
ICCA, ICCB
DC Supply Current Per Supply Pin
±100
mA
IGND
DC Ground Current per Ground Pin
±100
mA
TSTG
Storage Temperature
−65 to +150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
RECOMMENDED OPERATING CONDITIONS
Symbol
VCCA, VCCB
Parameter
Bus Input Voltage
VC
Control Input
VIO
Bus Output Voltage
Dt / DV
Max
Unit
0.9
4.5
V
GND
4.5
V
OE
GND
4.5
V
Bn
GND
4.5
V
(Active Mode)
Bn
GND
VCCB
V
(Tri−State Mode)
Bn
GND
4.5
V
−40
+85
°C
0
10
nS
Positive DC Supply Voltage
VI
TA
Min
(Power Down Mode)
Operating Temperature Range
Input Transition Rise or Rate
VI, from 30% to 70% of VCC; VCC = 3.3 V ±0.3 V
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3
NLSV8T244
DC ELECTRICAL CHARACTERISTICS
−405C to +855C
Symbol
VIH
VIL
VOH
Parameter
Test Conditions
Input HIGH Voltage
(An, OE)
Input LOW Voltage
(An, OE)
Output HIGH Voltage
Min
Max
Unit
3.6 – 4.5
0.9 – 4.5
V
2.2
−
2.7 – 3.6
2.0
−
2.3 – 2.7
1.6
−
1.4 − 2.3
0.65 * VCCA
−
0.9 – 1.4
0.9 * VCCA
−
0.9 – 4.5
−
0.8
2.7 – 3.6
−
0.8
2.3 – 2.7
−
0.7
1.4 − 2.3
−
0.35 * VCCA
0.9 – 1.4
−
0.1 * VCCA
IOH = −100 mA; VI = VIH
0.9 – 4.5
0.9 – 4.5
VCCB – 0.2
−
IOH = −0.5 mA; VI = VIH
0.9
0.9
0.75 * VCCB
−
IOH = −2 mA; VI = VIH
1.4
1.4
1.05
−
IOH = −6 mA; VI = VIH
1.65
1.65
1.25
−
2.3
2.3
2.0
−
2.3
2.3
1.8
−
2.7
2.7
2.2
−
2.3
2.3
1.7
−
IOH = −18 mA; VI = VIH
Output LOW Voltage
VCCB (V)
3.6 – 4.5
IOH = −12 mA; VI = VIH
VOL
VCCA (V)
3.0
3.0
2.4
−
IOH = −24 mA; VI = VIH
3.0
3.0
2.2
−
IOL = 100 mA; VI = VIL
0.9 – 4.5
0.9 – 4.5
−
0.2
IOL = 0.5 mA; VI = VIH
1.1
1.1
−
0.3
IOL = 2 mA; VI = VIH
1.4
1.4
−
0.35
IOL = 6 mA; VI = VIL
1.65
1.65
−
0.3
IOL = 12 mA; VI = VIL
2.3
2.3
−
0.4
2.7
2.7
−
0.4
2.3
2.3
−
0.6
3.0
3.0
−
0.45
IOL = 18 mA; VI = VIL
IOL = 24 mA; VI = VIL
V
V
V
3.0
3.0
−
0.6
Input Leakage Current
VI = VCCA or GND
0.9 – 4.5
0.9 – 4.5
−1.0
1.0
mA
IOFF
Power−Off Leakage Current
OE = 0 V
0
0.9 – 4.5
0.9 – 4.5
0
−1.0
−1.0
1.0
1.0
mA
ICCA
Quiescent Supply Current
VI = VCCA or GND;
IO = 0, VCCA = VCCB
0.9 – 4.5
0.9 − 4.5
−
2.0
mA
ICCB
Quiescent Supply Current
VI = VCCA or GND;
IO = 0, VCCA = VCCB
0.9 – 4.5
0.9 − 4.5
−
2.0
mA
ICCA + ICCB Quiescent Supply Current
VI = VCCA or GND;
IO = 0, VCCA = VCCB
0.9 – 4.5
0.9 – 4.5
−
4.0
mA
II
DICCA
Increase in ICC per Input Voltage,
Other Inputs at VCCA or GND
VI = VCCA – 0.6 V;
VI = VCCA or GND
4.5
3.6
4.5
3.6
−
10
5.0
mA
DICCB
Increase in ICC per Input Voltage,
Other Inputs at VCCA or GND
VI = VCCA – 0.6 V;
VI = VCCA or GND
4.5
3.6
4.5
3.6
−
10
5.0
mA
I/O Tri−State Output Leakage
Current
TA = 25°C, OE = 0 V
0.9 – 4.5
0.9 – 4.5
−1.0
1.0
mA
IOZ
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4
NLSV8T244
TOTAL STATIC POWER CONSUMPTION (ICCA + ICCB)
−405C to +855C
VCCB (V)
4.5
VCCA (V)
Min
3.3
Max
Min
2.8
Max
Min
1.8
Max
Min
0.9
Max
Min
Max
Unit
4.5
2
2
2
2
< 1.5
μA
3.3
2
2
2
2
< 1.5
μA
2.8
<2
<1
<1
< 0.5
< 0.5
μA
1.8
<1
<1
< 0.5
< 0.5
< 0.5
μA
0.9
< 0.5
< 0.5
< 0.5
< 0.5
< 0.5
μA
NOTE: Connect ground before applying supply voltage VCCA or VCCB. This device is designed with the feature that the power−up sequence
of VCCA and VCCB will not damage the IC.
AC ELECTRICAL CHARACTERISTICS
−405C to +855C
VCCB (V)
4.5
Symbol
tPLH,
tPHL
(Note 1)
tPZH,
tPZL
(Note 1)
tPHZ,
tPLZ
(Note 1)
tOSHL,
tOSLH
(Note 1)
Min
3.3
Max
Min
2.8
Max
Min
1.8
Max
Max
Unit
2.1
2.3
nS
2.3
2.6
2.3
2.5
2.8
2.4
2.5
2.7
3.0
2.4
2.7
2.8
3.0
3.3
4.5
2.6
3.8
4.0
4.1
4.3
3.3
3.7
3.9
4.1
4.3
4.6
2.5
3.9
4.1
4.3
4.5
4.8
1.8
4.1
4.4
4.5
4.7
5.0
1.2
4.4
4.7
4.8
5.0
5.3
4.5
2.6
3.8
4.0
4.1
4.3
3.3
3.7
3.9
4.1
4.3
4.6
2.5
3.9
4.1
4.3
4.5
4.8
1.8
4.1
4.4
4.5
4.7
5.0
1.2
4.4
4.7
4.8
5.0
5.3
4.5
0.15
0.15
0.15
0.15
0.15
3.3
0.15
0.15
0.15
0.15
0.15
2.5
0.15
0.15
0.15
0.15
0.15
1.8
0.15
0.15
0.15
0.15
0.15
1.2
0.15
0.15
0.15
0.15
0.15
Parameter
VCCA (V)
Propagation
Delay,
4.5
1.6
1.8
2.0
3.3
1.7
1.9
2.1
An to Bn
2.8
1.9
2.1
1.8
2.1
1.2
Output
Enable,
OE to Bn
Output
Disable,
OE to Bn
Output to
Output
Skew,
Time
Min
1.2
Max
Min
nS
nS
nS
1. Propagation delays defined per Figure 3.
CAPACITANCE
Symbol
Parameter
Test Conditions
Typ (Note 2)
Unit
CIN
Control Pin Input Capacitance
VCCA = VCCB = 3.3 V, VI = 0 V or VCCA/B
3.5
pF
CI/O
I/O Pin Input Capacitance
VCCA = VCCB = 3.3 V, VI = 0 V or VCCA/B
5.0
pF
CPD
Power Dissipation Capacitance
VCCA = VCCB = 3.3 V, VI = 0 V or VCCA, f = 10 MHz
20
pF
2. Typical values are at TA = +25°C.
3. CPD is defined as the value of the IC’s equivalent capacitance from which the operating current can be calculated from:
ICC(operating) ^ CPD x VCC x fIN x NSW where ICC = ICCA + ICCB and NSW = total number of outputs switching.
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5
NLSV8T244
VCC
Pulse
Generator
RL
DUT
CL
VCCO x 2
OPEN
GND
RL
Figure 3. AC (Propagation Delay) Test Circuit
Test
Switch
tPLH, tPHL
OPEN
tPLZ, tPZL
VCCO x 2
tPHZ, tPZH
GND
CL = 15 pF or equivalent (includes probe and jig capacitance)
RL = 2 kW or equivalent
ZOUT of pulse generator = 50 W
VIH
Input (An)
Vm
Vm
tPHL
tPLH
Output (Bn)
Vm
0V
VOH
Vm
VOL
Waveform 1 − Propagation Delays
tR = tF = 2.0 ns, 10% to 90%; f = 1 MHz; tW = 500 ns
VIH
OEn
Vm
Vm
tPZH
0V
tPHZ
Output (Bn)
VOH
VY
Vm
≈0V
tPZL
tPLZ
≈ VCC
Vm
Output (Bn)
VX
VOL
Waveform 2 − Output Enable and Disable Times
tR = tF = 2.0 ns, 10% to 90%; f = 1 MHz; tW = 500 ns
Figure 4. AC (Propagation Delay) Test Circuit Waveforms
VCC
Symbol
3.0 V – 4.5 V
2.3 V − 2.7 V
1.65 V − 1.95 V
1.4 V − 1.6 V
0.9 V − 1.3 V
VmA
VCCA/2
VCCA/2
VCCA/2
VCCA/2
VCCA/2
VmB
VCCB/2
VCCB/2
VCCB/2
VCCB/2
VCCB/2
VX
VOL x 0.1
VOL x 0.1
VOL x 0.1
VOL x 0.1
VOL x 0.1
VY
VOH x 0.9
VOH x 0.9
VOH x 0.9
VOH x 0.9
VOH x 0.9
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6
NLSV8T244
ORDERING INFORMATION
Package
Shipping†
NLSV8T244MUTAG
UQFN20
(Pb−Free)
3000 / Tape & Reel
NLSV8T244DTR2G
TSSOP−20
(Pb−Free)
2500 / Tape & Reel
NLSV8T244DWR2G
SOIC−20
(Pb−Free)
1000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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7
NLSV8T244
PACKAGE DIMENSIONS
UDFN20 4x2, 0.4P
CASE 517AK−01
ISSUE O
A B
D
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL TIP.
4. MOLD FLASH ALLOWED ON TERMINALS
ALONG EDGE OF PACKAGE. FLASH MAY
NOT EXCEED 0.03 ONTO BOTTOM
SURFACE OF TERMINALS.
5. DETAIL A SHOWS OPTIONAL
CONSTRUCTION FOR TERMINALS.
L1
0.15 C
E
PIN 1
REFERENCE
DETAIL A
NOTE 5
2X
0.15 C
TOP VIEW
(A3)
0.10 C
DIM
A
A1
A3
b
D
E
e
L
L1
L2
A
20X
0.08 C
SIDE VIEW
A1
DETAIL A
1
C
19X
SEATING
PLANE
L
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.15
0.25
4.00 BSC
2.00 BSC
0.40 BSC
0.50
0.60
0.00
0.03
0.60
0.70
10
MOUNTING FOOTPRINT
SOLDERMASK DEFINED
(L2)
19X
20X
20
e
e/2
BOTTOM VIEW
0.78
0.22
11
20X
b
0.10
M
C A B
0.05
M
C
2.30
NOTE 3
0.88
1
0.40 PITCH
DIMENSIONS: MILLIMETERS
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8
NLSV8T244
PACKAGE DIMENSIONS
TSSOP−20
CASE 948E−02
ISSUE C
20X
0.15 (0.006) T U
2X
L
K REF
0.10 (0.004)
S
L/2
20
M
T U
S
V
ÍÍÍ
ÍÍÍ
ÍÍÍ
K
K1
S
J J1
11
B
SECTION N−N
−U−
PIN 1
IDENT
0.25 (0.010)
N
1
10
M
0.15 (0.006) T U
S
A
−V−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
N
F
DETAIL E
−W−
C
G
D
H
DETAIL E
0.100 (0.004)
−T− SEATING
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
PLANE
SOLDERING FOOTPRINT
7.06
1
0.65
PITCH
16X
0.36
16X
1.26
DIMENSIONS: MILLIMETERS
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9
MILLIMETERS
MIN
MAX
6.40
6.60
4.30
4.50
--1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.27
0.37
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.252
0.260
0.169
0.177
--0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.011
0.015
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
NLSV8T244
PACKAGE DIMENSIONS
SOIC−20 WB
CASE 751D−05
ISSUE G
A
20
q
X 45 _
E
h
H
M
10X
0.25
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
11
B
M
D
1
10
20X
B
B
0.25
M
T A
S
B
S
L
A
18X
e
A1
SEATING
PLANE
C
T
DIM
A
A1
B
C
D
E
e
H
h
L
q
MILLIMETERS
MIN
MAX
2.35
2.65
0.10
0.25
0.35
0.49
0.23
0.32
12.65
12.95
7.40
7.60
1.27 BSC
10.05
10.55
0.25
0.75
0.50
0.90
0_
7_
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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NLSV8T244/D