Material Content Data Sheet Sales Product Name BSB280N15NZ3 G MA# MA001355930 Package MG-WDSON-2-9 Issued Weight* Construction Element Material Group Substances CAS# if applicable chip leadframe leadfinish inorganic material non noble metal non noble metal noble metal non noble metal plastics noble metal non noble metal noble metal non noble metal plastics < 10% silicon copper nickel silver nickel epoxy resin silver copper silver tin epoxy resin 7440-21-3 7440-50-8 7440-02-0 7440-22-4 7440-02-0 7440-22-4 7440-50-8 7440-22-4 7440-31-5 - plating glue solder passivation *deviation 4. September 2015 Weight [mg] 83.57 mg Average Mass [%] Sum [%] Average Mass [ppm] 4.059 4.86 4.86 48567 48567 74.415 89.04 89.04 890422 890422 0.211 0.25 0.840 1.01 1.26 10051 12578 0.211 0.25 0.25 2527 2527 0.184 0.22 2527 2201 1.130 1.35 0.011 0.01 1.57 13519 0.066 0.08 2.119 2.54 2.63 25350 0.327 0.39 0.39 3917 2. 3. 788 Sum in total: 100.00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 15720 131 Important Remarks: 1. Sum [ppm] 26269 3917 1000000