AVAGO APDS-9008 Miniature surface-mount ambient light photo sensor Datasheet

APDS-9008
Miniature Surface-Mount Ambient Light Photo Sensor
Data Sheet
Description
Features
The APDS-9008 is a low cost analog-output ambient
light photo sensor in miniature chipLED lead-free surface
mount package. It consists of a spectrally suited photo
sensor, which provides excellent responsivity that is close
to the response of the human eyes, as show in figure 2.
The APDS-9008 is ideal for applications in which the measurement of ambient light is used to control display backlighting. Mobile appliances such as the mobile phones
and PDAs that draw heavy current from display backlighting will benefit from incorporating these photo sensor
products in their designs by reducing power consumption significantly.
• Excellent responsivity
Application Support Information
The Application Engineering Group is available to assist
you with the application design associated with APDS9008 ambient light photo sensor module. You can contact them through your local sales representatives for additional details.
- Close responsivity to the human eye
• Miniature ChipLED Leadfree surface-mount package
Height – 0.55 mm
Width – 1.60 mm
Depth – 1.50 mm
• Low sensitivity variation across various light sources
• Operating temperature : -40°C to 85°C
• Vcc supply 1.6 to 5.5V
• Lead-free package, RoHS compliance
• Output linearity across wide illumination range
• High output saturation voltage
Applications
• Detection of ambient light to control display
backlighting
Mobile devices – Mobile phones, PDAs
Computing devices – Notebooks, Webpads
Consumer devices – TVs, Video Cameras, Digital
Still Camera
• Automatic Residential and Commercial Lighting
Management
• Electronic Signs and Signals
Ordering Information
Part Number
Packaging Type
Package
Quantity
APDS-9008-020
Tape and Reel
6-pins Chipled package
2500
Typical Application Circuit
VCC [1]
APDS-9008
OUT [6]
I/O Pins Configuration Table
GND [4]
LOAD
Figure 1. Typical application circuit for APDS-9008
Pin
Symbol
Description
1
VCC
VCC
2
NC
No Connect
3
NC
No Connect
4
GND
Ground
5
NC
No Connect
6
Iout
Out
Absolute Maximum Ratings
For implementations where case to ambient thermal resistance is ≤ 50 °C /W
Parameter
Symbol
Min.
Max.
Units
Storage Temperature
TS
-40
85
°C
Supply Voltage
VCC
0
6
V
Recommended Operating Conditions
Parameter
Symbol
Min.
Max.
Units
Operating Temperature
TA
-40
85
°C
Supply Voltage
VCC
1.6
5.5
V
CAUTION: It is advised that normal static precautions be taken in handling and assembly
of this component to prevent damage and/or degradation which may be induced by ESD.
2
Conditions
Electrical & Optical Specifications (Ta=25°C)
Parameter
Symbol
Supply Current
ICC
Min.
Typ.
Max.
42
28
40
52
Units
Conditions
μA
Vcc =1.8V, Lux = 100 (2)
Photo Current (I)
I_PH1
μA
Vcc =1.8V, Lux = 100 (2)
Photo Current (II)
I_PH2
44
μA
Vcc =1.8V, Lux = 100 (1)
Dark Current
I_DARK
300
nA
Vcc =1.8V, Lux = 0
Light Current Ratio
I_PH2/I_PH1
1.1
Rise Time
Tr
5
ms
Rl = 1Kohm, Lux = 100
Fall Time
Tf
5
ms
R1 = 1Kohm, Lux=100
Settling Time
Tset
10
ms
R1=2.4Kohm,Lux=100
Peak sensitivity wavelength
λ
565
nm
Propagation delay
Td
5
ms
Rl = 1Kohm, Lux = 100
Storage delay
Ts
5
ms
R1 = 1Kohm, Lux=100
Saturation voltage
Vsat
V
R1 = 100Kohm, Lux = 100, Vcc=1.8V
Incandescent light / Fluorescent light
1.5
Notes :
1. Illuminance by CIE standard light source (Incandescent lamp)
2. Fluorescence light is used as light source, however, white LED is substituted in a mass production process.
Light Measurement Circuit and Waveforms
Pin 1:Vcc
I_pulse
Pin 2,3,5: NC
I_pulse
Pin 6:Iout
APDS-9008
Pin 4: GND
Vout
Tf
Tr
Td
Ts
Vcc pulse from pulse generator
Vcc
t
Sensor output at load
Vout
90 %
t
Tset
3
Tset
450.0E-6
1
9008 Spectral response
Eye Response
400.0E-6
350.0E-6
Output Current [A]
Relative response
0.8
0.6
0.4
300.0E-6
250.0E-6
200.0E-6
150.0E-6
100.0E-6
0.2
50.0E-6
0
300
000.0E+0
400
500
600
700
Wavelength in nm
800
900
1.40
1.20
1.20
1.10
1.00
1.00
0.80
0.90
0.60
0.70
0.20
0.60
-20
0
20
40
60
Temperature in Degrees
80
0.50
1.8
100
2.3
2.8
3.3
3.8
4.3
4.8
5.3
VCC
Figure 4. Relative Iout Vs Temp (Vcc=1.8v, 100 Lux)
Figure 5. Relative Iout Vs Vcc (T=25°C, 100 Lux)
1.40
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.20
1.00
REL AVG-ICC
Relative Iout response
0.80
0.40
0.00
-40
100 200 300 400 500 600 700 800 900 1000
LUX
Figure 3. Average Iout Vs Lux (Vcc=1.8v, T=25°C, White LED source)
Rel IOUT
Relative Iout
Figure 2. Relative Spectral Response Vs Wavelength
0.80
0.60
0.40
0.20
-90
-70
-50
-30
-10
10
30
Angle in Degrees
Figure 6. Relative Iout Vs Angle ( Vcc=1.8V, T=25°C)
4
0
1000
50
70
90
0.00
-40
REL Avg-ICC Vs TEMP at 100LUX
-20
0
20
40
60
Temperature in Degrees
80
Figure 7. Relative Average Icc Vs Temp ( Vcc=1.8V, T=25°C, 100 Lux)
100
1.40E-06
1.10
1.20E-06
1.00
1.00E-06
0.90
8.00E-07
IDark
Rel ICC
1.20
0.80
0.70
4.00E-07
0.60
2.00E-07
0.50
1.8
2.3
2.8
3.3
3.8
4.3
4.8
5.3
VCC
Figure 8. Relative average Icc Vs Vcc (T=25°C, 100 Lux)
Vout (V)
R=12k
1.6
R=10k
1.2
R=8.2k
0.8
R=6.8k
R=4.7k
0.4
R=1k
0.0
0
200
400
600
800
LUX
Figure 10. General Luminance Vs Typical Output Voltage
(Vcc=1.8V, T=25°C, Light Source = White LED)
0.00E+00
-40
-20
0
20
40
Temp in Degrees
Figure 9. Dark Current Vs Temp (Vcc=1.8V)
2.0
5
6.00E-07
1000
60
80
100
APDS-9008 Package Outline
6
APDS-9008 Tape and Reel Dimension
7
Moisture Proof Packaging
UNITS IN A SEALED
MOISTURE-PROOF
PACKAGE
PACKAGE IS OPENED
(UNSEALED)
NO
PARTS ARE NOT
RECOMMENDED TO BE
USED
ENVIRONMENT LESS
THAN 30 °C AND
LESS THAN 60%RH
YES
PACKAGE IS OPENED
LESS THAN 168
HOURS
YES
NO BAKING IS
NECESSARY
NO
NO
PACKAGE IS OPENED
LESS THAN 15 DAYS
YES
PERFORM
RECOMMENDED BAKING
CONDITIONS
All APDS-9008 options are shipped in moisture proof
package. Once opened, moisture absorption begins. This
part is compliant to JEDEC Level 3.
Baking Conditions:
Recommended Storage Conditions:
Storage Temperature
100°C to 300°C
Relative Humidity
below 60% RH
Package
Temperature
Time
Time from unsealing to soldering:
In Reel
60°C
48 hours
In Bulk
100°C
6 hours
After removal from the bag, the parts should be soldered
within 168 hours if stored at the recommended storage
conditions. If times longer than 168 hours are needed, the
parts must be stored in a dry box.
* Baking should only be done once.
8
Recommended Reflow Profile
MAX 260°C
T - TEMPERATURE (°C)
255
R3
230
217
200
180
150
120
R2
R4
60 sec to 90 sec
Above 217°C
R5
R1
80
25
0
50
P1
HEAT
UP
100
150
P2
SOLDER PASTE DRY
250
P4
COOL DOWN
300
t-TIME
(SECONDS)
Process Zone
Symbol
ΔT
Maximum ΔT/Δtime or
Duration
Heat Up
P1, R1
25°C to 150°C
3°C/s
Solder Paste Dry
P2, R2
150°C to 200°C
100s to 180s
Solder Reflow
P3, R3
P3, R4
P4, R5
200°C to 260°C
260°C to 200°C
200°C to 25°C
3°C/s
-6°C/s
-6°C/s
Cool Down
Time maintained above liquidus point , 217°C
> 217°C
60s to 120s
Peak Temperature
260°C
-
Time within 5°C of actual Peak Temperature
>255°C
20s to 40s
Time 25°C to Peak Temperature
25°C to 260°C
8mins
The reflow profile is a straight-line representation of a
nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four
process zones, each with different ΔT/Δtime temperature
change rates or duration. The ΔT/Δtime rates or duration
are detailed in the above table. The temperatures are
measured at the component to printed circuit board connections.
Process zone P1, the PC board and component pins are
heated to a temperature of 150°C to activate the flux in
the solder paste. The temperature ramp up rate, R1, is limited to 3°C per second to allow for even heating of both
the PC board and component pins.
Process zone P2 should be of sufficient time duration (100
to 180 seconds) to dry the solder paste. The temperature
is raised to a level just below the liquidus point of the solder.
Process zone P3 is the solder reflow zone. In zone P3, the
temperature is quickly raised above the liquidus point of
9
200
P3
SOLDER
REFLOW
solder to 260°C (500°F) for optimum results. The dwell time
above the liquidus point of solder should be between 60
and 120 seconds. This is to assure proper coalescing of the
solder paste into liquid solder and the formation of good
solder connections. Beyond the recommended dwell time
the intermetallic growth within the solder connections
becomes excessive, resulting in the formation of weak
and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of
the solder to allow the solder within the connections to
freeze solid.
Process zone P4 is the cool down after solder freeze. The
cool down rate, R5, from the liquidus point of the solder
to 25°C (77°F) should not exceed 6°C per second maximum. This limitation is necessary to allow the PC board
and component pins to change dimensions evenly, putting minimal stresses on the component.
It is recommended to perform reflow soldering no more
than twice.
Appendix A. SMT Assembly Application Note
1.0 Solder Pad, Mask and Metal Stencil Aperture
1.2 Recommended Metal Solder Stencil Aperture
Metal Stencil For
Solder Paste
Printing
Stencil
Aperture
Land
Pattern
Solder
Mask
It is recommended that a 0.11 mm (0.004 inches) thick
stencil be used for solder paste printing. Aperture opening for shield pad is 0.4mm x 0.4mm and 0.2mm x 0.4mm
(as per land pattern). This is to ensure adequate printed
solder paste volume and no shorting.
Aperture
Opening
0.11
PCBA
1.6
1.7
Unit: mm
Figure A1. Stencil and PCBA
Figure A3. Solder Stencil Aperture
1.1 Recommended Land Pattern
1.3 Adjacent Land Keepout and Solder Mask Areas
CL
Adjacent land keep-out is the maximum space occupied
by the unit relative to the land pattern. There should be no
other SMD components within this area.
0.4
0.3
The minimum solder resist strip width required to avoid
solder bridging adjacent pads is 0.2 mm.
Note: Wet/Liquid Photo-Imageable solder resist/mask is
recommended.
0.45
2.6
0.9
0.4
0.2
Mounting
Center
2.7
0.4
Figure A2. Recommended Land Pattern
Unit: mm
0.2 MIN.
Figure A4. Adjacent Land Keepout and Solder Mask Areas
10
Appendix B. Optical Window Design for APDS-9008
1.0 Optical Window Dimensions
To ensure that the performance of the APDS-9008 will not
be affected by improper window design, there are some
constraints on the dimensions and design of the window.
There is a constraint on the minimum size of the window,
which is placed in front of the photo light sensor, so that
it will not affect the angular response of the APDS-9008.
This minimum dimension that is recommended will ensure at least a ±35° light reception cone.
If a smaller window is required, a light pipe or light guide
can be used. A light pipe or light guide is a cylindrical
piece of transparent plastic, which makes use of total internal reflection to focus the light.
Table 1 and Figure B3 below show the recommended
dimensions of the window. These dimension values are
based on a window thickness of 1.0mm with a refractive
index 1.585.
D1
T
WD
The thickness of the window should be kept as minimum
as possible because there is a loss of power in every optical
window of about 8% due to reflection (4% on each side)
and an additional loss of energy in the plastic material.
Figure B1 and B2 illustrate the two types of window that
we have recommended which could either be a flat window or a flat window with light pipe.
Flat
Top View
D2 D1
L
Z
APDS-9008
Light Receving Area
Figure B3. Recommended Window Dimensions
WD: Working Distance between window front panel &
APDS-9008
D1:
Window Diameter
T:
Thickness
L:
Length of Light Pipe
D2:
Light Pipe Diameter
Z:
Distance between window rear panel and
APDS-9008
Table 1. Recommended dimension for optical window
All dimensions are in mm
Figure B1. Window Size Determination for Flat Window
WD
(T+L+Z)
Flat Window
(L=0.0)
Flat window
with Light Pipe
(D2=1.5; Z =0.5)
Z
D1
D1
L
1.5
0.5
2.25
-
-
2.0
1.0
3.25
-
-
2.5
1.5
4.25
-
-
3.0
2.0
5.00
2.5
1.5
The window should be placed directly on top of the photo
sensor to achieve better performance and if a flat window
with a light pipe is used, dimension D2 should be 1.5mm
to optimize the performance of APDS-9008.
Figure B2. Window Design of Flat Window with Light Guide
11
2.1 Optical Window Material
The material of the window is recommended to be polycarbonate. The surface finish of the plastic should be
smooth, without any texture.
The recommended plastic material for use as a window is
available from Bayer AG and Bayer Antwerp N. V. (Europe),
Bayer Corp.(USA) and Bayer Polymers Co., Ltd. (Thailand),
as shown in Table 2.
Table 2. Recommended Plastic Materials
Material number
Visible light
transmission
Refractive index
Makrolon LQ2647
87%
1.587
Makrolon LQ3147
87%
1.587
Makrolon LQ3187
85%
1.587
by the brightness of the light shone on the photo sensor
and the load resistor used, RL. Increasing the brightness of
the light or/and the load resistor will increase the output
voltage.
Brightness is measured as “LUX” unit, which describes how
intense a light source that our eyes perceive. LUX meter is
the equipment for “LUX” measurement. Light sources with
the same LUX level appear at the same brightness to the
human eyes.
Vcc
Light
Source
1
NC
2,3,5
APDS-9008
Vout
6
C
4
Appendix C . General Application Guide for APDS-9008
The APDS-9008 is a low cost analog-output ambient light
photo sensor whose spectral response closely emulates
the human eyes. APDS-9008 consists of a photo sensor that is able to produce a high gain photo current to
a sufficient level that can be converted to voltage with a
standard value of external resistor. APDS-9008 can easily
be integrated into systems that use ADC input which is
available for sampling of the external source, as shown in
figure C1 below.
The amount of converted voltage, Vout, is mainly dependant proportionally on the photo current which generated
For product information and a complete list of distributors, please go to our web site:
A/D
RL
Microcontroller
Figure C1. Configuration of APDS-9008
Selection of the load resistor RL will determine the amount
of current-to-voltage conversion in the circuit.
Light source e.g. fluorescent light consists of ac noise frequency of about 100Hz. A capacitor of 10uF, which act as a
low-pass filter, is recommended to add in parallel with the
load resistor to reduce the ripples.
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Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved.
AV02-1169EN - November 7, 2008
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