MC10EL35, MC100EL35 5VECL JK Flip-Flop Description The MC10EL/100EL35 is a high speed JK flip-flop. The J/K data enters the master portion of the flip-flop when the clock is LOW and is transferred to the slave, and thus the outputs, upon a positive transition of the clock. The reset pin is asynchronous and is activated with a logic HIGH. The 100 Series contains temperature compensation. http://onsemi.com MARKING DIAGRAMS* 8 • 525 ps Propagation Delay • 2.2G Hz Toggle Frequency • ESD Protection: > 1 kV Human Body Model, • • • • > 100 V Machine Model PECL Mode Operating Range: VCC = 4.2 V to 5.7 with VEE = 0 V NECL Mode Operating Range: VCC = 0 V with VEE = −4.2 V to −5.7 V Internal Input Pulldown Resistors on J, K, CLK, and R Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test Moisture Sensitivity Level 1 For Additional Information, see Application Note AND8003/D Flammability Rating: UL−94 V−0 @ 0.125 in, Oxygen Index 28 to 34 Transistor Count = 81 devices SOIC−8 D SUFFIX CASE 751 8 8 HEL35 ALYW G 1 8 8 1 TSSOP−8 DT SUFFIX CASE 948R KEL35 ALYW G 1 1 8 HL35 ALYWG G 4W M G G • • 1 • • Pb−Free Packages are Available 1 4 1 KL35 ALYWG G 2L M G G Features 1 4 DFN8 MN SUFFIX CASE 506AA H K 4W 2L A = MC10 = MC100 = MC10 = MC100 = Assembly Location L Y W M G = Wafer Lot = Year = Work Week = Date Code = Pb−Free Package (Note: Microdot may be in either location) *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. © Semiconductor Components Industries, LLC, 2006 December, 2006 − Rev. 6 1 Publication Order Number: MC10EL35/D MC10EL35, MC100EL35 Table 1. PIN DESCRIPTION J K CLK 1 2 8 J 7 K 3 6 VCC PIN Q Q R R 4 5 VEE FUNCTION J ECL Input K ECL Input R ECL Reset CLK ECL Clock Input Q, Q ECL Data Outputs VCC Positive Supply VEE Negative Supply EP Exposed pad must be connected to a sufficient thermal conduit. Electrically connect to the most negative supply or leave floating open. Figure 1. Logic Diagram and Pinout Assignment Table 1. TRUTH TABLE J* K* R* CLK Qn+1 L L H H X L H L H X L L L L H Z Z Z Z X Qn L H Qn L Table 2. MAXIMUM RATINGS Symbol Parameter Condition 1 Condition 2 Rating Unit VCC PECL Mode Power Supply VEE = 0 V 8 V VEE NECL Mode Power Supply VCC = 0 V −8 V VI PECL Mode Input Voltage NECL Mode Input Voltage VEE = 0 V VCC = 0 V 6 −6 V V Iout Output Current Continuous Surge 50 100 mA mA TA Operating Temperature Range −40 to +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm 8 SOIC 8 SOIC 190 130 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board 8 SOIC 41 to 44 °C/W qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm 8 TSSOP 8 TSSOP 185 140 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board 8 TSSOP 41 to 44 ± 5% °C/W qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm DFN8 DFN8 129 84 °C/W °C/W Tsol Wave Solder <2 to 3 sec @ 248°C <2 to 3 sec @ 260°C 265 265 °C Pb Pb−Free VI VCC VI VEE Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. http://onsemi.com 2 MC10EL35, MC100EL35 Table 3. 10EL SERIES PECL DC CHARACTERISTICS VCC = 5.0 V; VEE = 0 V (Note 1) −40°C Symbol Characteristic Min 25°C Typ Max 27 32 Min 85°C Typ Max 27 32 Min Typ Max Unit 27 32 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 2) 3920 4010 4110 4020 4105 4190 4090 4185 4280 mV VOL Output LOW Voltage (Note 2) 3050 3200 3350 3050 3210 3370 3050 3227 3405 mV VIH Input HIGH Voltage 3770 4110 3870 4190 3940 4280 mV VIL Input LOW Voltage 3050 3500 3050 3520 3050 3555 mV IIH Input HIGH Current 150 mA IIL Input LOW Current 150 0.5 150 0.5 0.3 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters vary 1:1 with VCC. VEE can vary +0.25 V / −0.5 V. 2. Outputs are terminated through a 50 W resistor to VCC − 2.0 V. Table 4. 10EL SERIES NECL DC CHARACTERISTICS VCC = 0 V; VEE = −5.0 V (Note 3) −40°C Symbol Characteristic Min 25°C Typ Max 27 32 Min 85°C Typ Max 27 32 Min Typ Max Unit 27 32 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 4) −1080 −990 −890 −980 −895 −810 −910 −815 −720 mV VOL Output LOW Voltage (Note 4) −1950 −1800 −1650 −1950 −1790 −1630 −1950 −1773 −1595 mV VIH Input HIGH Voltage −1230 −890 −1130 −810 −1060 −720 mV VIL Input LOW Voltage −1950 −1500 −1950 −1480 −1950 −1445 mV IIH Input HIGH Current 150 mA IIL Input LOW Current 150 0.5 150 0.5 0.3 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 3. Input and output parameters vary 1:1 with VCC. VEE can vary +0.25 V / −0.5 V. 4. Outputs are terminated through a 50 W resistor to VCC − 2.0 V. Table 5. 100EL SERIES PECL DC CHARACTERISTICS VCC = 5.0 V; VEE = 0 V (Note 5) −40°C Symbol Characteristic Typ Max 27 32 3915 3995 4120 Output LOW Voltage (Note 6) 3170 3305 VIH Input HIGH Voltage (Single−Ended) VIL Input LOW Voltage (Single−Ended) IIH Input HIGH Current IIL Input LOW Current IEE Power Supply Current VOH Output HIGH Voltage (Note 6) VOL Min 25°C Min 85°C Typ Max 27 32 3975 4045 4120 3445 3190 3295 3835 4120 3190 3525 Typ Max Unit 32 37 mA 3975 4050 4120 mV 3380 3190 3295 3380 mV 3835 4120 3835 4120 mV 3190 3525 3190 3525 mV 150 mA 150 0.5 Min 150 0.5 0.5 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 5. Input and output parameters vary 1:1 with VCC. VEE can vary +0.8 V / −0.5 V. 6. Outputs are terminated through a 50 W resistor to VCC − 2.0 V. http://onsemi.com 3 MC10EL35, MC100EL35 Table 6. 100EL SERIES NECL DC CHARACTERISTICS VCC = 0 V; VEE = −5.0 V (Note 7) −40°C Symbol Characteristic Min 25°C Typ Max 27 32 Min 85°C Typ Max 27 32 Min Typ Max Unit 32 37 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 8) −1085 −1005 −880 −1025 −955 −880 −1025 −955 −880 mV VOL Output LOW Voltage (Note 8) −1830 −1695 −1555 −1810 −1705 −1620 −1810 −1705 −1620 mV VIH Input HIGH Voltage (Single−Ended) −1165 −880 −1165 −880 −1165 −880 mV VIL Input LOW Voltage (Single−Ended) −1810 −1475 −1810 −1475 −1810 −1475 mV IIH Input HIGH Current 150 mA IIL Input LOW Current 150 0.5 150 0.5 0.5 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 7. Input and output parameters vary 1:1 with VCC. VEE can vary +0.8 V / −0.5 V. 8. Outputs are terminated through a 50 W resistor to VCC − 2.0 V. Table 7. AC CHARACTERISTICS VCC = 5.0 V; VEE = 0 V or VCC = 0 V; VEE = −5.0 V (Note 9) −40°C Symbol Characteristic Min Typ 1.4 2.0 25°C Max Min Typ 1.8 2.2 350 275 525 450 85°C Max Min Typ 1.8 2.2 395 350 570 525 Max Unit fmax Maximum Toggle Frequency tPLH tPHL Propagation Delay to Output CLK MR 290 225 515 450 tS Setup Time J, K 150 0 150 0 150 0 ps tH Hold Time J, K 250 100 250 100 250 100 ps tRR Reset Recovery 400 200 400 200 400 200 ps tPW Minimum Pulse Width tJITTER Cycle−to−Cycle Jitter tr tf Output Rise/Fall Times Q (20% − 80%) CLK, Reset 740 675 400 400 1.0 100 700 625 225 100 745 700 400 1.0 350 GHz ps 1.0 225 350 100 ps 225 ps 350 ps NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 9. 10 Series: VEE can vary +0.25 V / −0.5 V. 100 Series: VEE can vary +0.8 V / −0.5 V. Q Zo = 50 W D Receiver Device Driver Device Q D Zo = 50 W 50 W 50 W VTT VTT = VCC − 3.0 V Figure 2. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D − Termination of ECL Logic Devices.) http://onsemi.com 4 MC10EL35, MC100EL35 ORDERING INFORMATION Package Shipping† SOIC−8 98 Units / Rail MC10EL35DG SOIC−8 (Pb−Free) 98 Units / Rail MC10EL35DR2 SOIC−8 2500 / Tape & Reel MC10EL35DR2G SOIC−8 (Pb−Free) 2500 / Tape & Reel MC10EL35DT TSSOP−8 100 Units / Rail MC10EL35DTG TSSOP−8 (Pb−Free) 100 Units / Rail MC10EL35DTR2 TSSOP−8 2500 / Tape & Reel MC10EL35DTR2G TSSOP−8 (Pb−Free) 2500 / Tape & Reel MC10EL35MNR4 DFN8 1000 / Tape & Reel DFN8 (Pb−Free) 1000 / Tape & Reel SOIC−8 98 Units / Rail MC100EL35DG SOIC−8 (Pb−Free) 98 Units / Rail MC100EL35DR2 SOIC−8 2500 / Tape & Reel MC100EL35DR2G SOIC−8 (Pb−Free) 2500 / Tape & Reel MC100EL35DT TSSOP−8 100 Units / Rail MC100EL35DTG TSSOP−8 (Pb−Free) 100 Units / Rail MC100EL35DTR2 TSSOP−8 2500 / Tape & Reel MC100EL35DTR2G TSSOP−8 (Pb−Free) 2500 / Tape & Reel MC100EL35MNR4 DFN8 1000 / Tape & Reel DFN8 (Pb−Free) 1000 / Tape & Reel Device MC10EL35D MC10EL35MNR4G MC100EL35D MC100EL35MNR4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Resource Reference of Application Notes AN1405/D − ECL Clock Distribution Techniques AN1406/D − Designing with PECL (ECL at +5.0 V) AN1503/D − ECLinPSt I/O SPiCE Modeling Kit AN1504/D − Metastability and the ECLinPS Family AN1568/D − Interfacing Between LVDS and ECL AN1672/D − The ECL Translator Guide AND8001/D − Odd Number Counters Design AND8002/D − Marking and Date Codes AND8020/D − Termination of ECL Logic Devices AND8066/D − Interfacing with ECLinPS AND8090/D − AC Characteristics of ECL Devices http://onsemi.com 5 MC10EL35, MC100EL35 PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE AH −X− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. A 8 5 S B 1 0.25 (0.010) M Y M 4 −Y− K G C N DIM A B C D G H J K M N S X 45 _ SEATING PLANE −Z− H 0.10 (0.004) D 0.25 (0.010) M Z Y S X M J S SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 6 MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 _ 8 _ 0.010 0.020 0.228 0.244 MC10EL35, MC100EL35 PACKAGE DIMENSIONS TSSOP−8 DT SUFFIX PLASTIC TSSOP PACKAGE CASE 948R−02 ISSUE A 8x 0.15 (0.006) T U 0.10 (0.004) S 2X L/2 L 8 5 1 PIN 1 IDENT 0.15 (0.006) T U K REF S M T U V S 0.25 (0.010) B −U− 4 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 6. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. S M A −V− F DETAIL E C 0.10 (0.004) −T− SEATING PLANE D −W− G DETAIL E http://onsemi.com 7 DIM A B C D F G K L M MILLIMETERS MIN MAX 2.90 3.10 2.90 3.10 0.80 1.10 0.05 0.15 0.40 0.70 0.65 BSC 0.25 0.40 4.90 BSC 0_ 6_ INCHES MIN MAX 0.114 0.122 0.114 0.122 0.031 0.043 0.002 0.006 0.016 0.028 0.026 BSC 0.010 0.016 0.193 BSC 0_ 6_ MC10EL35, MC100EL35 PACKAGE DIMENSIONS DFN8 CASE 506AA−01 ISSUE D D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994 . 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. A B PIN ONE REFERENCE 2X 0.10 C 2X ÇÇÇÇ ÇÇÇÇ ÇÇÇÇ ÇÇÇÇ 0.10 C TOP VIEW 0.08 C SEATING PLANE MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.20 0.30 2.00 BSC 1.10 1.30 2.00 BSC 0.70 0.90 0.50 BSC 0.20 −−− 0.25 0.35 A 0.10 C 8X DIM A A1 A3 b D D2 E E2 e K L E (A3) SIDE VIEW A1 C D2 e e/2 4 1 8X L E2 K 8 5 8X b 0.10 C A B 0.05 C NOTE 3 BOTTOM VIEW ECLinPS is a trademark of Semiconductor Components INdustries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 http://onsemi.com 8 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MC10EL35/D