VISHAY SI9142CW

Si9142
Vishay Siliconix
Si9142
Synchronous Buck Controller for High Performance Processors
FEATURES
•
•
•
•
•
Over-Voltage Protection
Programmable Over-Current Protection
Voltage Mode Control
Precision 1.3-V, ±1.6% Reference
Drives N-Channel Switch and Rectifier
•
•
•
•
•
800-µA Quiescent Current (fs = 200 kHz)
150-µA Standby Current
Integrated “Power Good” Output
Synchronization
Under-Voltage Lockout
DESCRIPTION
The voltage mode, synchronous buck controller is designed
for point-of-use dc/dc conversion in high performance server
and desktop computers. High efficiency is accomplished at full
load by driving high- and low-side n-channel MOSFETs. The
input voltage range has been designed for 4.75 V to 13.2 V to
allow use of either 5 V or 12 V. The 1-MHz switching
frequency combined with the 10-MHz error amplifier provides
ultra-fast transient response necessary in a high performance
microprocessor power supply.
Si9142 is available in a 20-pin SOIC wide-body package and
specified to operate over the commercial (0° to 70°C)
temperature range.
A demo board, Si9142DB, is available.
FUNCTIONAL BLOCK DIAGRAM
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ABSOLUTE MAXIMUM RATINGS
Continuous Power Dissipation (TA = 25°C)a
20-Pin SOIC Wide-Bodyb. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.45 W
Voltages Referenced to AGND
VSYNC_IN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to 7 V
VSYNC_OUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to 7 V
Operating Temperature Range. . . . . . . . . . . . . . . . . . . . . . . 0 to 70°C
VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to 15 V
Storage Temperature Range . . . . . . . . . . . . . . . . . . . . . . -65 to 125°C
Voltages Referenced to PGND
Lead Temperature (soldering, 10 sec) . . . . . . . . . . . . . . . . . . . . 300°C
TJMAX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
VBST . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to 20 V
VPGND to VAGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±2 V
ΘJA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .86°C/W
VL Short to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
Notes
VREF(OUT) Short to GND. . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
a. Device mounted with all leads soldered or welded to PC board.
b. Derate 11.6 mW/°C above 25°C.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.75 V to 13.2 V
VREF Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.1 µF
ROSC . . . . . . . . . . . . . . . . . . . . . . 100 kΩ (100 kHz) to 10 kΩ (1 MHz)
VREF Load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ≤1 mA
VL(out), (in) Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.7 µF
Analog and Digital Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 to VL
VL(out) Load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ≤1 mA
SPECIFICATIONS
Limits
Test Conditions
Unless Otherwise Specifed
Parameter
TA = 0 to 70°C
VCC = 4.75 V to 13.2 V
Mina
Typb
Maxa
IREF = 0
1.30 -1.6%
1.30
1.30 +1.6%
V
IREF = 0 to 1 mA
-10
10
mV
Unit
Reference
Output Voltage
Regulation
Line Rejection
At 10 kHz
80
dB
Oscillator
Operating Frequency
PWM Maximum Duty Cycle
Sync = Open
100
1000
fOSC = 200 kHz
94
fOSC = 400 kHz
88
SYNC High
IOH = -100 µA
0.7 VL
SYNC Low
IOL = 500 µA
0.3 VL
kHz
%
V
Output Drivers
Source/Sink I (Peak)
BST - LX = 4.5 V
H Driver
500
1000
VCC = 4.75 V
L Driver
500
1000
mA
Supply
Quiescent Current PWM
Standby Current Shutdown
fosc = 200 kHz
800
1200
VCC < 3.5 V
150
225
5.7
6.05
µA
VL
Output Voltage
Line Rejection
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IVL = 0, VCC = 5.7 to 13.2 V
4.95
IVL = 0, VCC = 4.7 to 5.7 V
VIN - 0.2 V
At 10 kHz
30
V
dB
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SPECIFICATIONS
Limits
Test Conditions
Unless Otherwise Specifed
TA = 0 to 70°C
Mina
Typb
Maxa
Unit
Source Current
-2.5
-5
-7.5
µA
Fault Sink Current
20
35
Parameter
VCC = 4.75 V to 13.2 V
SS/Enable
Logic Low
mA
0.8
Logic High
2.4
V
UVLO
Lockout Voltage
VL Falling
3.6
Hysteresis
3.8
200
V
mV
Error Amplifier
Unity-Gain BW Product
Input Bias Current
Offset Voltage
Output Current
VCC = 5 V
10
MHz
VNI = VREF , VFB = 1.0 V
-1
0
1
µA
VNI = VREF
-15.0
0
15.0
mV
Source (VFB = 0.8 V, NI = VREF)
-1
mA
Sink (VFB = 2.4 V, NI = VREF)
0.8
Typical Hysteresis = 1%
VNI = VREF
VNI + 7%
VNI +12%
VNI + 17%
VNI - 17%
VNI -12%
VNI - 7%
VDS ≤ 1 V
2
VNI = VREF
BST - LX = 4.5 V
VNI + 12%
VNI + 17%
VNI + 22%
V
4.75 ≤ VICS ≤ 13.2 V
126
170
204
µA
PWR_GOOD
VPWR_GOOD High
VPWR_GOOD Low
Output Sink Current
V
mA
OVP
Threshold Voltage
OCP
ICS Sink Current
Notes
a. The algebraic convention whereby the most negative value is a minimum and the most positive a maximum.
b. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
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Si9142
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TYPICAL CHARACTERISTICS (25°C UNLESS OTHERWISE NOTED)
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Si9142
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TYPICAL CHARACTERISTICS (25°C UNLESS OTHERWISE NOTED)
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Si9142
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PIN CONFIGURATION
ORDERING INFORMATION
Part Number
Temperature Range
Packaging
Si9142CW
0 to 70°C
Bulk
Ev Kit
Temperature Range
Board Type
Si9142 DB
0 to 70°C
Surface Mount
PIN DESCRIPTION
Pin Number
Symbol
1
NI
2
SS/Enable
3
FB
4
COMP
Description
Error amplifier non-inverting input
Soft-Start: Capacitor programmable or logic level controlled shutdown
Feedback
Compensation node for the external feedback circuit
5
VCC
Input Voltage: 4.75 V to 13.2 V
6
VREF
1.30 V precision reference
7
AGND
Ground: Connect to quiet ground.
8
ROSC
External resistor to determine switching frequency
9
NC
10
SYNC
11
PWR_GOOD
12, 13
PGND
Not internally connected
Synchronizing Clock
Power_Good window comparator output
Power Ground
Low-side gate driver for the synchronous rectifier
14
DL
15
VL(out)
16
VL(in)
17
LX
Inductor connection node
High-side gate driver for the power switch
5.5-V reference for gate drive supply
Reference input, connect to RC filter from VL(out)
18
DH
19
BST
Boost capacitor connection node to generate high-side gate drive
20
ICS
Programmable over current limit
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TIMING DIAGRAMS
FIGURE 1. Start-up Timing Sequence
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FIGURE 2. OVP Timing Diagram
FIGURE 3. OCP Timing Diagram
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DESCRIPTION OF OPERATION
The Si9142 is a voltage mode synchronous buck controller
designed to power a high performance microprocessor power
supply. The voltage mode control provides efficiency and cost
saving advantages over current mode control in high output
current converters by eliminating the current sense resistor.
The Si9142 provides ultra-fast (5-µsec) transient response
time and all the necessary protection circuits demanded by
microprocessor supply designers.
Pin 1. NI - Non-Inverting Input
NI is the non-inverting input of the error amplifier. For
converter output voltages equal to or greater than 1.3 V, the
NI pin can be connected directly to VREF. For converter output
voltages less than 1.3 V, the NI pin can be connected to VREF
through a voltage divider.
Pin 2. SS/Enable - Soft-Start/Enable
Soft-start is accomplished by connecting a capacitor from this
pin to AGND. The soft-start functions as a constant current
source into this capacitor. A logic low (≤0.8 V) on this pin
disables the output gate drives; the oscillator continues to
function. A logic high (≥2.4 V) enables the output gate drives,
assuming the input voltage is above the UVLO threshold, and
that no over-voltage or over-current condition exists.
Pins 3 and 4. FB and COMP - Error Amplifier
FB is the inverting input of the error amplifier. The voltage on
this pin is also connected internally to the input terminals of
the OVP and PWR_GOOD comparators for fault detection
and protection. The error amplifier has 10-MHz gainbandwidth when connected to a 20-pF load with 5-V input
voltage. COMP is the output of the error amplifier. The output
voltage is clamped at a maximum level to avoid long delays
due to saturation during large transient conditions. The
minimum COMP voltage is a diode drop below the 0% duty
cycle voltage; the maximum voltage is a diode drop above the
94% duty cycle voltage.
Pin 5. VCC - Input Voltage
The VCC pin should be connected to the input voltage for
optimum performance. The input voltage range of the Si9142
is specified to operate with either +5 VDC or +12 VDC. In
order to accommodate the tolerance of the +12 V, and the
possibility of using this controller in 2-cell Li+ notebook
applications with a battery charger, the input voltage is rated
up to +15-V absolute maximum.
Pin 7. AGND - Analog Ground
AGND is the analog ground for the low power circuitry in the
converter. This ground should be separated locally from
PGND, and should have a separate run back to the input
bypass capacitors.
Pin 8. ROSC - Oscillator Timing Resistor
A resistor from this pin to AGND determines the internal
switching frequency of the oscillator. The internal circuitry
produces 10% frequency accuracy with a 1% timing resistor.
The oscillator is capable of switching at up to 1 MHz.
Pin 10. SYNC - Synchronization
The SYNC signal is generated from the internal oscillator.
When the oscillator is ramping positive, SYNC will be logic
high; when the oscillator is ramping negative, SYNC will be
logic low. The SYNC pin can be used to synchronize the
Si9142 to an external clock. In particular, if several Si9142s
have their SYNC pins shorted together, they will all switch at
the same frequency and in phase, with the frequency being
set by the fastest oscillator.
Pin 11. PWR_GOOD - Open Collector Power Good Signal
This pin signals the status of the output voltage. The window
comparator is set at ±12% of the voltage at the NI pin, with a
tolerance of 5%. The PWR_GOOD signal is an open drain
output capable of sinking 2 mA.
Pins 12 and 13. PGND - Power Ground
PGND is the power ground for the high power circuitry in the
converter. This ground should be separated locally from
AGND, and should have a separate plane run back to the
input bypass capacitors.
Pins 14 and 18. DL and DH - Low- and High-Side Gate
Drives
DH is the high-side and DL the low-side gate drive to the
external MOSFETs. Both can source and sink 2.5-A peak with
4.5-V gate drives. The timing sequence of high- and low-side
gate drives is shown in Figure 1. The internal break-beforemake time interval (tBBM) of 55 nsec prevents shootthrough
current in the external MOSFETs. The ringing from the gate
drive output’s trace inductance can produce negative voltages
on DH and DL as much as 2-V negative with respect to PGND.
The gate drive circuit is capable of withstanding these
negative voltages without any functional defects.
Pin 6. VREF - Reference Voltage
The reference voltage is designed to produce 1.30 V ±1.6%
over the line and temperature range, to produce equally tight
output regulation of the converter. The reference should be
decoupled with at least 100-nF capacitance. The reference is
capable of driving 1mA of external load.
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Pins 15 and 16. VL(out) and VL(in) - +5.5-V Linear Regulator
VL(out) produces a +5.5-V output used as the gate drive
voltage for both the high- and low-side external MOSFETs.
The gate drive voltage for the high-side MOSFET is
bootstrapped (VL(out) - VDIODE) above the input voltage.
VL(out) should be bypassed with at least 4.7 µF of decoupling
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Si9142
Vishay Siliconix
capacitance, and should not be used for any other external
loads. VL(in) drives the internal circuitry. It should be
connected through an RC filter to VL(out).
Pin 17. LX - Inductor Node
The LX node is used internally to float the high-side n-channel
MOSFET gate drive. During the on-time of this MOSFET, the
gate to source voltage will be (VL(out) - VDIODE). The LX node
is also used internally as the negative sense voltage for overcurrent protection.
Pin 19. BST - Bootstrap Voltage
The external high-side n-channel MOSFET gate drive voltage
is derived by bootstrapping the VL(out) voltage on top of the
input supply voltage. The external 100-nF capacitor
connected across the BST and LX pins is charged to (VL(out) VDIODE) when the external low-side MOSFETs are on. Then,
when the low-side MOSFETs are turned off, BST is internally
connected to DH in order to turn on the high-side MOSFET. DL
is turned on at startup to ensure initial charging of the BST
capacitor.
Pin 20. ICS - Programmable Over-Current Protection
The over-current protection circuit senses the voltage across
the external high-side n-channel MOSFET to determine the
presence of an over-current condition. Current sensing occurs
only during the on-time of this MOSFET. The trigger level of
the over-current circuit is programmable by selecting the
external resistor value connected from VCC to ICS. Once the
over-current circuit has been triggered, it disables both output
gate drives within 250 nsec. The circuit also discharges the
soft-start capacitor as shown in the timing diagram in
Figure 3.
Under Voltage Lock-Out (UVLO)
The internal UVLO circuit is designed to prevent a converter
from starting when insufficient input voltage is present. UVLO
disables the oscillator, soft-start and output drives of the
Si9142 until VL(out) reaches 3.8 V; see Figure 1. The UVLO
circuit has 200-mV hysteresis to prevent turn-on and -off
oscillations. When the oscillator is disabled, the Si9142 is in
stand-by mode, and consumes only 150 µA of supply current.
Start-up Timing Sequence
Please refer to Figure 1 for this description. When V CC
reaches 4 V, VL(out) produces at least 3.8 V, and VREF has
stabilized and is regulating. The UVLO circuit enables the
oscillator and the soft-start circuits. Once the soft-start voltage
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exceeds 1.5 V, the gate drive pulses begin, with the duty cycle
of the high-side MOSFET beginning at 0% and gradually
increasing until the output voltage is in regulation.
APPLICATIONS
Setting the Current Limit
The current limit is set by comparing the voltage drop across
the external high-side n-channel MOSFET with the voltage
dropped across a sense resistor connected between VCC and
ICS. The ICS pin draws a constant current, and thus the
equation governing the overcurrent threshold is:
170 µA * R = ILimit * RMOSFET
Once the on-state resistance of the MOSFET is known, R can
be selected to set the desired current limit. One caution is in
order: since the MOSFET will normally be quite warm, the
resistance used in the equation should be the maximum
resistance at elevated temperatures, not typical resistance at
25°C. The designer should also leave adequate margin above
the normal output current, both to account for tolerances and
noise in the IC, as well as to permit any initial high currents
while charging output capacitors.
The Boost Diode
The application circuit shows the use of a 1N4148 diode for
the boost circuit. This provides a low-cost component for this
application. However, it may be advantageous in some circuits
to use a Schottky diode instead. The difference is that the
Schottky has less forward drop than the regular rectifier, and
this in turn means a somewhat greater gate drive voltage for
the external high-side MOSFET. For MOSFETs with high gate
threshold and/or low transconductance, the additional gate
drive may prove very beneficial in terms of the heating of the
MOSFET, and in turn the efficiency of the converter. A ½-A,
30-V Schottky works well in this application.
Grounding
The Si9142 is provided with both analog and power ground
pins (AGND and PGND, respectively). Because of the high
gate drive currents the Si9142 can source, it is essential that
these two grounds be separated. PGND should be attached
to the source of the external low-side MOSFET; AGND should
be attached to the small-signal components of the circuit,
such as the timing resistor and the feedback resistor. Each of
these grounds should be run back independently to the input
line capacitors, to avoid ground loops.
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FIGURE 4. High Performance Converter
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