ADS6445-EP ADS6444-EP www.ti.com SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 QUAD CHANNEL, 14 BIT, 125/105 MSPS ADC WITH SERIAL LVDS OUTPUTS Check for Samples: ADS6445-EP, ADS6444-EP FEATURES APPLICATIONS • • • • • • • • 1 • • • • • • • Maximum Sample Rate: 125 MSPS 14-Bit Resolution with No Missing Codes Simultaneous Sample and Hold 3.5-dB Coarse Gain and up to 6-dB Programmable Fine Gain for SFDR/SNR TradeOff Serialized LVDS Outputs with Programmable Internal Termination Option Supports Sine, LVCMOS, LVPECL, LVDS Clock Inputs and Amplitude Down to 400 mVPP Internal Reference with External Reference Support No External Decoupling Required for References 3.3-V Analog and Digital Supply 64-pin QFN Package (9 mm × 9 mm) Feature Compatible Dual Channel Family Base-Station IF Receivers Diversity Receivers Medical Imaging Test Equipment SUPPORTS DEFENSE, AEROSPACE, AND MEDICAL APPLICATIONS • • • • • • • Controlled Baseline One Assembly and Test Site One Fabrication Site Available in Military (–55°C to 125°C) Temperature Range Extended Product Life Cycle Extended Product-Change Notification Product Traceability Table 1. ADS644X Quad Channel Family (1) ADS644X 14 Bit (1) 125 MSPS 105 MSPS ADS6445 ADS6444 Product Preview for ADS6444 Table 2. Performance Summary SFDR, dBc SINAD, dBFS Fin = 10 MHz (0 dB gain) Fin = 170 MHz (3.5 dB gain) ADS6445 ADS6444 87 91 79 83 Fin = 10 MHz (0 dB gain) 73.4 73.4 Fin = 170 MHz (3.5 dB gain) 68.3 69.3 Power, per channel, mW 420 340 DESCRIPTION The ADS6445/ADS6444 is a high performance 14 bit 125/105 MSPS quad channel A-D converter. Serial LVDS data outputs reduce the number of interface lines, resulting in a compact 64-pin QFN package (9 mm × 9 mm) that allows for high system integration density. The device includes 3.5 dB coarse gain option that can be used to improve SFDR performance with little degradation in SNR. In addition to the coarse gain, fine gain options also exist, programmable in 1 dB steps up to 6 dB. The output interface is 2-wire, where each ADC data is serialized and output over two LVDS pairs. This makes it possible to halve the serial data rate (compared to a 1-wire interface) and restrict it to less than 1 Gbps easing receiver design. The ADS644X also includes the traditional 1-wire interface that can be used at lower sampling frequencies. An internal phase lock loop (PLL) multiplies the incoming ADC sampling clock to derive the bit clock. The bit clock is used to serialize the 14 bit data from each channel. In addition to the serial data streams, the frame and bit clocks also are transmitted as LVDS outputs. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2008–2013, Texas Instruments Incorporated ADS6445-EP ADS6444-EP SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 www.ti.com The LVDS output buffers have features such as programmable LVDS currents, current doubling modes and internal termination options. These can be used to widen eye openings and improve signal integrity, easing capture by the receiver. The ADC channel outputs can be transmitted either as MSB or LSB first and 2s complement or straight binary. The ADS644X has internal references, but also can support an external reference mode. The device is specified over –55°C to 125°C operating junction temperature range. 2 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP ADS6445-EP ADS6444-EP www.ti.com SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. LVDD LGND CAP AVDD AGND ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. CLKP CLKM BIT Clock DCLKP DCLKM FRAME Clock FCLKP FCLKM PLL 14 Bit ADC Digital Encoder and Serializer 14 Bit ADC Digital Encoder and Serializer SHA 14 Bit ADC Digital Encoder and Serializer SHA 14 Bit ADC Digital Encoder and Serializer INA_P SHA INA_M INB_P SHA INB_M INC_P INC_M IND_P VCM DA1_P DA1_M DB0_P DB0_M DB1_P DB1_M DC0_P DC0_M DC1_P DC1_M DD0_P DD0_M DD1_P DD1_M REFM REFP IND_M DA0_P DA0_M Reference Parallel Interface Serial Interface SCLK RESET SEN SDATA CFG4 CFG3 CFG1 CFG2 PDN ADS644x B0199-03 ORDERING INFORMATION (1) PRODUCT ADS6445 ADS6444 (1) (2) (3) PACKAGE-LEAD PACKAGE DESIGNATOR (2) SPECIFIED JUNCTION TEMPERATURE RANGE QFN-64 (3) RGC –55°C to 125°C PACKAGE MARKING ORDERING NUMBER 6445EP ADS6445MRGCTEP 6444EP ADS6444MRGCTEP TRANSPORT MEDIA, QUANTITY 250, Tape/reel VID NUMBER V62/08628-01XE V62/08628-02XE For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For thermal pad size on the package, see the mechanical drawings at the end of this data sheet. θJA = 23.17 °C/W (0 LFM air flow), θJC = 22.1 °C/W when used with 2 oz. copper trace and pad soldered directly to a JEDEC standard four layer 3 in. x 3 in. PCB. Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP Submit Documentation Feedback 3 ADS6445-EP ADS6444-EP SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 www.ti.com ABSOLUTE MAXIMUM RATINGS (1) VALUE UNIT AVDD Supply voltage range –0.3 to 3.9 V LVDD Supply voltage range –0.3 to 3.9 V Voltage between AGND and DGND –0.3 to 0.3 V Voltage between AVDD to LVDD –0.3 to 3.3 V Voltage applied to external pin, VCM –0.3 to 2.0 V Voltage applied to analog input pins –0.3 V to minimum ( 3.6, AVDD + 0.3 V) V TJ Operating junction temperature Tstg Storage temperature range 150 °C –65 to 150 °C 220 °C Lead temperature 1,6 mm (1/16") from the case for 10 seconds (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. xxx Lifetime Expectancy (Years) 100.00 10.00 1.00 85 95 105 115 125 135 145 Junction Temperature, T J (°C) (1) See datasheet for absolute maximum and minimum recommended operating conditions. (2) Silicon operating life design goal is 10 years at 105°C junction temperature (does not include package interconnect life). (3) Enhanced plastic product disclaimer applies. Figure 1. Lifetime Expectancy Graph at Elevated Temperature 4 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP ADS6445-EP ADS6444-EP www.ti.com SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 THERMAL INFORMATION ADS644x-EP THERMAL METRIC (1) RGC UNITS 64 PINS Junction-to-ambient thermal resistance (2) θJA 23.6 (3) θJCtop Junction-to-case (top) thermal resistance θJB Junction-to-board thermal resistance (4) ψJT Junction-to-top characterization parameter (5) ψJB Junction-to-board characterization parameter (6) 3 θJCbot Junction-to-case (bottom) thermal resistance (7) 0.3 (1) (2) (3) (4) (5) (6) (7) 7.7 3 °C/W 0.1 For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDECstandard test exists, but a close description can be found in the ANSI SEMI standard G30-88. The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8. The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7). The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7). The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. Spacer RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT SUPPLIES AVDD Analog supply voltage 3.0 3.3 3.6 V LVDD LVDS Buffer supply voltage 3.0 3.3 3.6 V ANALOG INPUTS Differential input voltage range 2 Input common-mode voltage Vpp 1.5±0.1 Voltage applied on VCM in external reference mode 1.45 1.50 V 1.55 V CLOCK INPUT Input clock sample rate, Fsrated ADS6445 5 125 ADS6444 5 105 Sine wave, ac coupled Input clock amplitude differential (VCLKP – VCLKM) 0.4 LVPECL, ac coupled Vpp ± 0.35 LVCMOS, ac coupled Input Clock duty cycle 1.5 ± 0.8 LVDS, ac coupled MSPS 3.3 35 50 65 % DIGITAL OUTPUTS Without internal termination CLOAD Maximum external load capacitance from each output pin to DGND RLOAD Differential load resistance (external) between the LVDS output pairs With internal termination Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP 5 10 100 Submit Documentation Feedback pF Ω 5 ADS6445-EP ADS6444-EP SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 www.ti.com ELECTRICAL CHARACTERISTICS Typical values are at 25°C, min and max values are across the full junction temperature range TJ,MIN = –55°C to TJ,MAX = 125°C, AVDD = LVDD = 3.3 V, maximum rated sampling frequency, 50% clock duty cycle, –1 dBFS differential analog input, internal reference mode (unless otherwise noted). ADS6445 Fs = 125 MSPS PARAMETER MIN RESOLUTION TYP ADS6444 Fs = 105 MSPS MAX MIN TYP UNIT MAX 14 14 Bits 2.0 2.0 VPP 7 7 Analog input bandwidth 500 500 MHz Analog input common mode current (per input pin of each ADC) 155 130 μA V ANALOG INPUT Differential input voltage range Differential input capacitance pF REFERENCE VOLTAGES VREFB Internal reference bottom voltage 1.0 1.0 VREFT Internal reference top voltage 2.0 2.0 ΔVREF Internal reference error (VREFT–VREFB) VCM Common mode output voltage 1.5 1.5 V VCM output current capability ±4 ±4 mA 0.985 1 1.015 0.985 1 V 1.015 V DC ACCURACY No missing codes EO Assured Offset error, across devices and across channels within a device –15 Offset error temperature coefficient, across devices and across channels within a device ±2 Assured 15 –15 0.05 ±2 15 0.05 mV mV/°C There are two sources of gain error - internal reference inaccuracy and channel gain error EGREF Gain error due to internal reference inaccuracy alone, (ΔVREF /2.0) % -0.75 Reference gain error temperature coefficient EGCHAN Gain error of channel alone, across devices and across channels within a device Channel gain error temperature coefficient, across devices and across channels within a device DNL Differential nonlinearity, Fin = 50 MHz INL Integral nonlinearity, Fin = 50 MHz PSRR DC power supply rejection ratio 0.1 0.75 -0.75 0.1 0.75 % FS 0.0125 0.0125 Δ%/°C ±0.3 ±0.3 % FS 0.005 0.005 Δ%/°C –0.99 ±0.6 2.0 –0.99 ±0.6 2.0 -5 ±3 5 -5 ±3 5 LSB LSB 0.5 0.5 mV/V POWER SUPPLY ICC Total supply current 502 410 mA IAVDD Analog supply current 410 322 mA ILVDD LVDS supply current 92 88 Total power Power down (with input clock stopped) 6 Submit Documentation Feedback mA 1.65 1.8 1.35 1.5 W 77 150 77 150 mW Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP ADS6445-EP ADS6444-EP www.ti.com SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 ELECTRICAL CHARACTERISTICS Typical values are at 25°C, min and max values are across the full junction temperature range TJ,MIN = –55°C to TJ,MAX = 125°C, AVDD = LVDD = 3.3 V, maximum rated sampling frequency, 50% clock duty cycle, –1 dBFS differential analog input, internal reference mode (unless otherwise noted). PARAMETER TEST CONDITIONS ADS6445 Fs = 125 MSPS MIN TYP ADS6444 Fs = 105 MSPS MAX MIN TYP UNIT MAX DYNAMIC AC CHARACTERISTICS Fin = 10 MHz 73.7 Fin = 50 MHz SNR Signal to noise ratio 68.5 72.7 Fin = 100 MHz 72.1 72.2 0 dB gain 69.9 70.2 3.5 dB Coarse gain 69.4 69.7 0 dB gain 68.7 68.8 3.5 dB Coarse gain 68.1 68.2 73.4 73.4 Fin = 170 MHz Fin = 10 MHz Fin = 50 MHz 67.75 71.8 72 0 dB gain 67.9 69.8 3.5 dB Coarse gain 68.3 69.3 0 dB gain 67.8 67.7 3.5 dB Coarse gain 67.9 67.6 1.05 1.05 87 91 Fin = 170 MHz Inputs tied to common-mode 69 81 72 Fin = 100 MHz 86 88 0 dB gain 76 79 3.5 dB Coarse gain 79 83 0 dB gain 77 77 3.5 dB Coarse gain 80 80 93 94 Fin = 10 MHz Fin = 50 MHz 69 74 87 Fin = 100 MHz 89 90 0 dB gain 83 84 3.5 dB Coarse gain 85 86 0 dB gain 80 81 3.5 dB Coarse gain 82 83 87 91 Fin = 10 MHz Fin = 50 MHz 69 74 81 88 78 Fin = 100 MHz 86 88 0 dB gain 76 79 3.5 dB Coarse gain 79 83 0 dB gain 77 77 3.5 dB Coarse gain 80 80 Fin = 230 MHz Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP dBc 80 Fin = 70 MHz Fin = 170 MHz dBc 88 87 Fin = 230 MHz LSB 81 Fin = 70 MHz Fin = 170 MHz dBFS 80 78 Fin = 230 MHz HD3 Third harmonic 68.5 Fin = 70 MHz Fin = 170 MHz dBFS 71.7 Fin = 100 MHz Fin = 50 MHz HD2 Second harmonic 72.3 73 71.2 Fin = 10 MHz SFDR Spurious free dynamic range 69 Fin = 70 MHz Fin = 230 MHz RMS Output noise 73.2 Fin = 70 MHz Fin = 230 MHz SINAD Signal to noise and distortion ratio 73.8 73.1 74 81 dBc Submit Documentation Feedback 7 ADS6445-EP ADS6444-EP SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 www.ti.com ELECTRICAL CHARACTERISTICS (continued) Typical values are at 25°C, min and max values are across the full junction temperature range TJ,MIN = –55°C to TJ,MAX = 125°C, AVDD = LVDD = 3.3 V, maximum rated sampling frequency, 50% clock duty cycle, –1 dBFS differential analog input, internal reference mode (unless otherwise noted). PARAMETER TEST CONDITIONS ADS6445 Fs = 125 MSPS MIN Worst harmonic (other than HD2, HD3) THD Total harmonic distortion TYP ADS6444 Fs = 105 MSPS MAX MIN TYP Fin = 10 MHz 91 91 Fin = 50 MHz 87 87 Fin = 100 MHz 90 91 Fin = 170 MHz 88 88 Fin = 230 MHz 87 87 Fin = 10 MHz 86 89.5 Fin = 50 MHz 69 80 84.5 Fin = 170 MHz 73.5 86 74 77 72 79 dBc ENOB Effective number of bits Fin = 50 MHz IMD 2-Tone intermodulation distortion F1= 46.09 MHz, F2 = 50.09 MHz 88 90 F1= 185.09 MHz, F2 = 190.09 MHz 86 88 Near channel Cross-talk signal frequency = 10 MHz 90 92 Far channel Cross-talk signal frequency = 10 MHz 103 105 1 1 Clock cycles 35 35 dBc Cross-talk 10.95 dBc 80 Fin = 100 MHz Fin = 230 MHz UNIT MAX 11.3 Fin = 70 MHz Input overload recovery Recovery to within 1% (of final value) for 6dB overload with sine wave input AC PSRR Power supply rejection ratio < 100 MHz signal, 100 mVPP on AVDD supply 8 11.7 Submit Documentation Feedback 11.7 Bits dBFS dBc Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP ADS6445-EP ADS6444-EP www.ti.com SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 DIGITAL CHARACTERISTICS The DC specifications refer to the condition where the digital outputs are not switching, but are permanently at a valid logic level 0 or 1 AVDD = LVDD = 3.3 V, IO = 3.5 mA, RLOAD = 100 Ω (1). All LVDS specifications are characterized, but not tested at production. PARAMETER TEST CONDITIONS ASD6445/ADS6444 MIN TYP MAX UNIT DIGITAL INPUTS High-level input voltage 2.4 V Low-level input voltage 0.8 V High-level input current 10 μA Low-level input current 10 μA 4 pF High-level output voltage 1375 mV Low-level output voltage 1025 Input capacitance DIGITAL OUTPUTS Output differential voltage |VOD| 250 Output offset voltage VOS Common-mode voltage of OUTP and OUTM Output capacitance Output capacitance inside the device, from either output to ground (1) 350 mV 450 mV 1200 mV 2 pF IO refers to the LVDS buffer current setting, RLOAD is the external differential load resistance between the LVDS output pair. Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP Submit Documentation Feedback 9 ADS6445-EP ADS6444-EP SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 www.ti.com TIMING SPECIFICATIONS (1) Typical values are at 25°C, min and max values are across the full junction temperature range TJ,MIN = –55°C to TJ,MAX = 125°C, AVDD = LVDD = 3.3 V, maximum rated sampling frequency, sine wave input clock, 1.5 VPP clock amplitude, CL = 5 pF (2), IO = 3.5 mA, RL = 100 Ω (3), no internal termination, unless otherwise noted. PARAMETER TEST CONDITIONS ADS6445 Fs = 125 MSPS MIN tJ Aperture jitter Uncertainty in the sampling instant TYP ADS6444 Fs = 105 MSPS MAX MIN TYP UNIT MAX 250 250 fs rms From data cross-over to bit clock cross-over 0.55 0.65 ns From bit clock cross-over to data cross-over 0.58 0.7 ns Input clock rising edge cross-over to frame clock rising edge cross-over 4.4 4.4 ns 350 350 ps pp 75 75 ps pp INTERFACE: 2-wire, DDR bit clock, 14x serialization tsu Data setup time (4) th Data hold time (4) tpd_clk (5) (6) (5) (6) Clock propagation delay (6) Bit clock cycle-cycle jitter (5) Frame clock cycle-cycle jitter (5) The following specifications apply for 5 MSPS ≤ Fs ≤ 125 MSPS and all interface options. tA Aperture delay Delay from input clock rising edge to the actual sampling instant 2 2 ns Aperture delay variation Channel-channel within same device ±80 ±80 ps 12 12 Clock cycles Time to valid data after coming out of global power down 100 100 μs Time to valid data after input clock is re-started 100 100 μs Time to valid data after coming out of channel standby 200 200 Clock cycles ADC Latency (7) Wake up time Time for a sample to propagate to ADC outputs, see Figure 2 tRISE Data rise time From –100 mV to +100 mV 100 100 ps tFALL Data fall time From +100 mV to –100 mV 100 100 ps tRISE Bit clock and frame clock rise time From –100 mV to +100 mV 100 100 ps tFALL Bit clock and frame clock fall time From +100 mV to –100 mV 100 100 ps LVDS Bit clock duty cycle 50% 50% LVDS Frame clock duty cycle 50% 50% (1) (2) (3) (4) (5) (6) (7) 10 Timing parameters are ensured by design and characterization and not tested in production. CL is the external single-ended load capacitance between each output pin and ground. Io refers to the LVDS buffer current setting; RL is the external differential load resistance between the LVDS output pair. Timing parameters are measured at the end of a 2 inch PCB trace (100 Ω characteristic impedance) terminated by RLand CL. Setup and hold time specifications take into account the effect of jitter on the output data and clock. Refer to Output Timings in application section for timings at lower sampling frequencies and other interface options. Note that the total latency = ADC latency + internal serializer latency. The serializer latency depends on the interface option selected as shown in Table 27. Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP ADS6445-EP ADS6444-EP www.ti.com SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 Sample N+13 Sample N+12 Sample N+11 Sample N Input Signal tA Input Clock CLKM CLKP tPD_CLK Latency 12 Clocks Bit Clock Output Data DCLKP DCLKM DOP D13 D12 D11 D10 D6 D5 D4 D3 D2 D1 D0 D13 D12 D11 D10 Sample N–1 Frame Clock D6 D5 D4 D3 D2 D1 D0 DOM Sample N FCLKM FCLKP T0105-04 Figure 2. Latency DCLKP Bit Clock DCLKM tsu th tsu Output Data DOP, DOM th Dn+1 Dn T0106-03 Figure 3. LVDS Timing Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP Submit Documentation Feedback 11 ADS6445-EP ADS6444-EP SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 www.ti.com DEVICE PROGRAMMING MODES ADS644X offers flexibility with several programmable features that are easily configured. The device can be configured independently using either parallel interface control or serial interface programming. In addition, the device supports a third configuration mode, where both the parallel interface and the serial control registers are used. In this mode, the priority between the parallel and serial interfaces is determined by a priority table (refer to Table 4). If this additional level of flexibility is not required, the user can select either the serial interface programming or the parallel interface control. USING PARALLEL INTERFACE CONTROL ONLY To control the device using parallel interface, keep RESET tied to high (LVDD). Pins CFG1, CFG2, CFG3, CFG4, PDN, SEN, SCLK, and SDATA are used to directly control certain functions of the ADC. After power-up, the device is automatically configured as per the parallel pin voltage settings (refer to Table 5 to Table 8) and no reset is required. In this mode, SEN, SCLK, and SDATA function as parallel interface control pins. Frequently used functions are controlled in this mode—output data interface and format, power down modes, coarse gain and internal/external reference. The parallel pins can be configured using a simple resistor string as illustrated in Figure 4. Table 3 has a description of the modes controlled by the parallel pins. Table 3. Parallel Pin Definition PIN SEN SCLK, SDATA CONTROL FUNCTIONS Coarse gain and internal/external reference. Sync, deskew patterns and global power down. PDN Dedicated pin for global power down CFG1 1-wire/2-wire and DDR/SDR bit clock CFG2 14x/16x serialization and SDR bit clock capture edge CFG3 Reserved function. Tie CFG3 to Ground. CFG4 MSB/LSB first and data format. USING SERIAL INTERFACE PROGRAMMING ONLY In this mode, SEN, SDATA, and SCLK function as serial interface pins and are used to access the internal registers of ADC. The registers must first be reset to their default values either by applying a pulse on RESET pin or by a high setting on the <RST> bit (in register ). After reset, the RESET pin must be kept low. The serial interface section describes the register programming and register reset in more detail. Because the parallel pins (CFG1-4 and PDN) are not used in this mode, they must be tied to ground. The register override bit <OVRD> - D10 in register 0x0D has to be set high to disable the control of parallel interface pins in this serial interface control ONLY mode. USING BOTH THE SERIAL INTERFACE AND PARALLEL CONTROLS For increased flexibility, a combination of serial interface registers and parallel pin controls (CFG1-4 and PDN) also can be used to configure the device. The parallel interface control pins CFG1 to CFG4 and PDN are available. After power-up, the device is automatically configured as per the parallel pin voltage settings (refer to Table 5 through Table 11) and no reset is required. A simple resistor string can be used as illustrated in Figure 4. SEN, SDATA, and SCLK function as serial interface pins and are used to access the internal registers of ADC. The registers must first be reset to their default values either by applying a pulse on RESET pin or by a high setting on the <RST> bit (in register ). After reset, the RESET pin must be kept low. The Serial Interface section describes the register programming and register reset in more detail. Since some functions are controlled using both the parallel pins and serial registers, the priority between the two is determined by a priority table (refer to Table 4). 12 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP ADS6445-EP ADS6444-EP www.ti.com SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 Table 4. Priority Between Parallel Pins and Serial Registers PIN FUNCTIONS SUPPORTED PRIORITY As described in Table 8 through Table 11 Register bits can control the modes only if the register bit <OVRD> is high. If <OVRD> bit is low, then the control voltage on these parallel pins determines the function. PDN Global power down Register bit <PDN GLOBAL> controls global power down only if PDN pin is low. If PDN is high, device is in global power down. SEN Serial interface enable CFG1 to CFG4 Coarse gain is controlled by register bit <COARSE GAIN> only if the <OVRD> bit is high. Else, device has 0 dB coarse gain. Internal/external reference setting is determined by register bit <REF>. SCLK, SDATA Serial interface clock and serial interface data pins Register bits <PATTERNS> control the sync and deskew output patterns. Power down is determined by bit <PDN GLOBAL> AVDD (5/8) AVDD 3R (5/8) AVDD GND 2R AVDD (3/8) AVDD (3/8) AVDD 3R To Parallel Pin GND Figure 4. Simple Scheme to Configure Parallel Pins Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP Submit Documentation Feedback 13 ADS6445-EP ADS6444-EP SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 www.ti.com DESCRIPTION OF PARALLEL PINS Table 5. SCLK, SDATA Control Pins SCLK SDATA DESCRIPTION LOW LOW NORMAL conversion. LOW HIGH SYNC – ADC outputs sync pattern on all channels. This pattern can be used by the receiver to align the deserialized data to the frame boundary. See Capture Test Patterns for details. HIGH LOW POWER DOWN – Global power down, all channels of the ADC are powered down, including internal references, PLL and output buffers. HIGH HIGH DESKEW – ADC outputs deskew pattern on all channels. This pattern can be used by the receiver to ensure deserializer uses the right clock edge. See Capture Test Patterns for details. Table 6. SEN Control Pin SEN 0 DESCRIPTION External reference and 0 dB coarse gain (full-scale = 2 VPP) (3/8)LVDD External reference and 3.5 dB coarse gain (full-scale = 1.34 VPP) (5/8)LVDD Internal reference and 3.5 dB coarse gain (full-scale = 1.34 VPP) LVDD Internal reference and 0 dB coarse gain (full-scale = 2 VPP) Independent of the programming mode used, after power-up the parallel pins PDN, CFG1 to CFG4 automatically configure the device as per the voltage applied (refer to Table 7 to Table 11). Table 7. PDN Control Pin PDN 0 AVDD DESCRIPTION Normal operation Power down global Table 8. CFG1 Control Pin CFG1 0 DESCRIPTION DDR Bit clock and 1-wire interface (3/8)LVDD Not used (5/8)LVDD SDR Bit clock and 2-wire interface LVDD DDR Bit clock and 2-wire interface Table 9. CFG2 Control Pin CFG2 DESCRIPTION 0 14x Serialization and capture at falling edge of bit clock (only in 2-wire SDR bit clock mode) (3/8)LVDD 16x Serialization and capture at falling edge of bit clock (only in 2-wire SDR bit clock mode) (5/8)LVDD 16x Serialization and capture at rising edge of bit clock (only in 2-wire SDR bit clock mode) LVDD 14x Serialization and capture at rising edge of bit clock (only in 2-wire SDR bit clock mode) Table 10. CFG3 Control Pin CFG3 RESERVED - TIE TO GROUND Table 11. CFG4 Control Pin CFG4 0 MSB First and 2s complement (3/8)LVDD MSB First and offset binary (5/8)LVDD LSB First and offset binary LVDD 14 DESCRIPTION LSB First and 2s complement Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP ADS6445-EP ADS6444-EP www.ti.com SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 SERIAL INTERFACE The ADC has a serial interface formed by pins SEN (serial interface enable), SCLK (serial interface clock), SDATA (serial interface data) and RESET. Serial shift of bits into the device is enabled when SEN is low. Serial data SDATA is latched at every falling edge of SCLK when SEN is active (low). The serial data is loaded into the register at every 16th SCLK falling edge when SEN is low. In case the word length exceeds a multiple of 16 bits, the excess bits are ignored. Data can be loaded in multiple of 16 bit words within a single active SEN pulse. The interface can work with SCLK frequency from 20 MHz down to very low speeds (few hertz) and even with non50% duty cycle SCLK. The first 5 bits of the 16 bit word are the address of the register while the next 11 bits are the register data. Register Reset After power-up, the internal registers must be reset to their default values. This can be done in one of two ways: 1. Either by applying a high-going pulse on RESET (of width greater than 10 ns) OR 2. By applying software reset. Using the serial interface, set the <RST> bit in register 0x00 to high – this resets the registers to their default values and then self-resets the <RST> bit to LOW. When RESET pin is not used, it must be tied to LOW. Register Address SDATA A4 A3 A2 A1 Register Data A0 D10 D9 D8 D7 D6 t(SCLK) D5 D4 D3 D2 D1 D0 t(DH) t(DSU) SCLK t(SLOADH) t(SLOADS) SEN RESET T0109-03 Figure 5. Serial Interface Timing Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP Submit Documentation Feedback 15 ADS6445-EP ADS6444-EP SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 www.ti.com SERIAL INTERFACE TIMING CHARACTERISTICS Typical values at 25°C, min and max values across the full junction temperature range TJ,MIN = –55°C to TJ,MAX = 125°C, AVDD = LVDD = 3.3 V, unless otherwise noted. PARAMETER MIN TYP > DC MAX UNIT 20 MHz fSCLK SCLK Frequency, fSCLK = 1/tSCLK tSLOADS SEN to SCLK Setup time 25 ns tSLOADH SCLK to SEN Hold time 25 ns tDSU SDATA Setup time 25 ns tDH SDATA Hold time 25 ns 100 ns Time taken for register write to take effect after 16th SCLK falling edge RESET TIMING Typical values at 25°C, min and max values across the full junction temperature range TJ,MIN = –55°C to TJ,MAX = 125°C, AVDD = LVDD = 3.3 V, unless otherwise noted. PARAMETER CONDITIONS MIN TYP 5 MAX UNIT t1 Power-on delay time Delay from power-up of AVDD and LVDD to RESET pulse active t2 Reset pulse width Pulse width of active RESET signal t3 Register write delay time Delay from RESET disable to SEN active 25 ns tPO Power-up delay time 6.5 ms 10 Delay from power-up of AVDD and LVDD to output stable ms ns Power Supply AVDD, LVDD t1 RESET t2 t3 SEN T0108-03 Figure 6. Reset Timing 16 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP ADS6445-EP ADS6444-EP www.ti.com SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 SERIAL REGISTER MAP Table 12. Summary of Functions Supported By Serial Interface REGISTER ADDRESS A4 - A0 REGISTER FUNCTIONS (1) D10 D9 D8 D7 00 <RST> S/W RESET 0 0 0 04 0 0 0 0 0 <DF> DATA FORMAT 2S COMP OR STRAIGHT BINARY 0 0A 0D 10 11 (1) (2) 0 D5 <REF> INTERNAL OR EXTERNAL D4 D3 <PDN CHD> POWER DOWN CH D <PDN CHC> POWER DOWN CHC D2 <PDN CHB> POWER DOWN CH B <CLKIN GAIN> INPUT CLOCK BUFFER GAIN CONTROL <PATTERNS> TEST PATTERNS 0 0 0 D1 D0 <PDN CHA> POWER DOWN CH A <PDN GLOBAL> GLOBAL POWER DOWN 0 0 0 0 <CUSTOM A> CUSTOM PATTERN (LOWER 11 BITS) 0B 0C D6 (2) <FINE GAIN> FINE GAIN CONTROL (1 dB to 6 dB) <OVRD> OVERRIDE BIT 0 0 0 0 0 0 0 BYTE-WISE OR BITWISE MSB OR LSB FIRST <COARSE GAIN> COURSE GAIN ENABLE FALLING OR RISING BIT CLOCK CAPTURE EDGE 0 <TERM CLK> LVDS INTERNAL TERMINATION BIT AND WORD CLOCKS WORD-WISE CONTROL 0 0 <LVDS CURR> LVDS CURRENT SETTINGS 0 0 <CUSTOM B> CUSTOM PATTERN (UPPER 3 BITS) 14 BIT OR 16 BIT SERIALIZE DDR OR SDR BIT CLOCK 1-WIRE OR 2-WIRE INTERFACE <CURR DOUBLE> LVDS CURRENT DOUBLE <TERM DATA> LVDS INTERNAL TERMINATION - DATA OUTPUTS The unused bits in each register (shown by blank cells in above table) must be programmed as 0. Multiple functions in a register can be programmed in a single write operation. Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP Submit Documentation Feedback 17 ADS6445-EP ADS6444-EP SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 www.ti.com DESCRIPTION OF SERIAL REGISTERS Table 13. Serial Register A REGISTER ADDRESS A4 - A0 BITS D10 <RST> S/W RESET 00 D9 0 D8 D7 0 0 D6 D5 D4 D3 D2 D1 D0 0 <REF> INTERNAL OR EXTERNAL <PDN CHD> POWER DOWN CH D <PDN CHC> POWER DOWN CHC <PDN CHB> POWER DOWN CH B <PDN CHA> POWER DOWN CH A <PDN> GLOBAL POWER DOWN D0 - D4 Power down modes D0 <PDN GLOBAL> 0 Normal operation 1 Global power down, including all channels ADCs, internal references, internal PLL and output buffers D1 <PDN CHA> 0 CH A Powered up 1 CH A ADC Powered down D2 <PDN CHB> 0 CH B Powered up 1 CH B ADC Powered down D3 <PDN CHC> 0 CH C Powered up 1 CH C ADC Powered down D4 <PDN CHD> 0 CH D Powered up 1 CH D ADC Powered down D5 <REF> Reference 0 Internal reference enabled 1 External reference enabled D10 <RST> 1 Software reset applied – resets all internal registers and self-clears to 0 18 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP ADS6445-EP ADS6444-EP www.ti.com SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 Table 14. Serial Register B REGISTER ADDRESS A4 - A0 04 BITS D10 0 D9 0 D8 D7 0 D6 D5 D4 D3 D2 <CLKIN GAIN> INPUT CLOCK BUFFER GAIN CONTROL 0 D6 - D2 <CLKIN GAIN> Input clock buffer gain control 11000 Gain 0, minimum gain 00000 Gain 1, default gain after reset 01100 Gain 2 01010 Gain 3 01001 Gain 4 01000 Gain 5, maximum gain D1 D0 0 0 Table 15. Serial Register C REGISTER ADDRESS A4 - A0 00 BITS D10 D9 D8 0 <DF> DATA DORMAT 2S COMP OR STRAIGHT BINARY 0 D7 D6 D5 <PATTERNS> TEST PATTERNS D4 D3 D2 D1 D0 0 0 0 0 0 D7 - D5 <PATTERNS> Capture test patterns 000 Normal ADC operation 001 Output all zeros 010 Output all ones 011 Output toggle pattern 100 Unused 101 Output custom pattern (contents of CUSTOM pattern registers 0x0B and 0x0C) 110 Output DESKEW pattern (serial stream of 1010..) 111 Output SYNC pattern D9 <DF> Data format selection 0 2s Complement format 1 Straight binary format Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP Submit Documentation Feedback 19 ADS6445-EP ADS6444-EP SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 www.ti.com Table 16. Serial Register D REGISTER ADDRESS A4 - A0 BITS D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 D2 D1 D0 <CUSTOM A> CUSTOM PATTERN (LOWER 11 BITS) 0B D10 - D0 <CUSTOM A> Lower 11 bits of custom pattern <D10>…<D0> Table 17. Serial Register E REGISTER ADDRESS A4 - A0 BITS D10 D9 D8 <FINE GAIN> FINE GAIN CONTROL (1 dB to 6 dB) 0C D7 D6 D5 D4 D3 0 0 0 0 0 D4 - D0 <CUSTOM B> Upper 3 bits of custom pattern <D13>…<D11> D10-D8 <FINE GAIN> Fine gain control 000 0 dB Gain (full-scale range = 2.00 VPP) 001 1 dB Gain (full-scale range = 1.78 VPP) 010 2 dB Gain (full-scale range = 1.59 VPP) 011 3 dB Gain (full-scale range = 1.42 VPP) 100 4 dB Gain (full-scale range = 1.26 VPP) 101 5 dB Gain (full-scale range = 1.12 VPP) 110 6 dB Gain (full-scale range = 1.00 VPP) <CUSTOM B> CUSTOM PATTERN (UPPER 3 BITS) Table 18. Serial Register F REGISTER ADDRESS A4 - A0 0D BITS D10 <OVRD> OVER-RIDE BITE D9 D8 0 D7 BYTE-WISE OR BITWISE 0 D6 MSB OR LSB FIRST D5 D4 D3 D2 D1 D0 <COARSE GAIN> COURSE GAIN ENABLE FALLING OR RISING BIT CLOCK CAPTURE EDGE 0 14 BIT OR 16 BIT SERIALIZE DDR OR SDR BIT CLOCK 1-WIRE OR 2- WIRE INTERFACE D0 Interface selection 0 1-Wire interface 1 2-Wire interface D1 Bit clock selection (only in 2-wire interface) 0 DDR Bit clock 1 SDR Bit clock D2 Serialization factor selection 0 14X Serialization 1 16X Serialization D4 Bit clock capture edge (only when SDR bit clock is selected, D1 = 1) 0 Capture data with falling edge of bit clock 1 Capture data with rising edge of bit clock D5 <COARSE GAIN> Coarse gain control 0 0 dB Coarse gain (full-scale range = 2.0 VPP) 20 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP ADS6445-EP ADS6444-EP www.ti.com SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 1 3.5 dB Coarse gain (full-scale range = 1.34 VPP) D6 MSB or LSB First selection 0 MSB First 1 LSB First D7 Byte/bit wise outputs (only when 2-wire is selected) 0 Byte wise 1 Bit wise D10 <OVRD> Over-ride bit. All the functions in register 0x0D also can be controlled using the parallel control pins. By setting bit <OVRD> = 1, the contents of register 0x0D will over-ride the settings of the parallel pins. 0 Disable over-ride 1 Enable over-ride Table 19. Serial Register G REGISTER ADDRESS A4 - A0 10 BITS D10 D9 D8 D7 D6 D5 <TERM CLK> LVDS INTERNAL TERMINATION BIT AND WORD CLOCKS D4 D3 D2 <LVDS CURR> LVDS CURRENT SETTINGS D0 <CURR DOUBLE> LVDS current double for data outputs 0 Nominal LVDS current, as set by <D5…D2> 1 Double the nominal value D1 <CURR DOUBLE> LVDS current double for bit and word clock outputs 0 Nominal LVDS current, as set by <D5…D2> 1 Double the nominal value D3-D2 <LVDS CURR> LVDS current setting for data outputs 00 3.5 mA 01 4 mA 10 2.5 mA 11 3 mA D5-D4 <LVDS CURR> LVDS current setting for bit and word clock outputs 00 3.5 mA 01 4 mA 10 2.5 mA 11 3 mA D10-D6 <TERM CLK> LVDS internal termination for bit and word clock outputs 00000 No internal termination 00001 166 Ω 00010 200 Ω 00100 250 Ω 01000 333 Ω Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP D1 D0 <LVDS DOUBLE> LVDS CURRENT DOUBLE Submit Documentation Feedback 21 ADS6445-EP ADS6444-EP SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 www.ti.com 500 Ω 10000 Any combination of above bits also can be programmed, resulting in a parallel combination of the selected values. For example, 00101 is the parallel combination of 166||250 = 100 Ω 100 Ω 00101 Table 20. Serial Register H REGISTER ADDRESS A4 - A0 11 BITS D10 D9 WORD-WISE CONTROL D8 0 D7 0 D6 D5 0 0 D4 D3 D2 D1 D0 <TERM DATA> LVDS INTERNAL TERMINATION - DATA OUTPUTS D4-D0 <TERM DATA> LVDS internal termination for data outputs 00000 No internal termination 00001 166 Ω 00010 200 Ω 00100 250 Ω 01000 333 Ω 10000 500 Ω Any combination of above bits can also be programmed, resulting in a parallel combination of the selected values. For example, 00101 is the parallel combination of 166||250 = 100 Ω 00101 100 Ω D10-D9 Only when 2-wire interface is selected 00 Byte-wise or bit-wise output, 1x frame clock 11 Word-wise output enabled, 0.5x frame clock 01,10 Do not use 22 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP ADS6445-EP ADS6444-EP www.ti.com SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 PIN CONFIGURATION (2-WIRE INTERFACE) LVDD DC1_P DC1_M DC0_P DC0_M LGND FCLKP FCLKM DCLKP DCLKM LGND DB1_P DB1_M DB0_P DB0_M LVDD ADS644x RGC PACKAGE (TOP VIEW) DA1_P 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 1 DD0_M DA1_M 2 47 DD0_P DA0_P 3 46 DD1_M DA0_M 4 45 DD1_P CAP 5 44 SCLK RESET 6 43 SDATA LVDD 7 42 SEN AGND 8 41 PDN PAD IND_P AGND 13 36 AGND INB_M 14 35 INC_M INB_P 15 34 INC_P AGND 33 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 AGND NC AVDD 37 AGND 12 CFG1 INA_P CFG2 IND_M CFG3 38 AVDD 11 AGND INA_M CLKM AGND CLKP 39 AGND 10 VCM AGND CFG4 AVDD AVDD 40 AGND 9 AVDD AVDD P0056-04 PIN ASSIGNMENTS (2-WIRE INTERFACE) PINS NAME NO. I/O NO. OF PINS DESCRIPTION SUPPLY AND GROUND PINS AVDD 9, 17, 19, 27, 32, 40 6 Analog power supply AGND 8, 10, 13, 16, 18, 23, 26, 31, 33, 36, 39 11 Analog ground LVDD 7, 49, 64 3 Digital power supply LGND 54, 59 2 Digital ground INPUT PINS CLKP, CLKM 24, 25 I 2 Differential input clock pair INA_P, INA_M 12, 11 I 2 Differential input signal pair, channel A. If unused, the pins should be tied to VCM. Do not float. Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP Submit Documentation Feedback 23 ADS6445-EP ADS6444-EP SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 www.ti.com PIN ASSIGNMENTS (2-WIRE INTERFACE) (continued) PINS NAME NO. I/O NO. OF PINS DESCRIPTION INB_P, INB_M 15, 14 I 2 Differential input signal pair, channel B. If unused, the pins should be tied to VCM. Do not float. INC_P, INC_M 34, 35 I 2 Differential input signal pair, channel C If unused, the pins should be tied to VCM. Do not float. IND_P, IND_M 37, 38 I 2 Differential input signal pair, channel D. If unused, the pins should be tied to VCM. Do not float. 1 Connect 2-nF capacitor from pin to ground CAP 5 SCLK 44 I 1 This pin functions as serial interface clock input when RESET is low. When RESET is high, it controls DESKEW, SYNC and global POWER DOWN modes (along with SDATA). Refer to Table 5 for description. This pin has an internal pull-down resistor. SDATA 43 I 1 This pin functions as serial interface data input when RESET is low. When RESET is high, it controls DESKEW, SYNC and global POWER DOWN modes (along with SCLK). Refer to Table 5 for description. This pin has an internal pull-down resistor. SEN 42 I 1 This pin functions as serial interface enable input when RESET is low. When RESET is high, it controls coarse gain and internal/external reference modes. Refer to Table 6 for description. This pin has an internal pull-up resistor. Serial interface reset input. RESET 6 I 1 When using the serial interface mode, the user MUST initialize internal registers through hardware RESET by applying a high-going pulse on this pin or by using software reset option. Refer to the Serial Interface section. In parallel interface mode, tie RESET permanently high. (SCLK, SDATA and SEN function as parallel control pins in this mode). The pin has an internal pull-down resistor to ground. PDN 41 I 1 Global power down control pin. CFG1 30 I 1 Parallel input pin. It controls 1-wire or 2-wire interface and DDR or SDR bit clock selection. Refer to Table 8 for description. Tie to AVDD for 2-wire interface with DDR bit clock. CFG2 29 I 1 Parallel input pin. It controls 14x or 16x serialization and SDR bit clock capture edge. Refer to Table 9 for description. For 14x serialization with DDR bit clock, tie to ground or AVDD. CFG3 28 I 1 RESERVED pin - Tie to ground. CFG4 21 I 1 Parallel input pin. It controls data format and MSB or LSB first modes. Refer to Table 11 for description. VCM 22 I/O 1 Internal reference mode – common-mode voltage output External reference mode – reference input. The voltage forced on this pin sets the internal reference. DA0_P,DA0_M 3, 4 O 2 Channel A differential LVDS data output pair, wire 0 DA1_P,DA1_M 1, 2 O 2 Channel A differential LVDS data output pair, wire 1 DB0_P,DB0_M 62, 63 O 2 Channel B differential LVDS data output pair, wire 0 DB1_P,DB1_M 60, 61 O 2 Channel B differential LVDS data output pair, wire 1 DC0_P,DC0_M 52, 53 O 2 Channel C differential LVDS data output pair, wire 0 DC1_P,DC1_M 50, 51 O 2 Channel C differential LVDS data output pair, wire 1 DD0_P,DD0_M 47, 48 O 2 Channel D differential LVDS data output pair, wire 0 DD1_P,DD1_M 45, 46 O 2 Channel D differential LVDS data output pair, wire 1 DCLKP,DCLKM 57, 58 O 2 Differential bit clock output pair FCLKP,FCLKM 55, 56 O 2 Differential frame clock output pair OUTPUT PINS NC 20 1 Do Not Connect PAD 0 1 Connect to ground plane using multiple vias. Refer to Board Design Considerations section. 24 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP ADS6445-EP ADS6444-EP www.ti.com SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 PIN CONFIGURATION (1-WIRE INTERFACE) LVDD DD_P DD_M DC_P DC_M LGND FCLKP FCLKM DCLKP DCLKM LGND DB_P DB_M DA_P LVDD DA_M ADS644x RGC PACKAGE (TOP VIEW) UNUSED 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 1 UNUSED UNUSED 2 47 UNUSED UNUSED 3 46 UNUSED UNUSED 4 45 UNUSED CAP 5 44 SCLK RESET 6 43 SDATA LVDD 7 42 SEN AGND 8 41 PDN PAD 37 IND_P AGND 13 36 AGND INB_M 14 35 INC_M INB_P 15 34 INC_P AGND 33 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 AGND AVDD AVDD AVDD 12 AGND INA_P CFG1 IND_M CFG2 38 CFG3 11 AVDD INA_M AGND AGND CLKM 39 CLKP 10 AGND AGND VCM AVDD CFG4 40 NC 9 AGND AVDD P0056-05 PIN ASSIGNMENTS (1-WIRE INTERFACE) PINS NAME NO. I/O NO. OF PINS DESCRIPTION SUPPLY AND GROUND PINS AVDD 9, 17, 19, 27, 32, 40 6 Analog power supply AGND 8, 10, 13, 16, 18, 23, 26, 31, 33, 36, 39 11 Analog ground LVDD 7, 49, 64 3 Digital power supply LGND 54, 59 2 Digital ground INPUT PINS CLKP, CLKM 24, 25 I 2 Differential input clock pair INA_P, INA_M 12, 11 I 2 Differential input signal pair, channel A. If unused, the pins should be tied to VCM. Do not float. INB_P, INB_M 15, 14 I 2 Differential input signal pair, channel B. If unused, the pins should be tied to VCM. Do not float. Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP Submit Documentation Feedback 25 ADS6445-EP ADS6444-EP SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 www.ti.com PIN ASSIGNMENTS (1-WIRE INTERFACE) (continued) PINS NAME NO. I/O NO. OF PINS DESCRIPTION INC_P, INC_M 34, 35 I 2 Differential input signal pair, channel C. If unused, the pins should be tied to VCM. Do not float. IND_P, IND_M 37, 38 I 2 Differential input signal pair, channel D. If unused, the pins should be tied to VCM. Do not float. 1 Connect 2 nF capacitance from pin to ground CAP 5 SCLK 44 I 1 This pin functions as serial interface clock input when RESET is low. When RESET is high, it controls DESKEW, SYNC and global POWER DOWN modes (along with SDATA). Refer to Table 5 for description. This pin has an internal pull-down resistor. SDATA 43 I 1 This pin functions as serial interface data input when RESET is low. When RESET is high, it controls DESKEW, SYNC and global POWER DOWN modes (along with SCLK). Refer to Table 5 for description. This pin has an internal pull-down resistor. SEN 42 I 1 This pin functions as serial interface enable input when RESET is low. When RESET is high, it controls coarse gain and internal/external reference modes. Refer to Table 6 for description. This pin has an internal pull-up resistor. Serial interface reset input. When using the serial interface mode, the user MUST initialize internal registers through hardware RESET by applying a high-going pulse on this pin or by using software reset option. Refer to the Serial Interface section. In parallel interface mode, tie RESET permanently high. (SCLK, SDATA and SEN function as parallel control pins in this mode). RESET 6 I 1 PDN 41 I 1 Global power down control pin. CFG1 30 I 1 Parallel input pin. It controls 1-wire or 2-wire interface and DDR or SDR bit clock selection. Refer to Table 8 for description. Tie to ground for 1-wire interface with DDR bit clock. CFG2 29 I 1 Parallel input pin. It controls 14x or 16x serialization and SDR bit clock capture edge. Refer to Table 9 for description. For 14x serialization with DDR bit clock, tie to ground or AVDD. CFG3 28 I 1 RESERVED pin - Tie to ground. CFG4 21 I 1 Parallel input pin. It controls data format and MSB or LSB first modes. Refer to Table 11 for description. VCM 22 I/O 1 Internal reference mode – common-mode voltage output External reference mode – reference input. The voltage forced on this pin sets the internal reference. DA_P,DA_M 62, 63 O 2 Channel A differential LVDS data output pair DB_P,DB_M 60, 61 O 2 Channel B differential LVDS data output pair DC_P,DC_M 52, 53 O 2 Channel C differential LVDS data output pair DD_P,DD_M 50, 51 O 2 Channel D differential LVDS data output pair DCLKP,DCLKM 57, 58 O 2 Differential bit clock output pair FCLKP,FCLKM 55, 56 O 2 Differential frame clock output pair 1–4, 45–48 8 These pins are unused in the 1-wire interface. Do not connect NC 20 1 Do not connect PAD 0 1 Connect to ground plane using multiple vias. Refer to Board Design Considerations in the application section. The pin has an internal pull-down resistor to ground. OUTPUT PINS UNUSED 26 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP ADS6445-EP ADS6444-EP www.ti.com SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 TYPICAL CHARACTERISTICS All plots are at 25°C, AVDD = LVDD = 3.3 V, maximum rated sampling frequency, sine wave input clock, 1.5 VPP differential clock amplitude, 50% clock duty cycle, –1 dBFS differential analog input, internal reference mode, 0 dB gain (unless otherwise noted) ADS6445 (Fsrated = 125 MSPS) FFT for 10 MHz INPUT SIGNAL FFT for 100 MHz INPUT SIGNAL 0 0 SFDR = 88 dBc SINAD = 74 dBFS SNR = 74.3 dBFS THD = 87.6 dBc −20 −40 Amplitude − dB Amplitude − dB −40 −60 −80 −100 −60 −80 −100 −120 −120 −140 −140 −160 −160 0 10 20 30 40 50 60 f − Frequency − MHz 0 10 20 40 50 60 G001 G002 Figure 7. Figure 8. FFT for 230 MHz INPUT SIGNAL INTERMODULATION DISTORTION (IMD) vs FREQUENCY 0 SFDR = 77.9 dBc SINAD = 68 dBFS SNR = 69.2 dBFS THD = 75.3 dBc −20 fIN1 = 185.1 MHz, –7 dBFS fIN2 = 190.1 MHz, –7 dBFS 2-Tone IMD = –86 dBFS SFDR = –95 dBFS −20 −40 Amplitude − dB −40 −60 −80 −100 −60 −80 −100 −120 −120 −140 −140 −160 −160 0 10 20 30 40 50 f − Frequency − MHz 60 0 10 20 30 40 50 60 f − Frequency − MHz G003 Figure 9. G004 Figure 10. SFDR vs INPUT FREQUENCY SNR vs INPUT FREQUENCY 75 92 90 74 Gain = 3.5 dB 88 73 86 SNR − dBFS SFDR − dBc 30 f − Frequency − MHz 0 Amplitude − dB SFDR = 86 dBc SINAD = 72.63 dBFS SNR = 72.76 dBFS THD = 85 dBc −20 84 82 80 Gain = 0 dB 72 71 70 Gain = 3.5 dB 69 78 Gain = 0 dB 76 68 74 67 0 50 100 150 200 fIN − Input Frequency − MHz 250 0 50 G005 Figure 11. 100 150 200 250 fIN − Input Frequency − MHz G006 Figure 12. Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP Submit Documentation Feedback 27 ADS6445-EP ADS6444-EP SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 www.ti.com ADS6445 (Fsrated = 125 MSPS) (continued) SFDR vs INPUT FREQUENCY ACROSS GAINS SINAD vs INPUT FREQUENCY ACROSS GAINS 75 92 Input adjusted to get −1dBFS input 90 4 dB 5 dB 84 3 dB 82 80 2 dB 3 dB 71 70 69 68 2 dB 78 76 0 dB 67 4 dB 66 1 dB 74 5 dB 6 dB 65 50 70 90 20 110 130 150 170 190 210 230 fIN − Input Frequency − MHz 40 60 80 100 120 140 160 180 200 220 fIN − Input Frequency − MHz G007 Figure 13. PERFORMANCE vs AVDD PERFORMANCE vs LVDD 88 77 SFDR 94 76 82 75 80 74 SNR 78 73 76 72 74 71 72 3.0 3.1 3.2 3.3 3.4 AVDD − Supply Voltage − V 74 90 73 86 72 SFDR 82 78 3.0 70 3.6 3.5 75 fIN = 50.1 MHz AVDD = 3.3 V SNR SFDR − dBc 84 SNR − dBFS SFDR − dBc 98 78 fIN = 50.1 MHz LVDD = 3.3 V 71 3.1 3.2 PERFORMANCE vs TEMPERATURE 76 75 80 74 SNR 78 73 76 72 SNR − dBFS SFDR − dBc SFDR 82 60 110 78 100 77 90 SFDR (dBFS) 76 80 70 75 SNR (dBFS) 74 60 73 50 72 30 −60 80 71 fIN = 20 MHz −50 −40 Submit Documentation Feedback −30 −20 Input Amplitude − dBFS G011 Figure 17. 28 G010 40 71 T − Temperature − °C 70 3.6 SFDR (dBc) fIN = 50.1 MHz 40 SFDR − dBc, dBFS 84 20 3.5 PERFORMANCE vs INPUT AMPLITUDE 77 0 3.4 Figure 16. 86 −20 3.3 LVDD − Supply Voltage − V G009 Figure 15. 74 −40 G008 Figure 14. SNR − dBFS 30 SNR − dBFS 10 86 1 dB 72 SINAD − dBFS SFDR − dBc 3.5 dB 73 88 86 0 dB 74 6 dB −10 70 0 G012 Figure 18. Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP ADS6445-EP ADS6444-EP www.ti.com SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 ADS6445 (Fsrated = 125 MSPS) (continued) PERFORMANCE vs CLOCK AMPLITUDE (differential) 86 PERFORMANCE vs CLOCK DUTY CYCLE 90 77 78 fIN = 50.1 MHz 84 76 75 80 74 78 73 SNR 76 72 74 71 SFDR − dBc 82 SNR − dBFS SFDR − dBc SFDR 89 77 88 76 87 75 86 SNR − dBFS SFDR 74 SNR 85 73 fIN = 20.1 MHz 72 0.5 1.0 1.5 2.0 70 3.0 2.5 72 35 40 45 50 60 65 Input Clock Duty Cycle − % G013 G014 Figure 20. POWER DISSIPATION vs SAMPLING FREQUENCY OUTPUT NOISE HISTOGRAM WITH INPUTS TIED TO COMMON-MODE 2.0 40 1.8 35 RMS (LSB) = 1.064 1.6 30 1.4 1.2 1.0 AVDD 0.8 0.6 25 20 15 10 0.4 LVDD 5 0.2 0 0.0 0 25 50 75 100 fS − Sampling Frequency − MSPS 8187 8188 8189 8190 8191 8192 8193 8194 8195 8196 125 G015 Output Code Figure 21. CMRR vs FREQUENCY 78 fIN = 50.1 MHz External Reference Mode 76 74 SNR 88 72 SNR − dBFS 92 SFDR 86 84 1.30 70 1.35 1.40 1.45 1.50 1.55 1.60 1.65 68 1.70 CMRR − Common-Mode Rejection Ratio − dBc PERFORMANCE IN EXTERNAL REFERENCE MODE 90 G016 Figure 22. 94 SFDR − dBc 55 Figure 19. Occurence − % PD − Power Dissipation − W Input Clock Amplitude − VPP 84 0 −10 −20 −30 −40 −50 −60 −70 −80 −90 −100 0 50 100 150 200 250 300 f − Frequency − MHz VVCM − VCM Voltage − V G017 Figure 23. G018 Figure 24. Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP Submit Documentation Feedback 29 ADS6445-EP ADS6444-EP SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 www.ti.com ADS6444 (Fsrated = 105 MSPS) FFT for 10 MHz INPUT SIGNAL FFT for 70 MHz INPUT SIGNAL 0 SFDR = 91.2 dBc SINAD = 73.9 dBFS SNR = 74.1 dBFS THD = 89.7 dBc −20 −40 −60 −80 −100 −60 −80 −100 −120 −120 −140 −140 −160 −160 0 10 20 30 40 50 f − Frequency − MHz 0 10 20 50 G019 G020 Figure 26. FFT for 230 MHz INPUT SIGNAL INTERMODULATION DISTORTION (IMD) vs FREQUENCY 0 SFDR = 81 dBc SINAD = 68.6 dBFS SNR = 69 dBFS THD = 79 dBc fIN1 = 185.1 MHz, –7 dBFS fIN2 = 190.1 MHz, –7 dBFS 2-Tone IMD = –88 dBFS SFDR = –89 dBFS −20 −40 Amplitude − dB −40 −60 −80 −100 −60 −80 −100 −120 −120 −140 −140 −160 −160 0 10 20 30 40 f − Frequency − MHz 50 0 10 20 30 40 f − Frequency − MHz G021 Figure 27. 50 G022 Figure 28. SFDR vs INPUT FREQUENCY SNR vs INPUT FREQUENCY 92 76 90 75 74 86 SNR − dBFS 88 SFDR − dBc 40 Figure 25. −20 Gain = 3.5 dB 84 82 73 72 Gain = 0 dB 71 70 Gain = 3.5 dB 69 80 68 Gain = 0 dB 78 67 76 66 0 50 100 150 200 fIN − Input Frequency − MHz 250 0 50 Submit Documentation Feedback 100 150 fIN − Input Frequency − MHz G023 Figure 29. 30 30 f − Frequency − MHz 0 Amplitude − dB SFDR = 81.2 dBc SINAD = 71.6 dBFS SNR = 72.6 dBFS THD = 79.9 dBc −20 Amplitude − dB −40 Amplitude − dB 0 200 250 G024 Figure 30. Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP ADS6445-EP ADS6444-EP www.ti.com SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 ADS6444 (Fsrated = 105 MSPS) (continued) SFDR vs INPUT FREQUENCY ACROSS GAINS SINAD vs INPUT FREQUENCY ACROSS GAINS 75 92 Input adjusted to get −1dBFS input 90 84 6 dB 80 2 dB 78 69 68 67 66 74 65 30 50 70 90 3 dB 70 76 10 2 dB 71 1 dB 0 dB 1 dB 72 SINAD − dBFS 20 110 130 150 170 190 210 230 fIN − Input Frequency − MHz 4 dB 40 5 dB 60 80 6 dB 100 120 140 160 180 200 220 fIN − Input Frequency − MHz G025 Figure 31. PERFORMANCE vs AVDD 88 fIN = 70.1 MHz LVDD = 3.3 V 77 94 75 fIN = 70.1 MHz AVDD = 3.3 V 74 75 80 74 78 73 76 SNR − dBFS SFDR 82 72 SNR 74 SNR 90 86 72 SFDR 82 71 71 72 3.0 3.1 3.2 3.3 3.4 3.5 78 3.0 70 3.6 AVDD − Supply Voltage − V 3.1 3.2 3.3 PERFORMANCE vs TEMPERATURE 79 100 78 86 77 SFDR 76 82 75 80 74 78 73 SFDR − dBc, dBFS 110 88 G028 85 SFDR (dBFS) 80 80 70 75 SNR (dBFS) 70 60 65 50 60 40 72 30 −60 15 30 45 60 75 90 105 120 135 T ± Temperature ± ƒC 90 90 SFDR (dBc) fIN = 70.1 MHz 76 ±60 ±45 ±30 ±15 0 70 3.6 PERFORMANCE vs INPUT AMPLITUDE 80 SNR ± dBFs SNR 84 3.5 Figure 34. 92 90 3.4 LVDD − Supply Voltage − V G027 Figure 33. SFDR ± dBc 73 SNR − dBFS 76 SFDR − dBc 84 SFDR − dBc PERFORMANCE vs LVDD 98 78 86 G026 Figure 32. SNR − dBFS SFDR − dBc 3 dB 82 3.5 dB 73 5 dB 86 0 dB 74 4 dB 88 55 fIN = 20 MHz −50 −40 −30 −20 −10 50 0 C029 Input Amplitude − dBFS Figure 35. G030 Figure 36. Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP Submit Documentation Feedback 31 ADS6445-EP ADS6444-EP SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 www.ti.com ADS6444 (Fsrated = 105 MSPS) (continued) PERFORMANCE vs CLOCK AMPLITUDE (differential) 92 PERFORMANCE vs CLOCK DUTY CYCLE 93 76 fIN = 70.1 MHz 90 76 fIN = 20.1 MHz 75 91 88 75 SFDR 74 84 72 82 71 80 74 SNR 87 70 SFDR 78 1.0 1.5 2.0 85 72 83 68 3.0 2.5 Input Clock Amplitude − VPP 71 35 40 45 50 65 G032 Figure 38. POWER DISSIPATION vs SAMPLING FREQUENCY OUTPUT NOISE HISTOGRAM WITH INPUTS TIED TO COMMON-MODE 40 1.8 35 RMS (LSB) = 1.054 1.6 30 Occurence − % 1.4 1.2 1.0 AVDD 0.8 0.6 25 20 15 10 LVDD 0.4 5 0 0.0 0 20 40 60 80 fS − Sampling Frequency − MSPS 8179 8180 8181 8182 8183 8184 8185 8186 8187 8188 100 G033 Output Code Figure 39. CMRR vs FREQUENCY 76 fIN = 70.1 MHz External Reference Mode 74 SNR 82 72 70 SFDR 81 SNR − dBFS 84 68 1.35 1.40 1.45 1.50 1.55 VVCM − VCM Voltage − V 1.60 1.65 66 1.70 CMRR − Common-Mode Rejection Ratio − dBc PERFORMANCE IN EXTERNAL REFERENCE MODE 83 0 −10 −20 −30 −40 −50 −60 −70 −80 −90 −100 0 50 100 150 200 f − Frequency − MHz G035 Figure 41. Submit Documentation Feedback G034 Figure 40. 85 SFDR − dBc 60 Figure 37. 2.0 80 1.30 55 Input Clock Duty Cycle − % G031 0.2 32 73 69 76 0.5 PD − Power Dissipation − W 89 SNR − dBFS 73 SFDR − dBc 86 SNR − dBFS SFDR − dBc SNR 250 300 G018 Figure 42. Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP ADS6445-EP ADS6444-EP www.ti.com SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 Contour Plots across Input and Sampling Frequencies 125 120 92 89 80 86 83 fS - Sampling Frequency - MSPS 110 65 86 80 83 89 74 100 77 83 90 86 80 86 83 80 70 68 71 74 86 89 80 60 68 71 77 65 83 50 89 86 30 10 50 74 80 83 150 100 68 71 77 40 200 250 300 65 400 350 450 500 fIN - Input Frequency - MHz 65 75 70 80 85 90 SFDR - dBc M0049-13 Figure 43. SFDR Contour (no gain) 125 120 85 88 70 76 82 110 fS - Sampling Frequency - MSPS 79 91 91 88 88 100 73 79 85 94 82 90 76 82 88 80 70 91 70 79 85 60 67 73 88 76 50 70 82 40 91 30 10 79 85 50 100 150 200 73 76 250 300 350 400 450 500 fIN - Input Frequency - MHz 65 75 70 80 85 SFDR - dBc 90 M0049-14 Figure 44. SFDR Contour (3.5 dB coarse gain) Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP Submit Documentation Feedback 33 ADS6445-EP ADS6444-EP SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 www.ti.com Contour Plots across Input and Sampling Frequencies (continued) 125 120 68 fS - Sampling Frequency - MSPS 73 74 110 64 67 72 70 71 65 66 69 100 90 66 80 70 71 72 73 74 64 65 67 68 69 70 60 66 64 65 50 67 40 30 10 50 69 71 70 72 73 74 150 100 68 66 200 250 64 65 300 63 400 350 62 450 500 fIN - Input Frequency - MHz 60 70 65 75 SNR - dBFS M0048-13 Figure 45. SNR Contour (no gain) 125 120 72 71 fS - Sampling Frequency - MSPS 110 70 67 68 69 66 65 100 90 67 71 80 68 72 70 70 65 69 64 66 60 50 71 67 72 69 40 30 10 70 50 100 150 66 68 200 250 64 65 64 300 63 62 63 400 350 61 450 500 fIN - Input Frequency - MHz 60 62 64 66 68 70 SNR - dBFS 72 M0048-14 Figure 46. SNR Contour (3.5 dB coarse gain) 34 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP ADS6445-EP ADS6444-EP www.ti.com SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 APPLICATION INFORMATION THEORY OF OPERATION The ADS6445/ADS6444 is a quad channel, 14 bit pipeline ADC based on switched capacitor architecture in CMOS technology. The conversion is initiated simultaneously by all the four channels at the rising edge of the external input clock. After the input signals are captured by the sample and hold circuit of each channel, the samples are sequentially converted by a series of low resolution stages. The stage outputs are combined in a digital correction logic block to form the final 14 bit word with a latency of 12 clock cycles. The 14 bit word of each channel is serialized and output as LVDS levels. In addition to the data streams, a bit clock and frame clock also are output. The frame clock is aligned with the 14 bit word boundary. ANALOG INPUT The analog input consists of a switched-capacitor based differential sample and hold architecture, shown in Figure 47. This differential topology results in very good AC performance even for high input frequencies. The INP and INM pins have to be externally biased around a common-mode voltage of 1.5 V, available on VCM pin 13. For a full-scale differential input, each input pin INP, INM has to swing symmetrically between VCM + 0.5 V and VCM – 0.5 V, resulting in a 2 VPP differential input swing. The maximum swing is determined by the internal reference voltages REFP (2.0 V nominal) and REFM (1.0 V, nominal). The sampling circuit has a 3 dB bandwidth that extends up to 500 MHz (see Figure 48, shown by the transfer function from the analog input pins to the voltage across the sampling capacitors, TF_ADC). Sampling Switch Lpkg 3 nH 25 W Sampling Capacitor RCR Filter INP Cbond 2 pF 50 W Resr 200 W Lpkg 3 nH 3.2 pF Cpar2 Ron 1 pF 15 W Cpar1 0.8 pF Ron 10 W 50 W Ron 15 W 25 W INM Cpar2 1 pF Cbond 2 pF Resr 200 W Csamp 4.0 pF Csamp 4.0 pF Sampling Capacitor Sampling Switch S0237-01 Figure 47. Input Sampling Circuit Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP Submit Documentation Feedback 35 ADS6445-EP ADS6444-EP SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 www.ti.com 1 Magnitude − dB 0 −1 −2 −3 −4 −5 −6 0 100 200 300 400 500 600 fIN − Input Frequency − MHz 700 G073 Figure 48. Analog Input Bandwidth (represented by magnitude of TF_ADC, see Figure 50 ) Drive Circuit Requirements For optimum performance, the analog inputs must be driven differentially. This improves the common-mode noise immunity and even order harmonic rejection. A 5 Ω resistor in series with each input pin is recommended to damp out ringing caused by the package parasitics. It is also necessary to present low impedance (< 50 Ω) for the common mode switching currents. For example, this is achieved by using two resistors from each input terminated to the common mode voltage (VCM). In addition to the above, the drive circuit may have to be designed to provide a low insertion loss over the desired frequency range and matched impedance to the source. While doing this, the ADC input impedance has to be taken into account. Figure 49 shows that the impedance (Zin, looking into the ADC input pins) decreases at high input frequencies. The Smith chart shows that the input impedance is capacitive and can be approximated by a series R-C up to 500 MHz. 36 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP ADS6445-EP ADS6444-EP www.ti.com SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 F1 Freq = 50 MHz S(1, 1) = 0.967 / –13.241 Impedance = 62.211 – j421.739 1000 F1 Frequency = 50 MHz Mag(Zin1) = 426.302 900 700 F2 Frequency = 400 MHz Mag(Zin1) = 65.193 600 F1 500 S(1, 1) Magnitude of Zin -- W 800 400 F2 300 200 F1 F2 100 0 0 50 100 150 200 250 300 350 400 450 500 fI -- Input Frequency -- MHz Frequency (100 kHz to 500 MHz) F2 Freq = 400 MHz S(1, 1) = 0.273 / –59.329 Impedance = 58.132 – j29.510 M0087-01 Figure 49. ADC Input Impedance, Zin Using RF-Transformers Based Drive Circuits Figure 50 shows a configuration using a single 1:1 turns ratio transformer (for example, Coilcraft WBC1-1) that can be used for low input frequencies up to 100 MHz. The single-ended signal is fed to the primary winding of the RF transformer. The transformer is terminated on the secondary side. Putting the termination on the secondary side helps to shield the kickbacks caused by the sampling circuit from the RF transformer’s leakage inductances. The termination is accomplished by two resistors connected in series, with the center point connected to the 1.5 V common mode (VCM pin). The value of the termination resistors (connected to common mode) has to be low (< 100 Ω) to provide a low-impedance path for the ADC common-mode switching current. Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP Submit Documentation Feedback 37 ADS6445-EP ADS6444-EP SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 www.ti.com TF_ADC 0.1 mF ADS6xxx 5W INP 0.1 mF 25 W 25 W INM 5W 1:1 VCM S0256-01 Figure 50. Single Transformer Drive Circuit At high input frequencies, the mismatch in the transformer parasitic capacitance (between the windings) results in degraded even-order harmonic performance. Connecting two identical RF transformers back-to-back helps minimize this mismatch, and good performance is obtained for high frequency input signals. Figure 51 shows an example using two transformers (like Coilcraft WBC1-1). An additional termination resistor pair (enclosed within the shaded box in Figure 51) may be required between the two transformers to improve the balance between the P and M sides. The center point of this termination must be connected to ground. ADS6xxx 0.1 µF 5Ω INP 50 Ω 0.1 µF 50 Ω 50 Ω 50 Ω INM 1:1 5Ω 1:1 VCM S0164-04 Figure 51. Two Transformer Drive Circuit 38 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP ADS6445-EP ADS6444-EP www.ti.com SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 Using Differential Amplifier Drive Circuits Figure 52 shows a drive circuit using a differential amplifier (TI's THS4509) to convert a single-ended input to differential output that can be interfaced to the ADC input pins. In addition to the single-ended to differential conversion, the amplifier also provides gain (10 dB in Figure 52). As shown in the figure, RFIL helps to isolate the amplifier output from the switching inputs of the ADC. Together with CFIL, it also forms a low-pass filter that bandlimits the noise (and signal) at the ADC input. As the amplifier outputs are ac-coupled, the common-mode voltage of the ADC input spins is set using two resistors connected to VCM. The amplifier outputs also can be dc-coupled. Using the output common-mode control of the THS4509, the ADC input pins can be biased to 1.5 V. In this case, use +4 V and -1 V supplies for the THS4509 to ensure that it's output common-mode voltage (1.5 V) is at mid-supply. RF +VS 500 W 0.1 mF RS 0.1 mF 10 mF RFIL 0.1 mF 5W INP RG 0.1 mF RT CFIL 200 W CFIL 200 W CM THS4509 RG RFIL INM RS || RT 0.1 mF 5W 0.1 mF 500 W VCM –VS ADS6xxx 0.1 mF 10 mF 0.1 mF RF S0259-01 Figure 52. Drive Circuit Using THS4509 Refer to the EVM User Guide (SLAU196) for more information. INPUT COMMON MODE To ensure a low-noise common-mode reference, the VCM pin is filtered with a 0.1 μF low-inductance capacitor connected to ground. The VCM pin is designed to directly drive the ADC inputs. The input stage of the ADC sinks a common-mode current in the order of 155 μA at 125 MSPS (per input pin). Equation 1 describes the dependency of the common-mode current and the sampling frequency. 155 mAxFs 125 MSPS (1) This equation helps to design the output capability and impedance of the CM driving circuit accordingly. REFERENCE The ADS644X has built-in internal references REFP and REFM, requiring no external components. Design schemes are used to linearize the converter load seen by the references; this and the on-chip integration of the requisite reference capacitors eliminates the need for external decoupling. The full-scale input range of the converter can be controlled in the external reference mode as explained below. The internal or external reference modes can be selected by programming the register bit <REF> (refer to Table 13). Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP Submit Documentation Feedback 39 ADS6445-EP ADS6444-EP SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 www.ti.com INTREF Internal Reference VCM 1 kW INTREF 4 kW EXTREF REFM REFP ADS6xxx S0165-04 Figure 53. Reference Section Internal Reference When the device is in internal reference mode, the REFP and REFM voltages are generated internally. Commonmode voltage (1.5 V nominal) is output on VCM pin, which can be used to externally bias the analog input pins. External Reference When the device is in external reference mode, the VCM acts as a reference input pin. The voltage forced on the VCM pin is buffered and gained by 1.33 internally, generating the REFP and REFM voltages. The differential input voltage corresponding to full-scale is given by Equation 2. Full−scale differential input pp + (Voltage forced on VCM) 1.33 (2) In this mode, the range of voltage applied on VCM should be 1.45 V to 1.55 V. The 1.5-V common-mode voltage to bias the input pins has to be generated externally. COARSE GAIN AND PROGRAMMABLE FINE GAIN ADS644X includes gain settings that can be used to get improved SFDR performance (compared to 0 dB gain mode). The gain settings are 3.5 dB coarse gain and programmable fine gain from 0 dB to 6 dB. For each gain setting, the analog input full-scale range scales proportionally, as listed in Table 21. The coarse gain is a fixed setting of 3.5 dB and is designed to improve SFDR with little degradation in SNR (as seen in Figure 11 and Figure 12). The fine gain is programmable in 1 dB steps from 0 to 6 dB. With fine gain also, SFDR improvement is achieved, but at the expense of SNR (there is about 1 dB SNR degradation for every 1 dB of fine gain). 40 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP ADS6445-EP ADS6444-EP www.ti.com SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 So, the fine gain can be used to trade-off between SFDR and SNR. The coarse gain makes it possible to get best SFDR but without losing SNR significantly. At high input frequencies, the gains are especially useful as the SFDR improvement is significant with marginal degradation in SINAD. The gains can be programmed using the register bits <COARSE GAIN> (refer to Table 18) and <FINE GAIN> (refer to Table 17). Note that the default gain after reset is 0 dB. Table 21. Full-Scale Range Across Gains GAIN, dB TYPE FULL-SCALE, VPP 0 Default (after reset) 2 3.5 Coarse setting (fixed) 1.34 1 1.78 2 1.59 3 1.42 Fine setting (programmable) 4 1.26 5 1.12 6 1.00 CLOCK INPUT The ADS644X clock inputs can be driven differentially (SINE, LVPECL or LVDS) or single-ended (LVCMOS), with little or no difference in performance between them. The common-mode voltage of the clock inputs is set to VCM using internal 5 kΩ resistors as shown in Figure 54. This allows using transformer-coupled drive circuits for sine wave clock or ac-coupling for LVPECL, LVDS clock sources (see Figure 55 and Figure 57). VCM VCM 5 kW 5 kW CLKP CLKM ADS6xxx S0166-04 Figure 54. Internal Clock Buffer Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP Submit Documentation Feedback 41 ADS6445-EP ADS6444-EP SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 www.ti.com 0.1 mF CLKP Differential Sine-Wave or PECL or LVDS Clock Input 0.1 mF CLKM ADS6xxx S0167-05 Figure 55. Differential Clock Driving Circuit Figure 56 shows a typical scheme using PECL clock drive from a CDCM7005 clock driver. SNR performance with this scheme is comparable with that of a low jitter sine wave clock source. VCC Reference Clock REF_IN VCC Y0 CLKP Y0B CLKM CDCM7005 VCXO_INP OUTM VCXO_INM CP_OUT ADS6xxx VCXO OUTP CTRL S0238-02 Figure 56. PECL Clock Drive Using CDCM7005 Single-ended CMOS clock can be ac coupled to the CLKP input, with CLKM (pin) connected to ground with a 0.1-μF capacitor, as shown in Figure 57. 0.1 mF CMOS Clock Input CLKP 0.1 mF CLKM ADS6xxx S0168-07 Figure 57. Single-Ended Clock Driving Circuit 42 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP ADS6445-EP ADS6444-EP www.ti.com SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 For best performance, the clock inputs have to be driven differentially, reducing susceptibility to common-mode noise. For high input frequency sampling, it is recommended to use a clock source with very low jitter. Bandpass filtering of the clock source can help reduce the effect of jitter. There is no change in performance with a non50% duty cycle clock input. CLOCK BUFFER GAIN When using a sinusoidal clock input, the noise contributed by clock jitter improves as the clock amplitude is increased. Hence, it is recommended to use large clock amplitude. As shown by Figure 19, use clock amplitude greater than 1 VPP to avoid performance degradation. In addition, the clock buffer has programmable gain to amplify the input clock to support very low clock amplitude. The gain can be set by programming the register bits <CLKIN GAIN> (refer to Table 14) and increases monotonically from Gain 0 to Gain 4 settings. Table 22 lists the minimum clock amplitude supported for each gain setting. Table 22. Minimum Clock Amplitude across gains CLOCK BUFFER GAIN MINIMUM CLOCK AMPLITUDE SUPPORTED mVPP differential Gain 0 (minimum gain) 800 Gain 1 (default gain) 400 Gain 2 300 Gain 3 200 Gain 4 (highest gain) 150 POWER DOWN MODES The ADS644X has three power-down modes – global power down, channel standby and input clock stop. Global Power Down This is a global power-down mode in which almost the entire chip is powered down, including the four ADCs, internal references, PLL and LVDS buffers. As a result, the total power dissipation falls to about 77 mW typical (with input clock running). This mode can be initiated by setting the register bit <PDN GLOBAL> (refer to Table 13). The output data and clock buffers are in high-impedance state. The wake-up time from this mode to data becoming valid in normal mode is 100 μs. Channel Standby In this mode, only the ADC of each channel is powered down and this helps to get very fast wake-up times. Each of the four ADCs can be powered down independently using the register bits <PDN CH> (refer to Table 13). The output LVDS buffers remain powered up. The wake-up time from this mode to data becoming valid in normal mode is 200 clock cycles. Input Clock Stop The converter enters this mode: • If the input clock frequency falls below 1 MSPS or • If the input clock amplitude is less than 400 mVPP, differential with default clock buffer gain setting) at any sampling frequency. All ADCs and LVDS buffers are powered down and the power dissipation is about 235 mW. The wake-up time from this mode to data becoming valid in normal mode is 100 μs. Table 23. Power-Down Mode Summary POWER-DOWN MODE AVDD POWER (mW) LVDD POWER (mW) WAKE-UP TIME In power-up 1360 297 – Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP Submit Documentation Feedback 43 ADS6445-EP ADS6444-EP SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 www.ti.com Table 23. Power-Down Mode Summary (continued) POWER-DOWN MODE Global power down 65 LVDD POWER (mW) 1115 2 Channels in standby 825 (1) 3 Channels in standby 532 (1) 4 Channels in standby 245 (1) 200 WAKE-UP TIME 100 μs 12 (1) 1 Channel in standby Input clock stop (1) AVDD POWER (mW) 297 (1) 200 Clocks 297 (1) 200 Clocks 297 (1) 200 Clocks 297 (1) 200 Clocks 35 100 μs Sampling frequency = 125 MSPS. POWER SUPPLY SEQUENCING During power-up, the AVDD and LVDD supplies can come up in any sequence. The two supplies are separated inside the device. Externally, they can be driven from separate supplies or from a single supply. 44 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP ADS6445-EP ADS6444-EP www.ti.com SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 DIGITAL OUTPUT INTERFACE The ADS644X offers several flexible output options making it easy to interface to an ASIC or an FPGA. Each of these options can be easily programmed using either parallel pins or the serial interface. The output interface options are: • 1-Wire, 1× frame clock, 14× and 16× serialization with DDR bit clock • 2-Wire, 1× frame clock, 16× serialization, with DDR and SDR bit clock, byte wise/bit wise/word wise • 2-Wire, 1× frame clock, 14× serialization, with SDR bit clock, byte wise/bit wise/word wise • 2-Wire, (0.5 x) frame clock, 14× serialization, with DDR bit clock, byte wise/bit wise/word wise The maximum sampling frequency, bit clock frequency and output data rate will vary depending on the interface options selected (refer to Table 12). Table 24. Maximum Recommended Sampling Frequency for Different Output Interface Options INTERFACE OPTIONS MAXIMUM RECOMMENDED SAMPLING FREQUENCY, MSPS BIT CLOCK FREQUENCY, MHZ FRAME CLOCK FREQUENCY, MHZ SERIAL DATA RATE, Mbps 1-Wire DDR Bit clock 14× Serialization 65 455 65 910 16× Serialization 65 520 65 1040 2-Wire DDR Bit clock 14× Serialization 125 437.5 62.5 875 16× Serialization 125 500 125 1000 2-Wire SDR Bit clock 14× Serialization 65 455 65 910 16× Serialization 65 520 65 1040 Each interface option is described in detail in the following sections. 1-WIRE INTERFACE - 14× AND 16× SERIALIZATION WITH DDR BIT CLOCK Here the device outputs the data of each ADC serially on a single LVDS pair (1 wire). The data is available at the rising and falling edges of the bit clock (DDR bit clock). The ADC outputs a new word at the rising edge of every frame clock, starting with the MSB. Optionally, it can also be programmed to output the LSB first. The data rate is 14 × sample frequency (14× serialization) and 16 × sample frequency (16× serialization). Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP Submit Documentation Feedback 45 ADS6445-EP ADS6444-EP SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 www.ti.com Input Clock, CLKP/M Freq = Fs 16 Bit Serialization (1) 12 Bit Serialization Frame Clock, FCLKP Freq = 1 × Fs Bit Clock – DDR, DCLKP/M Freq = 7 × Fs Output Data DA, DB, DC, DD Data Rate = 14 × Fs D13 (D0) D12 (D1) D11 (D2) D10 (D3) D9 (D4) D8 (D5) D7 (D6) D6 (D7) D8 (D7) D7 (D8) D5 (D8) D4 (D9) D3 D2 D1 D0 (D10) (D11) (D12) (D13) D13 (D0) D12 (D1) Bit Clock – DDR, DCLKP/M Freq = 8 × Fs Output Data DA, DB, DC, DD Data Rate = 16 × Fs 0 (D0) 0 (D1) D13 (D2) D12 (D3) D11 (D4) D10 (D5) D9 (D6) D6 D5 D4 D3 D2 (D9) (D10) (D11) (D12) (D13) D1 (0) Sample N D0 (0) 0 (D0) 0 (D1) Sample N + 1 Data Bit in MSB First Mode D13 (D2) Data Bit in LSB First Mode (1) In 16 Bit serialization, two zero bits are padded to the 14 bit ADC data on the MSB side. T0225-02 Figure 58. 1-Wire Interface 2-WIRE INTERFACE - 16× SERIALIZATION WITH DDR/SDR BIT CLOCK The 2-wire interface is recommended for sampling frequencies above 65 MSPS. In 16× serialization, two zero bits are padded to the 14 bit ADC data on the MSB side and the combined 16 bit data is serialized and output over two LVDS pairs. The data rate is 8 × Sample frequency since 8 bits are sent on each wire every clock cycle. The data is available along with DDR bit clock or optionally with SDR bit clock. Each ADC sample is sent over the 2 wires as byte-wise or bit-wise or word-wise. Using the 16× serialization makes it possible to upgrade to a 16-bit ADC in the future seamlessly, without requiring any modification to the receiver capture logic design. 46 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP ADS6445-EP ADS6444-EP www.ti.com SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 Input Clock, CLKP/M Freq = Fs Frame Clock, FCLKP/M Freq = 1 ´ Fs Bit Clock – SDR, DCLKP/M Freq = 8 ´ Fs In Byte-Wise Mode Bit Clock – DDR, DCLKP/M Freq = 4 ´ Fs Output Data DA0, DB0, DC0, DD0 D7 (D0) D6 (D1) D5 (D2) D4 (D3) D3 (D4) D2 (D5) D1 (D6) D0 (D7) D7 (D0) D6 (D1) D5 (D2) D4 (D3) D3 (D4) D2 (D5) D1 (D6) D0 (D7) Output Data DA1, DB1, DC1, DD1 0 (D8) 0 (D9) D13 D12 D11 D10 D9 (0) D8 (0) 0 (D8) 0 (D9) D13 D12 D11 D10 (D10) (D11) (D12) (D13) (D10) (D11) (D12) (D13) D9 (0) D8 (0) D0 (0) 0 (D0) D12 (D2) D10 (D4) D8 (D6) D6 (D8) D2 D0 (D10) (D12) D1 (0) 0 (D1) D13 (D3) D11 (D5) D9 (D7) D7 (D9) (D11) (D13) D5 D4 D3 In Word-Wise Mode In Bit-Wise Mode Data Rate = 8 ´ Fs Output Data DA0, DB0, DC0, DD0 0 (D0) D12 (D2) D10 (D4) D8 (D6) D6 (D8) (D10) (D12) Output Data DA1, DB1, DC1, DD1 0 (D1) D13 (D3) D11 (D5) D9 (D7) D7 (D9) (D11) (D13) Output Data DA0, DB0, DC0, DD0 0 (D0) 0 (D1) D13 (D2) D12 (D3) D11 (D4) D10 (D5) D9 (D6) D8 (D7) D7 (D8) D6 (D9) (D10) (D11) (D12) (D13) Output Data DA1, DB1, DC1, DD1 0 (D0) 0 (D1) D13 (D2) D12 (D3) D11 (D4) D10 (D5) D9 (D6) D8 (D7) D7 (D8) D6 (D9) (D10) (D11) (D12) (D13) D4 D5 Data Bit in MSB First Mode D2 D3 D5 D4 D3 D4 D5 D2 D2 D3 (0) D1 (0) D1 (0) D0 (0) D1 (0) D0 (0) White Cells – Sample N D13 (D3) Data Bit in LSB First Mode Grey Cells – Sample N + 1 T0226-02 Figure 59. 2-Wire Interface 16× Serialization Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP Submit Documentation Feedback 47 ADS6445-EP ADS6444-EP SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 www.ti.com 2-WIRE INTERFACE - 14× SERIALIZATION The 14 bit ADC data is serialized and output over two LVDS pairs. A frame clock at 1× sample frequency is also available with an SDR bit clock. With DDR bit clock option, the frame clock frequency is 0.5× sample frequency. The output data rate will be 7 × sample frequency as 7 data bits are output every clock cycle on each wire. Each ADC sample is sent over the 2 wires as byte-wise or bit-wise or word-wise. 48 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP ADS6445-EP ADS6444-EP www.ti.com SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 Input Clock, CLK Freq = Fs Frame Clock, FCLK Freq = 1 ´ Fs In Byte-Wise Mode Bit Clock – SDR, DCLK Freq = 7 ´ Fs Output Data DA0, DB0, DC0, DD0 D6 (D0) D5 (D1) D4 (D2) D3 (D3) D2 (D4) D1 (D5) D0 (D6) D6 (D0) D5 (D1) D4 (D2) D3 (D3) D2 (D4) D1 (D5) D0 (D6) D6 (D0) D5 (D1) Output Data DA1, DB1, DC1, DD1 D13 (D7) D12 (D8) D11 (D9) D10 D9 D8 D7 D13 (D7) D12 (D8) D11 (D9) D10 D9 (D10) (D11) (D12) (D13) (D10) (D11) D8 (0) D7 (0) D13 (D7) D12 (D8) D12 (D0) D10 (D2) D8 (D4) D6 (D6) D4 (D8) D2 D0 (D10) (D12) D12 (D0) D10 (D2) (D11) (D13) D13 (D1) D11 (D3) D13 (D0) D12 (D1) D13 (D0) D12 (D1) In Word-Wise Mode In Bit-Wise Mode Data Rate = 7 ´ Fs Output Data DA0, DB0, DC0, DD0 D12 (D0) D10 (D2) D8 (D4) D6 (D6) D4 (D8) (D10) (D12) Output Data DA1, DB1, DC1, DD1 D13 (D1) D11 (D3) D9 (D5) D7 (D7) D5 (D9) (D11) (D13) D13 (D1) D11 (D3) D9 (D5) D7 (D7) D5 (D9) Output Data DA0, DB0, DC0, DD0 D13 (D0) D12 (D1) D11 (D2) D10 (D3) D9 (D4) D8 (D5) D7 (D6) D6 (D7) D5 (D8) D4 (D9) D3 D2 (D10) (D11) (D12) (D13) Output Data DA1, DB1, DC1, DD1 D13 (D0) D12 (D1) D11 (D2) D10 (D3) D9 (D4) D8 (D5) D7 (D6) D6 (D7) D5 (D8) D4 (D9) (D10) (D11) (D12) (D13) D2 D3 D0 D1 Data Bit in MSB First Mode D3 D2 D3 D1 D1 D1 D0 D0 White Cells – Sample N D6 (D0) Data Bit in LSB First Mode Grey Cells – Sample N + 1 T0227-02 Figure 60. 2-Wire Interface 14× Serialization - SDR Bit Clock Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP Submit Documentation Feedback 49 ADS6445-EP ADS6444-EP SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 www.ti.com Input Clock, CLK Freq = Fs Frame Clock, FCLK Freq = 0.5 ´ Fs In Byte-Wise Mode Bit Clock – DDR, DCLK Freq = 3.5 ´ Fs Output Data DA0, DB0, DC0, DD0 D6 (D0) D5 (D1) D4 (D2) D3 (D3) D2 (D4) D1 (D5) D0 (D6) D6 (D0) D5 (D1) D4 (D2) D3 (D3) D2 (D4) D1 (D5) D0 (D6) D6 (D0) D5 (D1) Output Data DA1, DB1, DC1, DD1 D13 (D7) D12 (D8) D11 (D9) D10 D9 D8 (0) D7 (0) D13 (D7) D12 (D8) D11 (D9) D10 D9 (D10) (D11) (D10) (D11) D8 (0) D7 (0) D13 (D7) D12 (D8) D2 D0 (0) D12 (D0) D10 (D2) D8 (D4) D6 (D6) D4 (D8) D2 D0 (D10) (D12) D12 (D0) D10 (D2) (D11) (D13) D13 (D1) D11 (D3) 0 (D0) 0 (D1) D13 (D0) D12 (D1) In Word-Wise Mode In Bit-Wise Mode Data Rate = 7 ´ Fs Output Data DA0, DB0, DC0, DD0 D12 (D0) D10 (D2) D8 (D4) D6 (D6) D4 (D8) (D10) Output Data DA1, DB1, DC1, DD1 D13 (D1) D11 (D3) D9 (D5) D7 (D7) D5 (D9) (D11) D1 (0) D13 (D1) D11 (D3) D9 (D5) D7 (D7) D5 (D9) Output Data DA0, DB0, DC0, DD0 D13 (D0) D12 (D1) D11 (D2) D10 (D3) D9 (D4) D8 (D5) D7 (D6) D6 (D7) D5 (D8) D4 (D9) D3 D2 (D10) (D11) (D12) (D13) Output Data DA1, DB1, DC1, DD1 D13 (D0) D12 (D1) D11 (D2) D10 (D3) D9 (D4) D8 (D5) D7 (D6) D6 (D7) D5 (D8) D4 (D9) (D10) (D11) (D12) (D13) D3 D3 D2 D3 D1 D1 D1 D0 D0 White Cells – Sample N Data Bit in MSB First Mode D6 (D0) Data Bit in LSB First Mode Grey Cells – Sample N + 1 T0228-02 Figure 61. 2-Wire interface 14× Serialization - DDR Bit Clock 50 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP ADS6445-EP ADS6444-EP www.ti.com SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 OUTPUT BIT ORDER In the 2-wire interface, three types of bit order are supported - byte-wise, bit-wise and word-wise. Byte-wise: Each 14 bit sample is split across the 2 wires. Wires DA0, DB0, DC0, and DD0 carry the 7 LSB bits D6 - D0 and wires DA1, DB1, DC1, and DD1 carry the 7 MSB bits. Bit-wise: Each 14 bit sample is split across the 2 wires. Wires DA0, DB0, DC0 and DD0 carry the 7 even bits (D0, D2, D4...) and wires DA1, DB1, DC1 and DD1 carry the 7 odd bits (D1, D3, D5...). Word-wise: In this case, all 14 bits of a sample are sent over a single wire. Successive samples are sent over the 2 wires. For example sample N is sent on wires DA0, DB0, DC0 and DD0, while sample N+1 is sent over wires DA1, DB1, DC1 and DD1. The frame clock frequency is 0.5x sampling frequency, with the rising edge aligned with the start of each word. MSB/LSB FIRST By default after reset, the 14 bit ADC data is output serially with the MSB first (D13, D12, D11,...D1, D0). The data can be output LSB first also by programming the register bit <MSB_LSB_First>. In the 2-wire mode, the bit order in each wire is flipped in the LSB first mode. OUTPUT DATA FORMATS Two output data formats are supported – 2s complement (default after reset) and offset binary. They can be selected using the serial interface register bit <DF>. In the event of an input voltage overdrive, the digital outputs go to the appropriate full-scale level. For a positive overdrive, the output code is 0x3FFF in offset binary output format, and 0x1FFF in 2s complement output format. For a negative input overdrive, the output code is 0x0000 in offset binary output format and 0x2000 in 2s complement output format. LVDS CURRENT CONTROL The default LVDS buffer current is 3.5 mA. With an external 100 Ω termination resistance, this develops ±350 mV logic levels at the receiver. The LVDS buffer currents also can be programmed to 2.5 mA, 3.0 mA, and 4.5 mA using the register bits <LVDS CURR>. In addition, there exists a current double mode, where the LVDS nominal current is doubled (register bits <CURR DOUBLE>, refer to Table 19). LVDS INTERNAL TERMINATION An internal termination option is available (using the serial interface), by which the LVDS buffers are differentially terminated inside the device. Five termination resistances are available – 166, 200, 250, 333, and 500 Ω (nominal with ±20% variation). Any combination of these terminations can be programmed; the effective termination is the parallel combination of the selected resistances. The terminations can be programmed separately for the clock and data buffers (bits <TERM CLK> and <TERM DATA>, refer to Table 20). The internal termination helps to absorb any reflections from the receiver end, improving the signal integrity. This makes it possible to drive up to 10 pF of load capacitance, compared to only 5 pF without the internal termination. Figure 62 and Figure 63 show the eye diagram with 5 pF and 10 pF load capacitors (connected from each output pin to ground). With 100 Ω internal and 100 Ω external termination, the voltage swing at the receiver end will be halved (compared to no internal termination). The voltage swing can be restored by using the LVDS current double mode (bits <CURR DOUBLE>, refer to Table 19). Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP Submit Documentation Feedback 51 ADS6445-EP ADS6444-EP SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 www.ti.com C001 Figure 62. LVDS Data Eye Diagram With 5 pF Load Capacitance (No Internal Termination) C002 Figure 63. LVDS Data Eye Diagram With 10 pF Load Capacitance (100 Ω Internal Termination) 52 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP ADS6445-EP ADS6444-EP www.ti.com SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 CAPTURE TEST PATTERNS ADS644X outputs the bit clock (DCLK), positioned nearly at the center of the data transitions. It is recommended to route the bit clock, frame clock and output data lines with minimum relative skew on the PCB. This ensures sufficient setup/hold times for a reliable capture by the receiver. The DESKEW is a 1010... or 0101... pattern output on the serial data lines that can be used to verify if the receiver capture clock edge is positioned correctly. This may be useful in case there is some skew between DCLK and serial data inside the receiver. Once deserialized, it is required to ensure that the parallel data is aligned to the frame boundary. The SYNC test pattern can be used for this. For example, in the 1-wire interface, the SYNC pattern is 7 '1's followed by 7 '0's (from MSB to LSB). This information can be used by the receiver logic to shift the deserialized data until it matches the SYNC pattern. In addition to DESKEW and SYNC, the ADS644X includes other test patterns to verify correctness of the capture by the receiver such as all zeros, all ones and toggle. These patterns are output on all four channel data lines simultaneously. Some patterns like custom and sync are affected by the type of interface selected, serialization and bit order. Table 25. Test Patterns PATTERN DESCRIPTION All zeros Outputs logic low. All ones Outputs logic high. Toggle Outputs toggle pattern - <D13 – D0> alternates between 10101010101010 and 01010101010101 every clock cycle. Custom Outputs a 14 bit custom pattern. The 14 bit custom pattern can be specified into two serial interface registers. In the 2-wire interface, each code is sent over the 2 wires depending on the serialization and bit order. Sync Deskew Outputs a sync pattern. Outputs deskew pattern. Either <D13 – D0> = 10101010101010 or <D11 – D0> = 01010101010101 every clock cycle. Table 26. SYNC Pattern INTERFACE OPTION 1-Wire 2-Wire SERIALIZATION SYNC PATTERN ON EACH WIRE 14 X MSB-11111110000000-LSB 16 X MSB-111111111000000000-LSB 14 X MSB-1111000-LSB 16 X MSB-11110000-LSB Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP Submit Documentation Feedback 53 ADS6445-EP ADS6444-EP SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 www.ti.com OUTPUT TIMINGS AT LOWER SAMPLING FREQUENCIES Setup, hold, and other timing parameters are specified across sampling frequencies and for each type of output interface in the following tables. Table 28 to Table 31: Typical values are at 25°C, min and max values are across the full temperature range TMIN = –40°C to TMAX = 85°C, AVDD = LVDD = 3.3 V, CL = 5 pF, IO = 3.5 mA, RL = 100 Ω, no internal termination, unless otherwise noted. Timing parameters are ensured by design and characterization and not tested in production. Ts = 1/ Sampling frequency = 1/Fs Table 27. Clock Propagation Delay for Different Interface Options INTERFACE 1-Wire with DDR bit clock 2-Wire with DDR bit clock SERIALIZATION CLOCK PROPAGATION DELAY, tpd_clk 14x tpd_clk = 0.428 x Ts + tdelay 16x tpd_clk = 0.375 x Ts + tdelay 1 (when tpd_clk < Ts) 0 1 (when tpd_clk ≥ Ts) tpd_clk = 0.75 x Ts + tdelay 2-Wire with SDR bit clock (1) 2 (when tpd_clk ≥ Ts) tpd_clk = 0.428 x Ts + tdelay 16x (1) 0 tpd_clk = 0.857 x Ts + tdelay 14x 2-Wire with SDR bit clock 2-Wire with DDR bit clock SERIALIZER LATENCY clock cycles 0 (when tpd_clk < Ts) tpd_clk = 0.375 x Ts + tdelay 0 Note that the total latency = ADC latency + internal serializer latency. The ADC latency is 12 clock cycles. Table 28. Timing for 1-Wire Interface SERIALIZATION 14× DATA SETUP TIME, tsu ns DATA HOLD TIME, th ns SAMPLING FREQUENCY MSPS MIN TYP MIN TYP 65 0.3 0.5 0.4 0.6 40 0.65 0.85 0.7 0.9 20 1.3 1.65 1.6 1.9 10 3.2 3.5 3.2 3.6 65 0.22 0.42 0.35 0.55 MAX tdelay ns MAX MIN TYP MAX Fs ≥ 40 MSPS 3 4 5 Fs < 40 MSPS 3 4.5 6 Fs ≥ 40 MSPS 3 16× 4 5 Fs < 40 MSPS 3 4.5 6 Table 29. Timing for 2-Wire Interface, DDR Bit Clock SERIALIZATION 14× 16× 54 DATA SETUP TIME, tsu ns DATA HOLD TIME, th ns SAMPLING FREQUENCY MSPS MIN TYP MIN TYP 105 0.45 0.65 0.5 0.7 92 0.55 0.75 0.6 0.8 80 0.65 0.85 0.7 0.9 65 0.8 1.1 0.8 1.1 40 1.4 1.7 1.5 1.9 105 0.35 0.55 0.4 0.6 92 0.45 0.65 0.5 0.7 80 0.55 0.75 0.6 0.8 65 0.6 0.9 0.7 1 40 1.1 1.4 1.3 1.7 Submit Documentation Feedback MAX tdelay ns MAX MIN TYP MAX Fs ≥ 45 MSPS 3.4 4.4 5.4 Fs < 45 MSPS 3.7 5.2 6.7 Fs ≥ 45 MSPS 3.4 4.4 5.4 Fs < 45 MSPS 3.7 5.2 6.7 Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP ADS6445-EP ADS6444-EP www.ti.com SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 Table 30. Timing for 2-Wire Interface, SDR Bit Clock SERIALIZATION 14× 16× DATA SETUP TIME, tsu ns DATA HOLD TIME, th ns SAMPLING FREQUENCY MSPS MIN TYP MIN TYP 65 0.8 1 1 1.2 40 1.5 1.7 1.6 1.8 20 3.4 3.6 3.3 3.5 10 6.9 7.2 6.6 6.9 65 0.65 0.85 0.8 1.0 40 1.3 1.5 1.4 1.6 20 2.8 3.0 2.8 3.0 10 6.0 6.3 5.8 6.1 MAX tdelay ns MAX MIN TYP MAX Fs ≥ 40 MSPS 3.4 4.4 5.4 Fs < 40 MSPS 3.7 5.2 6.7 Fs ≥ 40 MSPS 3.4 4.4 5.4 Fs < 40 MSPS 3.7 5.2 6.7 Table 31. Output Jitter (applies to all interface options) SAMPLING FREQUENCY MSPS BIT CLOCK JITTER, CYCLE-CYCLE ps, peak-peak MIN TYP ≥ 65 MAX FRAME CLOCK JITTER, CYCLE-CYCLE ps, peak-peak MIN 350 Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP TYP MAX 75 Submit Documentation Feedback 55 ADS6445-EP ADS6444-EP SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 www.ti.com BOARD DESIGN CONSIDERATIONS Grounding A single ground plane is sufficient to give optimum performance, provided the analog, digital, and clock sections of the board are cleanly partitioned. Refer to the EVM User Guide (SLAU196) for board layout schemes. Supply Decoupling As the ADS644X already includes internal decoupling, minimal external decoupling can be used without loss in performance. Note that the decoupling capacitors can help to filter external power supply noise, so the optimum number of decoupling capacitors would depend on actual application. It is recommended to use separate supplies for the analog and digital supply pins to isolate digital switching noise from sensitive analog circuitry. In case only a single 3.3 V supply is available, it should be routed first to AVDD. It can then be tapped and isolated with a ferrite bead (or inductor) with decoupling capacitor, before being routed to LVDD. Exposed Thermal Pad It is necessary to solder the exposed pad at the bottom of the package to a ground plane for best thermal performance. For detailed information, see application notes QFN Layout Guidelines(SLOA122A) and QFN/SON PCB Attachment (SLUA271A). 56 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP ADS6445-EP ADS6444-EP www.ti.com SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 DEFINITION OF SPECIFICATIONS Analog Bandwidth – The analog input frequency at which the power of the fundamental is reduced by 3 dB with respect to the low frequency value. Aperture Delay – The delay in time between the rising edge of the input sampling clock and the actual time at which the sampling occurs. This delay will be different across channels. The maximum variation is specified as aperture delay variation (channel-channel). Aperture Uncertainty (Jitter) – The sample-to-sample variation in aperture delay. Clock Pulse Width/Duty Cycle – The duty cycle of a clock signal is the ratio of the time the clock signal remains at a logic high (clock pulse width) to the period of the clock signal. Duty cycle is typically expressed as a percentage. A perfect differential sine-wave clock results in a 50% duty cycle. Maximum Conversion Rate – The maximum sampling rate at which certified operation is given. All parametric testing is performed at this sampling rate unless otherwise noted. Minimum Conversion Rate – The minimum sampling rate at which the ADC functions. Differential Nonlinearity (DNL) – An ideal ADC exhibits code transitions at analog input values spaced exactly 1 LSB apart. The DNL is the deviation of any single step from this ideal value, measured in units of LSBs. Integral Nonlinearity (INL) – The INL is the deviation of the ADC's transfer function from a best fit line determined by a least squares curve fit of that transfer function, measured in units of LSBs. Gain Error – The gain error is the deviation of the ADC's actual input full-scale range from its ideal value. The gain error is given as a percentage of the ideal input full-scale range. The gain error does not include the error caused by the internal reference deviation from ideal value. This is specified separately as internal reference error. The maximum variation of the gain error across devices and across channels within a device is specified separately. Offset Error – The offset error is the difference, given in number of LSBs, between the ADC's actual average idle channel output code and the ideal average idle channel output code. This quantity is often mapped into mV. Temperature Drift – The temperature drift coefficient (with respect to gain error and offset error) specifies the change per degree Celsius of the parameter from TMIN to TMAX. It is calculated by dividing the maximum deviation of the parameter across the TMIN to TMAX range by the difference TMAX–TMIN. Signal-to-Noise Ratio(SNR) is the ratio of the power of the fundamental (PS) to the noise floor power (PN), excluding the power at DC and the first nine harmonics. P SNR + 10Log10 S PN (3) SNR is either given in units of dBc (dB to carrier) when the absolute power of the fundamental is used as the reference, or dBFS (dB to full scale) when the power of the fundamental is extrapolated to the converter’s fullscale range. Signal-to-Noise and Distortion (SINAD) – SINAD is the ratio of the power of the fundamental (PS) to the power of all the other spectral components including noise (PN) and distortion (PD), but excluding dc. PS SINAD + 10Log10 PN ) PD (4) SINAD is either given in units of dBc (dB to carrier) when the absolute power of the fundamental is used as the reference, or dBFS (dB to full scale) when the power of the fundamental is extrapolated to the converter's fullscale range. Effective Number of Bits (ENOB) – The ENOB is a measure of a converter’s performance as compared to the theoretical limit based on quantization noise. ENOB + SINAD * 1.76 6.02 (5) Total Harmonic Distortion (THD) – THD is the ratio of the power of the fundamental (PS) to the power of the first nine harmonics (PD). Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP Submit Documentation Feedback 57 ADS6445-EP ADS6444-EP SLAS573C – FEBRUARY 2008 – REVISED MAY 2013 THD + 10Log10 www.ti.com PS PD (6) THD is typically given in units of dBc (dB to carrier). Spurious-Free Dynamic Range (SFDR) – The ratio of the power of the fundamental to the highest other spectral component (either spur or harmonic). SFDR is typically given in units of dBc (dB to carrier). Two-Tone Intermodulation Distortion – IMD3 is the ratio of the power of the fundamental (at frequencies f1 and f2) to the power of the worst spectral component at either frequency 2f1 – f2 or 2f2 – f1. IMD3 is either given in units of dBc (dB to carrier) when the absolute power of the fundamental is used as the reference, or dBFS (dB to full scale) when the power of the fundamental is extrapolated to the converter’s full-scale range. DC Power Supply Rejection Ratio (DC PSRR) – The DC PSSR is the ratio of the change in offset error to a change in analog supply voltage. The DC PSRR is typically given in units of mV/V. AC Power Supply Rejection Ratio (AC PSRR) – AC PSRR is the measure of rejection of variations in the supply voltage by the ADC. If ΔVsup is the change in supply voltage and ΔVout is the resultant change of the ADC output code (referred to the input), then PSRR + 20Log10 DVout , expressed in dBc DVsup (7) Voltage Overload Recovery – The number of clock cycles taken to recover to less than 1% error after an overload on the analog inputs. This is tested by separately applying a sine wave signal with 6-dB positive and negative overload. The deviation of the first few samples after the overload (from their expected values) is noted. Common Mode Rejection Ratio (CMRR) – CMRR is the measure of rejection of variation in the analog input common-mode by the ADC. If ΔVcm_in is the change in the common-mode voltage of the input pins and ΔVout is the resultant change of the ADC output code (referred to the input), then CMRR + 20Log10 DVout , expressed in dBc DVcm_in (8) Cross-Talk (only for multi-channel ADC)– This is a measure of the internal coupling of a signal from adjacent channel into the channel of interest. It is specified separately for coupling from the immediate neighboring channel (near-channel) and for coupling from channel across the package (far-channel). It is usually measured by applying a full-scale signal in the adjacent channel. Cross-talk is the ratio of the power of the coupling signal (as measured at the output of the channel of interest) to the power of the signal applied at the adjacent channel input. It is typically expressed in dBc. 58 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADS6445-EP ADS6444-EP PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) ADS6444MRGCTEP ACTIVE VQFN RGC 64 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -55 to 125 6444EP ADS6445MRGCTEP ACTIVE VQFN RGC 64 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -55 to 125 6445EP V62/08628-01XE ACTIVE VQFN RGC 64 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -55 to 125 6445EP V62/08628-02XE ACTIVE VQFN RGC 64 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -55 to 125 6444EP (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. 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OTHER QUALIFIED VERSIONS OF ADS6444-EP, ADS6445-EP : • Catalog: ADS6444, ADS6445 NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 18-Mar-2014 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant ADS6444MRGCTEP VQFN RGC 64 250 180.0 16.4 9.3 9.3 1.5 12.0 16.0 Q2 ADS6445MRGCTEP VQFN RGC 64 250 180.0 16.4 9.3 9.3 1.5 12.0 16.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 18-Mar-2014 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) ADS6444MRGCTEP VQFN RGC 64 250 213.0 191.0 55.0 ADS6445MRGCTEP VQFN RGC 64 250 213.0 191.0 55.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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