NUF4107FC 4 Channel EMI Pi−Filter Array with Full USB Filter This device is a 4 channel EMI filter array for data lines. Greater than −35 dB attenuation is obtained at frequencies from 800 MHz to 2.2 GHz. It also offers USB filtering circuitry with speed detection. This includes the inline resistors for impedance matching and EMI filtering. ESD protection is provided across all capacitors. http://onsemi.com CIRCUIT DESCRIPTION Features • • • • • • • • • EMI Filtering and ESD Protection for Data Lines USB 1.1 Filtering Provided with Speed Detection Integration of 27 Discretes Offers Cost and Space Savings Pb−Free Package May be Available. The G−Suffix Denotes a Pb−Free Lead Finish 350 m Solder Spheres All TVS Protected Inputs Comply with IEC61000−4−2 (Level 4) 30 kV (Contact) 30 kV (Air) Low Profile Flip−Chip Packaging MSL 1 All Pins Exceed 2000 Volts Human Body Model R7 B1 R2 A2 C2 C2 D2 D11 B2 R3 A3 C3 D3 B3 C5 B4 D4 C4 C6 D6 R5 A5 B5 C5 C8 C7 D7 C3 C4 R4 A4 D5 EMI and USB Filtering and ESD Protection for Data Lines Cell Phones Handheld Portables Notebook Computers MP3 Players C1 C1 D1 Typical Applications • • • • • R1 A1 D8 R6 A6 MAXIMUM RATINGS (TA = 25°C) C9 D9 Rating Symbol Value ESD Discharge IEC61000−4−2 (Note 1) − Air Discharge, Contact Discharge Human Body Model Machine Model VPP DC Power per Resistor PR 100 mW DC Power per Package PT 600 mW Junction Temperature TJ 150 °C Operating Temperature Range Top −40 to +85 °C Storage Temperature Range Tstg −55 to +150 °C C6 D10 C10 Unit kV 30 16 0.4 FLIP−CHIP−17 CASE 499AD A1 ÈÈ ÈÈ DEVICE MARKING NUF4107 1. This does not include Pins B1, C1 and C2 ORDERING INFORMATION Device Package Shipping† NUF4107FCT1G Flip−Chip 3000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Semiconductor Components Industries, LLC, 2004 April, 2004 − Rev. 0 1 Publication Order Number: NUF4107FC/D NUF4107FC ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Symbol VBR Characteristic IR = 1 mA Min Typ Max Unit 6.0 6.8 8.0 V IR VRM = 3.3 V per line − − 0.1 A R3 − R6 EMI Filter Resistors 80 100 120 R1, R2 USB Resistors; Impedance Matching 18 22 26 1250 1500 1750 At 2.5 V Bias 48 60 72 pF C1, C2 At Pins A1 and A2; At 2.5 V Bias 29 36 43 pF Cpower At Pins B2; At 2.5 V Bias 54 68 82 pF R7 Cline USB Pull−up; Speed Detection Resistor http://onsemi.com 2 NUF4107FC TYPICAL CHARACTERISTICS 110 25 108 106 23 RESISTANCE RESISTANCE 24 22 21 104 102 100 98 96 94 20 92 19 −40 −20 0 20 40 60 90 −40 80 85 −20 0 20 40 TEMPERATURE °C TEMPERATURE °C Figure 1. USB 1.1 Resistors (R1, R2) vs. Temperature Figure 2. Data Resistors (R3, R4, R5, R6) vs. Temperature 0 1600 1580 1540 −20 1520 S21 (dB) RESISTANCE USB1 −10 1560 1500 1480 USB2 −30 −40 1460 1440 Test Conditions: Pins B1, B2 floating Vline = 0 V −50 1420 1400 −40 −20 0 20 40 60 −60 80 85 1 10 TEMPERATURE °C 0 0 −5 −10 −10 −30 S41 (dB) −20 −25 −30 −40 USB1 − USB2 −50 USB2 − EMI3 −60 −35 Test Conditions: Pins B1, B2 floating Vline = 0 V −40 −45 EMI5 EMI4 10,000 Test Conditions: Pins B1, B2 floating Vline = 0 V −20 EMI3 −15 100 1000 FREQUENCY (MHz) Figure 4. Insertion Loss Characteristic USB1, USB2 Figure 3. Pull−up Resistor (R7) vs. Temperature S21 (dB) 80 85 60 EMI3 − EMI4 −70 EMI5 − EMI6 EMI6 −80 −50 EMI4 − EMI5 −90 1 10 100 1000 FREQUENCY (MHz) 10,000 1 Figure 5. Insertion Loss Characteristic EMI3, EMI4, EMI5, EMI6 10 100 1000 FREQUENCY (MHz) Figure 6. Analog Crosstalk Curve EMI Filter http://onsemi.com 3 10,000 NUF4107FC Printed Circuit Board Recommendations 500 m Pitch 300 m Solder Ball Parameter 250 m +25 250 m −0 PCB Pad Size Pad Shape Round Pad Type NSMD 350 m ±25 Solder Mask Opening 125 m Solder Stencil Thickness Stencil Aperture 250 x 250 m sq. Solder Flux Ratio 50/50 Solder Paste Type No Clean Type 3 or Finer Trace Finish OSP Cu Trace Width 150 m Max Copper Solder Mask NSMD SMD Figure 7. Solder Mask versus Non−Solder Mask Definition − − − − − − − − − − − − − − − − − − − − − − − − − − − − Tp = (15−30 sec) Tp = 260°C − 5°C RAMP−UP RAMP−DOWN tL (60−90 sec) PRE−HEAT ZONE 0− 15 − 30 − 45 − 60 − 75 − 90 − 105 − 119 − 134 − 149 − 165 − 180 − 195 − 209 − 224 − 239 − 254 − 269 − 284 − 299 − 314 − 329 − 344 − 359 − 374 − 389 − 404 − 419 − 434 − 449 − 464 − 479 − 494 − TEMPERATURE (°C) 280 270 260 250 240 230 TL= 217 210 200 190 180 170 160 150 140 130 120 110 100 90 80 70 60 50 40 30 20 10 0 TIME (seconds) Figure 8. Typical Pb−Free Solder Heating Profile http://onsemi.com 4 NUF4107FC PACKAGE DIMENSIONS FLIP−CHIP−17 CSP CASE 499AD−01 ISSUE O 4X 0.10 C TERMINAL A1 LOCATOR ÈÈ ÈÈ D A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETER. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. B E TOP VIEW A1 0.10 C A2 0.05 C SIDE VIEW A C SEATING PLANE D1 e /2 e C 17 X b 0.05 C A B 0.03 C E1 B e1 A 1 2 3 4 5 6 BOTTOM VIEW http://onsemi.com 5 DIM A A1 A2 D E b e e1 D1 E1 MILLIMETERS MIN MAX −−− 0.740 0.250 0.310 0.380 0.430 2.960 BSC 1.330 BSC 0.290 0.350 0.500 BSC 0.435 BSC 2.500 BSC 0.870 BSC NUF4107FC ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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