TI CY29FCT818CTSOCT Diagnostic scan register Datasheet

Data sheet acquired from Cypress Semiconductor Corporation.
Data sheet modified to remove devices not offered.
CY29FCT818T
Diagnostic Scan Register
SCCS012 - May 1994 - Revised February 2000
Features
ter is designed for applications, such as diagnostics in sequential circuits, where it is desirable to load known data at a specific location in the circuit and to read the data at that location.
• Function, pinout and drive compatible with FCT, F Logic
and AM29818
• FCT-C speed at 6.0 ns max. (Com’l),
FCT-A speed at 12.0 ns max. (Mil)
• Reduced VOH (typically = 3.3V) versions of equivalent
FCT functions
• Edge-rate control circuitry for significantly improved
noise characteristics
• Power-off disable feature
• Matched rise and fall times
• Fully compatible with TTL input and output logic levels
• Sink current
64 mA (Com’l),
20 mA (Mil)
Source current 32 mA (Com’l),
3 mA (Mil)
• 8-Bit pipeline and shadow register
• ESD > 2000V
The shadow registers can load data from the output of the
FCT818T, and can be used as a right-shift register with
bit-serial input SDI and output SDO, using DCLK. The data
register input is multiplexed to enable loading from the shadow
register or from the data input pins using PCLK. Note that data
can be loaded simultaneously from the shadow register to the
pipeline register, and from the pipeline register to the shadow
register provided set-up and hold time requirements are
satisfied with respect to the two independent clock inputs.
In a typical application, the general-purpose register in the
FCT818T replaces an 8-bit data register in the normal data
path of a system. The shadow register is placed in an auxiliary
bit-serial loop which is used for diagnostics. During diagnostic
operation, data is shifted serially into the shadow register, then
transferred to the general purpose register to load a known
value into the data path. To read the contents at that point in
the data path, the data is transferred from the data register into
the shadow register, then shifted serially in the auxiliary
diagnostic loop to make it accessible to the diagnostics
controller. This data is then compared with the expected value
to diagnose faulty operation of the sequential circuit.
Functional Description
The FCT818T contains a high-speed 8-bit general-purpose
data pipeline register and a high-speed 8-bit shadow register.
The general-purpose register can be used in an 8-bit wide
data path for a normal system application. The shadow regis-
Logic Block Diagram
The outputs are designed with a power-off disable feature to
allow for live insertion of boards.
Pin Configurations
DIP, SOIC, QSOP
Top View
D6
D5
D4
NC
D3
D2
D1
LCC
Top View
D0−D 7
SDI
8-BIT
SHADOW
REGISTER
DCLK
CLK
11 10 9 8 7 6 5
SDO
S0−S 7
8
D
Q
D7
SDI
GND
NC
PCLK
SDO
Y7
12
13
14
15
16
17
18
8
PCLK
Y4
NC
Y3
Y2
Y1
MUX
Y5
MODE
Y6
19 2021 222324 25
4
3
2
1
28
27
26
D0
DCLK
OE
NC
Vcc
MODE
Y0
OE
1
24
VCC
DCLK
2
23
MODE
D0
3
22
Y0
D1
4
21
Y1
D2
5
20
Y2
D3
6
19
Y3
D4
7
18
Y4
D5
8
17
Y5
D6
9
16
Y6
D7
10
15
Y7
SDI
11
14
SDO
GND
12
13
PCLK
8-BIT
PIPELINE
REGISTER
8
P0−P 7
OE
8
Y0−Y 7
Copyright
© 2000, Texas Instruments Incorporated
CY29FCT818T
Function Table[1]
Inputs
MODE
SDI
L
X
L
X
H
H
H
L
H
X
Inputs
DCLK
Shadow
Register
Pipeline
Register
NA
S7
S0←SDI
Si←Si-1
NA
Pi←Di
Load Pipeline Register from Data Input
L
H
SDI
Si←Yi
Hold
NA
NA
NA
Pi←Si
Load Shadow Register from Y Output
Hold Shadow Register; D7−D0 Output Enabled
Load Pipeline Register from Shadow Register
PCLK
SDO
X
S7
X
X
X
X
Maximum Ratings[2, 3]
Operation
Serial Shift; D7–D0 Output Disabled
Power Dissipation .......................................................... 0.5W
Static Discharge Voltage............................................>2001V
(per MIL-STD-883, Method 3015)
(Above which the useful life may be impaired. For user
guidelines, not tested.)
Storage Temperature .................................–65°C to +150°C
Operating Range
Ambient Temperature with
Power Applied .............................................–65°C to +135°C
Range
Supply Voltage to Ground Potential ............... –0.5V to +7.0V
DC Input Voltage............................................ –0.5V to +7.0V
Range
Ambient
Temperature
VCC
Commercial
All
–40°C to +85°C
5V ± 5%
Military[4]
All
–55°C to +125°C
5V ± 10%
DC Output Voltage ......................................... –0.5V to +7.0V
DC Output Current (Maximum Sink Current/Pin).......120 mA
Electrical Characteristics Over the Operating Range
Parameter
VOH
Description
Output HIGH Voltage
Test Conditions
Min.
Typ.[5]
Max.
Unit
VCC=Min., IOH=–32 mA
Com’l
2.0
V
VCC=Min., IOH=–15 mA
Com’l
2.4
3.3
V
VCC=Min., IOH=–3 mA
Mil
2.4
3.3
V
VCC=Min., IOL=64 mA
Com’l
VCC=Min., IOL=20 mA
Mil
VOL
Output LOW Voltage
0.3
0.55
V
VIH
Input HIGH Voltage
0.3
0.55
V
VIL
Input LOW Voltage
VH
Hysteresis[6]
All inputs
0.2
VIK
Input Clamp Diode Voltage
VCC=Min., IIN=–18 mA
–0.7
II
Input HIGH Current
IIH
Input HIGH Current
IIL
2.0
V
0.8
V
V
–1.2
V
VCC=Max., VIN=VCC
5
µA
VCC=Max., VIN=2.7V
±1
µA
Input LOW Current
VCC=Max., VIN=0.5V
±1
µA
IOZH
Off State HIGH-Level Output
Current
VCC=Max., VOUT=2.7V
10
µA
IOZL
Off State LOW-Level
Output Current
VCC=Max., VOUT=0.5V
–10
µA
IOS
Output Short Circuit Current[7]
VCC=Max., VOUT=0.0V
–225
mA
IOFF
Power-Off Disable
VCC=0V, VOUT=4.5V
±1
µA
2
–60
–120
CY29FCT818T
Electrical Characteristics Over the Operating Range
Parameter
Description
Test Conditions
Min.
Typ.[5]
Max.
Unit
Notes:
1. NA = Not Applicable
2. Unless otherwise noted, these limits are over the operating free-air temperature range.
3. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground.
4. TA is the “instant on” case temperature.
5. Typical values are at VCC=5.0V, TA=+25˚C ambient.
6. This parameter is specified but not tested.
7. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample
and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of
a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parameters tests. In any sequence of parameter
tests, IOS tests should be performed last.
Capacitance[8]
Parameter
Description
Test Conditions
Typ.[5]
Max.
Unit
CIN
Input Capacitance
5
10
pF
COUT
Output Capacitance
9
12
pF
Document #: 38-00275-B
Power Supply Characteristics
Parameter
ICC
Description
Quiescent Power Supply Current
Test Conditions
VCC=Max., VIN<0.2V, VIN>VCC–0.2V
Typ.[5]
Max.
Unit
0.2
1.5
mA
0.5
2.0
mA
∆ICC
Quiescent Power Supply Current
(TTL inputs HIGH)
ICCD
Dynamic Power Supply Current[9] VCC=Max., 50% Duty Cycle, Outputs Open,
One Input Toggling, OE=GND,
VIN<0.2V or VIN>VCC–0.2V
0.25
mA/MHz
IC
Total Power Supply Current[10]
VCC=Max., 50% Duty Cycle, Outputs Open,
f0=10 MHz, One Bit Toggling at f1=5 MHz,
OE=GND, VIN<0.2V or VIN>VCC–0.2V
5.3
mA
VCC=Max., 50% Duty Cycle, Outputs Open,
f0=10 MHz, One Bit Toggling at f1=5 MHz,
OE=GND, VIN=3.4V or VIN=GND
7.3
mA
VCC=Max., 50% Duty Cycle, Outputs Open,
f0=10 MHz, Eight Bits and Four Controls
Toggling, f1=5 MHz, OE=GND,
VIN<0.2V or VIN>VCC–0.2V
17.8[11]
mA
VCC=Max., 50% Duty Cycle, Outputs Open,
f0=10 MHz, Eight Bits and Four Controls
Toggling, f1=5 MHz, OE=GND,
VIN=3.4V or VIN=GND
30.8[11]
mA
VCC=Max., VIN=3.4V, f1=0, Outputs Open
Notes:
8. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND.
9. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.
= IQUIESCENT + IINPUTS + IDYNAMIC
10. IC
IC
= ICC+∆ICCDHNT+ICCD(f0/2 + f1N1)
ICC = Quiescent Current with CMOS input levels
∆ICC = Power Supply Current for a TTL HIGH input (VIN=3.4V)
DH = Duty Cycle for TTL inputs HIGH
NT = Number of TTL inputs at DH
ICCD = Dynamic Current caused by an input transition pair (HLH or LHL)
= Clock frequency for registered devices, otherwise zero
f0
= Input signal frequency
f1
N1 = Number of inputs changing at f1
All currents are in milliamps and all frequencies are in megahertz.
11. Values for these conditions are examples of the ICC formula. These limits are specified but not tested.
3
[8]
CY29FCT818T
Switching Characteristics Over the Operating Range[12]
FCT818AT
FCT818CT
Military
Parameter
Description
Min.
Max.
Commercial
Min.
Max.
Unit
Fig. No.[13]
6.0
7.2
7.1
7.2
ns
ns
ns
ns
5
6
3
5
tPD
Propagation Delay
PCLK to Y
MODE to SDO
SDI to SDO
DCLK to SDO
tS
Set-Up Time
D to PCLK
MODE to PCLK
Y to DCLK
MODE to DCLK
SDI to DCLK
DCLK to PCLK
PCLK to DCLK
6
15
5
12
10
15
45
2.0
3.5
2.0
3.5
3.5
3.5
8.5
ns
ns
ns
ns
ns
ns
ns
4
Hold Time
D to PCLK
MODE to PCLK
Y to DCLK
MODE to DCLK
SDI to DCLK
2
0
5
5
0
1.5
0
1.5
1.5
0
ns
ns
ns
ns
ns
4
tH
12
18
18
30
tPLZ
Output Disable Time LOW
OE to Y
DCLK to D
20
45
5.5
5.5
ns
ns
7
5
tPHZ
Output Disable Time HIGH
OE to Y
DCLK to D
30
90
8.0
8.0
ns
ns
8
5
tPZL
Output Enable Time LOW
OE to Y
DCLK to D
20
35
8.0
9.0
ns
ns
7
5
tPZH
Output Enable Time HIGH
OE to Y
DCLK to D
20
30
8.5
9.0
ns
ns
8
5
tW
Pulse Width
PCLK (HIGH and LOW)
DCLK (HIGH and LOW)
ns
ns
5
5
Speed
(ns)
6.0
Ordering Code
CY29FCT818CTPC
CY29FCT818CTQCT
12.0
15
25
Package
Name
P13/13A
5.0
5.0
Package Type
24-Lead (300-Mil) Molded DIP
Q13
24-Lead (150-Mil) QSOP
CY29FCT818CTSOC/SOCT
S13
24-Lead (300-Mil) Molded SOIC
CY29FCT818ATDMB
D14
24-Lead (300-Mil) CerDIP
Notes:
12. Minimum limits are specified but not tested on Propagation Delays.
13. See “Parameter Measurement Information” in the General Information section.
4
Operating
Range
Commercial
Military
CY29FCT818T
Package Diagrams
24-Lead (300-Mil) CerDIP D14
MIL-STD-1835
28-Square Leadless Chip Carrier L64
D-9 Config.A
MIL-STD-1835 C-4
24-Lead (300-Mil) Molded DIP P13/P13A
5
CY29FCT818T
Package Diagrams (continued)
24-Lead Quarter Size Outline Q13
24-Lead (300-Mil) Molded SOIC S13
6
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Copyright  2000, Texas Instruments Incorporated
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