NUF9001FC 10 Line EMI Filter This device is a ten−line EMI filter array for wireless applications. Greater than −35 dB attenuation is obtained at frequencies from 800 MHz to 3.0 GHz. ESD protection is provided across all capacitors. http://onsemi.com Features • EMI Filtering and ESD Protection • Integration of 30 Discretes • Provides Protection for IEC61000−4−2 (Level 4) • • • • LOW−PASS FILTER INPUT OUTPUT ♦ 8.0 kV (Contact) Flip−Chip Package Moisture Sensitivity Level 1 ESD Rating: Machine Model = C; Human Body Model = 3B Pb−Free Package is Available* RI/O = 100 W Cinput = 28 pF ÇÇ ÇÇ MARKING DIAGRAM Benefits • Reduces EMI/RFI Emissions on a Data Line • Integrated Solution Offers Cost and Space Savings • Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass A1 NUF9001 = Specific Device Code A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package (Note: Microdot may be in either location) Filter Response • Integrated Solution Improves System Reliability Applications • • • • NUF9001 AYWWG G Flip−Chip CASE 499G EMI Filtering and ESD Protection for Data Lines Cell Phones Handheld Products MP3 Players PIN CONFIGURATION (Ball Side) 1 2 3 4 5 E O1 O2 O3 O4 O5 D O6 O7 O8 O9 O10 C GND GND GND GND GND B IN6 IN7 IN8 IN9 IN10 A IN1 IN2 IN3 IN4 IN5 MAXIMUM RATINGS (TA = 25°C unless otherwise noted) Rating ESD Discharge IEC61000−4−2 Contact Discharge Symbol Value Unit VPP 8.0 kV Steady−State Power per Resistor PR 100 mW Steady−State Power per Package PT 200 mW Operating Temperature Range TOP −40 to +85 °C Storage Temperature Range TSTG −55 to +150 °C TJ +125 °C Junction Temperature Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2006 March, 2006 − Rev. 5 1 ORDERING INFORMATION Device Package Shipping† NUF9001FCT1 Flip−Chip 3000 Tape & Reel NUF9001FCT1G Flip−Chip (Pb−Free) 3000 Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Publication Order Number: NUF9001FC/D NUF9001FC ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Symbol Test Conditions Min Typ Max Unit Maximum Reverse Working Voltage VRWM − − − 5.0 V VBR IR = 1.0 mA 6.0 7.0 8.0 V IR VRM = 3.0 V − − 0.1 mA Breakdown Voltage Leakage Current Series Resistance Capacitance RA − 170 200 230 W CLINE 1 f = 1.0 MHz, 0 Vdc − 45 50 pF f3dB (Above this frequency, appreciable attenuation occurs) − 100 − MHz Cut−Off Frequency TYPICAL PERFORMANCE CURVES (TA = 25°C unless otherwise specified) 0 0 −5 −10 −10 Channel 6 or 10 −20 −25 S41 (dB) S21 (dB) Channel 6 to Channel 7 −20 −15 Channel 1, 5, 7 and 9 −30 −35 −30 Channel 1 to Channel 2 −40 Channel 3 to Channel 4 −50 Channel 3 to Channel 8 −60 −40 −70 Channel 2, 3, 4 and 8 −45 −50 1.E+06 1.E+07 1.E+08 1.E+09 1.E+10 −80 1.E+06 1.E+07 FREQUENCY (Hz) 1.E+08 1.E+09 1.E+10 FREQUENCY (Hz) Figure 1. Insertion Loss Characteristics (S21 Measurement) Figure 2. Analog Crosstalk Curve (S41 Measurement) 50 220 215 210 RESISTANCE (W) CAPACITANCE (pF) 40 30 20 10 205 200 195 190 185 0 0 1 2 3 4 180 −40 5 REVERSE VOLTAGE (V) −15 10 35 60 TEMPERATURE (°C) Figure 3. Typical Line Capacitance vs. Reverse Bias Voltage Figure 4. Typical Resistance Over Temperature http://onsemi.com 2 85 NUF9001FC PRINTED CIRCUIT BOARD RECOMMENDATIONS 500 mm Pitch 300 or 350 mm Solder Ball Parameter PCB Pad Size 250 mm +25 −0 Pad Shape Round Pad Type NSMD Solder Mask Opening 350 mm "25 Solder Stencil Thickness 125 mm Stencil Aperture 250 x 250 mm sq. Solder Flux Ratio 50/50 Solder Paste Type No Clean Type 3 or Finer Trace Finish OSP Cu Trace Width 150 mm Max Copper Solder mask NSMD SMD Figure 5. NSMD vs. SMD − − − − − − − − − − − − − − − − − − − − − − − − − − − − Tp = (15−30 sec) Tp = 260°C − 5°C RAMP−UP tL (60−90 sec) RAMP−DOWN PRE−HEAT ZONE 0− 15 − 30 − 45 − 60 − 75 − 90 − 105 − 119 − 134 − 149 − 165 − 180 − 195 − 209 − 224 − 239 − 254 − 269 − 284 − 299 − 314 − 329 − 344 − 359 − 374 − 389 − 404 − 419 − 434 − 449 − 464 − 479 − 494 − TEMPERATURE (°C) 280 270 260 250 240 230 TL= 217 210 200 190 180 170 160 150 140 130 120 110 100 90 80 70 60 50 40 30 20 10 0 TIME (seconds) Figure 6. Typical Pb−Free Solder Heating Profile http://onsemi.com 3 NUF9001FC PACKAGE DIMENSIONS FLIP−CHIP−25 CSP CASE 499G−01 ISSUE A ÇÇ 4X 0.10 C PIN A1 LOCATOR D A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. B E TOP VIEW 0.10 C C A SEATING PLANE DIM A A1 A2 D E b e D1 E1 MILLIMETERS MIN MAX −−− 0.650 0.210 0.270 0.380 0.430 2.650 BSC 2.650 BSC 0.290 0.340 0.500 BSC 2.000 BSC 2.000 BSC A2 SIDE VIEW A1 0.05 C D1 e E D 25 X b 0.05 C A B 0.03 C C E1 B A 1 2 3 4 5 e BOTTOM VIEW ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 4 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. NUF9001FC/D