IXYS LAA108STR Dual single-pole, normally open optomos relay Datasheet

LAA108
Dual Single-Pole, Normally Open
OptoMOS® Relay
INTEGRATED CIRCUITS DIVISION
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
Ratings
100
300
8
Units
VP
mArms / mADC

Features
• 3750Vrms Input/Output Isolation
• Low Drive Power Requirements
(TTL/CMOS Compatible)
• High Reliability
• Arc-Free With No Snubbing Circuits
• FCC Compatible
• VDE Compatible
• No EMI/RFI Generation
• Small 8-Pin Package
• Machine Insertable, Wave Solderable
• Surface Mount Tape & Reel Versions Available
Description
IXYS Integrated Circuits Division's LAA108 is
a 100V, 300mA, 8 dual single-pole, normally
open (1-Form-A) Solid State Relay that has two
independently controlled, optically coupled outputs.
The output MOSFET switches and photovoltaic die
employ optically coupled MOSFET technology to
provide 3750 Vrms of input-to-output isolation.
The relay outputs, that use patented OptoMOS
architecture, are controlled by a highly efficient
GaAlAS infrared LED.
This dual single-pole OptoMOS relay provides a more
compact design solution than two discrete
single-pole relays in a variety of applications, saving
board space by incorporating both switches in a single
8-Pin package.
Approvals
Applications
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment-Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
• UL Certified Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 10 05 49410 006
Ordering Information
Part #
LAA108
LAA108S
LAA108STR
LAA108P
LAA108PTR
Description
8-Pin DIP (50/Tube)
8-Pin Surface Mount (50/Tube)
8-Pin Surface Mount (1,000/Reel)
8-Pin Flat Pack (50/Tube)
8-Pin Flat Pack (1,000/Reel)
Pin Configuration
+ Control - Switch #1
– Control - Switch #1
+ Control - Switch #2
– Control - Switch #2
1
8
2
7
3
6
4
5
Load - Switch #1
Load - Switch #1
Load - Switch #2
Load - Switch #2
Switching Characteristics of
Normally Open (Form A) Devices
Form-A
IF
90%
Pb
DS-LAA108-R04
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INTEGRATED CIRCUITS DIVISION
LAA108
Absolute Maximum Ratings @ 25°C
Parameter
Ratings
Blocking Voltage
100
Reverse Input Voltage
5
Input Control Current
50
Peak (10ms)
1
1
Input Power Dissipation
150
800
Total Power Dissipation 2
Isolation Voltage, Input to Output
3750
Operational Temperature
-40 to +85
Storage Temperature
-40 to +125
1
2
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Units
VP
V
mA
A
mW
mW
Vrms
°C
°C
Derate linearly 1.33 mW / °C
Derate linearly 6.67 mW / °C
Electrical Characteristics @ 25ºC (Unless Otherwise Noted)
Parameter
Output Characteristics
Load Current
Continuous 1
Peak
On-Resistance 2
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate 3
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
Symbol
Min
Typ
Max
Units
t =10ms
IL=300mA
VL=100VP
IL
ILPK
RON
ILEAK
-
4.5
-
300
±400
8
1
mArms / mADC
mAP

VL=50V, f=1MHz
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-
0.43
0.17
110
3
3
-
IL=300mA
IF=5mA
VR=5V
IF
VF
IR
0.2
0.9
-
0.5
0.3
1.2
-
2
1.4
10
mA
mA
V
A
-
CI/O
-
3
-
pF
IF=5mA, VL=10V
1
If both poles operate simultaneously, the load current must be derated so as not to exceed the package total power dissipation value.
2
Measurement taken within one (1) second of on-time.
For applications requiring high-temperature operation (T>60ºC), a LED drive currrent of 4mA is recommended.
3
2
Conditions
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A
ms
pF
R04
INTEGRATED CIRCUITS DIVISION
LAA108
PERFORMANCE DATA@ 25ºC (Unless Otherwise Noted)*
LED Forward Voltage Distribution
(IF=5mA)
30
Turn-On Time Distribution
(IF=5mA, IL=200mA)
20
25
15
10
Device Count (N)
Device Count (N)
Device Count (N)
25
20
15
10
5
5
0
0
15
10
5
10
5
1.2
1.0
-40
0
20
40
60
Temperature (ºC)
80
0.80
Turn-On Time (ms)
LED Current (mA)
0.445
0.3
0.2
0.1
0.65
0.60
0.55
-20
0
20
40
60
Temperature (ºC)
80
100
0.430
0.65
10
20
30
40
LED Forward Current (mA)
50
Turn-Off Time vs. Temperature
(IF=5mA, IL=80mA)
0.60
0.18
0.14
0.435
0
Turn-On Time vs. Temperature
(IF=5mA, IL=80mA)
0.20
0.45
-40
0.440
50
0.22
0.16
144
0.425
10
20
30
40
LED Forward Current (mA)
0.24
0.50
140
141
142
143
Blocking Voltage (VP)
Turn-Off Time vs. LED Forward Current
(IL=80mA)
0.4
0.26
0.70
5
0.5
0
0.75
10
0.450
100
LED Current to Operate
vs. Temperature
(IL=100mA)
15
139
0
-20
0.58
20
4.58
Turn-Off Time (ms)
1.1
IF=10mA
IF=5mA
IF=2mA
4.50 4.52 4.54 4.56
On-Resistance (:)
Turn-Off Time (ms)
1.3
4.48
Turn-On Time vs. LED Forward Current
(IL=80mA)
Turn-On Time (ms)
LED Forward Voltage (V)
IF=50mA
IF=20mA
0.42 0.46 0.50 0.54
Turn-Off Time (ms)
0
4.46
0.70
1.6
0.38
Blocking Voltage Distribution
15
LED Forward Voltage vs. Temperature
1.4
5
25
0
1.5
10
0.34
On-Resistance Distribution
(IF=2mA, IL=200mA)
20
0
0.45 0.50 0.55 0.60 0.65
LED Current to Operate (mA)
15
0.135 0.150 0.165 0.180 0.195 0.210 0.225
Turn-On Time (ms)
LED Current to Operate Distribution
(IL=100mA)
0.40
20
0
1.31
Device Count (N)
Device Count (N)
20
1.27
1.28
1.29
1.30
LED Forward Voltage (V)
Device Count (N)
1.26
Turn-Off Time Distribution
(IF=5mA, IL=200mA)
0.55
0.50
0.45
0.40
0.35
0.30
-40
-20
0
20
40
60
Temperature (ºC)
80
100
0.25
-40
-20
0
20
40
60
Temperature (ºC)
80
100
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R04
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INTEGRATED CIRCUITS DIVISION
LAA108
PERFORMANCE DATA@ 25ºC (Unless Otherwise Noted)*
0.6
6.0
Load Current (mA)
5.5
5.0
4.5
4.0
-40
-20
0
20
40
60
Temperature (ºC)
80
0.2
0.0
-0.2
-0.4
Blocking Voltage vs. Temperature
25
148
144
142
140
138
400
350
Single Pole Operating
300
250
200
* Neither pole to exceed
single pole limits
150
100
-0.2
-0.1
0.0
0.1
Load Voltage (V)
0.2
0.3
-40
Leakage Current vs. Temperature
Measured Across Pins 5 & 6, 7 & 8
(VL=100V)
-20
0
20
40
60
Temperature (ºC)
80
100
10s
100s
Energy Rating Curve
(Single Pole, IF=5mA)
1.0
0.9
20
146
Leakage (nA)
Blocking Voltage (VP)
150
Total Current - Both Poles Operating *
450
0.4
-0.6
-0.3
100
Maximum Load Current
vs. Temperature
(IF=5mA)
500
Load Curent (A)
On-Resistance (:)
6.5
Typical Load Current vs. Load Voltage
(IF=2mA)
Load Current (mA)
On-Resistance vs. Temperature
(IF=2mA, IL=200mA)
15
10
5
0.8
0.7
0.6
0.5
0.4
0.3
136
134
-40
-20
0
20
40
60
Temperature (ºC)
80
100
0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
0.2
10Ps 100Ps 1ms 10ms 100ms
Time
1s
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
4
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R04
INTEGRATED CIRCUITS DIVISION
LAA108
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
LAA108 / LAA108S / LAA108P
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
LAA108 / LAA108S
250ºC for 30 seconds
LAA108P
260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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INTEGRATED CIRCUITS DIVISION
LAA108
MECHANICAL DIMENSIONS
LAA108
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
8-0.800 DIA.
(8-0.031 DIA.)
2.540 ± 0.127
(0.100 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
PCB Hole Pattern
7.620 ± 0.254
(0.300 ± 0.010)
6.350 ± 0.127
(0.250 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
0.457 ± 0.076
(0.018 ± 0.003)
7.620 ± 0.127
(0.300 ± 0.005)
7.239 TYP.
(0.285)
4.064 TYP
(0.160)
7.620 ± 0.127
(0.300 ± 0.005)
0.254 ± 0.0127
(0.010 ± 0.0005)
Dimensions
mm
(inches)
0.813 ± 0.102
(0.032 ± 0.004)
LAA108S
9.652 ± 0.381
(0.380 ± 0.015)
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
0.635 ± 0.127
(0.025 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
PCB Land Pattern
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
7.620 ± 0.254
(0.300 ± 0.010)
0.254 ± 0.0127
(0.010 ± 0.0005)
0.65
(0.0255)
4.445 ± 0.127
(0.175 ± 0.005)
Dimensions
mm
(inches)
0.813 ± 0.102
(0.032 ± 0.004)
LAA108P
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
0 MIN / 0.102 MAX
(0 MIN / 0.004 MAX)
9.398 ± 0.127
(0.370 ± 0.005)
Pin 1
9.652 ± 0.381
(0.380 ± 0.015)
7.620 ± 0.254
(0.300 ± 0.010)
2.286 MAX.
(0.090 MAX.)
2.54
(0.10)
0.635 ± 0.127
(0.025 ± 0.005)
0.203 ± 0.013
(0.008 ± 0.0005)
8.70
(0.3425)
1.55
(0.0610)
0.65
(0.0255)
2.159 ± 0.025
(0.085 ± 0.001)
0.457 ± 0.076
(0.018 ± 0.003)
0.864 ± 0.120
(0.034 ± 0.004)
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PCB Land Pattern
Dimensions
mm
(inches)
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R04
INTEGRATED CIRCUITS DIVISION
LAA108
MECHANICAL DIMENSIONS
LAA108STR Tape & Reel
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
W=16.00
(0.63)
Bo=10.30
(0.406)
K0 =4.90
(0.193)
Ao=10.30
(0.406)
K1 =4.20
(0.165)
Embossed Carrier
Embossment
P=12.00
(0.472)
User Direction of Feed
Dimensions
mm
(inches)
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
LAA108PTR Tape & Reel
2.00
(0.079)
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
Embossment
W = 16.00
(0.63)
7.50
(0.295)
Bo = 10.30
(0.406)
K0 = 2.70
(0.106)
K1 = 2.00
(0.079)
Embossed Carrier
4.00
(0.157)
Ao = 10.30
(0.406)
P = 12.00
(0.472)
User Direction of Feed
Dimensions
mm
(inches)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
7
Specification: DS-LAA108-R04
©Copyright 2012, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/19/2012
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