ONSEMI MC10197

SEMICONDUCTOR TECHNICAL DATA
The MC10197 provides a high speed hex AND function with strobe
capability.
PD = 200 mW typ/pkg (No Load)
tpd = 2.8 ns typ (B–Q)
tpd = 3.8 ns typ (A–Q)
tr, tf = 2.5 ns typ (20%–80%)
L SUFFIX
CERAMIC PACKAGE
CASE 620–10
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
LOGIC DIAGRAM
9
5
A
Q
B
2
FN SUFFIX
PLCC
CASE 775–02
3
6
DIP
PIN ASSIGNMENT
4
7
13
10
14
11
12
TRUTH TABLE
Inputs
A
Output
B
Q
L
L
L
L
H
L
H
L
L
H
H
H
3–168
1
16
VCC2
AOUT
2
15
FOUT
BOUT
3
14
EOUT
COUT
4
13
DOUT
AIN
5
12
FIN
15
BIN
6
11
EIN
VCC1 = PIN 1
VCC2 = PIN 16
VEE = PIN 8
CIN
7
10
DIN
VEE
8
9
COMMON
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
Tables on page 6–11 of the Motorola MECL Data
Book (DL122/D).
3/93
 Motorola, Inc. 1996
VCC1
REV 5
MC10197
ELECTRICAL CHARACTERISTICS
Test Limits
Characteristic
Power Supply Drain Current
Input Current
Symbol
Pin
Pi
Under
Test
IE
8
54
IinH
5
9
425
460
IinL
5
0.5
–30°C
Min
+25°C
Max
Min
+85°C
Max
Unit
49
54
mAdc
265
290
265
290
µAdc
Typ
Max
39
0.5
0.3
Min
µAdc
Output Voltage
Logic 1
VOH
2
–1.060
–0.890
–0.960
–0.810
–0.890
–0.700
Vdc
Output Voltage
Logic 0
VOL
2
–1.890
–1.675
–1.850
–1.650
–1.825
–1.615
Vdc
Threshold Voltage
Logic 1
VOHA
2
–1.080
Logic 0
VOLA
2
Threshold Voltage
Switching Times
–0.980
–0.910
–1.655
Vdc
–1.630
–1.595
(50Ω Load)
Propagation Delay
Vdc
ns
t5+2+
t9+2+
2
2
1.1
1.1
4.2
5.3
1.1
1.1
2.8
3.5
4.0
5.0
1.1
1.1
4.4
5.5
Rise Time
(20 to 80%)
t2+
2
1.1
4.7
1.1
2.5
4.5
1.1
5.0
Fall Time
(20 to 80%)
t2–
2
1.1
4.7
1.1
2.5
4.5
1.1
5.0
ELECTRICAL CHARACTERISTICS (continued)
TEST VOLTAGE VALUES (Volts)
Characteristic
Power Supply Drain Current
Input Current
@ Test Temperature
VIHmax
VILmin
VIHAmin
VILAmax
VEE
–30°C
–0.890
–1.890
–1.205
–1.500
–5.2
+25°C
–0.810
–1.850
–1.105
–1.475
–5.2
+85°C
–0.700
–1.825
–1.035
–1.440
–5.2
Symbol
Pin
Under
Test
IE
8
IinH
5
9
IinL
5
TEST VOLTAGE APPLIED TO PINS LISTED BELOW
VIHmax
Logic 1
VOH
2
Logic 0
VOL
2
Threshold Voltage
Logic 1
VOHA
2
9
Logic 0
VOLA
2
9
Rise Time
5, 9
(50Ω Load)
Propagation Delay
(20 to 80%)
VILAmax
5
Output Voltage
Switching Times
VIHAmin
5
9
Output Voltage
Threshold Voltage
VILmin
5
VEE
(VCC)
Gnd
8
1, 16
8
8
1, 16
1, 16
8
1, 16
8
1, 16
8
1, 16
8
1, 16
5
8
1, 16
+1.11V
Pulse In
Pulse Out
–3.2 V
+2.0 V
t5+2+
t9+2+
2
2
9
5
5
9
2
2
8
8
1, 16
1, 16
t2+
2
9
5
2
8
1, 16
Fall Time
(20 to 80%)
t2–
2
9
5
2
8
1, 16
Each MECL 10,000 series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained.
Outputs are terminated through a 50–ohm resistor to –2.0 volts. Test procedures are shown for only one gate. The other gates are tested in the
same manner.
MECL Data
DL122 — Rev 6
3–169
MOTOROLA
MC10197
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
0.007 (0.180) M T L–M
B
Y BRK
–N–
U
N
S
0.007 (0.180) M T L–M
S
S
N
S
D
–L–
–M–
Z
W
20
D
1
V
0.010 (0.250)
G1
X
S
T L–M
N
S
S
VIEW D–D
A
0.007 (0.180) M T L–M
S
N
S
R
0.007 (0.180) M T L–M
S
N
S
Z
C
H
–T–
SEATING
PLANE
F
VIEW S
G1
0.010 (0.250) S T L–M
S
0.007 (0.180)
M
T L–M
S
N
S
VIEW S
S
N
S
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
MOTOROLA
N
K
0.004 (0.100)
J
S
K1
E
G
0.007 (0.180) M T L–M
3–170
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
–––
0.025
–––
0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
–––
0.020
2_
10 _
0.310
0.330
0.040
–––
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
–––
0.64
–––
8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
–––
0.50
2_
10 _
7.88
8.38
1.02
–––
MECL Data
DL122 — Rev 6
MC10197
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
–A–
16
9
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
–B–
C
L
DIM
A
B
C
D
E
F
G
H
K
L
M
N
–T–
K
N
SEATING
PLANE
M
E
F
J
G
D
16 PL
0.25 (0.010)
16 PL
0.25 (0.010)
M
T A
T B
M
–A–
9
1
8
B
F
C
L
S
–T–
SEATING
PLANE
K
H
G
D
M
J
16 PL
0.25 (0.010)
M
MILLIMETERS
MIN
MAX
19.05
19.93
6.10
7.49
–––
5.08
0.39
0.50
1.27 BSC
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0_
15 _
0.51
1.01
S
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
16
S
INCHES
MIN
MAX
0.750
0.785
0.240
0.295
–––
0.200
0.015
0.020
0.050 BSC
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0_
15 _
0.020
0.040
T A
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
How to reach us:
USA/EUROPE/Locations Not Listed: Motorola Literature Distribution;
P.O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454
JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center,
3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315
MFAX: [email protected] – TOUCHTONE 602–244–6609
INTERNET: http://Design–NET.com
ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,
51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298
◊
MECL Data
DL122 — Rev 6
3–171
*MC10197/D*
MC10197/D
MOTOROLA