Intersil HIP4081AIBZ 80v/2.5a peak, high frequency full bridge fet driver Datasheet

HIP4081A
®
Data Sheet
July 2004
80V/2.5A Peak, High Frequency Full
Bridge FET Driver
Features
The HIP4081A is a high frequency, medium voltage Full
Bridge N-Channel FET driver IC, available in 20 lead plastic
SOIC and DIP packages. The HIP4081A can drive every
possible switch combination except those which would
cause a shoot-through condition. The HIP4081A can switch
at frequencies up to 1MHz and is well suited to driving Voice
Coil Motors, high-frequency switching power amplifiers, and
power supplies.
For example, the HIP4081A can drive medium voltage brush
motors, and two HIP4081As can be used to drive high
performance stepper motors, since the short minimum
“on-time” can provide fine micro-stepping capability.
Short propagation delays of approximately 55ns maximizes
control loop crossover frequencies and dead-times which
can be adjusted to near zero to minimize distortion, resulting
in rapid, precise control of the driven load.
A similar part, the HIP4080A, includes an on-chip input
comparator to create a PWM signal from an external triangle
wave and to facilitate “hysteresis mode” switching.
The Application Note for the HIP4081A is the AN9405.
TEMP RANGE
(°C)
• Independently Drives 4 N-Channel FET in Half Bridge or
Full Bridge Configurations
• Bootstrap Supply Max Voltage to 95VDC
• Drives 1000pF Load at 1MHz in Free Air at 50°C with Rise
and Fall Times of Typically 10ns
• User-Programmable Dead Time
• On-Chip Charge-Pump and Bootstrap Upper Bias
Supplies
• DIS (Disable) Overrides Input Control
• Input Logic Thresholds Compatible with 5V to 15V Logic
Levels
• Very Low Power Consumption
• Undervoltage Protection
• Pb-free Available
Applications
• Medium/Large Voice Coil Motors
• Full Bridge Power Supplies
• Switching Power Amplifiers
Ordering Information
PART
NUMBER
• High Performance Motor Controls
PACKAGE
PKG.
DWG. #
• Noise Cancellation Systems
HIP4081AIP
-40 to 85
20 Ld PDIP
E20.3
• Battery Powered Vehicles
HIP4081AIPZ
(Note)
-40 to 85
20 Ld PDIP
(Pb-free)
E20.3
• Peripherals
HIP4081AIB
-40 to 85
20 Ld SOIC (W)
M20.3
HIP4081AIBZ
(Note)
-40 to 85
20 Ld SOIC (W)
(Pb-free)
M20.3
NOTE: Intersil Pb-free products employ special Pb-free material
sets; molding compounds/die attach materials and 100% matte tin
plate termination finish, which is compatible with both SnPb and
Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed
the Pb-free requirements of IPC/JEDEC J Std-020B.
1
FN3659.7
• U.P.S.
Pinout
HIP4081A
(PDIP, SOIC)
TOP VIEW
BHB
1
20
BHO
BHI
2
19
BHS
DIS
3
18
BLO
VSS
4
17
BLS
BLI
5
16
VDD
ALI
6
15
VCC
AHI
7
14
ALS
HDEL
8
13
ALO
LDEL
9
12
AHS
AHB 10
11
AHO
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Harris Corporation. Copyright Intersil Americas Inc. 2003, 2004. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
HIP4081A
Application Block Diagram
80V
12V
BHO
BHS
BHI
LOAD
BLO
BLI
HIP4081A
ALI
ALO
AHS
AHI
AHO
GND
Functional Block Diagram
GND
(1/2 HIP4081A)
HIGH VOLTAGE BUS ≤ 80VDC
AHB
10
UNDERVOLTAGE
CHARGE
PUMP
LEVEL SHIFT
AND LATCH
DRIVER
7
DIS
3
CBS
AHS
VDD 16
AHI
AHO
11
12
TURN-ON
DELAY
DBS
15
DRIVER
ALI
TURN-ON
DELAY
6
VCC
ALO
13
ALS
14
HDEL
8
LDEL
9
VSS
4
2
TO VDD (PIN 16)
CBF
+12VDC
BIAS
SUPPLY
HIP4081A
Typical Application
(PWM Mode Switching)
80V
BHO 20
2 BHI
BHS 19
DIS
3 DIS
HIP4081/HIP4081A
1 BHB
12V
4 VSS
PWM
INPUT
5 BLI
6 ALI
7 AHI
8 HDEL
LOAD
BLO 18
BLS 17
VDD 16
VCC 15
12V
ALS 14
ALO 13
9 LDEL
AHS 12
10 AHB
AHO 11
GND
-
TO OPTIONAL
CURRENT CONTROLLER
+
6V
GND
3
HIP4081A
Absolute Maximum Ratings
Thermal Information
Supply Voltage, VDD and VCC . . . . . . . . . . . . . . . . . . . . -0.3V to 16V
Logic I/O Voltages . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VDD +0.3V
Voltage on AHS, BHS . . . -6.0V (Transient) to 80V (25°C to 125°C)
Voltage on AHS, BHS . . . -6.0V (Transient) to 70V (-55°C to 125°C)
Voltage on ALS, BLS . . . . . . . -2.0V (Transient) to +2.0V (Transient)
Voltage on AHB, BHB . . . . . . . . VAHS, BHS -0.3V to VAHS, BHS +VDD
Voltage on ALO, BLO . . . . . . . . . . . . .VALS, BLS -0.3V to VCC +0.3V
Voltage on AHO, BHO . . . . . . . VAHS, BHS -0.3V to VAHB, BHB +0.3V
Input Current, HDEL and LDEL . . . . . . . . . . . . . . . . . . -5mA to 0mA
Phase Slew Rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20V/ns
NOTE: All Voltages relative to VSS, unless otherwise specified.
Thermal Resistance (Typical, Note 1)
θJA (°C/W)
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
85
DIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
75
Storage Temperature Range . . . . . . . . . . . . . . . . . . . -65°C to 150°C
Operating Max. Junction Temperature . . . . . . . . . . . . . . . . . . 125°C
Lead Temperature (Soldering 10s)). . . . . . . . . . . . . . . . . . . . . 300°C
(For SOIC - Lead Tips Only
Operating Conditions
Supply Voltage, VDD and VCC . . . . . . . . . . . . . . . . . . +9.5V to +15V
Voltage on ALS, BLS . . . . . . . . . . . . . . . . . . . . . . . . . -1.0V to +1.0V
Voltage on AHB, BHB . . . . . . . . . VAHS, BHS +5V to VAHS, BHS +15V
Input Current, HDEL and LDEL . . . . . . . . . . . . . . . .-500µA to -50µA
Operating Ambient Temperature Range . . . . . . . . . . .-40°C to 85°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θJA is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications
VDD = VCC = VAHB = VBHB = 12V, VSS = VALS = VBLS = VAHS = VBHS = 0V, RHDEL = RLDEL = 100K and
TA = 25°C, Unless Otherwise Specified
TJS = -40°C TO
125°C
TJ = 25°C
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
MIN
MAX
UNITS
All inputs = 0V
8.5
10.5
14.5
7.5
14.5
mA
Outputs switching f = 500kHz
SUPPLY CURRENTS AND CHARGE PUMPS
VDD Quiescent Current
IDD
VDD Operating Current
IDDO
VCC Quiescent Current
ICC
VCC Operating Current
ICCO
9.5
12.5
15.5
8.5
15.5
mA
All Inputs = 0V, IALO = IBLO = 0
-
0.1
10
-
20
µA
f = 500kHz, No Load
1
1.25
2.0
0.8
3
mA
All Inputs = 0V, IAHO = IBHO = 0
VDD = VCC = VAHB = VBHB = 10V
-50
-30
-11
-60
-10
µA
IAHBO, IBHBO
f = 500kHz, No Load
0.6
1.2
1.5
0.5
1.9
mA
IHLK
VBHS = VAHS = 80V,
VAHB = VBHB = 93V
-
0.02
1.0
-
10
µA
IAHB = IAHB = 0, No Load
11.5
12.6
14.0
10.5
14.5
V
IAHB, IBHB
AHB, BHB Quiescent Current Qpump Output Current
AHB, BHB Operating Current
AHS, BHS, AHB, BHB Leakage
Current
AHB-AHS, BHB-BHS Qpump
Output Voltage
VAHB-VAHS
VBHB-VBHS
INPUT PINS: ALI, BLI, AHI, BHI, AND DIS
Low Level Input Voltage
VIL
Full Operating Conditions
-
-
1.0
-
0.8
V
High Level Input Voltage
VIH
Full Operating Conditions
2.5
-
-
2.7
-
V
-
35
-
-
-
mV
Low Level Input Current
IIL
VIN = 0V, Full Operating Conditions
-130
-100
-75
-135
-65
µA
High Level Input Current
IIH
VIN = 5V, Full Operating Conditions
-1
-
+1
-10
+10
µA
IHDEL = ILDEL = -100µA
4.9
5.1
5.3
4.8
5.4
V
Input Voltage Hysteresis
TURN-ON DELAY PINS: LDEL AND HDEL
VHDEL, VLDEL
LDEL, HDEL Voltage
GATE DRIVER OUTPUT PINS: ALO, BLO, AHO, AND BHO
Low Level Output Voltage
VOL
IOUT = 100mA
0.7
0.85
1.0
0.5
1.1
V
High Level Output Voltage
VCC-VOH
IOUT = -100mA
0.8
0.95
1.1
0.5
1.2
V
VOUT = 0V
1.7
2.6
3.8
1.4
4.1
A
IO +
Peak Pullup Current
4
HIP4081A
Electrical Specifications
VDD = VCC = VAHB = VBHB = 12V, VSS = VALS = VBLS = VAHS = VBHS = 0V, RHDEL = RLDEL = 100K and
TA = 25°C, Unless Otherwise Specified (Continued)
TJS = -40°C TO
125°C
TJ = 25°C
PARAMETER
SYMBOL
Peak Pulldown Current
IO -
TEST CONDITIONS
MIN
MAX
MIN
MAX
UNITS
1.7
2.4
3.3
1.3
3.6
A
Undervoltage, Rising Threshold
UV+
8.1
8.8
9.4
8.0
9.5
V
Undervoltage, Falling Threshold
UV-
7.6
8.3
8.9
7.5
9.0
V
Undervoltage, Hysteresis
HYS
0.25
0.4
0.65
0.2
0.7
V
Switching Specifications
VO UT = 12V
TYP
VDD = VCC = VAHB = VBHB = 12V, VSS = VALS = VBLS = VAHS = VBHS = 0V, RHDEL = RLDEL = 10K,
CL = 1000pF.
TJS = -40°C
TO 125°C
TJ = 25°C
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
MIN
MAX
UNITS
Lower Turn-off Propagation Delay
(ALI-ALO, BLI-BLO)
TLPHL
-
30
60
-
80
ns
Upper Turn-off Propagation Delay
(AHI-AHO, BHI-BHO)
THPHL
-
35
70
-
90
ns
Lower Turn-on Propagation Delay
(ALI-ALO, BLI-BLO)
TLPLH
RHDEL = RLDEL = 10K
-
45
70
-
90
ns
Upper Turn-on Propagation Delay
(AHI-AHO, BHI-BHO)
THPLH
RHDEL = RLDEL = 10K
-
60
90
-
110
ns
Rise Time
TR
-
10
25
-
35
ns
Fall Time
TF
-
10
25
-
35
ns
TPWIN-ON
RHDEL = RLDEL = 10K
50
-
-
50
-
ns
Turn-off Input Pulse Width
TPWIN-OFF
RHDEL = RLDEL = 10K
40
-
-
40
-
ns
Turn-on Output Pulse Width
TPWOUT-ON
RHDEL = RLDEL = 10K
40
-
-
40
-
ns
Turn-off Output Pulse Width
TPWOUT-OFF
RHDEL = RLDEL = 10K
30
-
-
30
-
ns
Turn-on Input Pulse Width
Disable Turn-off Propagation Delay
(DIS - Lower Outputs)
TDISLOW
-
45
75
-
95
ns
Disable Turn-off Propagation Delay
(DIS - Upper Outputs)
TDISHIGH
-
55
85
-
105
ns
Disable to Lower Turn-on Propagation Delay
(DIS - ALO and BLO)
TDLPLH
-
40
70
-
90
ns
Refresh Pulse Width (ALO and BLO)
TREF-PW
240
410
550
200
600
ns
TUEN
-
450
620
-
690
ns
Disable to Upper Enable (DIS - AHO and BHO)
TRUTH TABLE
INPUT
NOTE:
OUTPUT
ALI, BLI
AHI, BHI
U/V
DIS
ALO, BLO
AHO, BHO
X
X
X
1
0
0
1
X
0
0
1
0
0
1
0
0
0
1
0
0
0
0
0
0
X
X
1
X
0
0
X signifies that input can be either a “1” or “0”.
5
HIP4081A
Pin Descriptions
PIN
NUMBER
SYMBOL
DESCRIPTION
1
BHB
B High-side Bootstrap supply. External bootstrap diode and capacitor are required. Connect cathode of bootstrap
diode and positive side of bootstrap capacitor to this pin. Internal charge pump supplies 30µA out of this pin to
maintain bootstrap supply. Internal circuitry clamps the bootstrap supply to approximately 12.8V.
2
BHI
B High-side Input. Logic level input that controls BHO driver (Pin 20). BLI (Pin 5) high level input overrides BHI high
level input to prevent half-bridge shoot-through, see Truth Table. DIS (Pin 3) high level input overrides BHI high level
input. The pin can be driven by signal levels of 0V to 15V (no greater than VDD).
3
DIS
DISable input. Logic level input that when taken high sets all four outputs low. DIS high overrides all other inputs.
When DIS is taken low the outputs are controlled by the other inputs. The pin can be driven by signal levels of 0V to
15V (no greater than VDD).
4
VSS
Chip negative supply, generally will be ground.
5
BLI
B Low-side Input. Logic level input that controls BLO driver (Pin 18). If BHI (Pin 2) is driven high or not connected
externally then BLI controls both BLO and BHO drivers, with dead time set by delay currents at HDEL and LDEL (Pin
8 and 9). DIS (Pin 3) high level input overrides BLI high level input. The pin can be driven by signal levels of 0V to 15V
(no greater than VDD).
6
ALI
A Low-side Input. Logic level input that controls ALO driver (Pin 13). If AHI (Pin 7) is driven high or not connected
externally then ALI controls both ALO and AHO drivers, with dead time set by delay currents at HDEL and LDEL (Pin
8 and 9). DIS (Pin 3) high level input overrides ALI high level input. The pin can be driven by signal levels of 0V to 15V
(no greater than VDD).
7
AHI
A High-side Input. Logic level input that controls AHO driver (Pin 11). ALI (Pin 6) high level input overrides AHI high
level input to prevent half-bridge shoot-through, see Truth Table. DIS (Pin 3) high level input overrides AHI high level
input. The pin can be driven by signal levels of 0V to 15V (no greater than VDD).
8
HDEL
High-side turn-on DELay. Connect resistor from this pin to VSS to set timing current that defines the turn-on delay of
both high-side drivers. The low-side drivers turn-off with no adjustable delay, so the HDEL resistor guarantees no
shoot-through by delaying the turn-on of the high-side drivers. HDEL reference voltage is approximately 5.1V.
9
LDEL
Low-side turn-on DELay. Connect resistor from this pin to VSS to set timing current that defines the turn-on delay of
both low-side drivers. The high-side drivers turn-off with no adjustable delay, so the LDEL resistor guarantees no
shoot-through by delaying the turn-on of the low-side drivers. LDEL reference voltage is approximately 5.1V.
10
AHB
A High-side Bootstrap supply. External bootstrap diode and capacitor are required. Connect cathode of bootstrap
diode and positive side of bootstrap capacitor to this pin. Internal charge pump supplies 30µA out of this pin to
maintain bootstrap supply. Internal circuitry clamps the bootstrap supply to approximately 12.8V.
11
AHO
A High-side Output. Connect to gate of A High-side power MOSFET.
12
AHS
A High-side Source connection. Connect to source of A High-side power MOSFET. Connect negative side of
bootstrap capacitor to this pin.
13
ALO
A Low-side Output. Connect to gate of A Low-side power MOSFET.
14
ALS
A Low-side Source connection. Connect to source of A Low-side power MOSFET.
15
VCC
Positive supply to gate drivers. Must be same potential as VDD (Pin 16). Connect to anodes of two bootstrap diodes.
16
VDD
Positive supply to lower gate drivers. Must be same potential as VCC (Pin 15). De-couple this pin to VSS (Pin 4).
17
BLS
B Low-side Source connection. Connect to source of B Low-side power MOSFET.
18
BLO
B Low-side Output. Connect to gate of B Low-side power MOSFET.
19
BHS
B High-side Source connection. Connect to source of B High-side power MOSFET. Connect negative side of
bootstrap capacitor to this pin.
20
BHO
B High-side Output. Connect to gate of B High-side power MOSFET.
6
HIP4081A
Timing Diagrams
X = A OR B, A AND B HALVES OF BRIDGE CONTROLLER ARE INDEPENDENT
TLPHL
THPHL
U/V = DIS = 0
XLI
XHI
XLO
XHO
THPLH
TLPLH
TR
(10% - 90%)
TF
(10% - 90%)
(10% - 90%)
(10% - 90%)
FIGURE 1. INDEPENDENT MODE
U/V = DIS = 0
XLI
XHI = HI OR NOT CONNECTED
XLO
XHO
FIGURE 2. BISTATE MODE
TDLPLH
TDIS
U/V OR DIS
TREF-PW
XLI
XHI
XLO
XHO
TUEN
FIGURE 3. DISABLE FUNCTION
7
HIP4081A
Typical Performance Curves
VDD = VCC = VAHB = VBHB = 12V, VSS = VALS = VBLS = VAHS = VBHS = 0V, RHDEL = RLDEL = 100K
and TA = 25°C, Unless Otherwise Specified
11.0
IDD SUPPLY CURRENT (mA)
IDD SUPPLY CURRENT (mA)
14.0
12.0
10.0
8.0
6.0
4.0
10.0
9.5
9.0
8.5
8.0
2.0
6
8
10
12
VDD SUPPLY VOLTAGE (V)
0
14
100
200
300
400
500
600
700
800
900 1000
SWITCHING FREQUENCY (kHz)
FIGURE 4. QUIESCENT IDD SUPPLY CURRENT vs VDD
SUPPLY VOLTAGE
FIGURE 5. IDDO, NO-LOAD IDD SUPPLY CURRENT vs
FREQUENCY (kHz)
5.0
30.0
125°C
25.0
ICC SUPPLY CURRENT (mA)
FLOATING SUPPLY BIAS CURRENT (mA)
10.5
20.0
15.0
10.0
5.0
75°C
4.0
25°C
0°C
3.0
-40°C
2.0
1.0
0.0
0
100
200 300
400
500
600
700
800
0.0
900 1000
0
SWITCHING FREQUENCY (kHz)
100
200
300
400
500
600
700
800
900 1000
SWITCHING FREQUENCY (kHz)
FIGURE 6. SIDE A, B FLOATING SUPPLY BIAS CURRENT vs
FREQUENCY (LOAD = 1000pF)
FIGURE 7. ICCO, NO-LOAD ICC SUPPLY CURRENT vs
FREQUENCY (kHz) TEMPERATURE
-90
LOW LEVEL INPUT CURRENT (µA)
FLOATING SUPPLY BIAS CURRENT (mA)
2.5
2
1.5
1
0.5
0
200
600
800
400
SWITCHING FREQUENCY (kHz)
1000
FIGURE 8. IAHB, IBHB, NO-LOAD FLOATING SUPPLY BIAS
CURRENT vs FREQUENCY
8
-100
-110
-120
-50
-25
0
25
50
75
JUNCTION TEMPERATURE (°C)
100
125
FIGURE 9. ALI, BLI, AHI, BHI LOW LEVEL INPUT CURRENT IIL
vs TEMPERATURE
HIP4081A
VDD = VCC = VAHB = VBHB = 12V, VSS = VALS = VBLS = VAHS = VBHS = 0V, RHDEL = RLDEL = 10K
and TA = 25°C, Unless Otherwise Specified
80
15.0
PROPAGATION DELAY (ns)
NO-LOAD FLOATING CHARGE PUMP VOLTAGE (V)
Typical Performance Curves
14.0
13.0
12.0
11.0
10.0
-40
-20
0
20
40
60
80
100
70
60
50
40
30
-40
120
-20
0
JUNCTION TEMPERATURE (°C)
FIGURE 10. AHB - AHS, BHB - BHS NO-LOAD CHARGE PUMP
VOLTAGE vs TEMPERATURE
PROPAGATION DELAY (ns)
PROPAGATION DELAY (ns)
60
80
100
120
80
500
475
450
-25
0
25
50
75
100
70
60
50
40
30
125 150
-40
-20
0
20
40
60
80
100
120
JUNCTION TEMPERATURE (°C)
JUNCTION TEMPERATURE (°C)
FIGURE 12. DISABLE TO UPPER ENABLE, TUEN,
PROPAGATION DELAY vs TEMPERATURE
FIGURE 13. LOWER DISABLE TURN-OFF PROPAGATION
DELAY TDISLOW vs TEMPERATURE
80
PROPAGATION DELAY (ns)
450
REFRESH PULSE WIDTH (ns)
40
FIGURE 11. UPPER DISABLE TURN-OFF PROPAGATION
DELAY TDISHIGH vs TEMPERATURE
525
425
-50
20
JUNCTION TEMPERATURE (°C)
425
400
375
70
60
50
40
30
350
-50
-25
0
25
50
75
100
JUNCTION TEMPERATURE (°C)
FIGURE 14. TREF-PW REFRESH PULSE WIDTH vs
TEMPERATURE
9
125 150
20
-40
-20
0
20
40
60
80
100
JUNCTION TEMPERATURE (°C)
FIGURE 15. DISABLE TO LOWER ENABLE TDLPLH
PROPAGATION DELAY vs TEMPERATURE
120
HIP4081A
VDD = VCC = VAHB = VBHB = 12V, VSS = VALS = VBLS = VAHS = VBHS = 0V, RHDEL = RLDEL = 10K
and TA = 25°C, Unless Otherwise Specified (Continued)
80
80
70
70
PROPAGATION DELAY (ns)
PROPAGATION DELAY (ns)
Typical Performance Curves
60
50
40
30
50
40
30
20
-40
-20
0
20
40
60
80
100
20
-40
120
JUNCTION TEMPERATURE (°C)
-20
20
40
60
80
100
120
FIGURE 17. UPPER TURN-ON PROPAGATION DELAY THPLH vs
TEMPERATURE
80
70
70
PROPAGATION DELAY (ns)
80
60
50
40
60
50
40
30
30
20
20
-40
-20
0
20
40
60
80
100
-40
120
-20
FIGURE 18. LOWER TURN-OFF PROPAGATION DELAY TLPHL
vs TEMPERATURE
12.5
12.5
TURN-ON RISE TIME (ns)
13.5
11.5
10.5
9.5
-20
0
20
40
60
80
100
JUNCTION TEMPERATURE (°C)
120
FIGURE 20. GATE DRIVE FALL TIME TF vs TEMPERATURE
10
20
40
60
80
100
120
FIGURE 19. LOWER TURN-ON PROPAGATION DELAY TLPLH vs
TEMPERATURE
13.5
8.5
-40
0
JUNCTION TEMPERATURE (°C)
JUNCTION TEMPERATURE (°C)
GATE DRIVE FALL TIME (ns)
0
JUNCTION TEMPERATURE (°C)
FIGURE 16. UPPER TURN-OFF PROPAGATION DELAY THPHL
vs TEMPERATURE
PROPAGATION DELAY (ns)
60
11.5
10.5
9.5
8.5
-40
-20
0
20
40
60
80
100
120
JUNCTION TEMPERATURE (°C)
FIGURE 21. GATE DRIVE RISE TIME TR vs TEMPERATURE
HIP4081A
Typical Performance Curves
VDD = VCC = VAHB = VBHB = 12V, VSS = VALS = VBLS = VAHS = VBHS = 0V, RHDEL = RLDEL =
100K and TA = 25°C, Unless Otherwise Specified
1500
1250
5.5
VCC - VOH (mV)
HDEL, LDEL INPUT VOLTAGE (V)
6.0
5.0
750
-40°C
0°C
500
4.5
25°C
250
4.0
-40
75°C
125°C
-20
0
20
40
60
80
100
JUNCTION TEMPERATURE (°C)
0
10
120
FIGURE 22. VLDEL, VHDEL VOLTAGE vs TEMPERATURE
12
14
BIAS SUPPLY VOLTAGE (V)
FIGURE 23. HIGH LEVEL OUTPUT VOLTAGE VCC - VOH vs BIAS
SUPPLY AND TEMPERATURE AT 100mA
3.5
GATE DRIVE SINK CURRENT (A)
1500
1250
1000
VOL (mV)
1000
750
-40°C
500
0°C
25°C
250
75°C
3.0
2.5
2.0
1.5
1.0
0.5
125°C
0
10
0.0
6
12
14
BIAS SUPPLY VOLTAGE (V)
8
9
10
11
12
13
VDD , VCC, VAHB , VBHB (V)
14
15
16
FIGURE 25. PEAK PULLDOWN CURRENT IO vs BIAS SUPPLY
VOLTAGE
FIGURE 24. LOW LEVEL OUTPUT VOLTAGE VOL vs BIAS
SUPPLY AND TEMPERATURE AT 100mA
3.5
500
LOW VOLTAGE BIAS CURRENT (mA)
GATE DRIVE SINK CURRENT (A)
7
3.0
2.5
2.0
1.5
1.0
0.5
10,000pF
200
100
3,000pF
50
1,000pF
20
100pF
10
5
2
1
0.5
0.2
0.0
6
7
8
9
10
11
12
13
14
15
VDD, VCC, VAHB, VBHB (V)
FIGURE 26. PEAK PULLUP CURRENT IO+ vs BIAS SUPPLY
VOLTAGE
11
16
0.1
1
2
5
10
20
50
100
200
500 1000
SWITCHING FREQUENCY (kHz)
FIGURE 27. LOW VOLTAGE BIAS CURRENT IDD (LESS
QUIESCENT COMPONENT) vs FREQUENCY AND
GATE LOAD CAPACITANCE
HIP4081A
Typical Performance Curves
VDD = VCC = VAHB = VBHB = 12V, VSS = VALS = VBLS = VAHS = VBHS = 0V, RHDEL = RLDEL =
100K and TA = 25°C, Unless Otherwise Specified (Continued)
1000
LEVEL-SHIFT CURRENT (µA)
500
200
100
50
20
10
10
20
50
100
200
500
1000
SWITCHING FREQUENCY (kHz)
FIGURE 28. HIGH VOLTAGE LEVEL-SHIFT CURRENT vs FREQUENCY AND BUS VOLTAGE
150
UV+
120
8.8
DEAD-TIME (ns)
BIAS SUPPLY VOLTAGE, VDD (V)
9.0
8.6
UV-
90
60
8.4
30
8.2
50
25
0
25
50
75
100
125
150
TEMPERATURE (°C)
FIGURE 29. UNDERVOLTAGE LOCKOUT vs TEMPERATURE
12
0
10
50
100
150
200
HDEL/LDEL RESISTANCE (kΩ)
250
FIGURE 30. MINIMUM DEAD-TIME vs DEL RESISTANCE
IN2
IN1
POWER SECTION
+12V
B+
Q1
1
R29
JMPR1
2
13
U2
+
C6
JMPR5
CONTROL LOGIC
SECTION
JMPR2
12
U2
IN+/ALI
CD4069UB
5
JMPR3
HEN/BHI
6
U2
CD4069UB
10
U2
CW
CD4069UB
1
VCC 15
ALS 14
8 HDEL
9 LDEL
ALO 13
AHS 12
DD
3
L1
AO
Q2
+12V
R23
2
CW
1
L2
C1
1
BO
C2
3
Q4
R24
AHO 11
2
1
3
CR1
2
2
6 IN+/ALI
7 IN-/AHI
R22
3
3
IN-/AHI
BLS 17
16
V
2
1
C3
R30
CX
R31
CY
C5
ENABLE IN
I
R32
3
U2
4
COM
O
ALS
BLS
NOTES:
CD4069UB
1. DEVICE CD4069UB PIN 7 = COM, PIN 14 = +12V.
9
U2
8
CD4069UB
O
2. COMPONENTS L1, L2, C1, C2, CX, CY, R30, R31, NOT SUPPLIED.
REFER TO APPLICATION NOTE FOR DESCRIPTION OF INPUT
LOGIC OPERATION TO DETERMINE JUMPER LOCATIONS FOR
JMPR1 - JMPR4.
FIGURE 31. HIP4081A EVALUATION PC BOARD SCHEMATIC
HIP4081A
11
Q3
3
4 V
SS
5 OUT/BLI
10 AHB
R34
R33
JMPR4
CR2
U1
C4
1 BHB
BHO 20
2 HEN/BHI BHS 19
3 DIS
BLO 18
OUT/BLI
C8
1
HIP4080A/81A
CD4069UB
13
R21
DRIVER SECTION
2
R26
COM
C8
C6
R28
R27
B+
CR2
+
R32
+
JMPR5
R29
+12V
C7
14
GND
Q1
C4
BHO
U1
Q3
1
R22
1
O
IN2
ALS
ALO
Q2
R23
Q4
1
1
R21
AHO
O
CY
CX
FIGURE 32. HIP4081A EVALUATION BOARD SILKSCREEN
R31
R34
R30
CR1
R33
BLS
C3
C5
ALS
HDEL
LDEL
L2
HIP4081A
JMPR1
JMPR2
JMPR3
JMPR4
I
BLO
BLS
L1
IN1
HIP4080/81
R24
DIS
U2
HIP4081A
Dual-In-Line Plastic Packages (PDIP)
E20.3 (JEDEC MS-001-AD ISSUE D)
N
20 LEAD DUAL-IN-LINE PLASTIC PACKAGE
E1
INDEX
AREA
1 2 3
INCHES
N/2
-B-
-AD
E
BASE
PLANE
-C-
A2
SEATING
PLANE
A
L
D1
e
B1
D1
A1
eC
B
0.010 (0.25) M
C A B S
MILLIMETERS
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
-
0.210
-
5.33
4
A1
0.015
-
0.39
-
4
A2
0.115
0.195
2.93
4.95
-
B
0.014
0.022
0.356
0.558
-
C
L
B1
0.045
0.070
1.55
1.77
8
eA
C
0.008
0.014
C
D
0.980
1.060
eB
NOTES:
0.005
-
0.13
-
5
0.300
0.325
7.62
8.25
6
E1
0.240
0.280
6.10
7.11
5
0.100 BSC
eA
0.300 BSC
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
eB
-
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication No. 95.
L
0.115
N
7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
15
5
E
1. Controlling Dimensions: INCH. In case of conflict between English
and Metric dimensions, the inch dimensions control.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and eA are measured with the leads constrained to be perpendicular to datum -C- .
0.355
26.9
D1
e
4. Dimensions A, A1 and L are measured with the package seated in
JEDEC seating plane gauge GS-3.
0.204
24.89
20
2.54 BSC
7.62 BSC
0.430
-
0.150
2.93
20
6
10.92
7
3.81
4
9
Rev. 0 12/93
HIP4081A
Small Outline Plastic Packages (SOIC)
M20.3 (JEDEC MS-013-AC ISSUE C)
20 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
N
INCHES
INDEX
AREA
0.25(0.010) M
H
B M
E
-B1
2
3
L
SEATING PLANE
-A-
h x 45o
A
D
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
0.0926
0.1043
2.35
2.65
-
A1
0.0040
0.0118
0.10
0.30
-
B
0.014
0.019
0.35
0.49
9
C
0.0091
0.0125
0.23
0.32
-
D
0.4961
0.5118
12.60
13.00
3
E
0.2914
0.2992
7.40
7.60
4
e
-C-
e
µα
A1
B
0.25(0.010) M
C
0.10(0.004)
C A M
B S
MILLIMETERS
0.050 BSC
1.27 BSC
-
H
0.394
0.419
10.00
10.65
-
h
0.010
0.029
0.25
0.75
5
L
0.016
0.050
0.40
1.27
6
N
α
20
0o
20
8o
0o
7
8o
Rev. 1 1/02
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
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16
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