ONSEMI CAT3644HV3-GT2

CAT3644
4-Channel Ultra High
Efficiency Quad-Mode) LED
Driver
Description
Applications
•
•
•
•
LCD Display Backlight
Cellular Phones
Digital Still Cameras
Handheld Devices
NC
NC
GND
LED1
1
LED2
C2−
LED3
C2+
LED4
C1−
RSET
C1+
VIN
High Efficiency 1.33x Charge Pump
Quad−mode Charge Pump: 1x, 1.33x, 1.5x, 2x
Drives up to 4 LEDs at 25 mA Each
1−wire EZDimt LED Current Programming
Power Efficiency up to 92%
Low Noise Input Ripple in All Modes
“Zero” Current Shutdown Mode
Soft Start and Current Limiting
Short Circuit Protection
Thermal Shutdown Protection
3 mm x 3 mm, 16−pad TQFN Package
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
PIN CONNECTIONS
NC
•
•
•
•
•
•
•
•
•
•
•
•
TQFN−16
HV3 SUFFIX
CASE 510AD
VOUT
Features
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EN/DIM
The CAT3644 is a high efficiency Quad−Mode® fractional charge
pump that can drive up to four LEDs programmable by a one wire
digital interface. The inclusion of a 1.33x fractional charge pump
mode increases device efficiency by up to 10% over traditional 1.5x
charge pumps with no added external capacitors.
Low noise input ripple is achieved by operating at a constant
switching frequency which allows the use of small external ceramic
capacitors. The multi−fractional charge pump supports a wide range of
input voltages from 2.5 V to 5.5 V.
The EN/DIM logic input functions as a chip enable and a digital
dimming interface for current setting of all LEDs. Six different current
ratios are available via the interface.
The device is available in the tiny 16−pad TQFN 3 mm x 3 mm
package with a max height of 0.8 mm.
ON Semiconductor’s Quad−Mode® 1.33x charge pump switching
architecture is patented.
(Top View)
MARKING DIAGRAMS
JAAG
AXXX
YWW
JAAH
AXXX
YWW
JAAD = CAT3644HV3−T2
JAAH = CAT3644HV3−GT2
A = Assembly Location
XXX = Last Three Digits of Assembly Lot Number
Y = Production Year (Last Digit)
WW = Production Week (Two Digits)
ORDERING INFORMATION
Device
Package
CAT3644HV3−T2
(Note 1)
TQFN−16
(Pb−Free)
CAT3644HV3−GT2
(Note 2)
TQFN−16
(Pb−Free)
Shipping
2,000/
Tape & Reel
1. Matte−Tin Plated Finish (RoHS−compliant).
2. NiPdAu Plated Finish (RoHS−compliant).
© Semiconductor Components Industries, LLC, 2010
April, 2010 − Rev. 6
1
Publication Order Number:
CAT3644/D
CAT3644
1 mF
VIN
2.4 V
to
5.5 V
CIN
C1+ C1− C2+ C2−
VOUT
VIN
CAT3644
1 mF
1−Wire
EZDimt
Programming
1 mF
EN/DIM
RSET
GND
4.02 kΩ
VOUT
COUT
1 mF
LED1
LED2
LED3
LED4
20 mA
Figure 1. Typical Application Circuit
Table 1. ABSOLUTE MAXIMUM RATINGS
Rating
Unit
VIN, LEDx, C1±, C2±, EN/DIM voltage
Parameter
6
V
VOUT voltage
7
V
Storage Temperature Range
−65 to +160
_C
Junction Temperature Range
−40 to +150
_C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 2. RECOMMENDED OPERATING CONDITIONS
Parameter
Rating
Unit
VIN
2.5 to 5.5
V
Ambient Temperature Range
−40 to +85
_C
ILED per LED pin
up to 30
mA
LED Forward Voltage Range
1.3 to 4.3
V
NOTE:
Typical application circuit with external components is shown above.
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CAT3644
Table 3. ELECTRICAL OPERATING CHARACTERISTICS
(over recommended operating conditions unless specified otherwise) VIN = 3.6 V, EN = High, TAMB = 25°C.
Symbol
Name
Conditions
IQ
Quiescent Current
1x mode, no load
1.33x mode, no load
1.5x mode, no load
2x mode, no load
IQSHDN
Shutdown Current
VEN = 0 V
ILED−ACC
LED Current Accuracy
(ILEDAVG – INOMINAL) / INOMINAL
RSET = 5 kW
ILED−DEV
LED Channel Matching
(ILED − ILEDAVG) / ILEDAVG
Min
Typ
Max
1.0
1.7
2.2
2.4
mA
1
mA
±2
%
±1.5
%
VRSET
RSET Regulated Voltage
ROUT
Output Resistance (open loop)
1x mode
1.33x mode, VIN = 3 V
1.5x mode, VIN = 2.7 V
2x mode, VIN = 2.4 V
FOSC
Charge Pump Frequency
1.33x and 2x mode
1.5x mode
ISC_MAX
Output short circuit Current Limit
VOUT < 0.5 V
50
mA
IIN_MAX
Input Current Limit
VOUT > 1 V
250
mA
LEDTH
1x to 1.33x or 1.33x to 1.5x or 1.5x to 2x
Transition Thresholds at any LED pin
130
mV
1x Mode Transition Hysteresis
400
mV
Transition Filter Delay
500
ms
100
kW
V
V
VHYS
TDF
REN/DIM
VHI
VLO
0.58
Units
EN/DIM Pin
− Internal Pull−down Resistor
− Logic High Level
− Logic Low Level
0.6
0.62
0.8
5
5
10
0.8
1
1
1.3
V
W
1.3
1.6
1.3
0.4
MHz
TSD
Thermal Shutdown
150
°C
THYS
Thermal Hysteresis
20
°C
VUVLO
Undervoltage lockout (UVLO) threshold
1.6
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1.8
2.0
V
CAT3644
Table 4. RECOMMENDED EN/DIM TIMING
(For 2.4 V ≤ VIN ≤ 5.5 V, over full ambient temperature range −40°C to +85°C.)
Name
Symbol
TSETUP
Conditions
Min
Typ
Max
Units
EN/DIM setup from shutdown
10
TLO
EN/DIM program low time
0.2
THI
EN/DIM program high time
0.2
ms
EN/DIM low time to shutdown
1.5
ms
TPWRDWN
TLED
LED current settling time
ms
100
40
TSETUP
ms
TPWRDWN
THI
EN/DIM
TLED
TLO
100%
100%
50%
LED
Current
Shutdown
25%
12.5% 6.25%
3.12%
Figure 2. EN/DIM Digital Dimming Timing Diagram
LED Current Setting
The nominal LED current is set by the external resistor
connected between the RSET pin and ground. Table 5 lists
standard resistor values for several LED current settings.
Table 5. RESISTOR RSET AND LED CURRENT
LED Current (mA)
RSET (kW)
2
40.0
5
15.8
10
7.87
15
5.23
20
4.02
25
3.16
30
2.67
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4
ms
Shutdown
CAT3644
TYPICAL PERFORMANCE CHARACTERISTICS
(VIN = 3.6 V, IOUT = 80 mA (4 LEDs at 20 mA), CIN = COUT = C1 = C2 = 1 mF, TAMB = 25°C unless otherwise specified.)
100
100
1.33x
VF = 3.3 V
1.5x
90
VF = 3.3 V
90
1x
EFFICIENCY (%)
EFFICIENCY (%)
1x
2x
80
70
60
50
40
4.5
4.0
3.5
3.0
2.5
4.0
3.8
3.6
3.4
3.2
INPUT VOLTAGE (V)
Figure 3. Efficiency vs. Input Voltage
Figure 4. Efficiency vs. Li−Ion Voltage
3.0
4
QUIESCENT CURRENT (mA)
QUIESCENT CURRENT (mA)
4.2
INPUT VOLTAGE (V)
3
2
1
LEDs Off
5.5
5.0
4.5
4.0
3.5
3.0
2.5
3
2x
1.5x
1.33x
2
1x
1
0
−40
2.0
0
40
80
120
INPUT VOLTAGE (V)
TEMPERATURE (°C)
Figure 5. Quiescent Current vs. Input Voltage
Figure 6. Quiescent Current vs. Temperature
10
10
8
VF = 3.3 V
LED CURRENT VARIATION (%)
LED CURRENT VARIATION (%)
60
40
2.0
VF = 3.3 V
6
4
2
0
−2
−4
−6
−8
−10
70
50
4
0
1.33x
80
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
8
VF = 3.3 V
6
4
2
0
−2
−4
−6
−8
−10
−40
0
40
80
INPUT VOLTAGE (V)
TEMPERATURE (°C)
Figure 7. LED Current Change vs. Input
Voltage
Figure 8. LED Current Change vs.
Temperature
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5
120
CAT3644
TYPICAL PERFORMANCE CHARACTERISTICS
(VIN = 3.6 V, IOUT = 80 mA (4 LEDs at 20 mA), CIN = COUT = C1 = C2 = 1 mF, TAMB = 25°C unless otherwise specified.)
12
1.2
OUTPUT RESISTANCE (W)
SWITCHING FREQUENCY (MHz)
1.3
1.5x Mode
1.1
1.0
0.9
1.33x, 2x Mode
0.8
0.7
−40
0
40
80
10
8
6
1.33x
1.5x
4
2
0
120
2x
1x
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
TEMPERATURE (°C)
INPUT VOLTAGE (V)
Figure 9. Switching Frequency vs.
Temperature
Figure 10. Output Resistance vs. Input Voltage
Figure 11. Power Up in 1x Mode
Figure 12. Power Up in 1.33x Mode
Figure 13. Power Up in 1.5x Mode
Figure 14. Power Up in 2x Mode
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CAT3644
TYPICAL PERFORMANCE CHARACTERISTICS
(VIN = 3.6 V, IOUT = 80 mA (4 LEDs at 20 mA), CIN = COUT = C1 = C2 = 1 mF, TAMB = 25°C unless otherwise specified.)
Figure 15. Power Up Delay (1x Mode)
Figure 16. Power Down Delay (1x Mode)
Figure 17. Operating Waveforms in 1x Mode
Figure 18. Switching Waveforms in
1.33x Mode
Figure 19. Switching Waveforms in
1.5x Mode
Figure 20. Switching Waveforms in
2x Mode
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CAT3644
TYPICAL PERFORMANCE CHARACTERISTICS
(VIN = 3.6 V, IOUT = 80 mA (4 LEDs at 20 mA), CIN = COUT = C1 = C2 = 1 mF, TAMB = 25°C unless otherwise specified.)
40
4.0
1x Mode
LED CURRENT (mA)
3.0
2.5
2.0
1.5
1.0
30
20
10
0.5
0
0
100
200
300
0
400
0
50
100
150
200
250
OUTPUT CURRENT (mA)
LED PIN VOLTAGE (mV)
Figure 21. Foldback Current Limit
Figure 22. LED Current vs. LED Pin Voltage
300
50
LED CURRENT (mA)
OUTPUT VOLTAGE (V)
3.5
40
30
20
10
0
1
10
RSET RESISTANCE (kW)
Figure 23. Dimming Waveform
Figure 24. LED Current vs. RSET
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100
CAT3644
Table 6. PIN DESCRIPTION
Pin #
Name
Function
1
LED2
LED2 cathode terminal.
2
LED3
LED3 cathode terminal.
3
LED4
LED4 cathode terminal.
4
RSET
Connect resistor RSET to set the LED current.
5
EN/DIM
6
VOUT
7
NC
Not connected inside the package.
8
VIN
Charge pump input, connect to battery or supply.
9
C1+
Bucket capacitor 1 Positive terminal
10
C1−
Bucket capacitor 1 Negative terminal
11
C2+
Bucket capacitor 2 Positive terminal
12
C2−
Bucket capacitor 2 Negative terminal
13
NC
Not connected inside the package.
14
NC
Not connected inside the package.
15
GND
Ground Reference
16
LED1
LED1 cathode terminal.
TAB
GND
Connect to GND on the PCB.
Device enable (active high) and Dimming Control.
Charge pump output connected to the LED anodes.
Pin Function
VIN is the supply pin for the charge pump. A small 1 mF
ceramic bypass capacitor is required between the VIN pin
and ground near the device. The operating input voltage
range is from 2.5 V to 5.5 V. Whenever the input supply falls
below the under−voltage threshold (1.8 V), all the LED
channels are disabled and the device enters shutdown mode.
EN/DIM is the enable and one wire dimming input for all
LED channels. Levels of logic high and logic low are set at
1.3 V and 0.4 V respectively. When EN/DIM is initially
taken high, the device becomes enabled and all LED
currents are set to the full scale according to the resistor
RSET. To place the device into “zero current” shutdown
mode, the EN/DIM pin must be held low for at least 1.5 ms.
VOUT is the charge pump output that is connected to the
LED anodes. A small 1 mF ceramic bypass capacitor is
required between the VOUT pin and ground near the device.
GND is the ground reference for the charge pump. The pin
must be connected to the ground plane on the PCB.
C1+, C1− are connected to each side of the ceramic bucket
capacitor C1.
C2+, C2− are connected to each side of the ceramic bucket
capacitor C2.
LED1 to LED4 provide the internal regulated current
source for each of the LED cathodes. These pins enter
high−impedance zero current state whenever the device is
placed in shutdown mode.
TAB is the exposed pad underneath the package. For best
thermal performance, the tab should be soldered to the PCB
and connected to the ground plane.
RSET is connected to the resistor (RSET) to set the full scale
current for the LEDs. The voltage at this pin regulated to
0.6 V. The ground side of the external resistor should be star
connected back to the GND of the PCB. In shutdown mode,
RSET becomes high impedance.
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CAT3644
Block Diagram
C1−
VIN
C1+
C2−
C2+
VOUT
1x mode (LDO)
4/3x, 3/2x, 2x Charge Pump
Mode Control
1, 1.3 MHz
Oscillator
EN/DIM
LED1
100 kΩ
LED2
LED3
LED4
Serial
Interface
Reference
Voltage
Registers
Current
Setting DAC
LED Channel
Current Regulators
RSET
GND
Figure 25. CAT3644 Functional Block Diagram
Basic Operation
At power−up, the CAT3644 starts operating in 1x mode
where the output will be approximately equal to the input
supply voltage (less any internal voltage losses). If the
output voltage is sufficient to regulate all LED currents, the
device remains in 1x operating mode.
If the input voltage is insufficient or falls to a level where
the regulated currents cannot be maintained, the device
automatically switches into 1.33x mode (after a fixed delay
time of about 400 ms). In 1.33x mode, the output voltage is
approximately equal to 1.33 times the input supply voltage
(less any internal voltage losses).
This sequence repeats in the 1.33x and 1.5x mode until the
driver enters the 2x mode. In 1.5x mode, the output voltage
is approximately equal to 1.5 times the input supply voltage.
While in 2x mode, the output is approximately equal to 2
times the input supply voltage.
If the device detects a sufficient input voltage is present to
drive all LED currents in 1x mode, it will change
automatically back to 1x mode. This only applies for
changing back to the 1x mode. The difference between the
input voltage when exiting 1x mode and returning to 1x
mode is called the 1x mode transition hysteresis (VHYS) and
is about 500 mV.
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CAT3644
LED Current Selection
input signal, as shown on Figure 26. On each consecutive
pulse rising edge, the LED current is divided by half to 50%,
then 25%, 12.5%, 6.25% and 3.125% dimming levels.
Pulses faster than the minimum TLO may be ignored and
filtered by the device. Pulses longer than the maximum TLO
may shutdown the device.
The LED driver enters a “zero current” shutdown mode if
EN/DIM is held low for 1.5 ms or more.
At power−up, the initial LED current is set to full scale
(100% brightness) by the external resistor RSET as follows:
LED current + 132
0.6 V
R SET
The EN/DIM pin has two primary functions. One function
enables and disables the device. The other function is LED
current dimming with six different levels by pulsing the
THI
TSETUP
TPWRDWN
EN/DIM
TLED
TLO
100%
100%
50%
LED
Current
Shutdown
25%
12.5% 6.25%
3.12%
Shutdown
Figure 26. EN/DIM Digital Dimming Timing Diagram
Table 7. LED CURRENT DIMMING LEVELS
EN/DIM # of Pulses *
RSET Gain
LED Current
EN = High
132
132 x 0.6 V / RSET
1st
66
66 x 0.6 V / RSET
2nd
33
33 x 0.6 V / RSET
3rd
16.5
16.5 x 0.6 V / RSET
4th
8.25
8.25 x 0.6 V / RSET
5th
4.125
4.125 x 0.6 V / RSET
6th
132
132 x 0.6 V / RSET
xth
Device cycling through gain selection
GAIN x 0.6 V / RSET
* The gain is changed on the rising edges of the EN/DIM input.
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CAT3644
Unused LED Channels
LED Selection
For applications not requiring all the channels, it is
recommended the unused LED pins be tied directly to VOUT
(see Figure 27).
LEDs with forward voltages (VF) ranging from 1.3 V to
4.3 V may be used. Selecting LEDs with lower VF is
recommended in order to improve the efficiency by keeping
the driver in 1x mode longer as the battery voltage decreases.
For example, if a white LED with a VF of 3.3 V is selected
over one with VF of 3.5 V, the driver will stay in 1x mode for
lower supply voltage of 0.2 V. This helps improve the
efficiency and extends battery life.
1 mF
VIN
C1+
VIN
C2−
VOUT
COUT
CIN
CAT3644
1 mF
ENABLE
DIMMING
C1− C2+
1 mF
LED1
EN/DIM
RSET
GND
RSET
External Components
The driver requires four external 1 mF ceramic capacitors
for decoupling input, output, and for the charge pump. Both
capacitors type X5R and X7R are recommended for the
LED driver application. In all charge pump modes, the input
current ripple is kept very low by design and an input bypass
capacitor of 1 mF is sufficient.
In 1x mode, the device operates in linear mode and does
not introduce switching noise back onto the supply.
1 mF
LED2
LED3
LED4
Figure 27. Application with 3 LEDs
Recommended Layout
Protection Mode
In charge pump mode, the driver switches internally at a
high frequency. It is recommended to minimize trace length
to all four capacitors. A ground plane should cover the area
under the driver IC as well as the bypass capacitors. Short
connection to ground on capacitors CIN and COUT can be
implemented with the use of multiple via. A copper area
matching the TQFN exposed pad (TAB) must be connected
to the ground plane underneath. The use of multiple via
improves the package heat dissipation.
If an LED is disconnected, the driver senses that and
automatically ignores that channel. When all LEDs are
disconnected, the driver goes to 1x mode where the output
is equal to the input voltage.
As soon as the output exceeds about 6 V, the driver resets
itself and reevaluate the mode.
If the die temperature exceeds +150°C, the driver will
enter a thermal protection shutdown mode. When the device
temperature drops by about 20°C, the device will resume
normal operation.
GND
Pin1
C2
EN/DIM
C1
RSET
VIN
GND
COUT
CIN
GND
Figure 28. Recommended Layout
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CAT3644
PACKAGE DIMENSIONS
TQFN16, 3x3
CASE 510AD−01
ISSUE A
A
D
e
b
L
E2
E
PIN#1 ID
PIN#1 INDEX AREA
A1
TOP VIEW
SIDE VIEW
SYMBOL
MIN
NOM
MAX
A
0.70
0.75
0.80
A1
0.00
0.02
0.05
A3
BOTTOM VIEW
0.20 REF
b
0.18
0.25
0.30
D
2.90
3.00
3.10
D2
1.40
−−−
1.80
E
2.90
3.00
3.10
E2
1.40
−−−
1.80
e
L
D2
A
FRONT VIEW
0.50 BSC
0.30
0.40
A3
A1
0.50
Notes:
(1) All dimensions are in millimeters.
(2) Complies with JEDEC MO-220.
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CAT3644
Example of Ordering Information (Note 5)
3.
4.
5.
6.
7.
Prefix
Device #
Suffix
CAT
3644
HV3
−G
T2
Company ID
(Optional)
Product Number
3644
Package
HV3: TQFN
Lead Finish
G: NiPdAu
Blank: Matte−Tin
Tape & Reel (Note 7)
T: Tape & Reel
2: 2,000 / Reel
All packages are RoHS−compliant (Lead−free, Halogen−free).
The standard lead finish is NiPdAu.
The device used in the above example is a CAT3644HV3−GT2 (TQFN, NiPdAu, Tape & Reel, 2,000/Reel).
For additional package and temperature options, please contact your nearest ON Semiconductor Sales office.
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
EZDim is a trademark of Semiconductor Components Industries, LLC.
Quad−Mode is a registered trademark of Semiconductor Components Industries, LLC.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
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ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
CAT3644/D