Intersil ISL83220ECB /-15kv esd protected, 3v to 5.5v, 1microamp, 250kbps, rs-232 transmitters/receiver Datasheet

ISL83220E
TM
Data Sheet
September 2001
+/-15kV ESD Protected, +3V to +5.5V,
1Microamp, 250kbps, RS-232
Transmitters/Receivers
itle
L32
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File Number
6011.1
Features
• ESD Protection for RS-232 I/O Pins to ±15kV (IEC1000)
• Drop in Replacement for SP3220E
The Intersil ISL83220E is a 3.0V to 5.5V powered RS-232
transmitter/receiver which meets ElA/TIA-232 and V.28/V.24
specifications, even at VCC = 3.0V. Additionally, it provides
±15kV ESD protection (IEC 1000-4-2 Air Gap and Human
Body Model) on transmitter outputs and receiver inputs
(RS-232 pins). Targeted applications are PDAs, Palmtops,
and notebook and laptop computers where the low
operational, and even lower standby, power consumption is
critical. Efficient on-chip charge pumps, coupled with a
manual powerdown function, reduce the standby supply
current to a 1µA trickle. Small footprint packaging, and the
use of small, low value capacitors ensure board space
savings as well. Data rates greater than 250kbps are
guaranteed at worst case load conditions. This family is fully
compatible with 3.3V only systems, mixed 3.3V and 5.0V
systems, and 5.0V only systems.
Table 1 summarizes the features of the ISL83320E, while
Application Note AN9863 summarizes the features of each
device comprising the ICL32XXE 3V family.
• Meets EIA/TIA-232 and V.28/V.24 Specifications at 3V
• Interoperable with RS-232 down to VCC = 2.7V
• Latch-Up Free
• On-Chip Voltage Converters Require Only Four External
0.1µF Capacitors
• Manual Powerdown Feature with Receivers Active
• Separate Receiver Enable Pin
• RX and TX Hysteresis For Improved Noise Immunity
• Guaranteed Minimum Data Rate . . . . . . . . . . . . . 250kbps
• Guaranteed Minimum Slew Rate . . . . . . . . . . . . . . . 6V/µs
• Wide Power Supply Range . . . . . . . Single +3V to +5.5V
• Low Supply Current in Powerdown State. . . . . . . . . . . 1µA
Applications
• Any System Requiring RS-232 Communication Ports
- Battery Powered, Hand-Held, and Portable Equipment
- Laptop Computers, Notebooks, Palmtops
- Modems, Printers and other Peripherals
- Digital Cameras
- Cellular/Mobile Phones
Related Literature
• Technical Brief TB363 “Guidelines for Handling and
Processing Moisture Sensitive Surface Mount Devices
(SMDs)”
TABLE 1. SUMMARY OF FEATURES
PART
NUMBER
ISL83220E
NO. OF NO. OF
Tx.
Rx.
1
1
1
NO. OF
MONITOR Rx.
(R OUTB)
DATA
RATE
(kbps)
Rx. ENABLE
FUNCTION?
READY
OUTPUT?
MANUAL
POWERDOWN?
AUTOMATIC
POWERDOWN
FUNCTION?
0
250
YES
NO
YES
NO
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Intersil and Design is a trademark of Intersil Americas Inc. | Copyright © Intersil Americas Inc. 2001
ISL83220E
Ordering Information
(NOTE 1)
PART NO.
TEMP.
RANGE ( oC)
Pinout
PACKAGE
ISL83220E (SOIC, SSOP, TSSOP)
TOP VIEW
PKG. NO.
ISL83220ECB
0 to 70
16 Ld SOIC
M16.3
EN 1
ISL83220EIB
-40 to 85
16 Ld SOIC
M16.3
C1+ 2
15 VCC
V+ 3
14 GND
ISL83220ECA
0 to 70
ISL83220EIA
-40 to 85
ISL83220ECV
ISL83220EIV
16 Ld SSOP
M16.209
16 Ld SSOP
M16.209
0 to 70
16 Ld TSSOP
M16.173
-40 to 85
16 Ld TSSOP
M16.173
16 SHDN
C1- 4
13 T1OUT
C2+ 5
12 N.C.
C2- 6
11 T1IN
V- 7
10 N.C.
R1IN 8
NOTE:
9 R1OUT
1. Most surface mount devices are available on tape and reel; add
“-T” to suffix.
Pin Descriptions
PIN
VCC
FUNCTION
System power supply input (3.0V to 5.5V).
V+
Internally generated positive transmitter supply (+5.5V).
V-
Internally generated negative transmitter supply (-5.5V).
GND
Ground connection.
C1+
External capacitor (voltage doubler) is connected to this lead.
C1-
External capacitor (voltage doubler) is connected to this lead.
C2+
External capacitor (voltage inverter) is connected to this lead.
C2-
External capacitor (voltage inverter) is connected to this lead.
TIN
TTL/CMOS compatible transmitter Inputs.
TOUT
RIN
ROUT
EN
SHDN
N.C.
±15kV ESD Protected, RS-232 level (nominally ±5.5V) transmitter outputs.
±15kV ESD Protected, RS-232 compatible receiver inputs.
TTL/CMOS level receiver outputs.
Active low receiver enable control; doesn’t disable ROUTB outputs.
Active low input shuts down transmitters and on-board power supply, to place device in low power mode.
No internal connection.
Typical Operating Circuit
ISL83220E
+3.3V
C1
0.1µF
C2
0.1µF
T1IN
TTL/CMOS
LOGIC LEVELS
R1OUT
+
0.1µF
2
+ C1+
4
C15
+ C2+
6
C211
15
VCC
3
V+
V- 7
+ C3
0.1µF
C4
+ 0.1µF
T1
13
9
8
T1OUT
R1 IN
5kΩ
R1
1 EN
16
GND
14
2
SHDN
VCC
RS-232
LEVELS
ISL83220E
Absolute Maximum Ratings
Thermal Information
VCC to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V
V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
V- to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3V to -7V
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14V
Input Voltages
TIN, EN, SHDN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V
RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25V
Output Voltages
TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±13.2V
ROUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to V CC +0.3V
Short Circuit Duration
TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table
Thermal Resistance (Typical, Note 2)
θJA (oC/W)
16 Ld Wide SOIC Package . . . . . . . . . . . . . . . . . . .
100
16 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .
135
16 Ld TSSOP Package . . . . . . . . . . . . . . . . . . . . . .
145
Moisture Sensitivity (see Technical Brief TB363)
All Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Level 1
Maximum Junction Temperature (Plastic Package) . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC
(Lead Tips Only)
Operating Conditions
Temperature Range
ISL83220ECX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 70oC
ISL83220EIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
2. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications
Test Conditions: VCC = 3V to 5.5V, C1 - C4 = 0.1µF; Unless Otherwise Specified.
Typicals are at TA = 25oC
PARAMETER
TEMP
(oC)
MIN
TYP
MAX
UNITS
25
-
0.3
1.0
mA
25
-
1.0
10
µA
Full
-
-
0.8
V
VCC = 3.3V
Full
2.0
-
-
V
VCC = 5.0V
Full
2.4
-
-
V
25
-
0.3
TEST CONDITIONS
DC CHARACTERISTICS
Supply Current
All Outputs Unloaded,
SHDN = VCC
Supply Current, Powerdown
SHDN = GND
VCC = 3.15V
LOGIC AND TRANSMITTER INPUTS AND RECEIVER OUTPUTS
Input Logic Threshold Low
TIN, EN, SHDN
Input Logic Threshold High
TIN, EN, SHDN
Transmitter Input Hysteresis
V
Input Leakage Current
TIN, EN, SHDN
Full
-
±0.01
±1.0
µA
Output Leakage Current
EN = VCC
Full
-
±0.05
±10
µA
Output Voltage Low
IOUT = 1.6mA
Full
-
-
0.4
V
Output Voltage High
IOUT = -1.0mA
Full
-
V
Output Voltage Swing
All Transmitter Outputs Loaded with 3kΩ to Ground
Full
±5.0
±5.4
-
V
Output Resistance
VCC = V+ = V- = 0V, Transmitter Output = ±2V
Full
300
10M
-
Ω
Output Short-Circuit Current
VOUT = 0V
Full
-
±35
±60
mA
Output Leakage Current
VOUT = ±12V, VCC = 0V or 3V to 5.5V, SHDN = GND
Full
-
-
±25
µA
Full
-25
-
25
V
VCC = 3.3V
Full
0.6
1.2
-
V
VCC = 5.0V
Full
0.8
1.5
-
V
VCC -0.6 VCC -0.1
TRANSMITTER OUTPUTS
RECEIVER INPUTS
Input Voltage Range
Input Threshold Low
3
ISL83220E
Electrical Specifications
Test Conditions: VCC = 3V to 5.5V, C1 - C4 = 0.1µF; Unless Otherwise Specified.
Typicals are at TA = 25oC (Continued)
TEMP
(oC)
MIN
TYP
MAX
UNITS
VCC = 3.3V
Full
-
1.5
2.4
V
VCC = 5.0V
Full
-
1.8
2.4
V
Input Hysteresis
25
-
0.3
-
V
Input Resistance
Full
3
5
7
kΩ
Full
250
500
-
kbps
tPHL
25
-
1.0
-
µs
tPLH
25
-
1.0
-
µs
tPHL
25
-
0.20
-
µs
tPLH
PARAMETER
TEST CONDITIONS
Input Threshold High
TIMING CHARACTERISTICS
Maximum Data Rate
RL = 3kΩ, C L = 1000pF, One Transmitter Switching
Transmitter Propagation Delay
Transmitter Input to
Transmitter Output,
RL = 3kΩ, C L = 1000pF
Receiver Propagation Delay
Receiver Input to Receiver
Output, CL = 150pF
25
-
0.30
-
µs
Receiver Output Enable Time
Normal Operation
25
-
200
-
ns
Receiver Output Disable Time
Normal Operation
25
-
200
-
ns
Transmitter Skew
tPHL - tPLH (Note 3)
25
-
100
500
ns
Receiver Skew
tPHL - tPLH
Full
-
100
1000
ns
Transition Region Slew Rate
CL = 150pF to 2500pF
VCC = 3.3V,
RL = 3kΩ to 7kΩ,
CL = 150pF to 1000pF
Measured From 3V to -3V or
-3V to 3V
25
4
-
30
V/µs
25
6
-
30
V/µs
Human Body Model
25
-
±15
-
kV
ESD PERFORMANCE
RS-232 Pins (TOUT, RIN)
All Other Pins
IEC1000-4-2 Contact Discharge
25
-
±8
-
kV
IEC1000-4-2 Air Gap Discharge
25
-
±15
-
kV
Human Body Model
25
-
±3
-
kV
NOTE:
3. Transmitter skew is measured at the transmitter zero crossing points.
Detailed Description
Transmitters
The ISL83220E operates from a single +3V to +5.5V supply,
guarantees a 250kbps minimum data rate, requires only four
small external 0.1µF capacitors, features low power
consumption, and meets all ElA RS-232C and V.28
specifications. The circuit is divided into three sections: The
charge pump, the transmitter, and the receiver.
The transmitters are proprietary, low dropout, inverting
drivers that translate TTL/CMOS inputs to EIA/TIA-232
output levels. Coupled with the on-chip ±5.5V supplies,
these transmitters deliver true RS-232 levels over a wide
range of single supply system voltages.
Charge-Pump
Intersil’s new 3.3V family utilizes regulated on-chip dual
charge pumps as voltage doublers, and voltage inverters to
generate ±5.5V transmitter supplies from a VCC supply as
low as 3.0V. This allows these devices to maintain RS-232
compliant output levels over the ±10% tolerance range of
3.3V powered systems. The efficient on-chip power supplies
require only four small, external 0.1µF capacitors for the
voltage doubler and inverter functions, even at VCC = 3.3V.
The charge pumps operate discontinuously (i.e., they turn off
as soon as the V+ and V- supplies are pumped up to the
nominal values), resulting in significant power savings.
4
The transmitter output disables and assumes a high
impedance state when the device enters the powerdown
mode (see Table 2). This output may be driven to ±12V when
disabled.
All devices guarantee a 250kbps data rate for full load
conditions (3kΩ and 1000pF), VCC ≥ 3.0V. Under more
typical conditions of VCC ≥ 3.3V, RL = 3kΩ, and CL = 250pF,
the ISL83220E easily operates at 900kbps.
Transmitter inputs float if left unconnected, and may cause
ICC increases.
ISL83220E
Receivers
The ISL83220E device contains a standard inverting
receiver that three-states via the EN control line. Receivers
convert RS-232 signals to CMOS output levels and accept
inputs up to ±25V while presenting the required 3kΩ to 7kΩ
input impedance (see Figure 1) even if the power is off
(VCC = 0V). The receiver’s Schmitt trigger input stage uses
hysteresis to increase noise immunity and decrease errors
due to slow input signal transitions.
The ISL83220E receiver disables only when EN is driven
high. (see Table 2). This allows the receiver to monitor
external devices, like a modem, even when the ISL83220E is
in its 1µA powerdown state.
Standard receivers driving powered down peripherals must
be disabled to prevent current flow through the peripheral’s
protection diodes (see Figures 2). This renders them
useless for wake up functions.
section). The time to recover from manual powerdown mode
is typically 100µs.
TABLE 2. POWERDOWN AND ENABLE LOGIC TRUTH TABLE
SHDN
EN
TRANSMITTER RECEIVER
INPUT INPUT
OUTPUT
OUTPUT
L
L
High-Z
Active
Manual
Powerdown
L
H
High-Z
High-Z
Manual
Powerdown
w/Rcvr. Disabled
H
L
Active
Active
Normal
Operation
H
H
Active
High-Z
Normal
Operation
w/Rcvr. Disabled
VCC
VCC
VCC
R1OUT
R1IN
-25V ≤ VRIN ≤ +25V
MODE OF
OPERATION
CURRENT
FLOW
VCC
GND ≤ VROUT ≤ VCC
5kΩ
VOUT = VCC
GND
Rx
FIGURE 1. INVERTING RECEIVER CONNECTIONS
POWERED
DOWN
UART
Operation down to 2.7V
ISL83220E transmitter outputs meet RS-562 levels (±3.7V)
with VCC as low as 2.7V. RS-562 levels typically ensure inter
operability with RS-232 devices.
Powerdown Functionality
This 3V family of RS-232 interface devices requires a
nominal supply current of 0.3mA during normal operation
(not in powerdown mode), which is considerably less than
the 5mA to 11mA current required of 5V RS-232 devices.
The already low current requirement drops significantly
when the device enters powerdown mode. In powerdown,
supply current drops to 1µA, because the on-chip charge
pump turns off (V+ collapses to VCC, V- collapses to GND),
and the transmitter outputs three-state. This micro-power
mode makes these devices ideal for battery powered and
portable applications.
Software Controlled (Manual) Powerdown
On the ISL83220E, the powerdown control is via a simple
shutdown (SHDN) pin. Driving this pin high enables normal
operation, while driving it low forces the IC into it’s
powerdown state. Connect SHDN to VCC if the powerdown
function isn’t needed. Note that the receiver output remains
enabled during shutdown (see Table 2). For the lowest
power consumption during powerdown, the receiver should
also be disabled by driving the EN input high (see next
5
Tx
GND
SHDN = GND
OLD
RS-232 CHIP
FIGURE 2. POWER DRAIN THROUGH POWERED DOWN
PERIPHERAL
Receiver ENABLE Control
The ISL83220E also features an EN input to control the
receiver output. Driving EN high disables the receiver output
placing it in a high impedance state. This is useful to
eliminate supply current, due to a receiver output forward
biasing the protection diode, when driving the input of a
powered down (VCC = GND) peripheral (see Figure 2).
Capacitor Selection
The charge pumps require 0.1µF capacitors for 3.3V
operation. Do not use values smaller than 0.1 µF. Increasing
the capacitor values (by a factor of 2) reduces ripple on the
transmitter outputs and slightly reduces power consumption.
When using minimum required capacitor values, make sure
that capacitor values do not degrade excessively with
temperature. If in doubt, use capacitors with a larger nominal
value. The capacitor’s equivalent series resistance (ESR)
usually rises at low temperatures and it influences the
amount of ripple on V+ and V-.
ISL83220E
Power Supply Decoupling
VCC
+
0.1µF
In most circumstances a 0.1µF bypass capacitor is
adequate. In applications that are particularly sensitive to
power supply noise, decouple V CC to ground with a
capacitor of the same value as the charge-pump capacitor C1.
Connect the bypass capacitor as close as possible to the IC.
+
C1+
VCC
V+
C1
C1-
+
C3
ISL83220E
+
Transmitter Output when Exiting
Powerdown
V-
C2+
C2
C4
+
C2-
Figure 3 shows the response of the transmitter output when
exiting powerdown mode. As it activates, the transmitter
output properly goes to RS-232 levels, with no glitching,
ringing, nor undesirable transients. The transmitter is loaded
with 3kΩ in parallel with 2500pF. Note that the transmitter
enables only when the magnitude of the supplies exceed
approximately 3V.
TIN
TOUT
RIN
ROUT
5k
EN
VCC
1000pF
SHDN
FIGURE 4. TRANSMITTER LOOPBACK TEST CIRCUIT
5V/DIV.
SHDN
TIN = LOW
5V/DIV.
T1IN
2V/DIV.
T1OUT
TIN = HIGH
VCC = +3.3V
C1 - C4 = 0.1µF
R1OUT
VCC = +3.3V
C1 - C4 = 0.1µF
TIME (20µs/DIV.)
FIGURE 3. TRANSMITTER OUTPUT WHEN EXITING
POWERDOWN
5µs/DIV.
FIGURE 5. LOOPBACK TEST AT 120kbps
High Data Rates
The ISL83220E maintains the RS-232 ±5V minimum
transmitter output voltages even at high data rates. Figure 4
details a transmitter loopback test circuit, and Figure 5
illustrates the loopback test result at 120kbps. For this test,
the transmitter is driving an RS-232 load in parallel with
1000pF, at 120kbps. Figure 6 shows the loopback results for
the transmitter driving 1000pF and an RS-232 load at
250kbps.
5V/DIV.
T1IN
T1OUT
R1OUT
VCC = +3.3V
C1 - C4 = 0.1µF
2µs/DIV.
FIGURE 6. LOOPBACK TEST AT 250kbps
6
ISL83220E
Interconnection with 3V and 5V Logic
The ISL83220E directly interfaces with 5V CMOS and TTL
logic families. Nevertheless, with the ISL83220E at 3.3V, and
the logic supply at 5V, AC, HC, and CD4000 outputs can
drive ISL83220E inputs, but ISL83220E outputs do not reach
the minimum V IH for these logic families. See Table 3 for
more information.
TABLE 3. LOGIC FAMILY COMPATIBILITY WITH VARIOUS
SUPPLY VOLTAGES
VCC
SYSTEM
POWER-SUPPLY SUPPLY
VOLTAGE
VOLTAGE
(V)
(V)
3.3
3.3
5
5
5
3.3
COMPATIBILITY
Compatible with all CMOS
families.
Compatible with all TTL and
CMOS logic families.
Compatible with ACT and HCT
CMOS, and with TTL. ISL83320E
outputs are incompatible with AC,
HC, and CD4000 CMOS inputs.
±15kV ESD Protection
All pins on ISL8XXX devices include ESD protection
structures, but the ISL8XXXE family incorporates advanced
structures which allow the RS-232 pins (transmitter outputs
and receiver inputs) to survive ESD events up to ±15kV. The
RS-232 pins are particularly vulnerable to ESD damage
because they typically connect to an exposed port on the
exterior of the finished product. Simply touching the port
pins, or connecting a cable, can cause an ESD event that
might destroy unprotected ICs. These new ESD structures
protect the device whether or not it is powered up, protect
without allowing any latchup mechanism to activate, and
don’t interfere with RS-232 signals as large as ±25V.
Human Body Model (HBM) Testing
As the name implies, this test method emulates the ESD
event delivered to an IC during human handling. The tester
delivers the charge through a 1.5kΩ current limiting resistor,
making the test less severe than the IEC-1000 test which
utilizes a 330Ω limiting resistor. The HBM method
determines an ICs ability to withstand the ESD transients
typically present during handling and manufacturing. Due to
the random nature of these events, each pin is tested with
respect to all other pins. The RS-232 pins on “E” family
devices can withstand HBM ESD events to ±15kV.
IEC1000-4-2 Testing
The IEC 1000 test method applies to finished equipment,
rather than to an individual IC. Therefore, the pins most likely
to suffer an ESD event are those that are exposed to the
outside world (the RS-232 pins in this case), and the IC is
tested in its typical application configuration (power applied)
rather than testing each pin-to-pin combination. The lower
7
current limiting resistor coupled with the larger charge
storage capacitor yields a test that is much more severe than
the HBM test. The extra ESD protection built into this
device’s RS-232 pins allows the design of equipment
meeting level 4 criteria without the need for additional board
level protection on the RS-232 port.
AIR-GAP DISCHARGE TEST METHOD
For this test method, a charged probe tip moves toward the
IC pin until the voltage arcs to it. The current waveform
delivered to the IC pin depends on approach speed,
humidity, temperature, etc., so it is difficult to obtain
repeatable results. The “E” device RS-232 pins withstand
±15kV air-gap discharges.
CONTACT DISCHARGE TEST METHOD
During the contact discharge test, the probe contacts the
tested pin before the probe tip is energized, thereby
eliminating the variables associated with the air-gap
discharge. The result is a more repeatable and predictable
test, but equipment limits prevent testing devices at voltages
higher than ±8kV. All “E” family devices survive ±8kV contact
discharges on the RS-232 pins.
ISL83220E
Typical Performance Curves
VCC = 3.3V, TA = 25oC
TRANSMITTER OUTPUT VOLTAGE (V)
6
25
VOUT+
4
SLEW RATE (V/µs)
20
2
TRANSMITTER AT 250kbps
0
-2
15
-SLEW
+SLEW
10
VOUT -
-4
-6
0
1000
2000
3000
4000
5
5000
0
1000
2000
3000
FIGURE 7. TRANSMITTER OUTPUT VOLTAGE vs LOAD
CAPACITANCE
3.5
NO LOAD
ALL OUTPUTS STATIC
3.0
SUPPLY CURRENT (mA)
SUPPLY CURRENT (mA)
40
250kbps
30
25
20
120kbps
15
10
5000
FIGURE 8. SLEW RATE vs LOAD CAPACITANCE
45
35
4000
LOAD CAPACITANCE (pF)
LOAD CAPACITANCE (pF)
20kbps
2.5
2.0
1.5
1.0
0.5
5
0
0
1000
2000
3000
4000
5000
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
SUPPLY VOLTAGE (V)
LOAD CAPACITANCE (pF)
FIGURE 9. SUPPLY CURRENT vs LOAD CAPACITANCE
WHEN TRANSMITTING DATA
FIGURE 10. SUPPLY CURRENT vs SUPPLY VOLTAGE
Die Characteristics
PASSIVATION:
DIE DIMENSIONS:
100 mils x 100 mils (2540µm x 2540µm)
METALLIZATION:
Type: Silox
Thickness: 13kÅ
TRANSISTOR COUNT:
Type: Metal 1: AISi(1%)
Thickness: Metal 1: 8kÅ
Type: Metal 2: AISi (1%)
Thickness: Metal 2: 10kÅ
286
PROCESS:
Si Gate CMOS
SUBSTRATE POTENTIAL (POWERED UP):
GND
8
6.0
ISL83220E
Thin Shrink Small Outline Plastic Packages (TSSOP)
M16.173
N
INDEX
AREA
E
0.25(0.010) M
E1
2
INCHES
GAUGE
PLANE
-B1
16 LEAD THIN SHRINK SMALL OUTLINE PLASTIC
PACKAGE
B M
3
L
0.05(0.002)
-A-
SEATING PLANE
A
D
-C-
e
α
A2
A1
b
0.10(0.004) M
0.25
0.010
c
0.10(0.004)
C A M
B S
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
-
0.047
-
1.20
-
A1
0.002
0.006
0.05
0.15
-
A2
0.031
0.051
0.80
1.05
-
b
0.0075
0.0118
0.19
0.30
9
c
0.0035
0.0079
0.09
0.20
-
D
0.193
0.201
4.90
5.10
3
E1
0.169
0.177
4.30
4.50
4
e
0.026 BSC
E
0.246
L
0.0177
N
α
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-153-AB, Issue E.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact. (Angles in degrees)
9
MILLIMETERS
0.65 BSC
0.256
6.25
0.0295
0.45
16
0o
6.50
0.75
16
8o
0o
6
7
8o
Rev. 0 6/98
ISL83220E
Small Outline Plastic Packages (SSOP)
M16.209 (JEDEC MO-150-AC ISSUE B)
16 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
N
INDEX
AREA
0.25(0.010) M
H
B M
INCHES
E
GAUGE
PLANE
-B1
2
3
L
0.25
0.010
SEATING PLANE
-A-
A
D
-C-
µα
e
B
0.25(0.010) M
C
0.10(0.004)
C A M
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
-
0.078
-
2.00
-
A1
0.002
-
0.05
-
-
A2
0.065
0.072
1.65
1.85
-
B
0.009
0.014
0.22
0.38
9
C
0.004
0.009
0.09
0.25
-
D
0.233
0.255
5.90
6.50
3
E
0.197
0.220
5.00
5.60
4
e
A2
A1
B S
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimension at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
10
0.026 BSC
H
0.292
L
0.022
N
α
NOTES:
MILLIMETERS
0.65 BSC
0.322
7.40
0.037
0.55
16
0o
-
8.20
0.95
16
8o
0o
6
7
8o
Rev. 2
3/95
ISL83220E
Small Outline Plastic Packages (SOIC)
M16.3 (JEDEC MS-013-AA ISSUE C)
N
16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
0.25(0.010) M
H
B M
INCHES
E
-B1
2
3
L
SEATING PLANE
-A-
h x 45o
A
D
-C-
e
A1
B
0.25(0.010) M
C
0.10(0.004)
C A M
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
0.0926
0.1043
2.35
2.65
-
A1
0.0040
0.0118
0.10
0.30
-
B
0.013
0.0200
0.33
0.51
9
C
0.0091
0.0125
0.23
0.32
-
D
0.3977
0.4133
10.10
10.50
3
E
0.2914
0.2992
7.40
7.60
4
e
µα
B S
0.050 BSC
1.27 BSC
-
H
0.394
0.419
10.00
10.65
-
h
0.010
0.029
0.25
0.75
5
L
0.016
0.050
0.40
N
α
NOTES:
MILLIMETERS
16
0o
1.27
16
8o
0o
6
7
8o
Rev. 0 12/93
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm (0.024
inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
All Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice.
Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable.
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11
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