MBR340 Preferred Device Axial Lead Rectifier . . . employing the Schottky Barrier principle in a large area metal–to–silicon power diode. State–of–the–art geometry features epitaxial construction with oxide passivation and metal overlap contact. Ideally suited for use as rectifiers in low–voltage, high–frequency inverters, free wheeling diodes, and polarity protection diodes. • • • • http://onsemi.com SCHOTTKY BARRIER RECTIFIER 3.0 AMPERES 40 VOLTS Extremely Low VF Low Power Loss/High Efficiency Highly Stable Oxide Passivated Junction Low Stored Charge, Majority Carrier Conduction Mechanical Characteristics: • Case: Epoxy, Molded • Weight: 1.1 gram (approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable • Lead and Mounting Surface Temperature for Soldering Purposes: • • • • 220°C Max. for 10 Seconds, 1/16″ from case Shipped in plastic bags, 500 per bag Available Tape and Reeled, 1500 per reel, by adding a “RL’’ suffix to the part number Polarity: Cathode indicated by Polarity Band Marking: B340 AXIAL LEAD CASE 267–05 (DO–201AD) STYLE 1 MAXIMUM RATINGS Rating Symbol Max Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 40 V Average Rectified Forward Current TA = 65°C (RJA = 28°C/W, P.C. Board Mounting) IO 3.0 B340 A B340 Non–Repetitive Peak Surge Current (Note 1) (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz, TL = 75°C) IFSM Operating and Storage Junction Temperature Range (Reverse Voltage Applied) TJ, Tstg –65 to +150 °C TJ(pk) 150 °C Peak Operating Junction Temperature (Forward Current Applied) 80 January, 2002 – Rev. 3 = Device Code A ORDERING INFORMATION Device Package Shipping MBR340 Axial Lead 500 Units/Bag MBR340RL Axial Lead 1500/Tape & Reel Preferred devices are recommended choices for future use and best overall value. 1. Lead Temperature reference is cathode lead 1/32″ from case. Semiconductor Components Industries, LLC, 2002 MARKING DIAGRAM 1 Publication Order Number: MBR340/D MBR340 THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction to Ambient (see Note 4, Mounting Method 3) Symbol Max Unit RθJA 28 °C/W Symbol Max Unit ELECTRICAL CHARACTERISTICS (TL = 25°C unless otherwise noted) (Note 2) Characteristic Maximum Instantaneous Forward Voltage (Note 3) (iF = 1.0 Amp) (iF = 3.0 Amp) (iF = 9.4 Amp) vF Maximum Instantaneous Reverse Current @ Rated dc Voltage (Note 3) TL = 25°C TL = 100°C iR V 0.500 0.600 0.850 mA 0.60 20 2. Lead Temperature reference is cathode lead 1/32″ from case. 3. Pulse Test: Pulse Width = 300 µs, Duty Cycle = 2.0%. I , REVERSE CURRENT (mA) R 20 10 7.0 i , INSTANTANEOUS FORWARD CURRENT (AMPS) F 5.0 3.0 2.0 TJ = 150°C 25°C 100 40 20 10 4.0 2.0 1.0 100°C 100°C 0.4 0.2 0.1 100 10 25°C 0 10 20 30 10 40 VR REVERSE VOLTAGE (VOLTS) 0.7 Figure 2. Typical Reverse Current* 0.5 *The curves shown are typical for the highest voltage device in the voltage grouping. Typical reverse current for lower voltage selections can be estimated from these same curves if VR is sufficiently below rated VR. 0.3 , AVERAGE FORWARD CURRENT (AMPS) 0.2 0.1 0.07 0.05 0.03 I F (AV) 0.02 0.01 1000 75°C 0.04 0.02 0.01 0.004 0.002 0.001 1.0 150°C 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 vF, INSTANTANEOUS VOLTAGE (VOLTS) 0.9 10 8.0 6.0 4.0 SQUARE WAVE 2.0 0 Figure 1. Typical Forward Voltage 20 40 dc 60 80 100 120 140 160 TA, AMBIENT TEMPERATURE (C°) Figure 3. Current Derating (Mounting Method #3 per Note 4) http://onsemi.com 2 180 200 MBR340 SQUARE WAVE RESISTIVE LOAD I PK (CAPACITIVE LOAD) I AV 2.0 1.5 500 dc 400 I PK 5.0 I AV 10 1.0 TJ = 150°C 20 0.5 0 TJ = 25°C 300 C, CAPACITANCE (pF) P , AVERAGE POWER DISSIPATION (WATTS) F (AV) 2.5 1.0 2.0 3.0 4.0 IF (AV), AVERAGE FORWARD CURRENT (AMPS) 5.0 200 100 90 80 70 60 50 0 10 Figure 4. Power Dissipation 20 30 40 VR REVERSE VOLTAGE (VOLTS) Figure 5. Typical Capacitance NOTE 4 — MOUNTING DATA Data shown for thermal resistance junction–to–ambient (RθJA) for the mountings shown is to be used as typical guideline values for preliminary engineering, or in case the tie point temperature cannot be measured. TYPICAL VALUES FOR RθJA IN STILL AIR Mounting Method Lead Length, L (in) 1/8 1/4 1/2 3/4 RθJA 1 50 51 53 55 °C/W 2 58 59 61 63 °C/W 3 °C/W 28 Mounting Method 1 Mounting Method 2 P.C. Board where available copper surface is small. Vector Push–In Terminals T–28 L ÉÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉÉ L ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ L Mounting Method 3 ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ P.C. Board with 2–1/2″ X 2–1/2″ copper surface. L = 1/2’’ Board Ground Plane http://onsemi.com 3 L 50 MBR340 PACKAGE DIMENSIONS AXIAL LEAD CASE 267–05 (DO–201AD) ISSUE G K D A 1 2 B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B D K K INCHES MIN MAX 0.287 0.374 0.189 0.209 0.047 0.051 1.000 --- MILLIMETERS MIN MAX 7.30 9.50 4.80 5.30 1.20 1.30 25.40 --- STYLE 1: PIN 1. CATHODE (POLARITY BAND) 2. ANODE ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. 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