LIGITEK LBD336C-XXB Bar digit led display Datasheet

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
BAR DIGIT LED DISPLAY
Pb
Lead-Free Parts
LBD336C-XXB
DATA SHEET
DOC. NO
:
QW0905- LBD336C-XXB
REV.
:
A
DATE
: 05 - Dec. - 2008
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LBD336C-XXB
Page 1/9
Package Dimensions
33.0(1.30")
11.0
(0.43")
11.0
(0.43")
Y
R
G
Y
7.62
(0.3")
R
LBD336C -XXB
LIGITEK
6.4
(0.25")
4.0±0.5
Ø0.45
TYP
2.54*6=15.24(0.6")
PIN NO. 1
Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm(0.01") unless otherwise noted.
2.Specifications are subject to change without notice.
.3.Film:temperature-resistant≦100° C.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 2/9
PART NO.LBD336C-XXB
Internal Circuit Diagram
LBD336C-XXB
8
a
b
c
d
A B C D E F G DP
1
14
2
4
9 10 3 5 12 13 11 7
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 3/9
PART NO.LBD336C-XXB
Electrical Connection
PIN NO.
LBD336C-XXB
1.
Cathode a
2.
Cathode c
3.
Cathode C
4.
Cathode d
5.
Cathode D
6.
NC
7.
Cathode DP
8.
Common Anode
9.
Cathode A
10.
Cathode B
11.
Cathode G
12.
Cathode E
13.
Cathode F
14.
Cathode b
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 4/9
PART NO. LBD336C -XXB
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
Red
Green
Yellow
Forward Current Per Chip
IF
15
15
15
mA
Peak Forward Current Per
Chip (Duty 1/10,0.1ms
Pulse Width)
IFP
70
80
50
mA
Power Dissipation Per Chip
PD
50
50
50
mW
Ir
10
μA
Operating Temperature
Topr
-25 ~ +85
℃
Storage Temperature
Tstg
-25 ~ +85
℃
Reverse Current Per Any Chip
Part Selection And Application Information(Ratings at 25℃)
CHIP
PART NO
Material
LBD336C-XXB
common
cathode
or
anode
Emitted
GaAlAs
Red
GaP
Green
GaAsP/GaP Yellow
Common
Anode
Electrical
λP
(nm)
△λ
Vf(v)
(nm)
Iv(mcd)
Min.
Typ.
Min.
Typ
660
20
1.5
2.1
565
30
1.7
2.1
---
---
585
35
1.7
2.1
---
---
Note : 1.The forward voltage data did not including ± 0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
IV-M
1.75 3.05
2:1
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LBD336C-XXB
Page 5/9
Test Condition For Each Parameter
Symbol
Unit
Test Condition
Forward Voltage Per Chip
Vf
volt
If=10mA
Luminous Intensity Per Chip
Iv
mcd
If=10mA
Peak Wavelength
λP
nm
If=20mA
△λ
nm
If=20mA
Ir
μA
Vr=5V
Parameter
Spectral Line Half-Width
Reverse Current Any Chip
Luminous Intensity Matching Ratio
IV-M
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page6/9
PART NO. LBD336C-XXB
Typical Electro-Optical Characteristics Curve
SR CHIP
Fig.2 Relative Intensity vs. Forward Current
Fig.1 Forward current vs. Forward Voltage
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
2.5
2.0
1.5
1.0
0.5
0.0
0.1
1.0
2.0
3.0
1.0
5.0
4.0
10
1.2
1.1
1.0
0.9
0.8
0
20
40
60
80
100
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
600
650
700
Wavelength (nm)
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Relative Intensity@20mA
Fig.4 Relative Intensity vs. Temperature
Relative Intensity@20mA
Normalize @25℃
Forward Voltage@20mA
Normalize @25℃
Fig.3 Forward Voltage vs. Temperature
-20
1000
Forward Current(mA)
Forward Voltage(V)
-40
100
750
80
100
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LBD336C-XXB
Page 7/9
Typical Electro-Optical Characteristics Curve
G CHIP
Fig.2 Relative Intensity vs. Forward Current
Relative Intensity
Normalize @20mA
Forward Current(mA)
Fig.1 Forward current vs. Forward Voltage
Forward Current(mA)
Forward Voltage(V)
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity@20mA
Fig.4 Relative Intensity vs. Temperature
Relative Intensity@20mA
Normalize @25℃
Forward Voltage@20mA
Normalize @25℃
Fig.3 Forward Voltage vs. Temperature
1.0
0.5
0.0
500
550
600
Wavelength (nm)
650
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 8/9
PART NO. LBD336C-XXB
Typical Electro-Optical Characteristics Curve
Y CHIP
Fig.2 Relative Intensity vs. Forward Current
Relative Intensity
Normalize @20mA
Forward Current(mA)
Fig.1 Forward current vs. Forward Voltage
Forward Current(mA)
Forward Voltage(V)
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity@20mA
Fig.4 Relative Intensity vs. Temperature
Relative Intensity@20mA
Normalize @25℃
Forward Voltage@20mA
Normalize @25℃
Fig.3 Forward Voltage vs. Temperature
1.0
0.5
0.0
500
550
600
650
Wavelength (nm)
700
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 9/9
PART NO. LBD336C-XXB
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=10mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5℃
2.RH=90 %~95%
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hours.
1.Ta=105 ℃±5℃ &-40 ℃±5 ℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11
Similar pages