NXP NTB0104GU16 Dual supply translating transceiver; auto direction sensing; 3-state Datasheet

NTB0104
Dual supply translating transceiver; auto direction sensing;
3-state
Rev. 1 — 26 October 2010
Product data sheet
1. General description
The NTB0104 is a 4-bit, dual supply translating transceiver with auto direction sensing,
that enables bidirectional voltage level translation. It features two data input-output ports
(An and Bn), one output enable input (OE) and two supply pins (VCC(A) and VCC(B)). VCC(A)
can be supplied at any voltage between 1.2 V and 3.6 V and VCC(B) can be supplied at any
voltage between 1.65 V and 5.5 V, making the device suitable for translating between any
of the low voltage nodes (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V and 5.0 V).
Pins An and OE are referenced to VCC(A) and pins Bn are referenced to VCC(B). A LOW
level at pin OE causes the outputs to assume a high-impedance OFF-state. This device is
fully specified for partial power-down applications using IOFF. The IOFF circuitry disables
the output, preventing the damaging backflow current through the device when it is
powered down.
2. Features and benefits
„ Wide supply voltage range:
‹ VCC(A): 1.2 V to 3.6 V and VCC(B): 1.65 V to 5.5 V
„ IOFF circuitry provides partial Power-down mode operation
„ Inputs accept voltages up to 5.5 V
„ ESD protection:
‹ HBM JESD22-A114E Class 2 exceeds 2500 V for A port
‹ HBM JESD22-A114E Class 3B exceeds 15000 V for B port
‹ MM JESD22-A115-A exceeds 200 V
‹ CDM JESD22-C101E exceeds 1500 V
„ Latch-up performance exceeds 100 mA per JESD 78B Class II
„ Multiple package options
„ Specified from −40 °C to +85 °C and −40 °C to +125 °C
NTB0104
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
3. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature
range
Name
Description
Version
NTB0104D
−40 °C to +125 °C SO14
plastic small outline package; 14 leads;
body width 3.9 mm
SOT108-1
NTB0104PW
−40 °C to +125 °C TSSOP14
plastic thin shrink small outline package; 14 leads;
body width 4.4 mm
SOT402-1
NTB0104BQ
−40 °C to +125 °C DHVQFN14 plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 14 terminals;
body 2.5 × 3 × 0.85 mm
SOT762-1
NTB0104GU16
−40 °C to +125 °C XQFN16
plastic, extremely thin quad flat package; no leads;
16 terminals; body 1.80 × 2.60 × 0.50 mm
SOT1161-1
NTB0104GU12
−40 °C to +125 °C XQFN12
plastic, extremely thin quad flat package; no leads;
12 terminals; body 1.70 × 2.0 × 0.50 mm
SOT1174
4. Marking
Table 2.
Marking
Type number
Marking code
NTB0104D
NTB0104D
NTB0104PW
NTB0104
NTB0104BQ
B0104
NTB0104GU16
t4
NTB0104GU12
t4
NTB0104
Product data sheet
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Rev. 1 — 26 October 2010
© NXP B.V. 2010. All rights reserved.
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NTB0104
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
5. Functional diagram
OE
A1
B1
A2
B2
A3
B3
A4
B4
VCC(A)
VCC(B)
001aam795
Fig 1.
Logic symbol
NTB0104
Product data sheet
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Rev. 1 — 26 October 2010
© NXP B.V. 2010. All rights reserved.
3 of 27
NTB0104
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
6. Pinning information
6.1 Pinning
VCC(A)
1
terminal 1
index area
14 VCC(B)
NTB0104
NTB0104
A1
2
13 B1
VCC(A)
1
14 VCC(B)
A2
3
12 B2
A1
2
13 B1
A3
4
A2
3
12 B2
A3
4
11 B3
6
9
n.c.
7
8
OE
8
n.c.
GND
10 B4
9
7
10 B4
6
OE
5
5
GND
A4
A4
n.c.
11 B3
GND(1)
n.c.
001aam797
Transparent top view
001aam796
(1) This is not a supply pin, the substrate is attached to this
pad using conductive die attach material. There is no
electrical or mechanical requirement to solder this pad
however if it is soldered the solder land should remain
floating or be connected to GND.
Fig 3.
Pin configuration DHVQFN14 (SOT762-1)
13 VCC(B)
A1 1
12 B1
A2 2
11 B2
VCC(A) 1
NTB0104
OE 8
9 B4
GND 7
A4 4
GND 6
10 B3
n.c. 5
A3 3
10 B1
A2 3
9 B2
A3 4
8 B3
A4 5
7 B4
001aam798
Product data sheet
001aam799
Transparent top view
Pin configuration XQFN16 (SOT1161-1)
NTB0104
11 VCC(B)
A1 2
Transparent top view
Fig 4.
12 OE
NTB0104
terminal 1
index area
GND 6
14 n.c.
terminal 1
index area
15 n.c.
Pin configuration SO14 (SOT108-1) and
TSSOP14 (SOT402-1)
16 VCC(A)
Fig 2.
Fig 5.
Pin configuration XQFN12 (SOT1174)
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© NXP B.V. 2010. All rights reserved.
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NTB0104
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
6.2 Pin description
Table 3.
Pin description
Symbol
Pin
Description
SOT108-1, SOT402-1 SOT1161-1
and SOT762-1
SOT1174
1
16
1
supply voltage A
A1, A2, A3, A4 2, 3, 4, 5
1, 2, 3, 4
2, 3, 4, 5
data input or output (referenced to VCC(A))
n.c.
6, 9
5, 14, 15
-
not connected
GND
7
6, 7
6
ground (0 V)
OE
8
8
12
output enable input (active HIGH; referenced to VCC(A))
9, 10, 11, 12
7, 8, 9, 10 data input or output (referenced to VCC(B))
13
11
VCC(A)
B4, B3, B2, B1 10, 11, 12, 13
14
VCC(B)
supply voltage B
7. Functional description
Table 4.
Function table[1]
Supply voltage
Input
Input/output
OE
An
VCC(A)
VCC(B)
Bn
1.2 V to VCC(B)
1.65 V to 5.5 V
L
Z
Z
1.2 V to VCC(B)
1.65 V to 5.5 V
H
input or output
output or input
GND[2]
GND[2]
X
Z
Z
[1]
H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state.
[2]
When either VCC(A) or VCC(B) is at GND level, the device goes into power-down mode.
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
VCC(A)
supply voltage A
VCC(B)
supply voltage B
VI
input voltage
VO
output voltage
Conditions
Active mode
input clamping current
VI < 0 V
IOK
output clamping current
VO < 0 V
IO
output current
VO = 0 V to VCCO
ICC
supply current
ICC(A) or ICC(B)
IGND
Tstg
Max
Unit
−0.5
+6.5
V
−0.5
+6.5
V
[1]
−0.5
+6.5
V
[1][2][3]
−0.5
VCCO + 0.5
V
[1]
−0.5
+6.5
V
−50
-
mA
Power-down or 3-state mode
IIK
Min
−50
-
mA
-
±50
mA
-
100
mA
ground current
−100
-
mA
storage temperature
−65
+150
°C
NTB0104
Product data sheet
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Rev. 1 — 26 October 2010
[2]
© NXP B.V. 2010. All rights reserved.
5 of 27
NTB0104
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
Table 5.
Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Ptot
[1]
Parameter
Conditions
total power dissipation
Tamb = −40 °C to +125 °C
[4]
Min
Max
Unit
-
250
mW
The minimum input and minimum output voltage ratings may be exceeded if the input and output current ratings are observed.
[2]
VCCO is the supply voltage associated with the output.
[3]
VCCO + 0.5 V should not exceed 6.5 V.
[4]
For SO14 packages: above 70 °C the value of Ptot derates linearly at 8 mW/K.
For TSSOP14 packages: above 60 °C the value of Ptot derates linearly at 5.5 mW/K.
For DHVQFN14 packages: above 60 °C the value of Ptot derates linearly at 4.5 mW/K.
For XQFN12 packages: above 128 °C the value of Ptot derates linearly with 11.5 mW/K.
For XQFN16 packages: above 135 the value of Ptot derates linearly at 16.9 mW/K.
9. Recommended operating conditions
Table 6.
Recommended operating conditions[1][2]
Symbol
Parameter
Min
Max
Unit
VCC(A)
supply voltage A
Conditions
1.2
3.6
V
VCC(B)
supply voltage B
1.65
5.5
V
VI
input voltage
0
5.5
V
VO
output voltage
0
3.6
V
Power-down or 3-state mode;
VCC(A) = 1.2 V to 3.6 V;
VCC(B) = 1.65 V to 5.5 V
A port
B port
Tamb
ambient temperature
Δt/ΔV
input transition rise and fall rate
VCC(A) = 1.2 V to 3.6 V;
VCC(B) = 1.65 V to 5.5 V
0
5.5
V
−40
+125
°C
-
40
ns/V
[1]
The A and B sides of an unused I/O pair must be held in the same state, both at VCCI or both at GND.
[2]
VCC(A) must be less than or equal to VCC(B).
10. Static characteristics
Table 7.
Typical static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); Tamb = 25 °C.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
VOH
HIGH-level
output voltage
A port; VCC(A) = 1.2 V; IO = −20 μA
-
1.1
-
V
VOL
LOW-level
output voltage
A port; VCC(A) = 1.2 V; IO = 20 μA
-
0.09
-
V
II
input leakage
current
OE input; VI = 0 V to 3.6 V; VCC(A) = 1.2 V to 3.6 V;
VCC(B) = 1.65 V to 5.5 V
-
-
±1
μA
IOZ
OFF-state output A or B port; VO = 0 V to VCCO; VCC(A) = 1.2 V to 3.6 V;
current
VCC(B) = 1.65 V to 5.5 V
-
-
±1
μA
NTB0104
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 26 October 2010
[1]
© NXP B.V. 2010. All rights reserved.
6 of 27
NTB0104
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
Table 7.
Typical static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); Tamb = 25 °C.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
IOFF
A port; VI or VO = 0 V to 3.6 V;
VCC(A) = 0 V; VCC(B) = 0 V to 5.5 V
-
-
±1
μA
B port; VI or VO = 0 V to 5.5 V;
VCC(B) = 0 V; VCC(A) = 0 V to 3.6 V
-
-
±1
μA
-
0.05
-
μA
power-off
leakage current
supply current
ICC
[2]
VI = 0 V or VCCI; IO = 0 A
ICC(A); VCC(A) = 1.2 V; VCC(B) = 1.65 V to 5.5 V
CI
input
capacitance
CI/O
input/output
capacitance
ICC(B); VCC(A) = 1.2 V; VCC(B) = 1.65 V to 5.5 V
-
3.3
-
μA
ICC(A) + ICC(B); VCC(A) = 1.2 V; VCC(B) = 1.65 V to 5.5 V
-
3.5
-
μA
OE input; VCC(A) = 1.2 V to 3.6 V; VCC(B) = 1.65 V to 5.5 V
-
2.8
-
pF
A port; VCC(A) = 1.2 V to 3.6 V; VCC(B) = 1.65 V to 5.5 V
-
4.0
-
pF
B port; VCC(A) = 1.2 V to 3.6 V; VCC(B) = 1.65 V to 5.5 V
-
7.5
-
pF
[1]
VCCO is the supply voltage associated with the output.
[2]
VCCI is the supply voltage associated with the input.
Table 8.
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
VIH
VIL
VOH
−40 °C to +85 °C
Conditions
Min
Max
0.65VCCI
-
0.65VCCI
-
V
-
0.35VCCI
-
0.35VCCI
V
VCCO − 0.4
-
VCCO − 0.4
-
V
VCCO − 0.4
-
VCCO − 0.4
-
V
A port; VCC(A) = 1.4 V to 3.6 V
-
0.4
-
0.4
V
B port; VCC(B) = 1.65 V to 5.5 V
-
0.4
-
0.4
V
-
±2
-
±5
μA
-
±2
-
±10
μA
HIGH-level
input voltage
A or B port and OE input
LOW-level
input voltage
A or B port and OE input
HIGH-level
output voltage
IO = −20 μA
LOW-level
output voltage
Unit
Max
[1]
VCC(A) = 1.2 V to 3.6 V;
VCC(B) = 1.65 V to 5.5 V
[1]
VCC(A) = 1.2 V to 3.6 V;
VCC(B) = 1.65 V to 5.5 V
[2]
A port; VCC(A) = 1.4 V to 3.6 V
B port; VCC(B) = 1.65 V to 5.5 V
VOL
−40 °C to +125 °C
Min
IO = 20 μA
[2]
II
input leakage
current
OE input; VI = 0 V to 3.6 V;
VCC(A) = 1.2 V to 3.6 V;
VCC(B) = 1.65 V to 5.5 V
IOZ
OFF-state
output current
A or B port; VO = 0 V or VCCO;
VCC(A) = 1.2 V to 3.6 V;
VCC(B) = 1.65 V to 5.5 V
IOFF
power-off
leakage
current
A port; VI or VO = 0 V to 3.6 V;
VCC(A) = 0 V; VCC(B) = 0 V to 5.5 V
-
±2
-
±10
μA
B port; VI or VO = 0 V to 5.5 V;
VCC(B) = 0 V; VCC(A) = 0 V to 3.6 V
-
±2
-
±10
μA
NTB0104
Product data sheet
[2]
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Rev. 1 — 26 October 2010
© NXP B.V. 2010. All rights reserved.
7 of 27
NTB0104
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
Table 8.
Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
ICC
supply current
−40 °C to +85 °C
Conditions
−40 °C to +125 °C
Unit
Min
Max
Min
Max
OE = LOW;
VCC(A) = 1.4 V to 3.6 V;
VCC(B) = 1.65 V to 5.5 V
-
5
-
15
μA
OE = HIGH;
VCC(A) = 1.4 V to 3.6 V;
VCC(B) = 1.65 V to 5.5 V
-
5
-
20
μA
VCC(A) = 3.6 V; VCC(B) = 0 V
-
2
-
15
μA
VCC(A) = 0 V; VCC(B) = 5.5 V
-
−2
-
−15
μA
OE = LOW;
VCC(A) = 1.4 V to 3.6 V;
VCC(B) = 1.65 V to 5.5 V
-
5
-
15
μA
OE = HIGH;
VCC(A) = 1.4 V to 3.6 V;
VCC(B) = 1.65 V to 5.5 V
-
5
-
20
μA
VCC(A) = 3.6 V; VCC(B) = 0 V
-
−2
-
−15
μA
VCC(A) = 0 V; VCC(B) = 5.5 V
-
2
-
15
μA
-
10
-
40
μA
VI = 0 V or VCCI; IO = 0 A
[1]
ICC(A)
ICC(B)
ICC(A) + ICC(B)
VCC(A) = 1.4 V to 3.6 V;
VCC(B) = 1.65 V to 5.5 V
[1]
VCCI is the supply voltage associated with the input.
[2]
VCCO is the supply voltage associated with the output.
11. Dynamic characteristics
Table 9.
Typical dynamic characteristics for temperature 25 °C[1]
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8; for waveforms see Figure 6 and Figure 7.
Symbol
Parameter
Conditions
VCC(B)
Unit
1.8 V
2.5 V
3.3 V
5.0 V
A to B
5.9
4.8
4.4
4.2
ns
B to A
5.6
4.8
4.5
4.4
ns
VCC(A) = 1.2 V; Tamb = 25 °C
tpd
propagation delay
ten
enable time
OE to A, B
0.5
0.5
0.5
0.5
μs
tdis
disable time
OE to A; no external load
[2]
8.3
8.3
8.3
8.3
ns
OE to B; no external load
[2]
10.4
9.4
9.3
8.8
ns
81
69
83
68
ns
OE to A
tt
transition time
NTB0104
Product data sheet
OE to B
81
69
83
68
ns
A port
4.0
4.0
4.1
4.1
ns
B port
2.6
2.0
1.7
1.4
ns
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Rev. 1 — 26 October 2010
© NXP B.V. 2010. All rights reserved.
8 of 27
NTB0104
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
Table 9.
Typical dynamic characteristics for temperature 25 °C[1] …continued
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8; for waveforms see Figure 6 and Figure 7.
Symbol
Parameter
Conditions
VCC(B)
tsk(o)
skew
between channels
tW
pulse width
data inputs
fdata
data rate
[1]
Unit
1.8 V
2.5 V
3.3 V
5.0 V
0.2
0.2
0.2
0.2
[3]
ns
15
13
13
13
ns
70
80
80
80
Mbps
tpd is the same as tPLH and tPHL.
ten is the same as tPZL and tPZH.
tdis is the same as tPLZ and tPHZ.
tt is the same as tTHL and tTLH
[2]
Delay between OE going LOW and when the outputs are actually disabled.
[3]
Skew between any two outputs of the same package switching in the same direction.
Table 10. Dynamic characteristics for temperature range −40 °C to +85 °C[1]
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8; for wave forms see Figure 6 and Figure 7.
Symbol Parameter
Conditions
VCC(B)
Unit
1.8 V ± 0.15 V 2.5 V ± 0.2 V 3.3 V ± 0.3 V 5.0 V ± 0.5 V
Min
Max
Min
Max
Min
Max
Min
Max
A to B
1.4
12.9
1.2
10.1
1.1
10.0
0.8
9.9
B to A
0.9
14.2
0.7
12.0
0.4
11.7
0.3
13.7 ns
VCC(A) = 1.5 V ± 0.1 V
tpd
propagation
delay
ns
μs
ten
enable time
OE to A, B
-
1.0
-
1.0
-
1.0
-
tdis
disable time
OE to A; no external load
[2]
1.0
12.9
1.0
12.9
1.0
12.9
1.0
12.9 ns
OE to B; no external load
[2]
1.0
18.7
1.0
15.8
1.0
15.1
1.0
14.4 ns
-
320
-
260
-
260
-
280
ns
OE to A
OE to B
tt
transition
time
A port
B port
tsk(o)
skew
between channels
tW
pulse width
data inputs
fdata
data rate
[3]
1.0
-
200
-
200
-
200
-
200
ns
0.9
5.1
0.9
5.1
0.9
5.1
0.9
5.1
ns
0.9
4.7
0.6
3.2
0.5
2.5
0.4
2.7
ns
-
0.5
-
0.5
-
0.5
-
0.5
ns
25
-
25
-
25
-
25
-
ns
-
40
-
40
-
40
-
40
Mbps
VCC(A) = 1.8 V ± 0.15 V
tpd
propagation
delay
A to B
1.6
11.0
1.4
7.7
1.3
6.8
1.2
6.5
ns
B to A
1.5
12.0
1.3
8.4
1.0
7.6
0.9
7.1
ns
ten
enable time
OE to A, B
-
1.0
-
1.0
-
1.0
-
1.0
μs
OE to A; no external load
[2]
1.0
11.7
1.0
11.7
1.0
11.7
1.0
11.7
ns
OE to B; no external load
[2]
1.0
16.9
1.0
14.5
1.0
13.7
1.0
12.7 ns
OE to A
-
260
-
230
-
230
-
230
ns
OE to B
-
200
-
200
-
200
-
200
ns
0.8
4.1
0.8
4.1
0.8
4.1
0.8
4.1
ns
0.9
4.7
0.6
3.2
0.5
2.5
0.4
2.7
ns
-
0.5
-
0.5
-
0.5
-
0.5
ns
20
-
17
-
17
-
17
-
ns
tdis
tt
disable time
transition
time
A port
B port
tsk(o)
skew
between channels
tW
pulse width
data inputs
NTB0104
Product data sheet
[3]
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 26 October 2010
© NXP B.V. 2010. All rights reserved.
9 of 27
NTB0104
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
Table 10. Dynamic characteristics for temperature range −40 °C to +85 °C[1] …continued
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8; for wave forms see Figure 6 and Figure 7.
Symbol Parameter
Conditions
VCC(B)
Unit
1.8 V ± 0.15 V 2.5 V ± 0.2 V 3.3 V ± 0.3 V 5.0 V ± 0.5 V
fdata
Min
Max
Min
Max
Min
Max
Min
Max
-
49
-
60
-
60
-
60
Mbps
A to B
-
-
1.1
6.3
1.0
5.2
0.9
4.7
ns
B to A
-
-
1.2
6.6
1.1
5.1
0.9
4.4
ns
data rate
VCC(A) = 2.5 V ± 0.2 V
propagation
delay
tpd
ten
enable time
OE to A, B
-
-
-
1.0
-
1.0
-
1.0
μs
tdis
disable time
OE to A; no external load
[2]
-
-
1.0
9.7
1.0
9.7
1.0
9.7
ns
OE to B; no external load
[2]
-
-
1.0
12.9
1.0
12.0
1.0
11.0
ns
OE to A
-
-
-
200
-
200
-
200
ns
OE to B
-
-
-
200
-
200
-
200
ns
A port
-
-
0.7
3.0
0.7
3.0
0.7
3.0
ns
-
-
0.7
3.2
0.5
2.5
0.4
2.7
ns
-
-
-
0.5
-
0.5
-
0.5
ns
transition
time
tt
B port
tsk(o)
skew
between channels
tW
pulse width
data inputs
fdata
data rate
[3]
-
-
12
-
10
-
10
-
-
-
-
85
-
100
-
100
Mbps
ns
ns
VCC(A) = 3.3 V ± 0.3 V
tpd
propagation
delay
A to B
-
-
-
-
0.9
4.7
0.8
4.0
B to A
-
-
-
-
1.0
4.9
0.9
3.8
ns
ten
enable time
OE to A, B
-
-
-
-
-
1.0
-
1.0
μs
tdis
disable time
OE to A; no external load
[2]
-
-
-
-
1.0
9.4
1.0
9.4
ns
OE to B; no external load
[2]
-
-
-
-
1.0
11.3
1.0
10.4 ns
OE to A
-
-
-
-
-
260
-
260
ns
OE to B
-
-
-
-
-
200
-
200
ns
A port
-
-
-
-
0.7
2.5
0.7
2.5
ns
-
-
-
-
0.5
2.5
0.4
2.7
ns
transition
time
tt
B port
tsk(o)
skew
between channels
tW
pulse width
data inputs
fdata
data rate
[1]
[3]
-
-
-
-
-
0.5
-
0.5
ns
-
-
-
-
10
-
10
-
ns
-
-
-
-
-
100
-
100
Mbps
tpd is the same as tPLH and tPHL.
ten is the same as tPZL and tPZH.
tdis is the same as tPLZ and tPHZ.
tt is the same as tTHL and tTLH
[2]
Delay between OE going LOW and when the outputs are actually disabled.
[3]
Skew between any two outputs of the same package switching in the same direction.
NTB0104
Product data sheet
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Rev. 1 — 26 October 2010
© NXP B.V. 2010. All rights reserved.
10 of 27
NTB0104
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
Table 11. Dynamic characteristics for temperature range −40 °C to +125 °C[1]
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8; for wave forms see Figure 6 and Figure 7.
Symbol Parameter
Conditions
VCC(B)
Unit
1.8 V ± 0.15 V 2.5 V ± 0.2 V 3.3 V ± 0.3 V 5.0 V ± 0.5 V
Min
Max
Min
Max
Min
Max
Min
Max
VCC(A) = 1.5 V ± 0.1 V
tpd
propagation
delay
A to B
1.4
15.9
1.2
13.1
1.1
13.0
0.8
12.9 ns
B to A
0.9
17.2
0.7
15.0
0.4
14.7
0.3
16.7 ns
ten
enable time
OE to A, B
-
1.0
-
1.0
-
1.0
-
OE to A; no external load
[2]
1.0
13.5
1.0
13.5
1.0
13.5
1.0
13.5 ns
OE to B; no external load
[2]
1.0
19.9
1.0
16.8
1.0
16.1
1.0
15.2 ns
OE to A
-
340
-
280
-
280
-
300
ns
OE to B
-
220
-
220
-
220
-
220
ns
0.9
7.1
0.9
7.1
0.9
7.1
0.9
7.1
ns
0.9
6.5
0.6
5.2
0.5
4.8
0.4
4.7
ns
tdis
tt
disable time
transition
time
A port
B port
tsk(o)
skew
between channels
tW
pulse width
data inputs
fdata
data rate
[3]
1.0
μs
-
0.5
-
0.5
-
0.5
-
0.5
ns
25
-
25
-
25
-
25
-
ns
-
40
-
40
-
40
-
40
Mbps
ns
VCC(A) = 1.8 V ± 0.15 V
tpd
ten
tdis
propagation
delay
A to B
1.6
14.0
1.4
10.7
1.3
9.8
1.2
9.5
B to A
1.5
15.0
1.3
11.4
1.0
10.6
0.9
10.1 ns
enable time
OE to A, B
disable time
1.0
μs
-
1.0
-
1.0
-
1.0
-
OE to A; no external load
[2]
1.0
12.3
1.0
12.3
1.0
12.3
1.0
12.3 ns
OE to B; no external load
[2]
13.5 ns
1.0
18.1
1.0
15.3
1.0
14.5
1.0
OE to A
-
280
-
250
-
250
-
250
ns
OE to B
-
220
-
220
-
220
-
220
ns
0.8
6.2
0.8
6.1
0.8
6.1
0.8
6.1
ns
0.9
5.8
0.6
5.2
0.5
4.8
0.4
4.7
ns
-
0.5
-
0.5
-
0.5
-
0.5
ns
22
-
19
-
19
-
19
-
ns
-
45
-
55
-
55
-
55
Mbps
tt
transition
time
A port
tsk(o)
skew
between channels
tW
pulse width
data inputs
fdata
data rate
B port
[3]
VCC(A) = 2.5 V ± 0.2 V
tpd
ten
tdis
tt
propagation
delay
A to B
-
-
1.1
9.3
1.0
8.2
0.9
7.7
ns
B to A
-
-
1.2
9.6
1.1
8.1
0.9
7.4
ns
enable time
OE to A, B
-
1.0
μs
disable time
transition
time
-
-
-
1.0
-
1.0
OE to A; no external load
[2]
-
-
1.0
10.1
1.0
10.1
1.0
10.1 ns
OE to B; no external load
[2]
-
-
1.0
13.5
1.0
12.7
1.0
11.7
ns
OE to A
-
-
-
220
-
220
-
220
ns
OE to B
-
-
-
220
-
220
-
220
ns
A port
-
-
0.7
5.0
0.7
5.0
0.7
5.0
ns
B port
-
-
0.7
4.6
0.5
4.8
0.4
4.7
ns
-
-
-
0.5
-
0.5
-
0.5
ns
-
-
14
-
13
-
10
-
ns
tsk(o)
skew
between channels
tW
pulse width
data inputs;
NTB0104
Product data sheet
[3]
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 26 October 2010
© NXP B.V. 2010. All rights reserved.
11 of 27
NTB0104
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
Table 11. Dynamic characteristics for temperature range −40 °C to +125 °C[1]
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8; for wave forms see Figure 6 and Figure 7.
Symbol Parameter
Conditions
VCC(B)
Unit
1.8 V ± 0.15 V 2.5 V ± 0.2 V 3.3 V ± 0.3 V 5.0 V ± 0.5 V
fdata
Min
Max
Min
Max
Min
Max
Min
Max
-
-
-
75
-
80
-
100
Mbps
A to B
-
-
-
-
0.9
7.7
0.8
7.0
ns
B to A
-
-
-
-
1.0
7.9
0.9
6.8
ns
data rate
VCC(A) = 3.3 V ± 0.3 V
propagation
delay
tpd
ten
enable time
OE to A, B
-
-
-
-
-
1.0
-
1.0
μs
tdis
disable time
OE to A; no external load
[2]
-
-
-
-
1.0
9.9
1.0
9.9
ns
OE to B; no external load
[2]
-
-
-
-
1.0
12.1
1.0
10.9 ns
OE to A
-
-
-
-
-
280
-
280
ns
OE to B
-
-
-
-
-
220
-
220
ns
A port
-
-
-
-
0.7
4.5
0.7
4.5
ns
-
-
-
-
0.5
4.1
0.4
4.7
ns
-
-
-
-
-
0.5
-
0.5
ns
-
-
-
-
10
-
10
-
ns
-
-
-
-
-
100
-
100
transition
time
tt
B port
tsk(o)
skew
between channels
tW
pulse width
data inputs
fdata
data rate
[1]
[3]
Mbps
tpd is the same as tPLH and tPHL.
ten is the same as tPZL and tPZH.
tdis is the same as tPLZ and tPHZ.
tt is the same as tTHL and tTLH
[2]
Delay between OE going LOW and when the outputs are actually disabled.
[3]
Skew between any two outputs of the same package switching in the same direction.
NTB0104
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 26 October 2010
© NXP B.V. 2010. All rights reserved.
12 of 27
NTB0104
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
Table 12. Typical power dissipation capacitance
Voltages are referenced to GND (ground = 0 V).[1][2]
Symbol Parameter
Conditions
VCC(A)
1.2 V
1.2 V
1.5 V
1.8 V
Unit
2.5 V
2.5 V
3.3 V
VCC(B)
1.8 V
5.0 V
1.8 V
1.8 V
2.5 V
5.0 V
3.3 V
to
5.0 V
5
5
5
5
5
5
5
Tamb = 25 °C
power
dissipation
capacitance
CPD
outputs enabled; OE = VCC(A)
A port: (direction A to B)
pF
A port: (direction B to A)
8
8
8
8
8
8
8
pF
B port: (direction A to B)
18
18
18
18
18
18
18
pF
B port: (direction B to A)
13
16
12
12
12
12
13
pF
A port: (direction A to B)
0.12
0.12
0.04
0.05
0.08
0.08
0.07
pF
A port: (direction B to A)
0.01
0.01
0.01
0.01
0.01
0.01
0.01
pF
B port: (direction A to B)
0.01
0.01
0.01
0.01
0.01
0.01
0.01
pF
B port: (direction B to A)
0.07
0.09
0.07
0.07
0.05
0.09
0.09
pF
outputs disabled; OE = GND
[1]
CPD is used to determine the dynamic power dissipation (PD in μW).
PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
Σ(CL × VCC2 × fo) = sum of the outputs.
[2]
fi = 10 MHz; VI = GND to VCC; tr = tf = 1 ns; CL = 0 pF; RL = ∞ Ω.
12. Waveforms
VI
An, Bn
input
VM
GND
tPHL
VOH
Bn, An
output
tPLH
90 %
VM
VOL
10 %
tTHL
tTLH
001aal918
Measurement points are given in Table 13.
VOL and VOH are typical output voltage levels that occur with the output load.
Fig 6.
The data input (An, Bn) to data output (Bn, An) propagation delay times
NTB0104
Product data sheet
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© NXP B.V. 2010. All rights reserved.
13 of 27
NTB0104
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
VI
OE input
VM
GND
tPLZ
output
LOW-to-OFF
OFF-to-LOW
tPZL
VCCO
VM
VX
VOL
tPHZ
VOH
tPZH
VY
output
HIGH-to-OFF
OFF-to-HIGH
VM
GND
outputs
enabled
outputs
disabled
outputs
enabled
001aal919
Measurement points are given in Table 13.
VOL and VOH are typical output voltage levels that occur with the output load.
Fig 7.
Enable and disable times
Table 13.
Measurement points[1]
Supply voltage
Input
Output
VCCO
VM
VM
VX
VY
1.2 V
0.5VCCI
0.5VCCO
VOL + 0.1 V
VOH − 0.1 V
1.5 V ± 0.1 V
0.5VCCI
0.5VCCO
VOL + 0.1 V
VOH − 0.1 V
1.8 V ± 0.15 V
0.5VCCI
0.5VCCO
VOL + 0.15 V
VOH − 0.15 V
2.5 V ± 0.2 V
0.5VCCI
0.5VCCO
VOL + 0.15 V
VOH − 0.15 V
3.3 V ± 0.3 V
0.5VCCI
0.5VCCO
VOL + 0.3 V
VOH − 0.3 V
5.0 V ± 0.5 V
0.5VCCI
0.5VCCO
VOL + 0.3 V
VOH − 0.3 V
[1]
VCCI is the supply voltage associated with the input and VCCO is the supply voltage associated with the output.
NTB0104
Product data sheet
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Rev. 1 — 26 October 2010
© NXP B.V. 2010. All rights reserved.
14 of 27
NTB0104
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
VI
tW
90 %
negative
pulse
VM
0V
tf
tr
tr
tf
VI
90 %
positive
pulse
0V
VM
10 %
VM
VM
10 %
tW
VEXT
VCC
VI
RL
VO
G
DUT
CL
RL
001aal920
Test data is given in Table 14.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz; ZO = 50 Ω; dV/dt ≥ 1.0 V/ns.
RL = Load resistance.
CL = Load capacitance including jig and probe capacitance.
VEXT = External voltage for measuring switching times.
Fig 8.
Table 14.
Test circuit for measuring switching times
Test data
Supply voltage
Input
VCC(A)
VI[1]
VCC(B)
1.2 V to 3.6 V 1.65 V to 5.5 V VCCI
Load
VEXT
Δt/ΔV
CL
RL[2]
≤ 1.0 ns/V
15 pF
50 kΩ, 1 MΩ open
tPLH, tPHL
tPZH, tPHZ
tPZL, tPLZ[3]
open
2VCCO
[1]
VCCI is the supply voltage associated with the input.
[2]
For measuring data rate, pulse width, propagation delay and output rise and fall measurements, RL = 1 MΩ; for measuring enable and
disable times, RL = 50 KΩ.
[3]
VCCO is the supply voltage associated with the output.
NTB0104
Product data sheet
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Rev. 1 — 26 October 2010
© NXP B.V. 2010. All rights reserved.
15 of 27
NTB0104
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
13. Application information
13.1 Applications
Voltage level-translation applications. The NTB0104 can be used to interface between
devices or systems operating at different supply voltages. See Figure 9 for a typical
operating circuit using the NTB0104.
3.3 V
1.8 V
0.1 μF
VCC(A)
1.8 V
0.1 μF
VCC(B)
3.3 V
OE
SYSTEM
CONTROLLER
DATA
A1
B1
A2
B2
NTB0104
A3
B3
A4
B3
SYSTEM
DATA
GND
001aam800
Fig 9.
NTB0104
Product data sheet
Typical operating circuit
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NTB0104
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
13.2 Architecture
The architecture of the NTB0104 is shown in Figure 10. The device does not require an
extra input signal to control the direction of data flow from A to B or from B to A. In a static
state, the output drivers of the NTB0104 can maintain a defined output level, but the
output architecture is designed to be weak, so that they can be overdriven by an external
driver when data on the bus starts flowing in the opposite direction. The output one shots
detect rising or falling edges on the A or B ports. During a rising edge, the one shots turn
on the PMOS transistors (T1, T3) for a short duration, accelerating the low-to-high
transition. Similarly, during a falling edge, the one shots turn on the NMOS transistors (T2,
T4) for a short duration, accelerating the high-to-low transition. During output transitions
the typical output impedance is 70 Ω at VCCO = 1.2 V to 1.8 V, 50 Ω at VCCO = 1.8 V to
3.3 V and 40 Ω at VCCO = 3.3 V to 5.0 V.
VCC(B)
VCC(A)
ONE
SHOT
T1
4 kΩ
ONE
SHOT
T2
B
A
T3
ONE
SHOT
4 kΩ
T4
ONE
SHOT
001aal921
Fig 10. Architecture of NTB0104 I/O cell (one channel)
NTB0104
Product data sheet
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Rev. 1 — 26 October 2010
© NXP B.V. 2010. All rights reserved.
17 of 27
NTB0104
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
13.3 Input driver requirements
For correct operation, the device driving the data I/Os of the NTB0104 must have a
minimum drive capability of ±2 mA See Figure 11 for a plot of typical input current versus
input voltage.
II
VT/4 kΩ
VI
−(VD − VT)/4 kΩ
001aal922
VT: input threshold voltage of the NTB0104 (typically VCCI / 2).
VD: supply voltage of the external driver.
Fig 11. Typical input current versus input voltage graph
13.4 Power up
During operation VCC(A) must never be higher than VCC(B), however during power-up
VCC(A) ≥ VCC(B) does not damage the device, so either power supply can be ramped up
first. There is no special power-up sequencing required. The NTB0104 includes circuitry
that disables all output ports when either VCC(A) or VCC(B) is switched off.
13.5 Enable and disable
An output enable input (OE) is used to disable the device. Setting OE = LOW causes all
I/Os to assume the high-impedance OFF-state. The disable time (tdis with no external
load) indicates the delay between when OE goes LOW and when outputs actually
become disabled. The enable time (ten) indicates the amount of time the user must allow
for one one-shot circuitry to become operational after OE is taken HIGH. To ensure the
high-impedance OFF-state during power-up or power-down, pin OE should be tied to
GND through a pull-down resistor, the minimum value of the resistor is determined by the
current-sourcing capability of the driver.
13.6 Pull-up or pull-down resistors on I/O lines
As mentioned previously the NTB0104 is designed with low static drive strength to drive
capacitive loads of up to 70 pF. To avoid output contention issues, any pull-up or
pull-down resistors used must be kept higher than 50 kΩ. For this reason the NTB0104 is
not recommended for use in open drain driver applications such as 1-Wire or I2C. For
these applications, the NTS0104 level translator is recommended.
NTB0104
Product data sheet
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Rev. 1 — 26 October 2010
© NXP B.V. 2010. All rights reserved.
18 of 27
NTB0104
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
14. Package outline
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
E
A
X
c
y
HE
v M A
Z
8
14
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
7
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.01
0.019 0.0100 0.35
0.014 0.0075 0.34
0.16
0.15
0.010 0.057
inches 0.069
0.004 0.049
0.05
0.244
0.039
0.041
0.228
0.016
0.028
0.024
0.01
0.01
0.028
0.004
0.012
θ
o
8
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT108-1
076E06
MS-012
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 12. Package outline SOT108-1 (SO14)
NTB0104
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 26 October 2010
© NXP B.V. 2010. All rights reserved.
19 of 27
NTB0104
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
E
D
A
X
c
y
HE
v M A
Z
8
14
Q
(A 3)
A2
A
A1
pin 1 index
θ
Lp
L
1
7
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
1
0.75
0.50
0.4
0.3
0.2
0.13
0.1
0.72
0.38
8
o
0
o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT402-1
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
MO-153
Fig 13. Package outline SOT402-1 (TSSOP14)
NTB0104
Product data sheet
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Rev. 1 — 26 October 2010
© NXP B.V. 2010. All rights reserved.
20 of 27
NTB0104
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
SOT762-1
14 terminals; body 2.5 x 3 x 0.85 mm
A
B
D
A
A1
E
c
detail X
terminal 1
index area
terminal 1
index area
C
e1
e
2
6
y
y1 C
v M C A B
w M C
b
L
1
7
Eh
e
14
8
13
9
Dh
X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
mm
A(1)
max.
A1
b
1
0.05
0.00
0.30
0.18
c
D (1)
Dh
E (1)
Eh
0.2
3.1
2.9
1.65
1.35
2.6
2.4
1.15
0.85
e
0.5
e1
L
v
w
y
y1
2
0.5
0.3
0.1
0.05
0.05
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT762-1
---
MO-241
---
EUROPEAN
PROJECTION
ISSUE DATE
02-10-17
03-01-27
Fig 14. Package outline SOT762-1 (DHVQFN14)
NTB0104
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 26 October 2010
© NXP B.V. 2010. All rights reserved.
21 of 27
NTB0104
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
XQFN16: plastic, extremely thin quad flat package; no leads;
16 terminals; body 1.80 x 2.60 x 0.50 mm
SOT1161-1
X
A
B
D
terminal 1
index area
A
E
A1
A3
detail X
e1
e
5
8
C
C A B
C
v
w
b
y1 C
y
L
4
9
e
e2
1
12
terminal 1
index area
16
L1
13
0
1
scale
Dimensions
Unit(1)
mm
max
nom
min
2 mm
A
A1
0.5
0.05
A3
b
0.25
0.127 0.20
0.00
0.15
D
E
1.9
1.8
1.7
2.7
2.6
2.5
e
e1
0.4
1.2
e2
1.2
L
L1
0.45 0.55
0.40 0.50
0.35 0.45
v
0.1
w
y
y1
0.05 0.05 0.05
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
References
Outline
version
IEC
JEDEC
JEITA
SOT1161-1
---
---
---
sot1161-1_po
European
projection
Issue date
09-12-28
09-12-29
Fig 15. Package outline SOT1161-1 (XQFN16)
NTB0104
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 26 October 2010
© NXP B.V. 2010. All rights reserved.
22 of 27
NTB0104
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
XQFN12: plastic, extremely thin quad flat package; no leads;
12 terminals; body 1.70 x 2.00 x 0.50 mm
SOT1174-1
X
B
D
A
terminal 1
index area
A
E
A1
A3
detail X
∅v
∅w
b
5
C
C A B
C
y1 C
y
7
e1
e
1
11
terminal 1
index area
L1
L
0
1
2 mm
scale
Dimensions
Unit(1)
mm
max
nom
min
A
A1
0.5
0.05
A3
b
0.25
0.127 0.20
0.00
0.15
D
E
1.8
1.7
1.6
2.1
2.0
1.9
e
e1
0.4
1.6
L
L1
0.55
0.50 0.15
0.45
v
0.1
w
y
y1
0.05 0.05 0.05
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
References
Outline
version
IEC
JEDEC
JEITA
SOT1174-1
---
MO-288
---
sot1174-1_po
European
projection
Issue date
10-04-07
10-04-21
Fig 16. Package outline SOT1174 (XQFN12)
NTB0104
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 26 October 2010
© NXP B.V. 2010. All rights reserved.
23 of 27
NTB0104
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
15. Abbreviations
Table 15.
Abbreviations
Acronym
Description
CDM
Charged Device Model
CMOS
Complementary Metal Oxide Semiconductor
DUT
Device Under Test
ESD
ElectroStatic Discharge
HBM
Human Body Model
MM
Machine Model
16. Revision history
Table 16.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
NTB0104 v.1
20101026
Product data sheet
-
-
NTB0104
Product data sheet
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Rev. 1 — 26 October 2010
© NXP B.V. 2010. All rights reserved.
24 of 27
NTB0104
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
17. Legal information
17.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
17.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
17.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. The product is not designed, authorized or warranted to be
NTB0104
Product data sheet
suitable for use in medical, military, aircraft, space or life support equipment,
nor in applications where failure or malfunction of an NXP Semiconductors
product can reasonably be expected to result in personal injury, death or
severe property or environmental damage. NXP Semiconductors accepts no
liability for inclusion and/or use of NXP Semiconductors products in such
equipment or applications and therefore such inclusion and/or use is at the
customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 26 October 2010
© NXP B.V. 2010. All rights reserved.
25 of 27
NTB0104
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
17.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
18. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
NTB0104
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 26 October 2010
© NXP B.V. 2010. All rights reserved.
26 of 27
NTB0104
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
19. Contents
1
2
3
4
5
6
6.1
6.2
7
8
9
10
11
12
13
13.1
13.2
13.3
13.4
13.5
13.6
14
15
16
17
17.1
17.2
17.3
17.4
18
19
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . . 5
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Recommended operating conditions. . . . . . . . 6
Static characteristics. . . . . . . . . . . . . . . . . . . . . 6
Dynamic characteristics . . . . . . . . . . . . . . . . . . 8
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Application information. . . . . . . . . . . . . . . . . . 16
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Input driver requirements . . . . . . . . . . . . . . . . 18
Power up . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Enable and disable . . . . . . . . . . . . . . . . . . . . . 18
Pull-up or pull-down resistors on I/O lines . . . 18
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 19
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 24
Legal information. . . . . . . . . . . . . . . . . . . . . . . 25
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 25
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Contact information. . . . . . . . . . . . . . . . . . . . . 26
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 26 October 2010
Document identifier: NTB0104
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