TI1 BUF18830AIRGFR Programmable gamma-voltage generator with two high slew rate vcom Datasheet

BUF18830
SBOS408A – MAY 2011 – REVISED JUNE 2011
www.ti.com
Programmable GAMMA-VOLTAGE GENERATOR
with Two High Slew Rate VCOMs
Check for Samples: BUF18830
FEATURES
DESCRIPTION
•
•
The BUF18830 offers 18 programmable gamma
channels and two programmable VCOM channels.
1
2
•
•
•
•
•
•
•
10-BIT RESOLUTION
18-CHANNEL P-GAMMA:
– 300-mV Min Swing-to-Rail (10 mA)
TWO-CHANNEL P-VCOM:
– 400-mA Typical IOUT
HIGH SLEW RATE VCOM: 45 V/μs
RAIL-TO-RAIL OUTPUT
LOW SUPPLY CURRENT
SUPPLY VOLTAGE: 6.5 V to 20 V
DIGITAL SUPPLY: 2.0 V to 5.5 V
TWO-WIRE INTERFACE: Supports 400 kHz and
3.4 MHz
All gamma and VCOM channels offer a rail-to-rail
output that typically swings to within 300 mV of either
supply rail with a 10-mA load. All channels are
programmed using a two-wire interface that supports
standard operations up to 400 kHz and high-speed
data transfers up to 3.4 MHz.
The BUF18830 is manufactured using Texas
Instruments’ proprietary, state-of-the-art, high-voltage
CMOS process. This process offers very dense logic
and high supply voltage operation of up to 20 V. The
BUF18830 is offered in a QFN-38 package and is
specified from –40°C to +85°C.
APPLICATIONS
•
TFT-LCD AND OLED REFERENCE DRIVERS
BUF18830
VS
Gamma DAC Registers
Gamma DAC Registers
VSD
DAC
OUT0
DAC
OUT1
DAC
OUT16
DAC
OUT17
GNDA
A0
SDA
SCL
Control
I/F
VCOM DAC Registers
GNDD
VCOM DAC Registers
VS-VCOM
DAC
VCOM-OUT1
VCOM-Feedback1
DAC
VCOM-OUT2
VCOM-Feedback2
GND-VCOM
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011, Texas Instruments Incorporated
To request a full data sheet, send an email to:
[email protected]
Include the product name in the subject line of your message.
PACKAGE OPTION ADDENDUM
www.ti.com
1-Jul-2011
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
BUF18830AIRGFR
ACTIVE
VQFN
RGF
38
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168HRS
BUF18830AIRGFT
ACTIVE
VQFN
RGF
38
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
Samples
(Requires Login)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
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provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Jun-2011
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
BUF18830AIRGFR
VQFN
RGF
38
3000
330.0
16.4
5.25
7.25
1.45
8.0
16.0
Q1
BUF18830AIRGFT
VQFN
RGF
38
250
180.0
16.4
5.25
7.25
1.45
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Jun-2011
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
BUF18830AIRGFR
VQFN
RGF
38
3000
346.0
346.0
33.0
BUF18830AIRGFT
VQFN
RGF
38
250
190.5
212.7
31.8
Pack Materials-Page 2
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