AVAGO HDJD-S722-QR999 Color sensor Datasheet

HDJD-S722-QR999
Color Sensor
Data Sheet
Description
Features
Avago Technologies’ color sensor is a high performance,
small in size, cost effective light to voltage converting
sensor. The sensor combines a photodiode array and
three trans-impedance amplifiers in a single monolithic
CMOS IC solution. With a Red (R), Green (G) and Blue
(B) color filters coated over the photodiode array, the
sensor converts R, G, B light to analog voltage outputs,
denoted by VROUT, VGOUT and VBOUT, respectively.
The sensor is packaged in a 5x5x1 (mm) surface mount
QFN-16 package.
• Convert light to R, G, B voltage output
• Monolithic CMOS IC solution with integrated R, G,
B color filter, photodiode array, trans-impedance
amplifier in one chip
• 3 sets of 3x3 photodiode array design minimize
the effect of contamination and optical aperture
misalignment
• Small in size 5x 5x1 mm
• Independent gain selection options for each R, G, B
channel
Applications
Avago Technologies’ color sensor is ideal for open-loop
color identification and closed-loop color point control.
The sensor is designed for low illuminance applications including color detection, environmental lighting,
industrial process, etc. With R, G, B photo-sensor and
amplifier integrated in a single 5x5x1 (mm) package,
Avago Technologies’ color sensor provides a high performance, small in size and cost effective solution
to color sensing.
ESD WARNING: Standard CMOS handling precautions should be observed to avoid static discharge.
AVAGO TECHNOLOGIES’ PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS
PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY
OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS
AGAINST AVAGO TECHNOLOGIES OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
Package Dimension
5
6
Part Numbering System
7
8
HDJD-S 7 X X-X X X X X
4
9
3
10
2
11
1
12
16
15
14
Gain Selection (GS) Option
999: GS 00,01 or 10
Packaging Type
R: Tape and Reel
Product Packaging
Q: QFN
13
BOTTOM VIEW
Product ID
22: Component without IR Filter
16L QFN 5X5
(0.8)
(0.3)
(3.2)
5.0 ± 0.15
(3.2)
5.0 ± 0.15
1.0 ± 0.15
NOTE: DIMENSIONS ARE IN MILLIMETERS (mm)
Pin Out for HDJD-S722-QR999
Pin
Pin Name
Normal Operation
Pin 1
VBOUT
Analog output voltage for BLUE
Pin 2
VGOUT
Analog output voltage for GREEN
Pin 3
VROUT
Analog output voltage for RED
Pin 4
VDD
5 V DC Supply
Pin 5
GND
Ground
Pin 6
GSGRN1
Gain Selection Green bit 1
Pin 7
GND
Ground
Pin 8
GSRED1
Gain Selection Red bit 1
Pin 9
GSRED0
Gain Selection Red bit 0
Pin 10
NC
No connection
Pin 11
NC
No connection
Pin 12
GSBLUE0
Gain Selection Blue bit 0
Pin 13
GSBLUE1
Gain Selection Blue bit 1
Pin 14
GND
Ground
Pin 15
GSGRN0
Gain Selection Green bit 0
Pin 16
GND
Ground
Theory of Operation
Sensor IC Block Diagram
The integral R, G, B color filters on the photodiode array
detect the R, G, B components of the light falling on the
sensor. The photodiode converts the R, G, B light components into photocurrents. The integrated transimpedence amplifiers for R, G, B components then convert
the photocurrent to analog voltage outputs. The voltage
output of each R, G, B channel increases linearly with increasing light intensity.
GS (1:0)
RF
CF
VDD5
–
+
GND
VROUT
TRANSIMPEDANCE AMP
GS (1:0)
RF
CF
GSRED (1:0)
GSGRN (1:0)
RED GAIN
SELECTION
GREEN GAIN
SELECTION
–
+
VGOUT
TRANSIMPEDANCE AMP
GS (1:0)
RF
CF
GSBLUE (1:0)
BLUE GAIN
SELECTION
–
+
VBOUT
TRANSIMPEDANCE AMP
Absolute Maximum Ratings[1,2]
Parameter
Supply Voltage
Storage Temperature
Operating Temperature
Human Body Model ESD Rating
Symbol
VDD
TS
TA
ESDHBM
Min.
4.5
-40
-40
Max.
5.5
100
85
1
Unit
V
°C
°C
kV
Notes
Notes:
1. Subjecting the part to stresses beyond those listed under this section may cause permanent damage to the device. These are stress ratings
only and do not imply that the devices will function beyond these ratings. Exposure to the extremes of these conditions for extended periods
may affect device reliability.
2. Unless otherwise specified, voltages are referenced to ground.
Recommended Operating Conditions
Parameter
Symbol
Operating Temperature
TA
Supply Voltage
VDD
Min.
0
4.5
Typ.
25
5.0
Max.
70
5.5
Units Notes
°C
V
A decoupling capacitor of 100 nF
between VDD and ground is recommended.
Operating Conditions and Electrical Requirements
Electrical Characteristics at VDD = 5 V, TA = 25°C, RL = 68 kΩ
Parameter
Symbol
Remark
Min.
Dark Voltage
VD
Ee = 0
Max. Output Voltage Swing
VOMAX
Supply Current
IDD
Ee = 0
Irradiance Responsivity
GS:10, lP = 460 nm[1] (Blue Channel)
Re
GS:10, lP = 542 nm[2] (Green Channel)
GS:10, lP = 645 nm[3] (Red Channel)
Irradiance Responsivity
GS:01, lP = 460 nm[1] (Blue Channel)
Re
GS:01, lP = 542 nm[2] (Green Channel)
GS:01, lP = 645 nm[3] (Red Channel)
Irradiance Responsivity
GS:00, lP = 460 nm[1] (Blue Channel)
Re
GS:00, lP = 542 nm[2] (Green Channel)
GS:00, lP = 645 nm[3] (Red Channel)
Saturation Irradiance[4]
GS:10, lP = 460 nm[1] (Blue Channel)
GS:10, lP = 542 nm[2] (Green Channel)
GS:10, lP = 645 nm[3] (Red Channel)
[4]
Saturation Irradiance GS:01, lP = 460 nm[1] (Blue Channel)
GS:01, lP = 542 nm[2] (Green Channel)
GS:01, lP = 645 nm[3] (Red Channel)
Saturation Irradiance[4]
GS:00, lP = 460 nm[1] (Blue Channel)
GS:00, lP = 542 nm[2] (Green Channel)
GS:00, lP = 645 nm[3] (Red Channel)
Output Rise Time
tr
GS:00 to GS01; Test Condition[5] (min Vo = 0V, peak Vo = 2V)
GS:10; Test Condition[5] (min Vo = 0V, peak Vo = 2V)
Output Fall Time
tf
GS:00 to GS01; Test Condition[5] (min Vo = 0V, peak Vo = 2V)
GS:10; Test Condition[5] (min Vo = 0V, peak Vo = 2V)
Typ.
Max.
Unit
15
mV
4.8 V
2.5
mA
15
19
V/(mW/cm2)
27
9
11
V/(mW/cm2)
16
5
6
V/(mW/cm2)
9
0.32
0.25
mW/cm2
0.18
0.53
0.44
mW/cm2
0.30
0.96
0.80
mW/cm2
0.53
45 µs
220
50 µs
240
Notes:
1. Test condition: using blue diffuse light of peak wavelength (lP) 460 nm and spectral half width (Dl1/2) 25 nm as light source.
2. Test condition: using green diffuse light of peak wavelength (lP) 542 nm and spectral half width (Dl1/2) 35 nm as light source.
3. Test condition: using red diffuse light of peak wavelength (lP) 645 nm and spectral half width (Dl1/2) 20 nm as light source.
4. Saturation irradiance = (Max. output voltage swing)/(Irradiance responsivity).
5. Test condition: The rise and fall time is measured with RC lowpass filter added to sensor output:
Gain Selection
Rext
Cext
GS:00 to GS:01
15 kΩ
1 nF
GS:10
15 kΩ
6.8 nF
RED CHANNEL
R
C
RED CHANNEL
SIGNAL
GENERATOR
–
+
+
–
VRout
Vout
Rext
Cext
LED
RC LOWPASS FILTER
TEST CIRCUIT
FOR ILLUSTRATION PURPOSE, ONLY RED CHANNEL IS SHOWN.
THE SAME CIRCUIT APPLIES TO GREEN AND BLUE CHANNELS.
Gain Selection Feedback Resistor Table
GS: Bit 1
Bit 0
0
0
0
1
1
0
Feedback Resistor, RF
4 MΩ
7 MΩ
12 MΩ
Notes:
1. Gains selections, GS: Bit 1 Bit 0 are applicable for each Red, Green and Blue Channel.
2. Gain selections for each channel can be selected independently of each other.
3. Feedback resistor value is proportional to responsivity. Refer to block diagram below.
4. 0 indicates that the pin is connected to ground. 1 indicates no connection.
GS (1:0)
RF
CF
–
+
TRANSIMPEDANCE AMP
Typical Characteristics
1.2
NORMALIZED SENSITIVITY
1.0
RED
0.8
0.6
0.4
GREEN
BLUE
0.2
0
350
450
550
650
750
WAVELENGTH (nm)
Figure 1. Spectral responsivity.
Note:
Test condition is when Gain Selection Jumpers are set to
GSBLUE1=0
GSGRN1=0
GSRED1=0
GSBLUE0=1
GSGRN0=1
GSRED0=1
in which 0 = connect to Ground, 1 = no connection. Refer to Gain Selection Feedback Resistor Table.
4.8
4.4
0.025
4.0
3.6
3.2
VOLTAGE OUTPUT – VO (V)
VD – DARK VOLTAGE (V)
0.03
0.02
0.015
0.01
0.005
0
-40
-20
0
20
40
60
80
GS:10
2.4
2.0
1.6
1.2
0.8
0.4
0
0
4.8
4.4
GS:00
2.8
2.4
2.0
1.6
1.2
0.8
0.4
0
0
0.2
0.4
0.6
0.8
1.0
IRRADIANCE – Ee (mW/cm2)
Figure 4. Voltage output of Green Channel vs. irradiance (lp = 542 nm).
0.4
0.6
0.8
1.0
Figure 3. Voltage output of Blue Channel vs. irradiance
(lp = 460 nm).
VOLTAGE OUTPUT – VO (V)
VOLTAGE OUTPUT – VO (V)
GS:10 GS:01
0.2
IRRADIANCE – Ee (mW/cm2)
Figure 2. Dark voltage vs. operating temperature.
4.0
3.6
3.2
GS:00
2.8
TA – OPERATING TEMPERATURE (°C)
4.8
4.4
GS:01
GS:10
4.0
3.6
GS:01
GS:00
3.2
2.8
2.4
2.0
1.6
1.2
0.8
0.4
0
0
0.2
0.4
0.6
IRRADIANCE – Ee (mW/cm2)
Figure 5. Voltage output of Red Channel vs. irradiance
(lp = 645 nm).
Recommended Reflow Profile
It is recommended that Henkel Pb- free solder paste LF310
be used for soldering HDJD-S722-QR999. Below is the
recommended reflow profile.
T-peak
T-reflow
230 ± 5°C
218°C
DELTA-FLUX = 2°C/sec. max.
TEMPERATURE
T-max.
T-min.
DELTA-COOLING = 2°C/sec. max.
160°C
120°C
DELTA-RAMP =
1°C/sec. max.
40-60 sec. max.
20-40 sec. max.
t-pre
t-reflow
TIME
Figure 6. Recommended reflow soldering profile.
16 Lead QFN Recommended PCB Land Pad Design
IPC-SM-782 is used as the standard for the PCB land-pad
design. Recommended PCB finishing is gold plated.
0.8 mm
0.4 mm
Recommendations for Handling and Storage of HDJDS722-QR999
This product is qualified as Moisture Sensitive Level 4
per Jedec J-STD-020. Precautions when handling this
moisture sensitive product is important to ensure the
reliability of the product. Do refer to Avago Application
Note AN5305 Handling Of Moisture Sensitive Surface
Mount Devices for details.
A. Storage before use
• Unopened moisture barrier bag (MBB) can be stored
at 30°C and 90%RH or less for maximum 1 year
3.19 mm
5.5 mm
• It is not recommended to open the MBB prior to
assembly (e.g. for IQC)
• It should also be sealed with a moisture absorbent
material (Silica Gel) and an indicator card (cobalt
chloride) to indicate the moisture within the bag
B. Control after opening the MBB
• The humidity indicator card (HIC) shall be read
immediately upon opening of MBB
3.9 mm
• The components must be kept at <30°C/60%RH at
5.5 mm
all time and all high temperature related process
including soldering, curing or rework need to be
Figure 7.
completed within 72hrs
C. Control for unfinished reel
• For any unused components, they need to be stored
16 Lead QFN Recommended Stencil Design
in sealed MBB with desiccant or desiccator at <5%RH
A stencil thickness of 2.18 mm (6 mils) for this QFN
D.
Control of assembled boards
package is recommended.
• If the PCB soldered with the components is to be
subjected to other high temperature processes, the
PCB need to be stored in sealed MBB with desiccant or
0.8 mm
desiccator at <5%RH to ensure no components have
exceeded their floor life of 72hrs
E. Baking is required if:
0.4 mm
0.8 mm • “10%” or “15%” HIC indicator turns pink
• The components are exposed to condition of
>30°C/60%RH at any time.
• The components floor life exceeded 72hrs
• Recommended baking condition (in component
form): 125°C for 24hrs
0.8 mm
3.19 mm
2.18 mm
Figure 8.
Package Tape and Reel Dimensions
4.00 ± 0.10
SEE NOTE #2
∅1.55 ± 0.05
2.00 ± 0.05
SEE NOTE #2
B
R 0.50 TYP.
1.75 ± .10
5.50 ± 0.05
12.00 ± 0.10
Bo
A
Ko
A
8.00 ± 0.10
B
∅1.50 (MIN.)
SECTION B-B
Ao
A o:
B o:
K o:
PITCH:
WIDTH:
0.30 ± 0.05
SECTION A-A
5.30
5.30
2.20
8.00
12.00
NOTES:
1. Ao AND Bo MEASURED AT 0.3 mm ABOVE BASE OF POCKET.
2. 10 PITCHES CUMULATIVE TOLERANCE IS ± 0.2 mm.
3. DIMENSIONS ARE IN MILLIMETERS (mm).
Reel Dimensions
65°
+1.5*
12.4 –0.0
45°
R10.65
R5.2
∅55.0 ± 0.5
45°
∅178.0 ± 0.5
∅176.0
EMBOSSED RIBS
RAISED: 0.25 mm
WIDTH: 1.25 mm
BACK VIEW
NOTES:
1. *MEASURED AT HUB AREA.
2. ALL FLANGE EDGES TO BE ROUNDED.
∅512
18.0 MAX.*
ESD WARNING: Standard CMOS handling precautions should be observed to avoid static discharge.
AVAGO TECHNOLOGIES’ PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS
PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY
OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS
AGAINST AVAGO TECHNOLOGIES OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our website:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries.
Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0136EN
AV01-0686EN - January 8, 2007
10
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