FCX458 400V NPN HIGH VOLTAGE TRANSISTOR IN SOT89 Features Mechanical Data BVCEO > 400V IC = 225mA Continuous Collector Current ICM = 500mA Peak Pulse Current Excellent hFE Characteristics up to 100mA Low saturation voltage VCE(sat) < 200mV @ 20mA Complementary PNP Type: FCX558 Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability SOT89 Case: SOT89 Case Material: Molded Plastic. “Green” Molding Compound. UL Flammability Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminals: Finish - Matte Tin Plated Leads, Solderable per MIL-STD-202, Method 208 Weight: 0.055 grams (Approximate) C E C C B B E Top View Top View Pin-Out Equivalent Circuit Ordering Information (Note 4) Product FCX458TA Notes: Compliance AEC-Q101 Marking N58 Reel size (inches) 7 Tape width (mm) 12mm Quantity per reel 1,000 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen and Antimony free, "Green" and Lead-Free. 3. Halogen and Antimony free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 4. For packaging details, go to our website at http://www.diodes.com/products/packages.html. Marking Information N1 N58 FCX458 Document number: DS33053 Rev. 7 - 2 N58 = Product Type Marking Code 1 of 7 www.diodes.com April 2017 © Diodes Incorporated FCX458 Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.) Symbol Value Unit Collector-Base Voltage Characteristic VCBO 400 V Collector-Emitter Voltage VCEO 400 V VEBO 7 V Emitter-Base Voltage Continuous Collector Current Peak Pulse Current IC 225 mA ICM 500 mA IB 200 mA Base Current Thermal Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol (Note 5) (Note 6) (Note 7) (Note 8) (Note 5) (Note 6) (Note 7) (Note 8) Power Dissipation Thermal Resistance, Junction to Ambient Air Thermal Resistance, Junction to Lead Value PD RJA (Note 9) Operating and Storage Temperature Range Unit 0.7 1 1.5 2 178 125 83 60 W °C/W RJL 22 TJ, TSTG -65 to +150 °C ESD Ratings (Note 10) Characteristic Electrostatic Discharge - Human Body Model Electrostatic Discharge - Machine Model Notes: Symbol ESD HBM ESD MM Value 4,000 400 Unit V V JEDEC Class 3A C 5. For a device mounted with the exposed collector pad on minimum recommended pad layout (MRP) 1oz copper that is on a single-sided 1.6mm FR4 PCB; device is measured under still air conditions whilst operating in a steady-state. 6. Same as Note 5, except the device is mounted with the exposed collector pad on 15mm x 15mm 1oz copper. 7. Same as Note 5, except the device is mounted with the exposed collector pad on 25mm x 25mm 1oz copper. 8. Same as Note 5, except the device is mounted with the exposed collector pad on 50mm x 50mm 1oz copper. 9. Thermal resistance from junction to solder-point (on the exposed collector pad). 10. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 140.0 3 120.0 100.0 80.0 1oz copper 60.0 Maximum Power (W) Thermal Resistance (°C/W) Thermal Characteristics and Derating Information 2oz copper 40.0 0 500 1000 1500 Document number: DS33053 Rev. 7 - 2 2oz copper 2 1oz copper 1 0 2000 2500 Copper Area (sqmm) FCX458 T A=25°C 0 500 1000 1500 2000 2500 Copper Area (sqmm) 2 of 7 www.diodes.com April 2017 © Diodes Incorporated FCX458 15mm x 15mm 1oz FR4 PCB 1.0 0.8 0.6 0.4 0.2 0.0 0 20 40 60 80 100 120 140 160 MRP 1oz FR4 PCB 0.8 0.6 0.4 0.2 0.0 0 40 60 80 100 120 140 160 Derating Curve Derating Curve 100 15mm x 15mm 1oz FR4 PCB Single Pulse T A=25°C 10 1 100µ 1m Pulse Width (s) 10m 100m 1 1k 100 160 MRP 1oz FR4 PCB Maximum Power (W) MRP 1oz FR4 PCB 140 120 100 D=0.5 80 40 100 Pulse Power Dissipation 180 60 10 Pulse Width (s) Transient Thermal Impedance Thermal Resistance (°C/W) 20 Temperature (°C) 130 120 15mm x 15mm 1oz FR4 PCB 110 100 90 80 70 D=0.5 60 50 40 D=0.2 Single Pulse 30 D=0.05 20 10 D=0.1 0 100µ 1m 10m 100m 1 10 100 1k Thermal Resistance (°C/W) 1.0 Temperature (°C) Maximum Power (W) Max Power Dissipation (W) 1.2 Max Power Dissipation (W) Thermal Characteristics and Derating Information (cont.) Single Pulse D=0.2 D=0.05 20 0 100µ D=0.1 1m 10m 100m 1 10 100 Pulse Width (s) 1k Single Pulse T A=25°C 10 1 100µ Document number: DS33053 Rev. 7 - 2 10m 100m 1 10 100 1k Pulse Width (s) Transient Thermal Impedance FCX458 1m Pulse Power Dissipation 3 of 7 www.diodes.com April 2017 © Diodes Incorporated FCX458 Electrical Characteristics (@TA = +25°C, unless otherwise specified.) Symbol Min Typ Max Unit Collector-Base Breakdown Voltage Characteristic BVCBO 400 550 — V IC = 100µA Collector-Emitter Breakdown Voltage BVCES 400 550 V IC = 100µA Collector-Emitter Breakdown Voltage (Note 11) BVCEO 400 450 — V IC = 1mA Emitter-Base Breakdown Voltage BVEBO 7 8.1 — V IE = 100µA ICBO — <1 100 nA VCB = 320V Collector Cutoff Current ICES — <1 100 nA VCES = 320V Emitter Cutoff Current IEBO — <1 20 nA VEB = 6V — — — — 200 500 mV IC = 20mA, IB = 2mA IC = 50mA, IB = 6mA Collector-Base Cutoff Current Test Condition Collector-Emitter Saturation Voltage (Note 11) VCE(sat) Base-Emitter Saturation Voltage (Note 11) VBE(sat) — — 900 mV IC = 50mA, IB = 5mA VBE(on) — — 900 mV IC = 50mA, VCE = 10V hFE 100 100 15 — 300 — IC = 1mA, VCE = 10V IC = 50mA, VCE = 10V IC = 100mA, VCE = 10V fT 50 — — MHz IC = 10mA, VCE = 20V, f = 20MHz Base-Emitter Turn-On Voltage (Note 11) DC Current Gain (Note 11) Transitional Frequency Cobo — — 5 pF VCB = 20V. f = 1MHz Turn-On Time ton — 135 — ns Turn-Off Time toff — 2260 — ns IC =50mA, VCE=100V, IB1 = 5mA, IB2 = -10mA Output Capacitance Note: 11. Measured under pulsed conditions. Pulse width ≤ 300µs. Duty cycle ≤ 2% FCX458 Document number: DS33053 Rev. 7 - 2 4 of 7 www.diodes.com April 2017 © Diodes Incorporated FCX458 Typical Electrical Characteristics FCX458 Document number: DS33053 Rev. 7 - 2 (@TA = +25°C, unless otherwise specified.) 5 of 7 www.diodes.com April 2017 © Diodes Incorporated FCX458 Package Outline Dimensions Please see http://www.diodes.com/package-outlines.html for the latest version. D1 0 .20 c R0 SOT89 Dim Min Max Typ A 1.40 1.60 1.50 B 0.50 0.62 0.56 B1 0.42 0.54 0.48 c 0.35 0.43 0.38 D 4.40 4.60 4.50 D1 1.62 1.83 1.733 D2 1.61 1.81 1.71 E 2.40 2.60 2.50 E2 2.05 2.35 2.20 e 1.50 H 3.95 4.25 4.10 H1 2.63 2.93 2.78 L 0.90 1.20 1.05 L1 0.327 0.527 0.427 z 0.20 0.40 0.30 All Dimensions in mm H E B1 L B e D2 8° (4 X) H1 E2 A L1 D z Suggested Pad Layout Please see http://www.diodes.com/package-outlines.html for the latest version. X2 Dimensions Y1 Y4 X Y C G X X1 X2 Y Y1 Y2 Y3 Y4 Y3 G Y2 Value (in mm) 1.500 0.244 0.580 0.760 1.933 1.730 3.030 1.500 0.770 4.530 X1 C Note: For high voltage applications, the appropriate industry sector guidelines should be considered with regards to creepage and clearance distances between device terminals and PCB tracking. FCX458 Document number: DS33053 Rev. 7 - 2 6 of 7 www.diodes.com April 2017 © Diodes Incorporated FCX458 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. 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LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2017, Diodes Incorporated www.diodes.com FCX458 Document number: DS33053 Rev. 7 - 2 7 of 7 www.diodes.com April 2017 © Diodes Incorporated