ON NBXDBB018LN1TAG Clock oscillator Datasheet

NBXDBB018, NBXDBA018
3.3 V, 155.52 MHz /
311.04MHz LVPECL Clock
Oscillator
The NBXDBB018 dual frequency crystal oscillator (XO) is
designed to meet today’s requirements for 3.3 V LVPECL clock
generation applications. The device uses a high Q fundamental crystal
and Phase Lock Loop (PLL) multiplier to provide selectable 155.52
MHz or 311.04 MHz, ultra low jitter and phase noise LVPECL
differential output.
This device is a member of ON Semiconductor’s PureEdget clock
family that provides accurate and precision clock solutions.
Available in 5 mm x 7 mm SMD (CLCC) package on 16 mm tape
and reel in quantities of 1000. Frequency stability options available as
either 50 PPM NBXDBA018 (Industrial Temperature Range) or
20 PPM NBXDBB018 (Commercial Temperature Range).
Features
•
•
•
•
•
•
•
•
•
LVPECL Differential Output
Uses High Q Fundamental Mode Crystal and PLL Multiplier
Ultra Low Jitter and Phase Noise − 0.4 ps (12 kHz − 20 MHz)
Selectable Output Frequency − 155.52 MHz (default) / 311.04 MHz
Hermetically Sealed Ceramic SMD Package
RoHS Compliant
Operating Range 3.3 V ±10%
Total Frequency Stability − ±20 PPM or ±50 PPM
This is a Pb−Free Device
Applications
• Networking
• SONET
• SDH
VDD
6
CLK CLK
5 4
PLL
Clock
Multiplier
Crystal
1
OE
2
FSEL
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6 PIN CLCC
LN SUFFIX
CASE 848AB
MARKING DIAGRAM
NBXDBA018
155.52/311.04
AWLYYWWG
NBXDBA018
NBXDBB018
155.52/311.04
A
WL
YY
WW
G
NBXDBB018
155.52/311.04
AWLYYWWG
= NBXDBA018 (±50 PPM)
= NBXDBB018 (±20 PPM)
= Output Frequency (MHz)
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
Device
Package
Shipping†
NBXDBB018LN1TAG
CLCC−6
(Pb−Free)
1000/
Tape & Reel
NBXDBA018LN1TAG
CLCC−6
(Pb−Free)
1000/
Tape & Reel
NBXDBB018LNHTAG
CLCC−6
(Pb−Free)
100/
Tape & Reel
NBXDBA018LNHTAG
CLCC−6
(Pb−Free)
100/
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
3
GND
Figure 1. Simplified Logic Diagram
© Semiconductor Components Industries, LLC, 2009
March, 2009 − Rev. 2
1
Publication Order Number:
NBXDBB018/D
NBXDBB018, NBXDBA018
OE
1
6
VDD
FSEL
2
5
CLK
GND
3
4
CLK
Figure 2. Pin Connections (Top View)
Table 1. PIN DESCRIPTION
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Pin No.
Symbol
I/O
Description
1
OE
LVTTL/LVCMOS
Control Input
Output Enable Pin. When left floating pin defaults to logic HIGH and output is active.
See OE pin description Table 2.
2
FSEL
LVTTL/LVCMOS
Control Input
Output Frequency Select Pin. Pin will default to logic HIGH when left open. See Output
Frequency Select pin description Table 3.
3
GND
Power Supply
4
CLK
LVPECL Output
Non−Inverted Clock Output. Typically loaded with 50 W receiver termination resistor to
VTT = VDD − 2 V.
5
CLK
LVPECL Output
Inverted Clock Output. Typically loaded with 50 W receiver termination resistor to
VTT = VDD − 2 V.
6
VDD
Power Supply
Ground 0 V
Positive power supply voltage. Voltage should not exceed 3.3 V ±10%.
Table 2. OUTPUT ENABLE TRI−STATE FUNCTION
Table 3. OUTPUT FREQUENCY SELECT
OE Pin
Output Pins
FSEL Pin
Output Frequency (MHz)
Open
Active
Open
(pin will float high)
155.52
HIGH Level
155.52
LOW Level
311.04
HIGH Level
Active
LOW Level
High Z
Table 4. ATTRIBUTES
Characteristic
Value
Input Default State Resistor
ESD Protection
170 kW
Human Body Model
Machine Model
2 kV
200 V
Meets or Exceeds JEDEC Standard EIA/JESD78 IC Latchup Test
1. For additional Moisture Sensitivity information, refer to Application Note AND8003/D.
Table 5. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Units
VDD
Positive Power Supply
GND = 0 V
4.6
V
Iout
LVPECL Output Current
Continuous
Surge
25
50
mA
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−55 to +120
°C
Tsol
Wave Solder
260
°C
See Figure 6
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
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2
NBXDBB018, NBXDBA018
Table 6. DC CHARACTERISTICS (VDD = 3.3 V ± 10%, GND = 0 V, TA = −40°C to +85°C) (Note 2)
Symbol
Characteristic
Conditions
Min.
Typ.
Max.
Units
78
100
mA
IDD
Power Supply Current (Note 2)
VIH
OE and FSEL Input HIGH Voltage
2000
VDD
mV
VIL
OE and FSEL Input LOW Voltage
GND − 300
800
mV
IIH
Input HIGH Current
OE
FSEL
−100
−100
+100
+100
mA
IIL
Input LOW Current
OE
FSEL
−100
−100
+100
+100
mA
VDD−1195
2105
VDD−945
2355
mV
VDD = 3.3 V
VDD−1945
1355
VDD−1600
1700
mV
VDD = 3.3 V
VOH
VOL
VOUTPP
Output HIGH Voltage (Note 2)
Output LOW Voltage (Note 2)
Output Voltage Amplitude (Note 2)
670
mV
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 Ifpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
2. Measurement taken with outputs terminated with 50 W to VDD − 2.0 V.
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3
NBXDBB018, NBXDBA018
Table 7. AC CHARACTERISTICS (VDD = 3.3 V ± 10%, GND = 0 V, TA = −40°C to +85°C) (Note 3)
Symbol
fCLKOUT
Characteristic
Output Clock Frequency
Conditions
Min.
Typ.
FSEL = HIGH
155.52
FSEL = LOW
311.04
Max.
Units
MHz
Df
Frequency Stability − NBXDBB018
− NBXDBA018
0°C to +70°C
−40°C to +85°C
(Note 4)
FNOISE
Phase−Noise Performance
fCLKout = 155.52 MHz/311.04 MHz
(See Figures 3 and 4)
100 Hz of Carrier
−105/−102
dBc/Hz
1 kHz of Carrier
−122/−115
dBc/Hz
10 kHz of Carrier
−129/−122
dBc/Hz
−129/−122
dBc/Hz
1 MHz of Carrier
−137/−131
dBc/Hz
10 MHz of Carrier
−160/−156
dBc/Hz
12 kHz to 20 MHz
0.4
0.9
ps
1000 Cycles
2
8
ps
Cycle to Cycle, Peak−to−Peak
1000 Cycles
13
30
ps
Period, RMS
10000 Cycles
1
4
ps
Period, Peak−to−Peak
10000 Cycles
9
20
ps
200
ns
50
52
%
RMS Phase Jitter
tjitter
Cycle to Cycle, RMS
tDUTY_CYCLE
ppm
100 kHz of Carrier
tjit(F)
tOE/OD
±20
±50
Output Enable/Disable Time
Output Clock Duty Cycle
(Measured at Cross Point)
48
tR
Output Rise Time (20% and 80%)
250
400
ps
tF
Output Fall Time (80% and 20%)
250
400
ps
1
5
ms
3
ppm
1
ppm
tstart
Startup Time
Aging
1st
Year
Every Year After 1st
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 Ifpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
3. Measurement taken with outputs terminated with 50 W to VDD − 2.0 V.
4. Parameter guarantees 10 years of aging. Includes initial stability at 25°C, shock, vibration, and first year aging.
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4
NBXDBB018, NBXDBA018
Figure 3. Typical Phase Noise Plot at 155.52 MHz
Figure 4. Typical Phase Noise Plot at 311.04 MHz
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5
NBXDBB018, NBXDBA018
Table 8. RELIABILITY COMPLIANCE
ÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Parameter
Standard
Method
Shock
Mechanical
MIL−STD−833, Method 2002, Condition B
Solderability
Mechanical
MIL−STD−833, Method 2003
Vibration
Mechanical
MIL−STD−833, Method 2007, Condition A
Solvent Resistance
Mechanical
MIL−STD−202, Method 215
Thermal Shock
Environment
MIL−STD−833, Method 1011, Condition A
Moisture Level Sensitivity
Environment
MSL1 260°C per IPC/JEDEC J−STD−020D
NBXDBB018/NBXDBA018
Zo = 50 W
CLK
D
Receiver
Device
Driver
Device
CLK
D
Zo = 50 W
50 W
50 W
VTT
VTT = VDD − 2.0 V
Figure 5. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
temp. 260°C
20 − 40 sec. max.
peak
Temperature (°C)
260
6°C/sec. max.
3°C/sec. max.
217
ramp−up
175
150
cooling
pre−heat
reflow
60180 sec.
Time
60150 sec.
Figure 6. Recommended Reflow Soldering Profile
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6
NBXDBB018, NBXDBA018
PACKAGE DIMENSIONS
6 PIN CLCC, 7x5, 2.54P
CASE 848AB−01
ISSUE C
A
D
4X
D1
0.15 C
E2
TERMINAL 1
INDICATOR
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
B
H E1
DIM
A
A1
A2
A3
b
D
D1
D2
D3
E
E1
E2
E3
e
H
L
R
E
D2
TOP VIEW
A2
A3
0.10 C
A
SIDE VIEW
A1
C
6.17
6.66
4.37
4.65
1.17
SOLDERING FOOTPRINT*
3
2
e
6X
R
1.50
E3
0.10 C A B
0.05 C
0.08
1.30
MILLIMETERS
NOM
MAX
1.80
1.90
0.70 REF
0.36 REF
0.10
0.12
1.40
1.50
7.00 BSC
6.20
6.23
6.81
6.96
5.08 BSC
5.00 BSC
4.40
4.43
4.80
4.95
3.49 BSC
2.54 BSC
1.80 REF
1.27
1.37
0.70 REF
SEATING
PLANE
D3
1
MIN
1.70
6X
b
6
5
4
6X
5.06
L
BOTTOM VIEW
2.54
PITCH
6X
1.50
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
PureEdge is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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For additional information, please contact your local
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NBXDBB018/D
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