Rohm BD6517F High-side switch Datasheet

Power Management Switch IC Series for PCs and Digital Consumer Product
2ch Large Current Output
USB High Side Switch ICs
BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ
No.09029EAT11
Description
High side switch for USB is a high side switch having over current protection used in power supply line of universal serial bus
(USB). Its switch unit has two channels of N-channel power MOSFET, and current of 500mA as USB standard can be flown
to the respective channels. And, over current detection circuit, thermal shutdown circuit, under voltage lockout and soft start
circuit are built in.
Features
1) Dual N-MOS high side switch
2) Continuous current load 0.5A
3) Control input logic
Active-Low
Active-High
4) Soft start circuit
5) Over current detection
6) Thermal shutdown
7) Under voltage lockout
8) Open drain error flag output
9) Reverse-current protection when switch off
10) Flag output delay filter built in
Applications
USB hub in consumer appliances, Car accessory, PC, PC peripheral equipment, and so forth
Lineup
Parameter
BD6512F
BD6513F
BD6516F
BD6517F
BD2052AFJ
BD2042AFJ
Unit
Over current detection
1.65
1.65
-
-
-
-
A
Output current at short
-
-
1.65
1.65
1.0
1.0
A
On resistance
100
100
110
110
100
100
mΩ
Control input logic
High
Low
High
Low
High
Low
-
Reverse current flow
blockingat switch off
-
-
○
○
○
○
-
Flag output delay filter
-
-
○
○
○
○
-
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© 2009 ROHM Co., Ltd. All rights reserved.
1/20
2009.05 - Rev.A
BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ
Absolute Maximum Ratings
◎BD6512F/BD6513F/BD6516F/BD6517F
Parameter
Symbol
Supply voltage
VDD
CTRL voltage
VCTRL
Flag voltage
VFLAG
Limits
-0.3
to
Unit
6.0
-0.3 to VDD+0.3
-0.3
-0.3 to VDD+0.3
to
Technical Note
6.0
(BD6512F/ BD6513F)
V
V
V
V
Output voltage
VOUT
Storage temperature
TSTG
-55 to 150
ºC
Power dissipation *1
Pd
560 *1
mW
Symbol
Limits
Unit
◎BD2042AFJ/ BD2052AFJ
Parameter
-0.3 to 6.0
(BD6516F/ BD6517F)
V
Supply voltage
VIN
-0.3
to
6.0
V
EN,/EN voltage
VEN, V/EN
-0.3
to
6.0
V
/OC voltage
V/OC
-0.3
to
6.0
V
/OC current
IS/OC
OUT voltage
VOUT
-0.3
6.0
V
TSTG
-55 to 150
ºC
Storage temperature
to
mA
*1
560
mW
Symbol
Limits
Unit
Supply voltage
VDD
3.0 to 5.5
V
Operation temperature
Power dissipation
*1
10
Pd
*1 This value decreases 4.48mW/℃ above Ta=25℃.
* Resistance radiation design is not doing.
Operating conditions
◎BD6512F/BD6513F/BD6516F/BD6517F
Parameter
TOPR
-25 to 85
°C
Continuous output current
ILO
0 to 500
mA
◎BD2042AFJ/ BD2052AFJ
Parameter
Symbol
Limits
Unit
VIN
2.7 to 5.5
V
TOPR
-40 to 85
ºC
ILO
0 to 500
mA
Supply voltage
Operation temperature
Continuous output current
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2/20
2009.05 - Rev.A
Technical Note
BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ
Electrical characteristics
◎BD6512F/BD6513F(VDD =5V, Ta=25℃, unless otherwise specified.)
Limits
Parameter
Symbol
Min.
Typ.
Max.
Operating current
Unit
-
85
120
μA
VCTRL=5V(BD6512F), 0V(BD6513F)
OUT=OPEN
-
0.01
2
μA
VCTRL=0V(BD6512F), 5V(BD6513F)
OUT=OPEN
IDD
Control input voltage
VCTRL
Control input current
ICTRL
Condition
-
-
0.7
V
CTRL Low Level Input
2.5
-
-
V
CTRL High Level Input
-1
0.01
1
μA
VCTRL=0V or 5V
-
100
130
mΩ
VDD=5V,IOUT=500mA
-
120
160
mΩ
VDD=3.3V,IOUT=500mA
On resistance
RON
Turn on delay
TRD
100
600
2000
μs
RL=10Ω
Turn on rise time
TR
200
1500
6000
μs
RL=10Ω
Turn off delay
TFD
-
3
20
μs
RL=10Ω
Turn off fall time
TF
-
1
20
μs
RL=10Ω
VUVLOH
2.3
2.5
2.7
V
VDD increasing
VUVLOL
2.1
2.3
2.5
V
VDD decreasing
TTS
-
135
-
ºC
Flag output resistance
RFLAG
-
16
40
Ω
Flag off current
IFLAG
-
0.01
1
μA
Current limit threshold
ITHLIM
1.25
1.65
2.20
A
Over current limit level
ILIM
0.6
1.1
1.6
A
UVLO threshold voltage
Thermal shutdown threshold
IFLAG=5mA
◎BD6516F/BD6517F (VDD =5V, Ta=25℃, unless otherwise specified.)
Limits
Parameter
Symbol
Unit
Min.
Typ.
Max.
Current consumption
Condition
-
100
140
μA
VCTRL=5V(BD6516F), 0V(BD6517F)
OUT=OPEN
-
0.01
2
μA
VCTRL=0V(BD6516F), 5V(BD6517F)
OUT=OPEN
-
-
0.7
V
Low level input voltage
IDD
CTRL input voltage
VCTRL
2.5
-
-
V
High level input voltage
CTRL input current
ICTRL
-1
0.01
1
μA
VCTRL=0V or 5V
FLAG output resistance
RFLAG
-
250
450
Ω
IFLAG=1mA
FLAG output leak current
IFLAG
-
0.01
1
μA
VFLAG=5V
FLAG output delay
TDFL
-
1
4
ms
ON resistance
RON
Short circuit output current
-
110
150
mΩ
VDD=5V,IOUT=500mA
-
140
180
mΩ
VDD=3.3V,IOUT=500mA
ISC
1.2
1.65
2.2
A
VOUT=0V
ILEAK
-
-
10
μA
VCTRL=0V(BD6516F), 5V(BD6517F)
Thermal shutdown threshold
TTS
-
135
-
ºC
At Tj increase
Output rise time
TON1
100
1300
4000
μs
RL=10Ω
Output turn on delay time
TON2
200
1500
6000
μs
RL=10Ω
Output fall time
TOFF1
-
1
20
μs
RL=10Ω
Output turn off delay time
TOFF2
-
3
20
μs
RL=10Ω
Output leak current
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3/20
2009.05 - Rev.A
Technical Note
BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ
◎BD2042AFJ/BD2052AFJ (VDD =5V, Ta=25℃, unless otherwise specified.)
Limits
Parameter
Symbol
Unit
Min.
Typ.
Max.
Condition
Operating Current
IDD
-
110
140
μA
V/EN = 0V, OUT = OPEN (BD2042AFJ)
VEN = 5V, OUT = OPEN (BD2052AFJ)
Standby Current
ISTB
-
0.01
1
μA
V/EN = 5V, OUT = OPEN (BD2042AFJ)
VEN = 0V, OUT = OPEN (BD2052AFJ)
/EN input voltage
V/EN,EN
/EN input current
2.0
-
-
V
High input
-
-
0.8
V
Low input
-
-
0.4
V
Low input2.7V≤ VIN ≤4.5V
I/EN,EN
-1.0
0.01
1.0
μA
V/EN,EN = 0V or V/EN,EN = 5V
/OC output LOW voltage
V/OC
-
-
0.5
V
I/OC = 5mA
/OC output leak current
IL/OC
-
0.01
1
μA
V/OC = 5V
ON resistance
RON
-
100
130
mΩ
IOUT = 500mA
Output current at short
ISC
0.7
1.0
1.3
A
Output rise time
TON1
-
1.8
10
ms
Output turn on time
TON2
-
2.1
20
ms
Output fall time
TOFF1
-
1
20
μs
Output turn off time
TOFF2
-
3
40
μs
VTUVH
2.1
2.3
2.5
V
Increasing VIN
VTUVL
2.0
2.2
2.4
V
Decreasing VIN
UVLO threshold
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4/20
VIN = 5V, VOUT = 0V,
CL = 100μF (RMS)
RL = 10Ω , CL = OPEN
2009.05 - Rev.A
Technical Note
BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ
Measurement circuit
◎BD6512F/ BD6513F/ BD6516F/ BD6517F
VDD
VDD
VCTRL
CTRLA
OUTA
FLAGA
VDD
FLAGB
GND
CTRLB
OUTB
VCTRL
A
VCTRL
Operating current
VCTRL
VCTRL
FLAGA
VDD
RL
CL
VDD
CTRLA
OUTA
FLAGA
VDD
FLAGB
GND
CTRLB
OUTB
FLAGB
GND
CTRLB
OUTB
RL
CL
CTRL input voltage, Output rise, fall time
VDD
10k
10k
OUTA
1µF
1µF
VCTRL
CTRLA
IFLAG
VCTRL
IOUT
VDD
IFLAG
CL
CTRLA
OUTA
FLAGA
VDD
FLAGB
GND
CTRLB
OUTB
1µF
1µF
VCTRL
IOUT
CL
ON resistance, Over current detection
FLAG output resistance
◎BD2042AFJ/ BD2052AFJ
VDD
VDD
1µF
1µF
A
GND
/OC1
IN
OUT1
VEN
EN1
OUT2
VEN
EN2
/OC2
GND
/OC1
IN
OUT1
VEN
EN1
OUT2
VEN
EN2
/OC2
RL
RL
Operating current
VDD
1µF
GND
10k
OUT1
VEN
EN1
OUT2
VEN
EN2
/OC2
CL
EN, /EN input voltage, Output rise, fall time
VDD
10k
VDD
1µF
GND
/OC1
IN
CL
IOUT
IOUT
IOUT
/OC1
IN
OUT1
VEN
EN1
OUT2
VEN
EN2
/OC2
ON resistance, Over current detection
IOUT
/OC output LOW voltage
Fig.1 Measurement circuit
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5/20
2009.05 - Rev.A
Technical Note
BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ
Timing diagram
◎BD6513F
◎BD6512F
TF
TF
TR
TR
90%
90%
VOUT
50%
90%
VOUT
50%
50%
10%
10%
50%
10%
10%
TFD
TFD
TRD
VCTRL
90%
TRD
50%
VCTRL
50%
50%
◎BD6515F/BD2042AFJ
50%
◎BD6516F/BD2052AFJ
TOFF1
TOFF1
TON1
TON1
90%
VOUT
90%
10%
10%
TON2
VCTRL
V/EN
50%
90%
VOUT
90%
10%
10%
TON2
TOFF2
50%
VCTRL
VEN
50%
TOFF2
50%
Fig.2 Timing diagram
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6/20
2009.05 - Rev.A
Technical Note
BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ
Reference data
◎BD6512F/ BD6513F
120
OPERATING CURRENT : IDD [uA]
Ta=25ºC
100
80
60
40
20
3
4
5
SUPPLY VOLTAGE : VDD [V]
VDD=5.0V
100
80
60
40
20
0
-50
0
2
3.0
6
0
0.5
0.0
2
3
4
5
SUPPLY VOLTAGE : VDD [V]
6
Fig.5 CTRL input voltage
200
Low to High
1.5
High to Low
1.0
0.5
ON RESISTANCE : RON [mΩ]
ON RESISTANCE : RON [mΩ]
CONTROL INPUT VOLTAGE : VCTRL [V]
2.0
150
100
50
0
0.0
2
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
3
4
5
SUPPLY VOLTAGE : VDD [V]
Fig.6 CTRL input voltage
150
VDD=3.3V
100
VDD=5.0V
50
0
6
-50
1000
3000
2000
1000
4
5
6
3000
2000
1000
0
0
-50
0
3
Ta=25ºC
TURN ON DELAY : TRD [us]
TURN ON RISE TIME : TR [us]
2000
0
50
2
100
Fig.9 Output rise time
5.0
5.0
Ta=25ºC
2000
1000
VDD=5.0V
TURN OFF FALL TIME : T F[us]
TURN OFF FALL TIME : T F[us]
3000
4.0
3.0
2.0
1.0
100
AMBIENT TEMPERATURE : Ta[℃ ]
Fig.12 Output rise delay time
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4.0
3.0
2.0
1.0
0.0
0.0
50
6
Fig.11 Output rise delay time
Fig.10 Output rise time
VDD=5.0V
0
3
4
5
SUPPLY VOLTAGE : VDD [V]
AMBIENT TEMPERATURE : Ta[℃ ]
SUPPLY VOLTAGE : VDD [V]
4000
100
4000
VDD=5.0V
3000
50
Fig.8 ON resistance
4000
Ta=25ºC
0
AMBIENT TEMPERATURE : Ta[℃]
Fig.7 ON resistance
4000
0
-50
High to Low
1.0
Ta=25ºC
2.5
2
Low to High
1.5
100
200
VDD=5.0V
-50
2.0
Fig.4 Operating current
3.0
TURN ON RISE TIME : TR [us]
50
Ta=25ºC
2.5
AMBIENT TEMPERATURE : Ta[℃]
Fig.3 Operating current
TURN ON DELAY : TRD [us]
CONTROL INPUT VOLTAGE : VCTRL [V]
OPERATING CURRENT : IDD [uA]
120
2
3
4
5
SUPPLY VOLTAGE : VDD [V]
Fig.13 Output fall time
7/20
6
-50
0
50
100
AMBIENT T EMPERATURE : Ta[℃ ]
Fig.14 Output fall time
2009.05 - Rev.A
Technical Note
BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ
5.0
3.0
5.0
4.0
3.0
2.0
1.0
4.0
3.0
2.0
1.0
0.0
0.0
3
4
5
SUPPLY VOLTAGE : VDD [V]
-50
6
0.6
0.4
0.2
0.0
100
CURRENT LIMIT THRESHOLD : ITHLIM[A]
Ta=25ºC
2.0
1.0
0.0
2
FLAG OUTPUT RESISTANCE : RFLAG[Ω]
Ta=25ºC
25
20
15
10
5
0
5
0
3
4
5
SUPPLY VOLTAGE : VDD [V]
6
6
Fig.21 Flag output resistance
100
3.0
VDD=5.0V
2.0
1.0
0.0
-50
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Fig.20 Over current threshold
1.0
VDD=5.0V
25
20
15
10
5
Ta=25ºC
0.8
0.6
0.4
0.2
0.0
0
-50
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Supply Voltage : VDD [V]
50
AMBIENT TEMPERATURE : Ta[℃]
30
30
4
VUVLOL
2.2
Fig.19 Over current threshold
Fig.18 UVLO hysteresis voltage
3
2.4
Fig.17 UVLO threshold voltage
3.0
AMBIENT TEMPERATURE : Ta[℃]
2
VUVLOH
-50
OPERATING CURRENT : IDD [uA]
UVLO HYSTERESIS VOLTAGE : VHYS[V]
0.8
50
2.6
2.0
100
Fig.16 Output fall delay time
1.0
0
50
2.8
AMBIENT TEMPERATURE : Ta[℃]
Fig.15 Output fall delay time
-50
0
CURRENT LIMIT THRESHOLD : ITHLIM[A]
2
FLAG OUTPUT RESISTANCE : RFLAG[Ω]
UVLO THRESHOLD VOLTAGE
VUVLOH , VUVLOL [V]
VDD=5.0V
TURN OFF DELAY : TFD [us]
TURN OFF DELAY : TFD [us]
Ta=25ºC
Fig.22 Flag output resistance
2
3
4
5
6
SUPPLY VOLTAGE : VDD [V]
Fig.23 Operating current
CTRL Disable
OPERATING CURRENT : IDD [uA]
1.0
VDD=5.0V
0.8
0.6
0.4
0.2
0.0
2
3
4
5
6
SUPPLY VOLTAGE : VDD [V]
Fig.24 Operating current
CTRL Disable
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8/20
2009.05 - Rev.A
Technical Note
BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ
Reference data
◎BD6516F/ BD6517F
120
100
80
60
40
20
3
4
5
VDD=5.0V
100
80
60
40
20
0
-50
0
2
3.0
6
Fig.25 Operating current
50
1.0
0.5
100
2
2.0
1.5
1.0
0.5
2.0
Low to High
1.5
High to Low
1.0
0.5
VDD=5.0V
2.5
2.0
Low to High
1.5
High to Low
1.0
0.5
0.0
3
4
5
-50
6
Fig.28 CTRL input voltage
Fig.29 CTRL input voltage
(BD6516F)
(BD6517F)
4000
TURN ON RISE TIME : TON1 [us]
ON RESISTANCE : RON[mΩ]
ON RESISTANCE : RON [mΩ]
150
VDD=3.3V
VDD=5.0V
100
50
3
4
5
6
Ta=25ºC
3000
2000
1000
0
0
0
-50
SUPPLY VOLTAGE : VDD [V]
0
50
2
100
4
5
6
Fig.33 Output rise time
Fig.32 ON resistance
Fig.31 ON resistance
3
SUPPLY VOLTAGE : VDD [V]
AMBIENT TEMPERATURE : Ta[℃]
4000
4000
100
(BD6517F)
200
50
50
Fig.30 CTRL input voltage
Ta=25ºC
100
0
AMBIENT TEMPERATURE : Ta[℃]
SUPPLY VOLTAGE : VDD [V]
AMBIENT TEMPERATURE : Ta[℃]
150
6
3.0
2
200
5
(BD6516F)
Ta=25ºC
2.5
100
4
Fig.27 CTRL input voltage
0.0
0.0
2
3
SUPPLY VOLTAGE : VDD [V]
CONTROL INPUT VOLTAGE : VCTRL [V]
CONTROL INPUT VOLTAGE : VCTRL [V]
2.5
50
1.5
0.0
0
3.0
VDD=5.0V
0
2.0
Fig.26 Operating current
3.0
-50
Ta=25ºC
2.5
AMBIENT TEMPERATURE : Ta[℃]
SUPPLY VOLTAGE : VDD [V]
CONTROL INPUT VOLTAGE : VCTRL [V]
CONTROL INPUT VOLTAGE : VCTRL [V]
Ta=25ºC
OPERATING CURRENT : I DD [uA]
OPERATING CURRENT : IDD [uA]
120
4000
3000
VDD=3.3V
2000
VDD=5.0V
1000
TURN ON DELAY : TON2[us]
TURN ON DELAY : TON2[us]
TURN ON RISE TIME : TON1[us]
Ta=25ºC
3000
2000
1000
0
0
-50
0
50
100
2
3
4
5
6
AMBIENT TEMPERATURE : Ta[℃]
SUPPLY VOLTAGE : VDD[V]
Fig.34 Output rise time
Fig.35 Output rise delay time
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9/20
3000
VDD=3.3V
2000
VDD=5.0V
1000
0
-50
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Fig.36 Output rise delay time
2009.05 - Rev.A
Technical Note
5.0
400
300
VDD=3.3V
200
VDD=5.0V
100
5.0
Ta=25ºC
4.0
3.0
2.0
1.0
0.0
0
-50
0
50
2
100
3
Fig.37 Flag output resistance
4.0
3.0
2.0
1.0
0.0
5
3
4
5
-50
VDD=3.3V
3.0
2.0
VDD=5.0V
1.0
0.0
-50
0
50
2.0
1.0
0
50
100
2
3
4
5
Fig.42 Shortcircuit output
current
4
Ta=25ºC
400
300
200
100
Ta=25ºC
3
2
1
0
0
2
3
4
5
2
6
3
4
5
AMBIENT TEMPERATURE : Ta[℃]
SUPPLY VOLTAGE : VDD[V]
SUPPLY VOLTAGE : VDD[V]
Fig.43 Shortcircuit output
current
Fig.44 Flag output resistance
Fig.45 Flag output delay
3
2
1
Ta=25ºC
OPERATING CURRENT : IDD[uA]
OPERATING CURRENT : IDD[uA]
VDD=5.0V
0.8
0.6
0.4
0.2
0.0
0
-50
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Fig.46 Flag output delay
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6
1.0
1.0
4
6
SUPPLY VOLTAGE : VDD[V]
500
100
100
Ta=25ºC
FLAG OUTPUT DELAY : TDFL[ms]
FLAG OUTPUT RESISTANCE : RFLAG[Ω]
1.0
50
0.0
-50
Fig.41 Output fall delay time
VDD=3.3V
0
3.0
Fig.40 Output fall delay time
VDD=5.0V
VDD=5.0V
Fig.39 Output fall time
AMBIENT TEMPERATURE : Ta[℃]
2.0
1.0
Fig.38 Output fall time
SUPPLY VOLTAGE : VDD[V]
3.0
VDD=3.3V
AMBIENT TEMPERATURE : Ta[℃]
4.0
6
2.0
6
0.0
2
SHORT CIRCUIT CURRENT : ISC[A]
4
SHORT CIRCUIT CURRENT : ISC[A]
TURN OFF DELAY : TOFF2[us]
TURN OFF DELAY : TOFF2[us]
Ta=25ºC
3.0
SUPPLY VOLTAGE : VDD [V]
5.0
5.0
4.0
0.0
AMBIENT TEMPERATURE : Ta[℃]
FLAG OUTPUT DELAY : TDFL[ms]
TURN OFF FALL TIME : T OFF1[us]
500
TURN OFF FALL TIME : TOFF1 [us]
FLAG OUTPUT RESISTANCE : RFLAG[Ω]
BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ
VDD=5.0V
0.8
0.6
0.4
0.2
0.0
2
3
4
5
6
-50
0
50
SUPPLY VOLTAGE : VDD[V]
AMBIENT TEMPERATURE : Ta[℃]
Fig.47 Operating current
CTRL Disable
Fig.48 Operating current
CTRL Disable
10/20
100
2009.05 - Rev.A
Technical Note
BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ
Reference data
◎BD2042AFJ/ BD2052AFJ
140
Ta=25ºC
120
OPERATING CURRENT :
IDD[uA]
OPERATING CURRENT :
IDD[uA]
120
1.0
VIN=5.0V
100
100
80
60
40
0.6
80
60
0.4
40
0.2
20
20
0
0
2
3
4
5
SUPPLY VOLTAGE : VIN[V]
0.0
-50
6
VIN=5.0V
0.4
0.2
ENABLE INPUT VOLTAGE :
VEN, V/EN[V]
ENABLE INPUT VOLTAGE :
VEN, V/EN[V] 0
0.6
1.5
1.5
Low to High
High to Low
1.0
0.5
0.0
2
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
3
4
5
SUPPLY VOLTAGE : VIN[V]
6
-50
200
0.5
0.3
0.2
0.1
0.0
6
Fig.55 /OC output LOW voltage
VIN=5.0V
0.3
0.2
150
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Fig.58 ON resistance
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3
4
5
SUPPLY VOLTAGE : VDD [V]
6
Fig.57 ON resistance
2.0
2.0
VIN=5.0V
Ta=25ºC
1.5
1.0
0.5
0.0
0.0
-50
2
Fig.56 /OC output LOW voltage
0.5
0
50
0
-50
1.0
50
100
0.0
1.5
100
150
0.1
SHORT CIRCUIT CURRENT :
ISC[A]
200
0.4
SHORT CIRCUIT CURRENT :
ISC[A]
0.4
Ta=25ºC
VIN=5.0V
ON RESISTANCE :
R ON[mΩ]
/OC OUTPUT LOW VOLTAGE :
V/OC[V]
Ta=25ºC
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Fig.54 EN,/EN input voltage
Fig.53 EN,/EN input voltage
0.5
3
4
5
SUPPLY VOLTAGE : VDD[V]
High to Low
0.5
Fig.52 Operating current
EN,/EN Disable
2
Low to High
1.0
0.0
0.0
6
Fig.51 Operating current
EN,/EN Disable
Ta=25ºC
0.8
-50
3
4
5
SUPPLY VOLTAGE : VIN[V]
2.0
VIN=5.0V
OPERATING CURRENT :
ISTB[uA]
2
2.0
1.0
/OC OUTPUT LOW VOLTAGE :
V/OC[V]
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Fig.50 Operating current
EN,/EN Enable
Fig.49 Operating current
EN,/EN Enable
ON RESISTANCE :
RON[mΩ]
Ta=25ºC
0.8
OPERATING CURRENT :
ISTB[uA]
140
2
3
4
5
SUPPLY VOLTAGE : VIN[V]
6
Fig.59 Output current at shortcircuit
11/20
-50
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Fig.60 Output current at shortcircuit
2009.05 - Rev.A
Technical Note
BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ
5.0
5.0
5.0
Ta=25ºC
4.0
4.0
2.0
1.0
TURN ON TIME :
TON2[ms]
RISE TIME :
TON1[ms]
RISE TIME :
TON1[ms]
4.0
3.0
3.0
2.0
1.0
0.0
3
4
5
SUPPLY VOLTAGE : VIN[V]
6
-50
Fig.61 Output rise time
0.0
100
2
2.0
1.0
VIN=5.0V
4.0
4.0
3.0
3.0
2.0
0.0
0.0
0
50
100
2
AMBIENT TEMPERATURE : Ta[℃]
3
4
5
SUPPLY VOLTAGE : VIN[V]
-50
6
Fig.65 Output fall time
Fig.64 Output turn on time
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Fig.66 Output fall time
2.5
5.0
6.0
5.0
UVLO THRESHOLD VOLTAGE :
VUVLOH, VUVLOL[V]
VIN=5.0V
Ta=25°C
TURN OFF TIME :
TOFF2[us]
4.0
4.0
3.0
2.0
3.0
2.0
1.0
1.0
0.0
0.0
3
4
5
SUPPLY VOLTAGE : VIN[V]
2.0
1.0
1.0
0.0
6
5.0
FALL TIME :
TOFF1[us]
FALL TIME :
TOFF1[us]
3.0
3
4
5
SUPPLY VOLTAGE : VIN[V]
Fig.63 Output turn on time
Ta=25ºC
4.0
TURN ON TIME :
TON2[ms]
0
50
AMBIENT TEMPERATURE : Ta[℃]
5.0
VIN=5.0V
2
2.0
Fig.62 Output rise time
5.0
-50
3.0
1.0
0.0
2
TURN OFF TIME :
TOFF2[us]
Ta=25ºC
VIN=5.0V
6
Fig.67 Output turn off time
-50
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Fig.68 Output turn off time
2.4
VUVLOH
2.3
VUVLOL
2.2
2.1
2.0
-50
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Fig.69 UVLO threshold voltage
UVLO HYSTERESIS VOLTAGE : VHYS[V]
1.0
0.8
0.6
0.4
0.2
0.0
-50
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Fig.70 UVLO hysteresis voltage
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12/20
2009.05 - Rev.A
Technical Note
BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ
Waveform data
VCTRL
(5V/div.)
VCTRL
(5V/div.)
VEN
(5V/div.)
VFLAG
(5V/div.)
VFLAG
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
VDD=5V
RL=47Ω
CL=47uF
IOUT
(0.2A/div.)
VDD=5V
RL=47Ω
CL=47uF
VDD=5V
RL=10Ω
CL=100uF
IOUT
(0.2A/div.)
IOUT
(0.2A/div.)
TIME(200ms/div.)
TIME(200ms/div.)
TIME(200ms/div.)
Fig.71 Output rise, fall characteristic
(BD6512F)
Fig.72 Output rise, fall characteristic
(BD6516F)
Fig.73 Output rise, fall characteristic
(BD2052AFJ)
VFLAG
(5V/div.)
VFLAG
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
VDD=5V
CL=47uF
IOUT
(0.5A/div.)
VDD=5V
CL=47uF
IOUT
(0.5A/div.)
VDD=5V
IOUT
(0.5A/div.)
TIME (2ms/div.)
TIME (2ms/div.)
TIME (2ms/div.)
Fig.74 Over current response
Ramped load
(BD6512F)
Fig.75 Over current response
Ramped load
(BD6516F)
Fig.76 Over current response
Ramped load
(BD2052AFJ)
VCTRL
(5V/div.)
VCTRL
(5V/div.)
VFLAG
(5V/div.)
VOUT
(5V/div.)
VFLAG
(5V/div.)
VEN
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
VDD=5V
CL=47uF
IOUT
(0.5A/div.)
1ms Delay
IOUT
(0.5A/div.)
VDD=5V
CL=47uF
1.3ms Delay
VDD=5V
CL=100uF
IOUT
(0.5A/div.)
TIME (2ms/div.)
TIME (2ms/div.)
TIME (2ms/div.)
Fig.77 Over current response
Enable to shortcircuit (BD6512F)
Fig.78 Over current response
Enable to shortcircuit (BD6516F)
Fig.79 Over current response
Enable to shortcircuit (BD2052AFJ)
VFLAG
(5V/div.)
VFLAG
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
VDD=5V
CL=47uF
VDD=5V
CL=47uF
Thermal Shutdown
Thermal Shutdown
IOUT
(2A/div.)
IOUT
(2A/div.)
VDD=5V
CL=100uF
Thermal Shutdown
IOUT
(2A/div.)
TIME (100ms/div.)
TIME (100ms/div.)
TIME (200ms/div.)
Fig.80 Over current response
Output shortcircuit at Enable (BD6512F)
Fig.81 Over current response
Output shortcircuit at Enable (BD6516F)
Fig.82 Over current response
Output shortcircuit at Enable (BD2052AFJ)
Regarding the output rise/fall and over current detection characteristics of BD6513F, BD6517F, BD2042AFJ refer to the characteristic of BD6512F, BD6516F, BD2052AFJ.
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13/20
2009.05 - Rev.A
Technical Note
BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ
Block diagram
◎BD6512F/ BD6513F/ BD6516F/ BD6517F
CTRLA
(BD6516F/17F)
Delay
Gate
Logic1
FLAGA
Charge
Pump1
OCD1
OUTA
VDD
UVLO
CTRLA 1
TSD
8 OUTA
OUTB
CTRLB
FLAGA 2
Charge
Pump2
OCD2
Gate
Logic2
GND
7 VDD
Top View
FLAGB 3
6 GND
CTRLB 4
5 OUTB
FLAGB
Delay
(BD6516F/17F)
Fig.83 Block diagram
Fig.84 Pin Configuration
Pin description
◎BD6512F/ BD6513F/ BD6516F/ BD6517F
Pin No.
Symbol
I/O
Pin function
1, 4
CTRLA
CTRLB
I
Enable input.
Switch on at Low level. (BD6513F/BD6517F)
Switch on at High level. (BD6512F/BD6516F)
High level input > 2.5V, Low level input < 0.7V.
2, 3
FLAGA
FLAGB
O
Error flag output.
Low at over current, thermal shutdown.
Open drain output.
5, 8
OUTB
OUTA
O
Switch output.
6
GND
I
Ground.
7
VDD
I
Power supply input.
Input terminal to the switch and power supply input terminal of the internal circuit.
I/O circuit
◎BD6512F/ BD6513F/ BD6516F/ BD6517F
Symbol
CTRLA
CTRLB
Pin No.
Equivalent circuit
(BD6512F/ BD6513F)
CTRLA
CTRLB
CTRLA
CTRLB
1, 4
FLAGA
FLAGB
FLAGA
FLAGB
OUTA
OUTB
Equivalent circuit
(BD6516F/ BD6517F)
FLAGA
FLAGB
2, 3
5, 8
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© 2009 ROHM Co., Ltd. All rights reserved.
OUTA
OUTB
OUTA
OUTB
14/20
2009.05 - Rev.A
Technical Note
BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ
Block diagram
◎BD2042AFJ/BD2052AFJ
TSD1
/EN1
EN1
/OC1
Gate
Logic1
Delay
Charge
Pump1
OCD1
IN
OUT1
UVLO
GND 1
OUT2
/EN2
EN2
IN 2
Charge
Pump2
OCD2
7 OUT1
Top View
/EN1 3
(EN1)
/EN2 4
(EN2)
/OC2
Gate
Logic2
8 /OC1
Delay
GND
6 OUT2
5 /OC2
TSD2
Fig.85 Block diagram
Pin description
◎BD2042AFJ/BD2052AFJ
Pin No.
Symbol
Fig.86 Pin Configuration
I/O
Pin function
1
GND
I
Ground.
2
IN
I
Power supply input.
Input terminal to the switch and power supply input terminal of the
internal circuit.
3, 4
/EN, EN
I
Enable input.
Switch on at Low level. (BD2042AFJ)
Switch on at High level. (BD2052AFJ)
High level input > 2.0V, Low level input < 0.8V.
5, 8
/OC
O
Error flag output.
Low at over current, thermal shutdown.
Open drain output.
6, 7
OUT
O
Switch output.
I/O circuit
◎BD2042AFJ/BD2052AFJ
Symbol
Pin No
/EN1(EN1)
/EN2(EN2)
Equivalent circuit
/EN1(EN1)
/EN2(EN2)
3, 4
/OC1
/OC2
/OC1
/OC2
OUT1
OUT2
5, 8
OUT1
OUT2
6, 7
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15/20
2009.05 - Rev.A
BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ
Technical Note
Functional description
1. Switch operation
VDD(IN) pin and OUT pin are connected to the drain and the source of switch MOSFET respectively. And the VDD(IN) pin
is used also as power source input to internal control circuit.
When the switch is turned on from CTRL(EN) control input, VDD(IN) and OUT is connected. In a normal condition, current
flows from VDD to OUT. If voltage of OUT is higher than VDD, current flows from OUT to VDD, since the switch is
bidirectional.
◎BD6512F/ BD6513F
There is a parasitic diode between the drain and the source of switch MOSFET. Therefore, even when the switch is off, if
the voltage of OUT is higher than that of VDD, current flows from OUT to VDD.
◎BD6516F/BD6517F/BD2042AFJ/BD2052AFJ
There is not parasitic diode, it is possible to prevent current from flowing reversely from OUT to VDD.
2. Thermal shutdown (TSD)
Thermal shut down circuit turns off the switch and outputs an error flag when the junction temperature in chip exceeds a
threshold temperature. The thermal shut down circuit works when either of two control signals is active.
In BD6512F/BD6513F/BD6516F/BD6517F, the switches of both OUTA and OUTB become off and error flags are output to the both.
BD2042AFJ/ BD2052AFJ have dual thermal shutdown threshold. Since thermal shutdown works at a lower junction
temperature when an overcurrent occurs, only the switch of an overcurrent state become off and error flag is output.
◎BD6512F/BD6513F
The switch off status of the thermal shut down is latched. Therefore, even when the junction temperature goes down,
switch off and error flag output status are maintained. To release the latch, it is necessary to input a signal to switch off to
CTRL pin or make UVLO status. When the switch on signal is input or UVLO is released, the switch on and error flag
output are recovered.
◎BD6516F/BD6517F/BD2042AFJ/BD2052AFJ
Thermal shut down action has hysteresis. Therefore, when the junction temperature goes down, switch on and error flag
output automatically recover. However, until cause of junction temperature increase such as output shortcircuit is
removed or the switch is turned off, thermal shut down detection and recovery are repeated.
3. Over current detection, limit circuit
The over current detection circuit limits current and outputs error flag when current flowing in each switch MOSFET
exceeds a specified value. There are three types of response against over current. The over current detection, limit circuit
works when the switch is on (CTRL・EN signal is active).
3-1 When the switch is turned on while the output is in shortcircuit status
When the switch is turned on while the output is in shortcircuit status, the switch become current limit mode soon.
3-2 When the output shortcircuits while the switch is on
When the output shortcircuits or large capacity is connected while the switch is on, very large current flows until the
over current limit circuit responds. When the current detection, limit circuit works, current limitation is carried out.
3-3 When the output current increases gradually
When the output current increases gradually, current limitation does not work until the output current exceeds the over
current detection value. When it exceeds the detection value, current limitation is carried out.
4. Under voltage lockout(UVLO)
When the supply voltage is below UVLO threshold level, UVLO circuit turns off switch to prevent malfunction. The UVLO
circuit works when either of two control signals is active.
◎BD6512F/BD6513F
UVLO circuit prevents the switch from turning on until the VDD exceeds 2.5V(Typ.). If the VDD drops below 2.3V(Typ.)
while the switch turns on, then UVLO shuts off the switch.
◎BD2042AFJ/BD2052AFJ
UVLO circuit prevents the switch from turning on until the VIN exceeds 2.3V(Typ.). If the VIN drops below 2.2V(Typ.)
while the switch turns on, then UVLO shuts off the switch. UVLO has hysteresis of a 100mV(Typ).
5. Error flag output
Error flag output is N-MOS open drain output.
◎BD6512F/BD6513F
At detection of over current detection, thermal shutdown, UVLO, Low level is output.
◎BD6516F/BD6517F/BD2042AFJ/BD2052AFJ
At detection of over current detection, thermal shutdown, Low level is output. Error flag output at over current detection
has delay filter. This delay filter prevents instantaneous current detection such as inrush current at switch on, hot plug
from being informed to outside.
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16/20
2009.05 - Rev.A
Technical Note
BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ
VCTRL
Output shortcircuit
VOUT
Thermal shut down
IOUT
VFLAG
Latch
Latch release
Fig.87 BD6512F/ BD6513F over current detection, thermal shutdown timing
(VCTRL of BD6513F active Low)
VCTRL
VEN
Output shortcircuit
VOUT
Thermal shut down
IOUT
VFLAG
V/OC
delay
Fig.88 BD6516F/ BD6517F/BD2042AFJ/ BD2052AFJ over current detection, thermal shutdown timing
(VCTRL, V/EN of BD6517F/BD2042AFJ active Low)
Typical application circuit
5V(Typ)
100k
100k
VBUS
IN
OUT
CTRLA
(EN)
CTRLB
(EN)
FLAGA
(/OC)
FLAGA
(/OC)
ON/OFF
D+
ON/OFF
DRegulator
GND
OC
OC
VDD
Ferrite
Beads
CIN
CL
GND
OUTA
Data
OUTB
CL
Data
USB Controller
Data
Fig.89 Typical application circuit
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17/20
2009.05 - Rev.A
Technical Note
BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ
Application information
When excessive current flows owing to output shortcircuit or so, ringing occurs by inductance of power source line to IC, and
may cause bad influences upon IC operations. In order to avoid this case, connect a bypass capacitor by VDD pin and GND
pin of IC. 1uF or higher is recommended.
Pull up flag output by resistance 10kΩ ~ 100kΩ.
Set up value which satisfies the application as CL and Ferrite Beads.
This system connection diagram doesn’t guarantee operating as the application.
The external circuit constant and so on is changed and it uses, in which there are adequate margins by taking into account
external parts or dispersion of IC including not only static characteristics but also transient characteristics.
In BD6512F/BD6513F, there are cases where over current detection error flag is output to inrush current at switch on or at
insertion of active line of peripheral devices. In the case of erroneous detection inBD6512F/BD6513F, use RC filter shown in
Fig. 90 for FLAG output.
VDD
OC
CTRLA
OUTA
FLAGA
VDD
FLAGB
GND
CTRLB
OUTB
USB Controller
BD6512F/13F
Fig.90 FLAG output RC filter
Thermal derating characteristic
(SOP8, SOP-J8)
600
POWER DISSIPATION: Pd[mW]
500
400
300
200
100
0
0
25
50
75
100
125
150
AMBIENT TEMPERATURE: Ta [℃]
Fig.92 Power dissipation curve
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18/20
2009.05 - Rev.A
BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ
Technical Note
Notes for use
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
(2) Operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The
electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due
to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal.
(4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard,
for the digital block power supply and the analog block power supply, even though these power supplies has the same
level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing
the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns.
For the GND line, give consideration to design the patterns in a similar manner.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal.
At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be
used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant.
(5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient.
(6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between
the terminal and the power supply or the GND terminal, the ICs can break down.
(7) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig.
After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition,
for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the
transportation and the storage of the set PCB.
(9) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a
voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to
the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is
applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of
electrical characteristics.
(10) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the
small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
(11) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(12) Thermal shutdown circuit (TSD)
When junction temperatures become 135°C (typ) or higher, the thermal shutdown circuit operates and turns a switch OFF.
The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed
at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the
LSI assuming its operation.
(13) Thermal design
Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual states of use.
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© 2009 ROHM Co., Ltd. All rights reserved.
19/20
2009.05 - Rev.A
BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ
Technical Note
 Ordering part number
B
D
6
Part No.
5
1
2
F
Part No.
6512
6513
6516
6517
2042A
2052A
-
Package
F: SOP8
E
2
Packaging and forming specification
E2: Embossed tape and reel
(SOP8,SOP-J8)
FJ:SOP-J8
SOP8
<Tape and Reel information>
7
6
5
+6°
4° −4°
6.2±0.3
4.4±0.2
0.3MIN
8
1 2
3
0.9±0.15
5.0±0.2
(MAX 5.35 include BURR)
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
4
0.595
1.5±0.1
+0.1
0.17 -0.05
0.11
S
1.27
0.42±0.1
1pin
Reel
(Unit : mm)
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
SOP-J8
<Tape and Reel information>
4.9±0.2
(MAX 5.25 include BURR)
+6°
4° −4°
6
5
0.45MIN
7
3.9±0.2
6.0±0.3
8
1
2
3
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
4
0.545
0.2±0.1
0.175
1.375±0.1
S
1.27
0.42±0.1
0.1 S
1pin
(Unit : mm)
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© 2009 ROHM Co., Ltd. All rights reserved.
Reel
20/20
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2009.05 - Rev.A
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,
fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of
any of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
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© 2009 ROHM Co., Ltd. All rights reserved.
R0039A
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