Secure Digital (SD) Card EMI Filter Array with ESD Protection CM1423 Features Product Description • The CM1423 is an EMI filter array with ESD protection, which integrates six Pi- filters (C-R-C) and four channels of ESD protection. The CM1423’s filters have component values of 12pF-100Ω-12pF. The part includes ESD protection diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). All the ESD diodes safely dissipate ESD strikes of ±15kV, beyond the maximum requirement of the IEC 610004-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30kV. • • • • • • • • • • Provides EMI filtering and ESD protection for an SD port on a mobile device Six channels of EMI filtering with ESD protection Four channels of ESD protection ±15kV ESD protection on all I/O pins (IEC 610004-2, contact discharge) ±30kV ESD protection (HBM) Better than 25dB of attenuation at 1GHz for 12pF-100Ω -12pF filter configuration Integrates 34 components into small form factor CSP solution 20-bump, 4.000mm x 1.458mm footprint Chip Scale Package Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance Available with OptiGuard™ coating for improved reliability at assembly RoHS compliant (lead-free) finishing Applications • • • • Secure Digital (SD) card data lines in mobile handsets SD card interface protection for other mobile electronics such as MP3 players, PDAs and digital cameras I/O port protection for mobile handsets, notebook computers, PDAs etc. EMI filtering for data ports in cell phones, PDAs or notebook computers. This device is particularly well-suited for portable electronics (e.g. mobile handsets, PDAs, notebook computers) because of its small package and easyto-use pin assignments. In particular, the CM1423 is ideal for EMI filtering and protecting data lines from ESD for the Secure Digital (SD) Card interface slot in mobile handsets. The CM1423 is an all-inclusive solution for the SD card interface since its EMI filters provide the proper cut-off frequency to attenuate unwanted signals. The CM1423 is manufactured in a space-saving, lowprofile, chip-scale package, and is optionally available with OptiGuard™ coating for improved reliability. It is available with RoHS compliant leadfree finishing. ©2010 SCILLC. All rights reserved. April 2010 Rev. 3 Publication Order Number: CM1423/D CM1423 Block Diagram Rev. 3 | Page 2 of 14 | www.onsemi.com CM1423 PIN DESCRIPTIONS PIN(s) NAME DESCRIPTION PIN(s) NAME DESCRIPTION A1 DAT2 DATA2 Filter+ESD Channel, System Side C1 DAT2 DATA2 Filter+ ESD Channel, SD Card Side A2 DAT3 DATA3 Filter+ESD Channel, System Side C2 DAT3 DATA3 Filter+ ESD Channel, SD Card Side A3 CMD CMD Signal Filter+ESD Channel, System Side C3 CMD CMD Signal Filter+ESD Channel, SD Card Side A4 VSS1 ESD-only Channel, Supply Voltage Ground C4 VDD ESD-only Channel, Supply Voltage A5 CLK Clock Filter + ESD Channel C5 CLK Clock Filter + ESD Channel A6 ESD ESD-only Channel C6 VSS2 ESD-only Channel, Supply Voltage Ground A7 DAT0 DATA0 Filter+ ESD Channel, System Side C7 DAT0 DATA0 Filter+ ESD Channel, SD Card Side A8 DAT1 DATA1 Filter+ ESD Channel, System Side C8 DAT1 DATA1 Filter+ ESD Channel, SD Card Side B1-B4 GND Device Ground Ordering Information PART NUMBERING INFORMATION TM -No Coating Bumps PKG Ordering Part Number 20 CSP CM1423-01CP 1 OptiGuard Part Marking Ordering Part Number N231 CM1423-03CP Note 1: Parts are shipped in Tape and Reel form unless otherwise specified. Rev. 3 | Page 3 of 14 | www.onsemi.com 1 Coated Part Marking N233 CM1423 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS -65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 500 mW RATING UNITS -40 to +85 °C Storage Temperature Range STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range Rev. 3 | Page 4 of 14 | www.onsemi.com CM1423 ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS 80 100 120 Ω 9 12 15 pF R Resistance C Capacitance At 2.5V DC, 1MHz, 30mV AC Diode Standoff Voltage IDIODE = 10μA 6.0 ILEAK Diode Leakage Current (reverse bias) VDIODE = 3.3V 100 300 nA VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10mA ILOAD = -10mA 6.8 -0.8 9.0 -0.4 V V VDIODE VESD RDYN f C In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Note 2 Dynamic Resistance Positive Negative Cut-off Frequency ZSOURCE=50Ω, ZLOAD=50Ω 5.6 -1.5 V ±30 kV ±15 kV 1.6 0.4 Ω Ω 145 MHz R = 100Ω, C = 12pF; Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Rev. 3 | Page 5 of 14 | www.onsemi.com CM1423 Performance Information Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 1. A1-C1 EMI Filter Performance Figure 2. A2-C2 EMI Filter Performance Rev. 3 | Page 6 of 14 | www.onsemi.com CM1423 Performance Information (cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 3. A3-C3 EMI Filter Performance Figure 4. A5-C5 EMI Filter Performance Rev. 3 | Page 7 of 14 | www.onsemi.com CM1423 Performance Information (cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 5. A7-C7 EMI Filter Performance Figure 6. A8-C8 EMI Filter Performance Rev. 3 | Page 8 of 14 | www.onsemi.com CM1423 Performance Information Figure 7. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VDC and 25°C) Rev. 3 | Page 9 of 14 | www.onsemi.com CM1423 Application Information Figure 8. Typical SD Card Application Rev. 3 | Page 10 of 14 | www.onsemi.com CM1423 Application Information PARAMETER VALUE Pad Size on PCB 0.240mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.290mm Round Solder Stencil Thickness 0.125mm - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50μm Solder Ball Side Coplanarity +20μm Maximum Dwell Time Above Liquidous 60 seconds Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste Non-Solder Mask Defined Pad 0.240mm DIA. Solder Stencil Opening 0.300mm DIA. Solder Mask Opening 0.290mm DIA. Figure 5. Recommended Non-Solder Mask Defined Pad Illustration Figure 6. Lead-free (SnAgCu) Solder Ball Reflow Profile Rev. 3 | Page 11 of 14 | www.onsemi.com 260°C CM1423 Mechanical Details CM1423Mechanical Specifications The package dimensions for the CM1423-01 and the CM1423-03 are presented below. PACKAGE DIMENSIONS Package Custom CSP Bumps 20 Millimeters Inches Dim Min Nom Max Min Nom Max A1 3.955 4.000 4.045 0.1557 0.1575 0.1593 A2 1.413 1.458 1.503 0.0556 0.0574 0.0592 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.200 0.250 0.300 0.0079 0.0098 0.0118 C2 0.244 0.294 0.344 0.0096 0.0116 0.0135 D1 0.562 0.606 0.650 0.0221 0.0239 0.0256 D2 0.356 0.381 0.406 0.0140 0.0150 0.0160 D3 0.575 0.644 0.714 0.0226 0.0254 0.0281 D4 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel Package Dimensions for CM1423 Chip Scale Package 3500 pieces Controlling dimension: millimeters Rev. 3 | Page 12 of 14 | www.onsemi.com CM1423 CSP Tape and Reel Specifications POCKET SIZE (mm) TAPE WIDTH B0 X A0 X K0 W PART NUMBER CHIP SIZE (mm) CM1423-01 4.00 X 1.46 X 0.606 4.11 X 1.57 X 0.76 CM1423-03 4.00 X 1.46 X 0.644 4.11 X 1.57 X 0.76 + REEL DIAMETER QTY PER REEL P0 P1 12mm 330mm (13") 3500 4mm 4mm 12mm 330mm (13") 3500 4mm 4mm + + Figure 11. Tape and Reel Mechanical Data Rev. 3 | Page 13 of 14 | www.onsemi.com CM1423 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. 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SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 Rev. 3 | Page 14 of 14 | www.onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative