TI DRV2604YZFR Haptic driver for erm and lra with internal memory and smart loop architecture Datasheet

DRV2604
www.ti.com
SLOS824 – DECEMBER 2012
Haptic Driver for ERM and LRA with Internal Memory and Smart Loop Architecture
Check for Samples: DRV2604
FEATURES
DESCRIPTION
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The DRV2604 is designed to give extremely flexible
haptic control of ERM and LRA actuators over a
shared I2C compatible bus. This relieves the host
processor from ever generating pulse-width
modulated (PWM) drive signals, saving both costly
timer interrupts and hardware pins.
1
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•
•
•
•
•
•
•
•
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(1)
Flexible Haptic/Vibra Driver
– LRA (Linear Resonance Actuator)
– ERM (Eccentric Rotating Mass)
I2C Controlled Digital Playback Engine
– Internal RAM for Customized Waveforms
– Real-Time Playback Mode via I2C
Smart Loop Architecture(1)
– Automatic Overdrive/Braking (ERM/LRA)
– Automatic Resonance Tracking (LRA)
– Automatic Actuator Diagnostic (ERM/LRA)
– Automatic Level Calibration (ERM/LRA)
Optional PWM Input with 0% to 100% Duty
Cycle Control Range
Optional Analog Input Control
Optional Hardware Trigger Pin
Efficient Output Drive
Fast Start Up Time
Constant Acceleration Over Supply Voltage
1.8 V Compatible, VDD Tolerant Digital Pins
Available in a 9-Ball, 0.5 mm Pitch WCSP
The DRV2604 includes enough integrated RAM to
allow the user to pre-load over 100 customized
waveforms. These waveforms can be instantly played
back via I2C or optionally triggered via a hardware
trigger pin. Additionally, the real-time playback mode
allows the host processor to bypass the library
playback engine and play waveforms directly from the
host via I2C.
The DRV2604 also contains a smart loop
architecture, which allows effortless auto resonant
drive for LRA as well as feedback-optimized ERM
drive. This feedback gives automatic overdrive and
braking, which creates a simplified input waveform
paradigm as well as reliable motor control and
consistent motor performance.
The DRV2604 features a trinary-modulated output
stage, providing greater efficiency than linear-based
output drivers. The 9-ball WCSP footprint, flexible
operation, and low component count make the
DRV2604 the ideal choice for portable and touchenabled vibratory and haptic applications.
Patent pending control algorithm
APPLICATIONS
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•
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Mobile Phones
Tablets
Touch-Enabled Devices
CVREG
2.5 V – 5.5 V
VDD
DRV2604
I2C
Control
EN
IN/Trigger
SDA
I2C
I/F
RAM
Feedback
Detection
REG
SCL
OUT+
Playback Engine
Auto Calibration
Auto Diagnostic
LRA or
DC Motor
Driver
GND
OUT-
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
12-Dec-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package Qty
Drawing
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Samples
(3)
(Requires Login)
DRV2604YZFR
ACTIVE
DSBGA
YZF
9
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
DRV2604YZFT
ACTIVE
DSBGA
YZF
9
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
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TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
13-Dec-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
DRV2604YZFR
Package Package Pins
Type Drawing
SPQ
DSBGA
3000
YZF
9
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
180.0
8.4
Pack Materials-Page 1
1.65
B0
(mm)
K0
(mm)
P1
(mm)
1.65
0.81
4.0
W
Pin1
(mm) Quadrant
8.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
13-Dec-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DRV2604YZFR
DSBGA
YZF
9
3000
210.0
185.0
35.0
Pack Materials-Page 2
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